CN212542366U

CN212542366U - Full-automatic visual inspection machine for wafers

Info

Publication number: CN212542366U
Application number: CN202021571836.4U
Authority: CN
Inventors: 颜博
Original assignee: Suzhou Xinshangsi Automation Equipment Co Ltd
Current assignee: Suzhou Xinshangsi Automation Equipment Co Ltd
Priority date: 2020-07-31
Filing date: 2020-07-31
Publication date: 2021-02-12
Anticipated expiration: 2030-07-31

Abstract

The utility model discloses a full-automatic visual inspection machine of wafer, it includes that wafer material collecting system, wafer receive material system, wafer detecting system and wafer get and send the manipulator. The utility model discloses an aspect can realize the full-automatic artifical visual inspection of wafer, not only efficient, but also reduce the wafer spoilage; on the other hand is simplifying under the prerequisite of wafer carrier structure, the location of accessible point or line contact's mode realization wafer for area of contact is little, and under the spacing protection of draw-in groove, no matter how flip motion can not take place the wafer and drop, and the rotation of wafer moreover can satisfy and realize the comprehensive on-line measuring requirement of wafer under different angles, ensures the accuracy of detecting.

Description

Full-automatic visual inspection machine for wafers

Technical Field

The utility model belongs to the machine field is examined to the wafer eye, concretely relates to machine is examined to full-automatic eye of wafer.

Background

The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular, and various circuit element structures can be manufactured on the silicon wafer to form an IC product with specific electrical functions. The starting material for the wafer is silicon, while the crust surface has an inexhaustible amount of silicon dioxide. The silicon dioxide ore is refined by an electric arc furnace, chloridized by hydrochloric acid and distilled to prepare high-purity polysilicon with the purity as high as 99.999999999 percent. The polysilicon is melted by the wafer manufacturer, and then seeded in the melt, which is then slowly pulled out to form a cylindrical monocrystalline silicon ingot, which is called "crystal growth" because the silicon ingot is formed by the gradual growth of a seed crystal defined by the orientation of one crystal plane in the molten silicon feedstock. The silicon crystal bar is cut, milled, sliced, chamfered, polished, laser etched and packed to form the basic material of integrated circuit factory, i.e. silicon wafer.

Therefore, when the wafer is processed, microscopic particles, scratches, pollution and the like of the wafer need to be detected, so that a manual visual inspection machine is appeared in the market, and the manual visual inspection machine basically comprises a wafer loading system, a wafer receiving system, a wafer detection system and a wafer taking and sending manipulator, wherein the wafer taking and sending manipulator can transfer the wafer in the systems, and basically all the operations are manual, so that the wafer damage rate is high when the wafer is detected.

Then, the detecting system of the manual visual inspection machine mainly comprises a wafer carrier and an online visual inspection mechanism, wherein the wafer is adsorbed on the wafer carrier through negative pressure, the online visual inspection mechanism mainly comprises a strong light lamp capable of irradiating on the surface of the wafer, and when the detecting is carried out, the light of the strong light lamp irradiates on the surface of the wafer so as to observe the conditions of particles, scratches, pollution and the like on the surface of the wafer.

However, in the above-described inspection system, there are the following drawbacks:

1) when the wafer is adsorbed under negative pressure, the contact area with the wafer is large, so that the wafer is not beneficial to overall detection;

2) because the strong light lamp has a certain irradiation range, in order to realize the overall detection of the wafer, either the wafer carrier rotates or the strong light lamp rotates, when the wafer carrier rotates, the positioning adsorption also rotates along with the wafer carrier, thus not only forming a detection obstacle, but also easily causing the falling of the wafer; this is more difficult to control when the accent light is turned.

Disclosure of Invention

The utility model aims to solve the technical problem that a full-automatic machine of examining of modified wafer is provided.

