CN212555419U

CN212555419U - Anti-warping carrier film stripping equipment

Info

Publication number: CN212555419U
Application number: CN202020796757.7U
Authority: CN
Inventors: 蔡杰; 程成; 林雾杰
Original assignee: Shenzhen Xindahui Flex Circuit Technology Co ltd
Current assignee: Shenzhen Xindahui Flex Circuit Technology Co ltd
Priority date: 2020-05-14
Filing date: 2020-05-14
Publication date: 2021-02-19
Anticipated expiration: 2030-05-14

Abstract

The utility model discloses a warp-proof carrier film stripping device, which comprises an operation platform and a case positioned at the bottom of the operation platform; the operation table is internally provided with a cavity, a panel positioned at the top of the operation table is provided with a punching array, and the cavity is communicated with the outside through the punching array; an air pump is arranged in the case and is connected with the cavity of the operating platform through an air exhaust pipe; the device can protect the thin PCB or FPC from warping and deforming when the carrier film is peeled off.

Description

Anti-warping carrier film stripping equipment

Technical Field

The utility model relates to a PCB processing technology field, concretely relates to proof warp bears carrier film and peels off equipment.

Background

In the thin PCB process, the product is easily deformed due to the curing of green oil, the glue preparation baking of PI of the copper foil, and other influences. The bearing film is a functional film used when the PCB substrate is thinner, and can not only prevent the product from deforming, but also prevent the welding disc and the circuit from being corroded by chemical agents, prevent the surface of the product from being scratched and the like.

However, when peeling the carrier film, the thin PCB is easily warped during peeling, and the warpage is generally between 1.5MM and 3.5 MM. Such articles are prone to quality problems in subsequent processing and do not meet customer requirements.

In the FPC process, a carrier film is often used, and the substrate is easily bent excessively to be deformed and wrinkled even when the carrier film is peeled off.

SUMMERY OF THE UTILITY MODEL

In view of the above, the utility model provides a prevent warping carrier film stripping apparatus for protection sheet metal PCB or FPC do not warp when peeling off the carrier film.

A warp-proof carrier film stripping device comprises an operation platform and a case positioned at the bottom of the operation platform;

the operation table is internally provided with a cavity, a panel positioned at the top of the operation table is provided with a punching array, and the cavity is communicated with the outside through the punching array;

an air pump is installed in the case and is connected with the cavity of the operating platform through an air exhaust pipe.

Preferably, a heating pipe is installed in the cavity of the operating platform and used for heating the PCB or the FPC and reducing the viscosity of the bearing film.

Preferably, the panel is detachably mounted on the top of the operating table body;

the panel with different hole diameters and different hole distances of a plurality of punching arrays can be manufactured so as to be suitable for PCBs or FPCs with different specifications.

Preferably, the operating platform is provided with an exhaust nozzle which is positioned at the rear side of the bottom of the operating platform;

the exhaust nozzle is designed at the rear part of the operating platform, so that the influence of the exhaust pipe on normal operation is avoided.

Preferably, the exhaust nozzle is provided with an inner cavity in an inverted triangle shape, the upper part of the inner cavity is communicated with the cavity of the operating platform, and the bottom of the inner cavity is communicated with the exhaust pipe;

the width of the air flow direction is narrowed, so that air pressure can be diffused to the front part of the panel more easily, and the suction force of each through hole of the punching array is more uniform.

Preferably, the panel comprises an upper layer of PET and a bottom layer of sheet metal;

the bottom metal sheet is heat conduction more easily, and the temperature changes more easily, and after its upper portion increased the PET layer, PET layer heat conductivity is poor, and the temperature changes slowly relatively, and PET material does not have metal material hardness height in addition, consequently contacts PCB or FPC goods with the PET layer, can avoid hard contact between goods and the panel to cause the damage, can also avoid various factors to lead to the panel temperature sudden rise and damage the goods.

Preferably, the panel is provided with a temperature sensor for measuring the temperature of the PET layer of the panel;

in order to measure accurately and install conveniently, the side of PET layer is provided with the gap that is used for installing temperature sensor.

