CN212570996U

CN212570996U - IGBT substrate convenient to dismantle and maintain

Info

Publication number: CN212570996U
Application number: CN202021543317.7U
Authority: CN
Inventors: 邓泽龙; 冯小平; 许新星
Original assignee: Suzhou Guishi Technology Co ltd
Current assignee: Suzhou Guishi Technology Co ltd
Priority date: 2020-07-30
Filing date: 2020-07-30
Publication date: 2021-02-19
Anticipated expiration: 2030-07-30

Abstract

The utility model discloses an IGBT substrate convenient for disassembly and maintenance, which comprises a substrate, wherein the front surface of the substrate is uniformly provided with a plurality of mounting grooves, the inner cavity of each mounting groove is provided with an IGBT module, jacks are respectively arranged at the left side and the right side of the IGBT module, the top part of the inner wall of each mounting groove is provided with a placing opening, the top part of the substrate is uniformly provided with a plurality of movable grooves, the inner cavity of each movable groove is spliced with an inserting strip, the top part of each inserting strip is provided with a shifting block, one side of each inserting strip, which is close to the mounting groove, is provided with a clamping strip which is clamped in the inner cavity of each jack, the back surface of the substrate is provided with a cooling groove, the inner cavity of the cooling groove is provided with a heat exchange water pipe, the back surface of the substrate is provided with a back cover, the right side of the back cover is hinged with the right side, the back cover can be opened through the hinge, and then the back cover is maintained, so that the back cover is convenient to disassemble and maintain.

Description

IGBT substrate convenient to dismantle and maintain

Technical Field

The utility model relates to a IGBT base plate technical field specifically is a IGBT base plate convenient to dismantle and maintain.

Background

An IGBT (insulated gate bipolar transistor) is a composite fully-controlled voltage-driven power semiconductor device composed of BJTs (bipolar junction transistors) and MOS (insulated gate field effect transistors), has the advantages of both high input impedance of the MOSFETs and low conduction voltage drop of GTRs (GTRs), is a core device for energy conversion and transmission, commonly called as a CPU (central processing unit) of a power electronic device, serves as a strategic emerging industry of China, and is widely applied in the fields of rail transit, smart grids, aerospace, electric vehicles, new energy equipment and the like, an IGBT module is a modular semiconductor product formed by bridging and packaging IGBT (insulated gate bipolar transistor chips) and FWDs (freewheeling diode chips) through specific circuits, and has the characteristics of energy conservation, convenience in installation and maintenance, stable heat dissipation and the like, and the IGBT module is generally installed on a specially-made substrate. The existing IGBT substrate is generally provided with a plurality of IGBT modules, the IGBT modules are fixedly arranged on the substrate and are difficult to disassemble, and if one IGBT module breaks down, the whole IGBT substrate needs to be sent for maintenance, so that inconvenience is brought to daily use and maintenance; the existing IGBT substrate is generally only used for heat dissipation through a heat dissipation sheet, the heat dissipation structure is simple, the heat dissipation effect is poor, after the IGBT substrate is used for a long time, the IGBT module is easily burnt due to excessive accumulated heat, the service life of the IGBT module is shortened, and the use and maintenance cost is increased. In view of this, we propose an IGBT substrate that is easy to disassemble and maintain.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an IGBT base plate convenient to dismantle and maintain, it is convenient to have the dismantlement, the advantage of the maintenance of being convenient for, it generally installs a plurality of IGBT modules on the current IGBT base plate to have solved, and the IGBT module is fixed mounting on the base plate, be difficult to dismantle, it is inconvenient to bring for daily use and maintenance, heat radiation structure is simple and radiating effect is poor, after long-time the use, the IGBT module burns out because of long-pending too much, the life of IGBT module has been shortened, use and cost of maintenance's problem has been increased.

