CN211920126U - Automatic look for reference code reading equipment - Google Patents
Automatic look for reference code reading equipment Download PDFInfo
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- CN211920126U CN211920126U CN202020177844.4U CN202020177844U CN211920126U CN 211920126 U CN211920126 U CN 211920126U CN 202020177844 U CN202020177844 U CN 202020177844U CN 211920126 U CN211920126 U CN 211920126U
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- 235000012431 wafers Nutrition 0.000 claims description 211
- 230000007246 mechanism Effects 0.000 claims description 35
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- 230000009286 beneficial effect Effects 0.000 abstract 1
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
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- 238000004519 manufacturing process Methods 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
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- 230000003028 elevating effect Effects 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
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- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
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Abstract
The utility model provides an automatic parameter searching and reading device, which comprises a wafer loading and unloading device, a wafer transferring box and a wafer box, wherein the wafer loading and unloading device is used for placing the wafer transferring box and the wafer box; the robot device is used for grabbing and transferring the wafer; the reference searching and reading device is used for reading the relevant information of the wafer and searching the reference edge; the wafer loading and unloading device is communicated with the reference searching and reading device through the robot device, the wafer in the wafer transfer box on the wafer loading and unloading device is taken out and placed on the reference searching and reading device, after the reference searching and reading, the wafer is placed on the wafer box, and the inverted basket carrying is carried out. The beneficial effects of the utility model are that can realize automatic and accurate looking for the reference limit, read and beat the reference numeral and carry the basket of falling, avoid the artificial risk of reading by mistake, increase the granularity effectively, improve and read a yard efficiency, reduce intensity of labour, reduce the cost of labor.
Description
Technical Field
The utility model belongs to the technical field of silicon chip production facility, especially, relate to an automatic seek reference reading equipment.
Background
In the process of silicon wafer production, the silicon wafer needs to be carried, and in the process of carrying the silicon wafer, particles and error data are easily generated by manual carrying and handheld reading, so that the working efficiency is low, and the labor intensity is high.
Disclosure of Invention
In view of the above problem, the to-be-solved problem of the utility model is to provide an automatic seek reference code reading equipment, through automation equipment, transport that can be quick to guarantee the cleanliness factor, improve information reading correct rate, improve degree of automation.
In order to solve the technical problem, the utility model discloses a technical scheme is: an automatic reference searching and reading device, characterized in that: comprises the steps of (a) preparing a mixture of a plurality of raw materials,
the wafer loading and unloading device is used for placing the wafer transfer box and the wafer box;
the robot device is used for grabbing and transferring the wafer;
the reference searching and reading device is used for reading the relevant information of the wafer and searching the reference edge;
the wafer loading and unloading device is communicated with the reference searching and reading device through the robot device, the wafer in the wafer transfer box on the wafer loading and unloading device is taken out and placed on the reference searching and reading device, after the reference searching and reading, the wafer is placed on the wafer box, and the inverted basket carrying is carried out.
Specifically, the wafer handling device comprises a positioning mechanism, a cover opening mechanism and a handling control device, wherein the positioning mechanism and the cover opening mechanism are both electrically connected with the handling control device, and the handling control device controls the cover opening mechanism to act according to the information of the positioning mechanism.
Specifically, the robot device comprises a wafer scanning device and a sucking and carrying device, the wafer scanning device is arranged on the sucking and carrying device, wherein,
the wafer scanning device is used for detecting the positions and the number of the wafers in the wafer transfer box and the wafer box;
the sucking and conveying device is used for sucking and conveying the wafer.
Further, the suction and carrying device comprises a robot body, a suction device, a first connecting arm, a second connecting arm and a third connecting arm, wherein,
one end of the first connecting arm is connected with the robot body, the other end of the first connecting arm is connected with the second connecting arm, the first connecting arm can rotate and lift relative to the robot body, and meanwhile, the second connecting arm can rotate relative to the first connecting arm;
the other end of the second connecting arm is connected with a third connecting arm, and the third connecting arm can rotate relative to the second connecting arm;
the suction device is connected with the third connecting arm, and the suction device can rotate relative to the third connecting arm.
Further, the suction device is a vacuum chuck.
Further, the wafer scanning device is a scanning sensor.
Specifically, the parameter searching and reading device comprises a parameter searching and rotating device, a reference edge detecting device, a wafer information reading device and a bearing device,
the bearing device is connected with the reference searching and rotating device and is used for bearing the wafer;
the reference edge detection device is connected with the reference searching rotating device, and the reference edge detection device and the bearing device are correspondingly arranged and used for searching a reference edge for the wafer;
the wafer information reading device is arranged on two sides of the bearing device and used for reading the wafer information.
Further, the reference edge detection device is a linear sensor.
Furthermore, the wafer information reading device is a code reader.