Preferably, a temperature control device and a power supply device are installed in the case;

the temperature control device is matched with the temperature sensor, and the power supply device is used for supplying power to the heating pipe and other electric devices;

various products and carrier films have different tolerance temperatures, so that a temperature range needs to be set to avoid damaging the products due to overheating, or the temperature is not enough to achieve the purpose of reducing the viscosity of the carrier film, and the temperature is usually set within the range of 65 +/-1 ℃.

Preferably, the device also comprises a support screw rod, wherein the support screw rod is arranged between the operating platform and the case, and is used for supporting the operating platform and suspending the bottom of the operating platform;

blind holes for fixing the top of the supporting screw are formed in the periphery of the bottom of the operating platform;

a through hole is formed in the top plate of the case and used for fixing a through hole at the bottom of the supporting screw rod;

the blind holes and the through holes are in one-to-one correspondence.

Preferably, the number of the operation platforms is at least one, but the heating of the product generally needs more than 3 seconds, if only one operation platform exists, an operator needs to wait, and if the waiting time is short, the viscosity of the carrier film is high, the product is warped when being peeled;

if a plurality of operation platforms exist, an operator can alternately operate the operation platforms in turn, so that waiting time is eliminated;

because the PET sheet material is used as the top layer material of the panel and the heating temperature is only about 65 ℃, the warping of the product caused by uneven heating can not occur in a short time after the heating time exceeds 3 seconds.

The utility model has the advantages that: a warp-proof carrier film stripping device comprises an operation platform and a case positioned at the bottom of the operation platform; the operation table is internally provided with a cavity, a panel positioned at the top of the operation table is provided with a punching array, and the cavity is communicated with the outside through the punching array; an air pump is arranged in the case and is connected with the cavity of the operating platform through an air exhaust pipe; the device can protect the thin PCB or FPC from warping and deforming when the carrier film is peeled off.

Drawings

The following describes the anti-warping carrier film peeling apparatus of the present invention with reference to the accompanying drawings.

Fig. 1 is a perspective view of the utility model of an anti-warping carrier film peeling device.

Fig. 2 is a left side perspective cut-away view of the console.

Fig. 3 is a front view shape schematic diagram of the exhaust nozzle.

Fig. 4 is a diagram showing the components inside the housing.

In the figure:

1-operation table, 11-panel, 111-PET layer, 112-metal plate layer, 113-temperature sensor, 114-gap, 12-punching array, 13-heating pipe, 14-exhaust nozzle, 2-cabinet, 21-air pump, 22-air pipe, 23-temperature control device, 24-power supply device and 3-support screw.

Detailed Description

The utility model relates to a warp-proof carrier film stripping equipment is further explained with reference to the attached figures 1-4.

A warp-proof carrier film stripping device comprises an operation platform 1 and a case 2 positioned at the bottom of the operation platform 1;

the operation table 1 is internally provided with a cavity, a panel 11 positioned at the top of the operation table 1 is provided with a punching array 12, and the cavity is communicated with the outside through the punching array 12;

the case 2 is internally provided with a suction pump 21, and the suction pump 21 is connected with the cavity of the operation table 1 through a suction pipe 22.

In this embodiment, a heating pipe 13 is installed in the cavity of the console 1, and the heating pipe 13 extends horizontally in the front-rear direction;

in order to uniformly heat the panel 11, a plurality of heating pipes 13 are arranged in parallel at equal intervals in the cavity of the operating table 1.

In this embodiment, the panel 11 is detachably mounted on the top of the console 1 body;

the panel with the corresponding punching array specification can be manufactured aiming at PCBs and FPCs with different specifications, for example, the punching array with the punching circle center spacing of 1cm and the punching diameter of 0.5cm has good effect on the conventional PCBs.

In this embodiment, the console 1 is provided with an exhaust nozzle 14, and the exhaust nozzle 14 is located at the rear side of the bottom of the console 1.