In order to achieve the above object, the utility model provides a following technical scheme: an IGBT substrate convenient to disassemble and maintain comprises a substrate, wherein a plurality of mounting grooves are uniformly arranged on the front surface of the substrate, IGBT modules are arranged in the inner cavity of each mounting groove, a placing opening is formed in the top of the inner wall of each mounting groove, a plurality of movable grooves are uniformly formed in the top of the substrate, inserting strips are inserted into the inner cavities of the movable grooves, shifting blocks are arranged at the tops of the inserting strips, clamping strips are arranged on one sides of the inserting strips, which are close to the mounting grooves, and penetrate through one sides, which are close to the mounting grooves, of the inner walls of the movable grooves and extend to the inner cavities of the mounting grooves, springs are connected between the sides, which are far away from the mounting grooves, of the inserting strips and the sides, which are far away from the mounting grooves, the back surface of the substrate is provided with a cooling groove, a heat exchange water pipe is, and a water outlet of the heat exchange water pipe penetrates through the left side of the inner wall of the cooling tank.

Preferably, jacks are formed in the left side and the right side of the IGBT module, and the clamping strips are clamped in inner cavities of the jacks.

Preferably, the back of the base plate is provided with a rear cover, and the right side of the rear cover is hinged with the right side of the base plate through a hinge.

Preferably, the inner cavity of the heat exchange water pipe is uniformly provided with a plurality of baffles which are arranged in an inclined manner.

Preferably, the number of the active slots is twice the number of the IGBT modules.

Preferably, the outer diameter of the shifting block is larger than the width of the movable groove.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses if the IGBT module damages, can stir the shifting block to both sides and take the card strip out the jack, then can take out the IGBT module and maintain, if the heat transfer water pipe damages, the accessible hinge is opened the back lid, then maintain it, it is convenient to dismantle, the maintenance of being convenient for, a plurality of IGBT modules have generally been installed on having solved current IGBT base plate, and the IGBT module all is fixed mounting on the base plate, be difficult to dismantle, if there is an IGBT module to break down, the maintenance will all be sent to whole IGBT base plate, for daily use and the problem of maintaining inconvenience.

2. The utility model discloses the pipe wall of cooling water accessible heat transfer water pipe, the cell wall of cooling bath and mounting groove produces the heat exchange with the IGBT module, absorb and take away the produced heat of IGBT module during operation, the baffle can delay the speed of passing through of cooling water simultaneously, thereby can prolong hot exchange time, and improve the heat exchange rate, so can carry out high efficiency cooling to the IGBT module, can effectively protect the IGBT module and prolong its life, it generally only dispels the heat through the fin to have solved current IGBT base plate, heat radiation structure is simple and radiating effect is poor, after long-time use, the IGBT module burns out because of long-pending hot too much easily, the life of IGBT module has been shortened, use and cost of maintenance's problem has been increased.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the structure of the cooling tank of the present invention;

FIG. 3 is a schematic structural diagram of the IGBT module of the present invention;

FIG. 4 is a schematic view of the structure of the movable trough of the present invention;

FIG. 5 is a schematic view of the heat exchange water pipe of the present invention;

fig. 6 is an enlarged view of a portion a in fig. 1 according to the present invention.

In the figure: 1 base plate, 2 mounting grooves, 3IGBT module, 4 place mouthful, 5 activity grooves, 6 cutting, 7 shifting blocks, 8 springs, 9 card strips, 10 cooling bath, 11 heat transfer water pipe, 12 jacks, 13 baffles, 14 back lids.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-6, the present invention provides a technical solution: an IGBT substrate convenient for disassembly and maintenance comprises a substrate 1, wherein a plurality of installation grooves 2 are uniformly arranged on the front surface of the substrate 1, IGBT modules 3 are arranged in the inner cavities of the installation grooves 2, jacks 12 are respectively arranged on the left side and the right side of each IGBT module 3, a placement opening 4 is arranged on the top of the inner wall of each installation groove 2, a plurality of movable grooves 5 are uniformly arranged on the top of the substrate 1, the number of the movable grooves 5 is twice that of the IGBT modules 3, an inserting strip 6 is inserted into the inner cavity of each movable groove 5, a shifting block 7 is arranged on the top of each inserting strip 6, the outer diameter of each shifting block 7 is larger than the width of each movable groove 5, a clamping strip 9 is arranged on one side of each inserting strip 6 close to the installation groove 2, one side of each clamping strip 9 close to the installation groove 2 penetrates through one side of the inner wall of each movable groove 5 close to the installation groove 2 and extends to the inner cavity of the installation groove 2, the clamping strip 9, cooling bath 10 has been seted up at the back of base plate 1, the inner chamber of cooling bath 10 is provided with heat transfer water pipe 11, the inner chamber of heat transfer water pipe 11 is even is provided with a plurality of baffles 13, baffle 13 is "slant" and arranges, the water inlet of heat transfer water pipe 11 runs through the right side of cooling bath 10 inner wall, the left side of cooling bath 10 inner wall is run through to the delivery port of heat transfer water pipe 11, the back of base plate 1 is provided with back lid 14, the right side of back lid 14 is passed through the hinge and is articulated with the right side of base plate 1.