Furthermore, the automatic parameter searching and reading equipment also comprises a control device which is respectively electrically connected with the wafer loading and unloading device, the parameter searching and reading device and the robot device and controls the wafer loading and unloading device, the parameter searching and reading device and the robot device to act.
By adopting the technical scheme, the automatic parameter searching and reading equipment is compact in structure and convenient to mount and dismount, is provided with the wafer loading and unloading device, the robot device and the parameter searching and reading device, can automatically and accurately search the reference edge, read the marking number and carry the inverted basket, effectively avoids the risk of artificial error reading and granularity increase, improves the code reading efficiency, reduces the labor intensity, reduces the labor cost, is high in automation degree, and can accurately, quickly and efficiently carry out crystal carrying and parameter searching and code reading.
Drawings
Fig. 1 is a schematic view of a directional structure according to an embodiment of the present invention;
fig. 2 is another schematic structural view of an embodiment of the present invention;
fig. 3 is a schematic top view of a wafer handling device according to an embodiment of the present invention;
fig. 4 is a schematic structural view of a wafer handling device according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a reference searching and code reading apparatus according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a robot apparatus according to an embodiment of the present invention.
In the figure:
1. frame 2, wafer loading and unloading device 3, and parameter searching and reading device
4. Robot device 20, lid opening mechanism 21, and positioning mechanism
201. Opening cover 202, plug-in unit 210, positioning piece
211. Carrier 300, wafer information reading device 301, reference edge detection device
302. Bearing device 303, look for and consult rotating device 400, robot body
401. A first connecting arm 402, a second connecting arm 403, a third connecting arm
404. Suction device
Detailed Description
The invention will be further described with reference to the accompanying drawings and specific embodiments.
Fig. 1 shows the structure schematic diagram of an embodiment of the utility model, specifically shows the structure of this embodiment, and this embodiment relates to an automatic look for and read sign indicating number equipment for the wafer is looked for the reference limit, is read and marks information and fall the basket transport to the storage and the management of wafer information avoid the manual work to look for the limit and cause the granule to increase, and read the sign indicating number efficiently, and degree of automation is high, reduces artifical the participation, improves work efficiency.
An automatic reference searching and reading device is shown in fig. 1 and 2 and comprises a wafer loading and unloading device 2 for placing a wafer transfer box and a wafer box, wherein the wafer transfer box is used for placing wafers which are not searched for reference reading codes, and the wafer box is used for placing wafers which are searched for reference reading codes, so that the wafers can be conveniently stored and placed in an inverted basket for carrying; the robot device 4 is used for grabbing and transferring the wafer, grabbing the wafer without the reference searching and reading code, placing the wafer on the reference searching and reading code device 3, searching and reading the reference searching and reading code, taking down the wafer after the reference searching and reading code is completed, and placing the wafer in a wafer box, so that the manual participation in the wafer carrying process is reduced, and the increase of particles is avoided; the reference searching and reading device 3 is used for reading relevant information and reference searching edges in the production process of the wafer, searching the reference edges of the wafer and reading ID information of the two sides of the wafer; when the automatic parameter searching and reading equipment is used, the wafer loading and unloading device 2 is communicated with the parameter searching and reading device 3 through the robot device 4, wafers in a wafer transfer box on the wafer loading and unloading device 2 are taken out and placed on the parameter searching and reading device 3, after parameter searching and reading, the wafers are placed on the wafer box, basket reversing and carrying are carried out, manual participation is avoided, increase of particles is avoided, and the automatic parameter searching and reading equipment is automatic and controllable and high in working efficiency.
The automatic parameter searching and reading equipment further comprises a control device, wherein the control device is respectively electrically connected with the wafer loading and unloading device 2, the parameter searching and reading device 3 and the robot device 4, and controls the wafer loading and unloading device 2, the parameter searching and reading device 3 and the robot device 4 to act. The control device is provided with an edited program, so that the wafer handling device 2, the robot device 4 and the reference finding and reading device 3 operate according to the program to carry the wafer in a reversed basket manner, find the reference edge and read the double-sided ID information of the wafer.
The automatic parameter searching and reading equipment further comprises an upper system and a display device, wherein the upper system is in communication connection with the control device and is electrically connected with the display device, and the control device transmits information to the upper system, displays the information on the display device and stores the information of the wafer.
The control device can be a PLC controller or other control devices, is selected according to actual requirements, does not make specific requirements, and is communicated with an upper system through RS 232.
The upper system can be a computer or other upper systems, and is selected according to actual requirements, and no specific requirements are made here.
The display device may be a display or other display devices, and is selected according to actual requirements, which are not specifically required here.
The automatic parameter searching and reading equipment further comprises a frame 1, the frame 1 is arranged, the wafer loading and unloading device 2, the robot device 4 and the parameter searching and reading device 3 are convenient to install, the frame 1 is formed by splicing aluminum profiles, a stainless steel plate is fixedly installed outside the aluminum profiles, the whole structure of the frame 1 is stable, and meanwhile, universal wheels are rotatably installed at the bottom of the frame 1, so that the automatic parameter searching and reading equipment is convenient to move.