For solving the technical problem, the utility model discloses a following technical scheme:

a full-automatic visual inspection machine of wafer, it includes:

the wafer loading system comprises a supply box capable of stacking and storing wafers, and a loader for supplying the wafers one by one along the vertical direction;

the wafer receiving system comprises receiving boxes capable of stacking and collecting wafers and a material collector for collecting the wafers one by one along the vertical direction;

the wafer detection system comprises a wafer carrier and an online visual inspection mechanism, wherein the wafer carrier comprises a frame seat, a frame ring which can be freely and rotatably arranged on the frame seat along the radial direction of the wafer carrier, a supporting part which is arranged on the frame ring and can form a positioning area matched with the outer diameter of the wafer, and a clamping part which is arranged on the frame ring and can synchronously abut against the periphery of the wafer, wherein a clamping groove matched with the edge of the wafer is formed on the end surface of the clamping part, and the clamping groove is in point or line contact with the periphery of the wafer; the wafer detection system also comprises a first turnover mechanism which is arranged on the frame seat and used for driving the frame ring to rotate freely, and a second turnover mechanism which is used for driving the frame seat to rotate freely around the center extending in the vertical direction, wherein the rotating axis of the first turnover mechanism is intersected with the rotating axis of the second turnover mechanism;

and the wafer taking and delivering manipulator can transfer wafers among the wafer feeding system, the wafer receiving system and the wafer detection system.

Preferably, the rotating axis of the first turnover mechanism is perpendicular to the rotating axis of the second turnover mechanism. Therefore, the online detection requirement of the surface of the wafer can be comprehensively realized at different angles, and the detection accuracy is ensured.

Preferably, the support member comprises a plurality of support modules extending in a radial direction of the carrier ring towards a central portion of the carrier ring, wherein ends of the plurality of support modules remote from the carrier ring form the positioning zone.

Further, a plurality of support modules are symmetrically distributed on the two frame rings about the rotation center line of the frame rings. The arrangement is convenient for the control of rotation balance and the rotation is convenient to implement.

According to a specific implementation and preferred aspect of the utility model, the clamping part includes a plurality of along the radial clamping module that extends to the ring middle part of frame ring and drive a plurality of clamping module simultaneous movement with the centre gripping or break away from the power ware of wafer, wherein the draw-in groove is located every clamping module and keeps away from the terminal surface of frame ring. Therefore, under the synchronous conflict clamping, the center of the clamping center and the center of the wafer coincide, the clamping accuracy and stability are further ensured, and the surface visual inspection after the subsequent overturning angle is adjusted is facilitated.

Preferably, the rack ring is provided with at least two sliding rails extending along the radial direction of the rack ring, the power devices and the sliding rails are arranged in one-to-one correspondence, and the power devices move synchronously.

Specifically, two slide rails are arranged on the same straight line, wherein the connecting line of the two slide rails is arranged in parallel with the rotation center line of the frame ring;

each power device comprises a base which is correspondingly arranged on the slide rail in a sliding manner, an arc-shaped connecting strip which is used for connecting the base with the end parts of the plurality of clamping modules far away from the clamping grooves, and a driving piece which drives the base to linearly move on the slide rail; wherein the arc connecting strip corresponds and is equipped with two, and a plurality of centre gripping modules are around rotating the central line symmetric distribution on two arc connecting strips. The advantage of setting up like this, not only be convenient for the balanced control of rotation, the centre gripping is more firm.

Preferably, the depth of the clamping groove is 0.1-2.0 mm. In this example, the depth of the slot is 0.5 mm.

According to the utility model discloses a concrete implementation and preferred aspect form in one side that the frame ring corresponds rotation center line and dodge the wafer and get the breach that send the manipulator to get and put the wafer to be the C type, support component and hold assembly correspond and set up on the frame ring of C type. Through the arrangement of the notch, the wafer taking and placing of the wafer taking and sending manipulator are very convenient, and the detection efficiency is greatly improved.

