CN212625516U

CN212625516U - Heap wafer rapid cooling device

Info

Publication number: CN212625516U
Application number: CN202022016344.5U
Authority: CN
Inventors: 张杨; 金凤鸣
Original assignee: Liaoning Equipment Manufacturing Vocational And Technical College
Current assignee: Liaoning Equipment Manufacturing Vocational And Technical College
Priority date: 2020-09-15
Filing date: 2020-09-15
Publication date: 2021-02-26
Anticipated expiration: 2030-09-15

Abstract

The utility model discloses a heap wafer rapid cooling device, the base of intaking is connected with into, the outlet pipe, on the base of intaking was installed to first layer refrigeration disk body, the second floor refrigeration disk body passed through the disk body connecting piece and links to each other with first layer refrigeration disk body, the base of intaking, the inside pipeline that has mutual intercommunication of refrigeration disk body and disk body connecting piece, the pipeline constitutes a complete inside circulation passageway, constant temperature cooling water circulates in inside circulation passageway, takes away the unnecessary heat of refrigeration disk body. This heap wafer rapid cooling device adopts constant temperature cooling water to cool down for the refrigeration disk body, simple structure, and refrigeration effect is stable, and space utilization is high.

Description

Heap wafer rapid cooling device

Technical Field

The utility model relates to a wafer processing unit in the semiconductor manufacturing process, especially a wafer rapid cooling device.

Background

In the chip fabrication process, photolithography is a key process step in the fabrication of large scale integrated circuits. When the photoetching process is carried out on the wafer, a series of pretreatment and post-treatment operations are required to be carried out on the wafer, and the specific process flow is as follows: pretreatment, gluing, soft baking, photoetching, post-exposure baking, developing and hard baking. Wherein, the wafer is required to be cooled after the pretreatment, the soft baking, the post-exposure baking and the hard baking treatment, so that the wafer is rapidly recovered to a normal temperature state (22 ℃). This means of cooling the wafer is called a cold plate.

The existing cooling plate technology generally adopts a structural form that an upper plate body and a lower plate body clamp a semiconductor cooling plate, and the Peltier effect of the semiconductor cooling plate is utilized to cool the upper plate body so as to achieve the effect of cooling the wafer. For example, chinese utility model patent publication No. CN201011654 discloses a "cold plate body structure", which realizes accurate control of the temperature of the cold plate body through a semiconductor refrigeration module. The cold plate structure form of clamping the semiconductor refrigerating plate by the upper plate body and the lower plate body has certain defects, and the plate body structure is thicker in order to ensure the uniformity of temperature conduction; because the temperature control precision of the cold plate in the wafer manufacturing process is high and the cooling rate is high, a large number of high-power refrigerating pieces and precise control circuits are required, and the cost and the structural complexity of the cold plate unit are greatly improved; in addition, the heat release end of the semiconductor cooling plate needs to be additionally provided with an additional cooling device in the using process. All of the above limits the efficiency of the cold plate.

Disclosure of Invention

In order to improve equipment's space utilization, simplify cold dish structure, the utility model provides an adopt water-cooling mode to carry out the cold dish structure of cooling lets in the metal plate that inside processing has the circulating water channel with the constant temperature circulating water in, when wafer and cold dish surface contact, takes away the temperature of wafer through the circulating water, accomplishes the cooling process of wafer. Meanwhile, the structure greatly reduces the thickness and the structural complexity of the cold plate, so that a plurality of groups of cold plates can be stacked and placed, and the space is saved.

The utility model provides a technical scheme that its technical problem adopted is: the utility model provides a heap wafer rapid cooling device, includes into water base, advances, goes out water piping connection with intaking, lets in the constant temperature cooling water that has steady pressure and flow in the water pipe, constitutes a liquid circulation circuit through inside rivers passageway.

In the stacked wafer rapid cooling device, the water inlet base is connected with the refrigerating disc body, and the water inlet base and the refrigerating disc body are sealed in a waterproof way by the sealing ring; a spiral water flow channel is processed in the refrigerating disc body, and constant-temperature cooling water flows through the internal channel of the refrigerating disc body to take away redundant heat; limiting retaining columns are arranged on the periphery of the refrigerating disc body and used for ensuring that the cooling wafer is located at the center of the refrigerating disc body; the upper surface of the refrigeration disk body is provided with an annular groove for vacuum, and the back surface is provided with an air hole communicated with the groove on the upper surface.

In the stacked wafer rapid cooling device, the refrigeration disc bodies are connected by the disc body connecting piece, and the cooling water channel is arranged in the disc body connecting piece; grooves for mounting sealing rings are arranged on the upper surface and the lower surface of the disk body connecting piece; the upper surface and the lower surface of the tray body connecting piece can be connected with the refrigeration tray body.