In this embodiment, the exhaust nozzle 14 has an inner cavity in the shape of an inverted triangle, and a sleeve is arranged at the bottom of the exhaust nozzle 14 and is used for being sleeved with the exhaust pipe;

the upper part of the inner cavity is communicated with the cavity of the operation platform 1, the bottom of the inner cavity is communicated with the air exhaust pipe 22, when the air exhaust pump 21 works, air in the cavity of the operation platform 1 is exhausted by the air exhaust nozzle 14 through the air exhaust pipe 22, and each punched hole of the punched hole array 12 generates suction force to suck the PCB or the FPC.

In this embodiment, the panel 11 includes an upper PET layer 111 and a bottom metal plate layer 112, the PCB or the FPC is placed on the PET layer 111 during operation, and the metal plate layer 112 is a heating surface facing the heating tube 13 and keeps a certain gap with the heating tube 13.

In the present embodiment, the panel 11 is mounted with a temperature sensor 113;

the side of the PET layer 111 is provided with a slit 114 for mounting the temperature sensor 113.

In this embodiment, a temperature control device 23 and a power supply device 24 are installed in the case 2;

the temperature control device 23 monitors the temperature of the PET layer 111 in real time through the temperature sensor 113, and controls the power on/off of the power supply device and the heating pipe 13, so that the temperature of the PET layer 111 is kept within a preset temperature range.

In the embodiment, the device further comprises a support screw rod 3;

blind holes for fixing the top of the supporting screw rod 3 are formed in the periphery of the bottom of the operating platform 1;

a through hole is formed in the top plate of the case 2 and used for fixing a through hole at the bottom of the supporting screw rod 3;

the blind holes and the through holes are in one-to-one correspondence.

In this embodiment, the number of the operation platforms is two, which is just suitable for one operator to perform work.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications can be made without departing from the principle of the present invention, and these modifications should also be regarded as the protection scope of the present invention.

Claims

1. The anti-warping carrier film peeling equipment is characterized by comprising an operation table (1) and a case (2) positioned at the bottom of the operation table (1);

the operating table (1) is internally provided with a cavity, a panel (11) positioned at the top of the operating table (1) is provided with a punching array (12), and the cavity is communicated with the outside through the punching array (12);

an air pump (21) is installed in the case (2), and the air pump (21) is connected with a cavity of the operating platform (1) through an air pumping pipe (22).

2. The peeling apparatus for warp-resistant carrier film according to claim 1, wherein a heating pipe (13) is installed in the cavity of the operation table (1).

3. The peeling apparatus for warp-proof carrier film according to claim 2, wherein the panel (11) is detachably mounted on the top of the body of the operation table (1).

4. The warp-resistant carrier film peeling apparatus as claimed in claim 3, wherein said operation table (1) is provided with an exhaust nozzle (14), said exhaust nozzle (14) being located at a bottom rear side of said operation table (1).

5. The anti-warping carrier film peeling apparatus according to claim 4, wherein the exhaust nozzle (14) has an inner cavity in the shape of an inverted triangle, an upper portion of the inner cavity is communicated with the cavity of the operation table (1), and a bottom portion of the inner cavity is communicated with the exhaust pipe (22).

6. The peeling apparatus for warp-resistant carrier film as claimed in claim 5, wherein said panel (11) comprises an upper PET layer (111) and a bottom metal plate layer (112).

7. The peeling apparatus for a warp-proof carrier film as claimed in claim 6, wherein said panel (11) is mounted with a temperature sensor (113);

the side surface of the PET layer (111) is provided with a gap (114) for installing the temperature sensor (113).

8. The peeling apparatus for anti-warping carrier film according to claim 7, wherein a temperature control device (23) and a power supply device (24) are installed in the cabinet (2).

9. The peeling apparatus for a warp-resistant carrier film according to claim 8, further comprising a support screw (3);

blind holes for fixing the top of the supporting screw rod (3) are formed in the periphery of the bottom of the operating platform (1);

a through hole is formed in the top plate of the case (2) and used for fixing a through hole at the bottom of the supporting screw rod (3);

the blind holes and the through holes are in one-to-one correspondence.

10. The peeling apparatus for warp-proof carrier film according to claim 9, wherein the number of the operation tables (1) is 1 or more.