In addition, the frame seat comprises a frame disc formed in a circular shape and two frame arms extending upwards from the inside of the frame disc, the frame ring is respectively connected between the two frame arms through pivots, and the two frame arms can avoid the rotation of the frame ring.

Preferably, the first turnover mechanism comprises a turnover motor arranged on the frame arm and a first transmission piece used for connecting the turnover motor with the pivot in a transmission way; the second turnover mechanism comprises a turnover seat arranged on the visual inspection machine frame plate, a rotating shaft, a driving motor and a second transmission part, wherein the rotating shaft is vertically extended in the turnover seat, the second transmission part is used for connecting the driving motor and the rotating shaft in a transmission manner, the upper end part of the rotating shaft is fixed at the bottom of the frame disc through a connecting piece, and the center of the rotating shaft is coincided with the center of the frame disc.

Preferably, full-automatic visual inspection machine still includes the casing, wherein the casing inner wall is black or grey, and including last unloading district and the detection zone that is linked together, the wafer is got and is sent the manipulator setting and is in go up in the unloading district, just go up the unloading district and have feed inlet and material receiving mouth, the wafer material loading system with the wafer material receiving system corresponds the setting and is in feed inlet and material receiving mouth, wafer detection system be located the detection zone in, and form detection window on the side of detection zone.

Due to the implementation of the above technical scheme, compared with the prior art, the utility model have the following advantage:

the utility model discloses an aspect can realize the full-automatic artifical visual inspection of wafer, not only efficient, but also reduce the wafer spoilage; on the other hand is simplifying under the prerequisite of wafer carrier structure, the location of accessible point or line contact's mode realization wafer for area of contact is little, and under the spacing protection of draw-in groove, no matter how flip motion can not take place the wafer and drop, and the rotation of wafer moreover can satisfy and realize the comprehensive on-line measuring requirement of wafer under different angles, ensures the accuracy of detecting.

Drawings

Fig. 1 is a schematic top view of the fully automatic visual inspection machine of the present invention;

FIG. 2 is a schematic diagram of the wafer inspection system shown in FIG. 1;

FIG. 3 is an exploded view of the structure of FIG. 2 (with the wafer omitted);

wherein: K. a housing; k1, a feeding and discharging area; k10, feed inlet; k11, a receiving port; k2, detection zone;

G. a wafer loading system; g1, supply box;

s, a wafer receiving system; s1, collecting box;

q, a wafer taking and delivering manipulator; q1, a material taking head;

A. a wafer detection system; 1. a wafer carrier; 10. a frame seat; 100. a shelf tray; 101. a boom arm; 11. a frame ring; q, a gap; 12. a support member; 120. a support module; 13. a clamping member; 130. a clamping module; c. a card slot; 131. a power device; a. a base; b. an arc-shaped connecting strip; d. a drive member; 14. a slide rail; 2. an online visual inspection mechanism; 20. a highlight lamp; 3. a first turnover mechanism; 30. a turnover motor; 4. a second turnover mechanism; 40. a turning seat; 41. a rotating shaft; 42. a drive motor; 43. a second transmission member; 44. a connecting member;

J. a wafer; B. visually inspecting the frame plate.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention is described in detail with reference to the accompanying drawings and the detailed description thereof. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

As shown in fig. 1, the full-automatic visual inspection machine of the present embodiment includes a housing K, a wafer loading system G, a wafer receiving system S, a wafer detecting system a, and a wafer picking and delivering robot Q.

Specifically, casing K includes unloading district K1 and detection zone K2 that are linked together, and wherein unloading district K1 has feed inlet K10 and material receiving port K11, forms the detection window on the side of detection zone K2.

In this example, the inner and outer walls of the casing K are black (of course, other dark series are possible). The interference of external light is prevented, and the detection accuracy is improved.