The beneficial effects of the utility model are that, the utility model relates to a heap wafer rapid cooling device adopts the mode of constant temperature cooling water to cool down to the refrigeration disk body, compares with other cooling methods and has greatly reduced the structure of refrigeration disk body, has reduced the occupation space of whole device. The refrigeration mode of using the constant temperature cooling water can conveniently combine a plurality of groups of refrigeration disc bodies in a stacking mode, thereby improving the utilization efficiency of unit space.

Drawings

The present invention will be further explained with reference to the drawings and examples.

FIG. 1 is a schematic view of the present invention;

FIG. 2 is a schematic view of the internal circulation path of the present invention;

FIG. 3 is a schematic view of the internal circulating water pipeline of the refrigeration tray body;

fig. 4 is a schematic view of the wafer picking and placing device of the present invention.

In the figure, 1, a water inlet base, 2, a disc body connecting piece, 3, a refrigeration disc body, 4, a limiting baffle column, 5, an annular groove for vacuum, 6, a water inlet pipe, 7, a water outlet pipe, 8, an internal circulation channel, 9, a cooling disc body internal channel, 10, a wafer and 11, mechanical fingers are arranged.

Detailed Description

The utility model provides a heap wafer rapid cooling device includes into water base 1, and first layer refrigeration disk body 3 is installed on into water base 1, and first layer is connected through disk body connecting piece 2 with the middle of second floor refrigeration disk body 3, uses the sealing washer to compress tightly sealed between each connection.

As shown in fig. 1, a water inlet base 1 is connected with a water inlet pipe 6 and a water outlet pipe 7; limiting stop posts 4 are arranged on the periphery of the refrigerating disc body 3 and can limit the position of the wafer 10 during cooling; the upper disc surface of the refrigeration disc body 3 is provided with an annular groove 5 for vacuum, the annular groove is connected to a vacuum generating device, when the wafer 10 is sent to the refrigeration disc body 3, a vacuum valve is opened, and the wafer 10 is tightly adsorbed on the upper surface of the refrigeration disc body 3 under the atmospheric pressure, so that the cooling efficiency is improved.

As shown in fig. 2, the constant temperature cooling water flows in from the water inlet pipe 6, and flows into the refrigeration disc body 3 through the water inlet base 1; meanwhile, the refrigerant flows into the second-layer refrigerating disc body 3 through the disc body connecting piece 2; constant temperature water circulates in the refrigerating disc body 3 and then flows out from the other outlet; all circulating water flowing out of the refrigerating disc body 3 flows out of the water outlet pipe 7 through the water inlet base 1 after converging.

As shown in fig. 3, a spiral cooling tray body internal channel 9 is arranged inside the cooling tray body 3, and inside the cooling tray body 3 with uniformly distributed channels, the circulating water flowing through takes away the excessive heat on the cooling tray body 3.

As shown in fig. 4, the mechanical finger 11 grips the wafer 10 and sends the wafer to the position right above the refrigeration tray 3, the mechanical finger 11 falls to the position below the refrigeration tray 3, during the falling process, the wafer 10 falls on the refrigeration tray 3, the vacuum valve is opened, the cooling process is started, the mechanical finger 11 withdraws along the horizontal direction, and the process of sending the wafer 10 is completed; after the cooling process is finished, the mechanical finger 11 moves to a position right below the refrigerating disc body 3, the vacuum valve is closed, the mechanical finger 11 vertically rises to hold the wafer 10, and after the mechanical finger 11 is completely higher than the refrigerating disc body 3, the mechanical finger 11 moves out along the horizontal direction, and the process of taking out the wafer 10 is finished.

Claims

1. The utility model provides a heap wafer rapid cooling device, includes into water base (1), refrigeration disk body (3), disk body connecting piece (2), inlet tube (6), outlet pipe (7) and constitutes its characterized in that: the water inlet base (1) is connected with the water inlet pipe (6) and the water outlet pipe (7), the first-layer refrigeration disk body (3) is installed on the water inlet base (1), the first-layer refrigeration disk body (3) is connected with the second-layer refrigeration disk body (3) through the disk body connecting piece (2), and the water inlet base (1), the refrigeration disk body (3) and the disk body connecting piece (2) are internally provided with pipelines which are communicated, so that an internal circulation channel (8) is formed jointly.

2. The stacked wafer rapid cooling device as claimed in claim 1, wherein a limit stop pillar (4) is installed around the upper disc surface of the refrigeration disc body (3); the refrigeration disk body (3) is provided with an annular groove (5) for vacuum, and is connected with a vacuum generating device.

3. The stacked wafer rapid cooling device as claimed in claim 1, wherein the water inlet base (1), the refrigerating tray body (3) and the tray body connecting member (2) are sealed by sealing rings.

4. The stacked wafer rapid cooling device as claimed in claim 1, wherein a plurality of cooling trays (3) can be connected and assembled by tray connectors (2).