Before use, the IGBT module 3 is placed into the mounting groove 2 through the placing opening 4, the clamping strips 9 are clamped into the insertion holes 12, so that the IGBT module 3 can be firmly fixed, when in use, cooling water enters the heat exchange water pipe 11 through the water inlet, and then exits the heat exchange water pipe 11 through the water outlet, the cooling water can generate heat exchange with the IGBT module 3 through the pipe wall of the heat exchange water pipe 11, the groove wall of the cooling groove 10 and the groove wall of the mounting groove 2, heat generated during the work of the IGBT module 3 is absorbed and taken away, meanwhile, the baffle 13 in the heat exchange water pipe 11 can delay the passing speed of the cooling water, so that the heat exchange time of the cooling water and the IGBT module 3 can be prolonged, the heat exchange rate is improved, so that the IGBT module 3 can be quickly and efficiently cooled, the IGBT module 3 can be effectively protected, the service life of the IGBT module 3 can be prolonged, if the IGBT module 3 is damaged, the shifting blocks 7 can be shifted to two sides, the IGBT module 3 can then be taken out and repaired, and if the heat exchange water pipe 11 is damaged, the rear cover 14 can be opened by a hinge and then repaired.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a IGBT base plate convenient to dismantle maintenance, includes base plate (1), its characterized in that: the front surface of the base plate (1) is uniformly provided with a plurality of mounting grooves (2), the inner cavity of each mounting groove (2) is provided with an IGBT module (3), the top of the inner wall of each mounting groove (2) is provided with a placing opening (4), the top of the base plate (1) is uniformly provided with a plurality of movable grooves (5), the inner cavity of each movable groove (5) is spliced with an inserting strip (6), the top of each inserting strip (6) is provided with a shifting block (7), one side of each inserting strip (6) close to the corresponding mounting groove (2) is provided with a clamping strip (9), one side of each clamping strip (9) close to the corresponding mounting groove (2) penetrates through one side of the inner wall of each movable groove (5) close to the corresponding mounting groove (2) and extends to the inner cavity of the corresponding mounting groove (2), a spring (8) is connected between one side of each inserting strip (6) far away from the corresponding mounting groove (, cooling bath (10) have been seted up to the back of base plate (1), the inner chamber of cooling bath (10) is provided with heat transfer water pipe (11), the right side of cooling bath (10) inner wall is run through to the water inlet of heat transfer water pipe (11), the left side of cooling bath (10) inner wall is run through to the delivery port of heat transfer water pipe (11).

2. The IGBT substrate convenient to disassemble and maintain according to claim 1, characterized in that: jacks (12) are formed in the left side and the right side of the IGBT module (3), and the clamping strips (9) are clamped in inner cavities of the jacks (12).

3. The IGBT substrate convenient to disassemble and maintain according to claim 1, characterized in that: the back of base plate (1) is provided with back lid (14), the right side of back lid (14) is articulated with the right side of base plate (1) through the hinge.

4. The IGBT substrate convenient to disassemble and maintain according to claim 1, characterized in that: the inner cavity of the heat exchange water pipe (11) is uniformly provided with a plurality of baffles (13), and the baffles (13) are arranged in an inclined manner.

5. The IGBT substrate convenient to disassemble and maintain according to claim 1, characterized in that: the number of the active slots (5) is twice that of the IGBT modules (3).

6. The IGBT substrate convenient to disassemble and maintain according to claim 1, characterized in that: the outer diameter of the shifting block (7) is larger than the width of the movable groove (5).