The wafer taking and conveying manipulator Q is arranged in the material loading and unloading area k1, the wafer loading system G and the wafer receiving system S are correspondingly arranged at the material inlet k10 and the material receiving opening k11, and the wafer detection system A is located in the detection area k 2.

The wafer loading system G comprises a supply box G1 capable of stacking and storing wafers, and a loader for supplying wafers one by one along the vertical direction. In the art, it is quite common to achieve a laminated product, which is not described in detail here, but is clearly implementable, on a sheet-by-sheet basis.

The wafer receiving system S comprises a receiving box S1 capable of stacking and collecting wafers, and a material collector for collecting the wafers one by one along the vertical direction; it is also quite common in the art to achieve sheet-by-sheet receipt of stacked products, which is not described in detail herein, and which is clearly practicable.

And a wafer taking and delivering manipulator Q which can transfer the wafer J among the wafer loading system G, the wafer receiving system S and the wafer detection system A. Is also conventional and employs vacuum suction to position wafer J on pick head q 1.

Meanwhile, referring to fig. 2, the wafer inspection system a includes a wafer carrier 1, an online visual inspection mechanism 2, a first turnover mechanism 3, and a second turnover mechanism 4.

Specifically, the wafer carrier 1 includes a frame base 10, a frame ring 11 disposed on the frame base 10 and capable of freely rotating around its radial direction, a support member 12 disposed on the frame ring 11 and capable of forming a positioning area matching with the outer diameter of the wafer J, and a clamping member 13 disposed on the frame ring 11 and capable of synchronously abutting against the periphery of the wafer J.

In this example, the mount 10 includes a circular mount plate 100 and two mount arms 101 extending upward from the inside of the mount plate 100, and the mount ring 11 is pivotally connected between the two mount arms 101, respectively, and the two mount arms 101 are capable of avoiding the rotation of the mount ring 11.

A notch q avoiding the wafer taking and delivering manipulator to take and place the wafer J is formed on one side of the frame ring 11 corresponding to the rotation center line and is C-shaped, and the supporting part 12 and the clamping part 13 are correspondingly arranged on the C-shaped frame ring 11. Through the arrangement of the notch, the wafer taking and placing of the wafer taking and sending manipulator are very convenient, and the detection efficiency is greatly improved.

The support member 12 includes four support modules 120 extending along a radial direction of the frame ring 11 toward a middle of the frame ring 11, wherein ends of the plurality of support modules 120 away from the frame ring 11 form a positioning region.

The four support modules 120 are symmetrically distributed on the two gantry rings 11 about the rotation center line of the gantry rings 11. The arrangement is convenient for the control of rotation balance and the rotation is convenient to implement.

The chucking member 13 includes four chucking modules 130 extending toward the middle of the frame ring 11 in the radial direction of the frame ring 11, and a power unit 131 for driving the plurality of chucking modules 130 to move synchronously to chuck or unclamp the wafer J.

In this example, a catching groove c recessed inward from the end surface is formed at an end of each of the grip modules 130 remote from the carrier ring 11. Therefore, under the synchronous conflict clamping, the center of the clamping center and the center of the wafer coincide, the clamping accuracy and stability are further ensured, and the surface visual inspection after the subsequent overturning angle is adjusted is facilitated.

Specifically, the clamping groove c is matched with the circumferential edge of the wafer J, and the clamping groove c is in point or line contact with the periphery of the wafer J.

In this example, the depth of the slot is 0.5 mm. In this case, the clamping is stable, and the contact area is small.

Meanwhile, the rack ring 11 is provided with two slide rails 14 extending along the radial direction of the rack ring 11, the two slide rails 14 are provided, the power devices 131 are arranged in one-to-one correspondence with the slide rails 14, and the two power devices 131 move synchronously.

Specifically, the two slide rails 14 are located on the same straight line, wherein a connecting line of the two slide rails 14 is parallel to the rotation center line of the frame ring 11.

The power device 131 includes a seat a correspondingly slidably disposed on the slide rail 14, two arc-shaped connecting strips b for connecting the seat a and the end portions of the plurality of clamping modules 130 far away from the clamping grooves c, and a driving member d for driving the seat a to linearly move on the slide rail 14, wherein the number of the arc-shaped connecting strips b is two, and the plurality of clamping modules 130 are symmetrically distributed on the two arc-shaped connecting strips b about the rotation center line. The advantage of setting up like this, not only be convenient for the balanced control of rotation, the centre gripping is more firm.

The driving member d may be a cylinder. Of course, hydraulic or electric telescopic cylinders are also possible.

Meanwhile, it should be noted that the four support modules 120 and the four clamping modules 130 are disposed in a one-to-one correspondence, and are also disposed symmetrically with respect to a direction (also radial direction) perpendicular to the rotation axis of the frame ring 11.

Two arc-shaped connecting strips b are also symmetrically arranged above the frame ring 11. The advantage of setting up like this is, convenient centre gripping, and after centre gripping wafer J, the centre of a circle that arc connecting strip b corresponds also coincides with the center of wafer J.

In this embodiment, the on-line visual inspection mechanism 2 includes a high intensity light 20 capable of irradiating the wafer J, wherein the high intensity light 20 is correspondingly disposed above the wafer carrier 1.

In this example, the first flipping mechanism 3 comprises a flipping motor 30 arranged on the frame arm 101, and a first transmission member for connecting the flipping motor 30 with the pivot in a transmission manner, wherein the first transmission member is a gear or a pulley.

Referring to fig. 3, the second turnover mechanism 4 includes a turnover seat 40 disposed on the frame B of the visual inspection machine, a vertically extending rotating shaft 41 disposed in the turnover seat 40, a driving motor 42, and a second transmission member 43 for driving and connecting the driving motor 42 and the rotating shaft, wherein the upper end of the rotating shaft 41 is fixed at the bottom of the frame tray 100 through a connecting member 44, and the center of the rotating shaft 41 coincides with the center of the frame tray 100.

Specifically, the second transmission member 43 is a pulley.

Meanwhile, the rotation axis lines of the first turnover mechanism 3 and the second turnover mechanism 4 are vertically arranged. Therefore, the online detection requirement of the surface of the wafer can be comprehensively realized at different angles, and the detection accuracy is ensured.

In summary, the present embodiment has the following advantages:

1. the full-automatic manual visual inspection of the wafer can be realized, the efficiency is high, and the wafer damage rate is reduced;

2. on the premise of simplifying the structure of the wafer carrier, the positioning of the wafer can be realized through a point or line contact mode, so that the contact area is small, the comprehensive detection of the wafer is convenient to implement, and meanwhile, under the limit protection of the clamping groove, the wafer cannot fall off no matter how the wafer turns over;

3. through the rotation of the wafer around the horizontal direction, the wafer carrier rotates around the vertical direction so as to meet the requirement of realizing the online detection of the surface of the wafer at different angles and ensure the accuracy of the detection.

The present invention has been described in detail, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and to implement the same, and the protection scope of the present invention should not be limited thereby, and all equivalent changes or modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.

Claims

1. A full-automatic visual inspection machine of wafer, it includes:

the wafer detection system comprises a wafer carrier and an online visual inspection mechanism;

and a wafer pick-and-place robot capable of transferring wafers among the wafer loading system, the wafer receiving system, and the wafer inspection system,

the method is characterized in that: the wafer carrier comprises a frame seat, a frame ring which can be freely and rotatably arranged on the frame seat around the radial direction of the frame ring, a supporting component which is arranged on the frame ring and can form a positioning area matched with the outer diameter of a wafer, and a clamping component which is arranged on the frame ring and can synchronously abut against the periphery of the wafer, wherein a clamping groove matched with the edge of the wafer is formed on the end surface of the clamping component, and the clamping groove is in point or line contact with the periphery of the wafer;

the wafer detection system also comprises a first turnover mechanism which is arranged on the frame seat and used for driving the frame ring to rotate freely, and a second turnover mechanism which is used for driving the frame seat to rotate freely around the center extending in the vertical direction, wherein the rotating axis of the first turnover mechanism is intersected with the rotating axis of the second turnover mechanism.

2. The fully automatic visual inspection machine of wafers of claim 1, wherein: the rotating axis of the first turnover mechanism is perpendicular to the rotating axis of the second turnover mechanism.

3. The fully automatic visual inspection machine of wafers of claim 1, wherein: the supporting component comprises a plurality of supporting modules which extend to the middle of the frame ring along the radial direction of the frame ring, wherein the end parts of the plurality of supporting modules far away from the frame ring form the positioning area, and the plurality of supporting modules are symmetrically distributed on the two frame rings about the rotation center line of the frame ring.

4. The fully automatic visual inspection machine of wafers of claim 1, wherein: the clamping component comprises a plurality of clamping modules and a power device, the clamping modules extend to the middle of the frame ring along the radial direction of the frame ring, the power device drives the clamping modules to synchronously move so as to clamp or separate the wafer, and the clamping grooves are located on the end face, away from the frame ring, of each clamping module.

5. The fully automatic visual inspection machine of wafers of claim 4, wherein: the frame ring is provided with two slide rails extending along the radial direction of the frame ring, the two slide rails are positioned on the same straight line, the power devices are arranged corresponding to the slide rails one by one, and the power devices move synchronously,

wherein the connecting line of the two slide rails is arranged in parallel with the rotation center line of the frame ring;

each power device comprises a seat correspondingly arranged on the slide rail in a sliding manner, an arc-shaped connecting strip used for connecting the seat with the end parts of the clamping modules far away from the clamping grooves, and a driving piece used for driving the seat to move linearly on the slide rail; the clamping modules are symmetrically distributed on the two arc-shaped connecting strips around the rotation center line.

6. The fully automatic visual inspection machine of wafers of claim 1, wherein: the depth of the clamping groove is 0.1-2.0 mm.

7. The fully automatic visual inspection machine of wafers of claim 1, wherein: and a C-shaped notch for avoiding the wafer taking and placing manipulator to take and place the wafer is formed on one side of the frame ring corresponding to the rotation center line, and the support component and the clamping component are correspondingly arranged on the C-shaped frame ring.

8. The fully automatic visual inspection machine of wafers of claim 1, wherein: the frame seat comprises a circular frame disc and two frame arms extending upwards from the inside of the frame disc, the frame ring is respectively connected between the two frame arms through a pivot, and the two frame arms can avoid the rotation of the frame ring.

9. The fully automatic visual inspection machine of wafers of claim 8, wherein: the first turnover mechanism comprises a turnover motor arranged on the frame arm and a first transmission piece used for connecting the turnover motor with the pivot in a transmission way; the second turnover mechanism comprises a turnover seat arranged on the visual inspection machine frame plate, a vertically extending rotating shaft, a driving motor and a second transmission piece, wherein the rotating shaft, the driving motor and the second transmission piece are arranged in the turnover seat, the driving motor and the rotating shaft are connected in a transmission manner, the upper end part of the rotating shaft is fixed to the bottom of the frame plate through a connecting piece, and the center of the rotating shaft is coincided with the center of the frame plate.

10. The fully automatic visual inspection machine of wafers of claim 1, wherein: full-automatic visual inspection machine still include the casing, wherein the casing is including last unloading district and the detection zone that is linked together, the wafer is got and is sent the manipulator setting and is in go up the unloading district, just go up the unloading district and have feed inlet and material receiving mouth, the wafer go up the material system with the wafer material receiving system corresponds the setting and is in feed inlet and material receiving mouth, wafer detecting system be located the detection zone in, just form detection window on the side of detection zone.