As shown in fig. 3 and 4, the wafer loading and unloading apparatus 2 includes a positioning mechanism 21, an opening mechanism 20, and a loading and unloading control device, wherein the positioning mechanism 21 and the opening mechanism 20 are electrically connected to the loading and unloading control device, and the loading and unloading control device controls the opening mechanism 20 to operate according to the detection information of the positioning mechanism 21. The wafer transfer box containing the wafers without the reference reading codes is placed on the positioning mechanism 21, the wafer transfer box is positioned, and after the positioning, the cover opening mechanism 20 opens the cover of the wafer transfer box, so that the subsequent operation of the robot device 4 is facilitated, and the wafers are taken.
The positioning mechanism 21 comprises a bearing part 211 and a positioning part 210, the bearing part 211 is fixedly installed on the support frame, the bearing part 211 is of a plate-shaped structure and is fixedly installed on the support frame through a connecting piece such as a bolt, the size of the bearing part 211 is larger than that of the wafer transmission box, the wafer transmission box is convenient to place, and the shape of the bearing part 211 can be matched with that of the wafer transmission box, so that the wafer transmission box is convenient to place; the locating part 210 is fixed on the bearing part 211, the number of the locating part 210 is a plurality of, the locating part is all fixedly installed on the bearing part 211, the locating part can be arranged in a triangular shape or in a quadrilateral shape or in other shapes, the locating part is selected according to actual requirements, the locating part 210 is a locating pin which is vertically arranged on the upper surface of the bearing part 211 and protrudes out of the upper surface of the bearing part 211, and when the wafer transmission box is placed, the wafer transmission box is inserted into the locating part to locate the wafer transmission box. The positioning mechanism 21 further comprises a detecting device for detecting whether a foup is placed on the carrier 211, wherein the detecting device is installed on the upper surface of the carrier 211, and preferably, the detecting device is a gravity sensor.
The cover opening mechanism 20 is fixedly connected with the support frame, the cover opening mechanism 20 is located on one side face of the positioning mechanism 21, the cover opening mechanism 20 and the positioning mechanism 21 are arranged perpendicularly, namely, the cover opening mechanism 20 and the wafer transmission box are placed on the positioning mechanism 21 in parallel and correspond to one side of the wafer transmission box cover, and therefore the cover opening of the wafer transmission box is facilitated. This mechanism 20 of uncapping is including uncapping piece 201, moving member and the support of uncapping, uncapping support fixed mounting on the support frame, moving member and support frame fixed connection, uncapping piece 201 and moving member fixed connection, through the removal of the moving member of moving member, drive and open the action of cover piece 201, uncap to the wafer transfer box. This uncap support is quadrilateral frame 1 structure, and the size of this uncap support suits with the size of uncapping piece 201, is greater than the size of wafer transfer lid, is convenient for open the installation of covering piece 201, carries on spacingly to the motion of uncapping piece 201 simultaneously, and the wafer transfer lid of also being convenient for passes through. This uncap piece 201 is platelike structure, has the plug connector 202 corresponding with spliced eye on the wafer transfer lid, and when uncapping, in the plug connector 202 inserted the spliced eye of wafer transfer lid, the moving member drives and opens the upward movement of cover piece 201, takes off the wafer transfer lid, downstream again for the wafer transfer lid is kept away from the wafer transfer lid, and robot device 4 carries out taking of wafer. Preferably, the moving member is a cylinder, which is a commercially available product and is selected according to actual requirements, and no specific requirement is made here.
The above-mentioned loading and unloading control device is electrically connected to the detection device of the positioning mechanism 21 and the moving member of the cover opening mechanism 20, respectively, and controls the moving member to operate according to the detection signal transmitted from the detection device, and the loading and unloading control device is preferably a PLC controller, and is electrically connected to the control device, and transmits the cover opening information to the control device, and the control device controls the robot device 4 to operate, and takes the wafer.
As shown in fig. 6, the robot device 4 is fixedly connected to the frame 1 by a connecting member such as a bolt. The robot device 4 comprises a wafer scanning device, a robot body 400, a suction device 404, a first connecting arm 401, a second connecting arm 402 and a third connecting arm 403, wherein the wafer scanning device is connected with the first connecting arm 401 and is used for detecting the positions and the number of wafers in a wafer transfer box and a wafer box; one end of the first connecting arm 401 is connected with the robot body 400, the other end of the first connecting arm 401 is connected with the second connecting arm 402, the first connecting arm 401 can rotate and lift relative to the robot body 400, and meanwhile, the second connecting arm 402 can rotate relative to the first connecting arm 401; the other end of the second connecting arm 402 is connected with a third connecting arm 403, and the third connecting arm 403 can rotate relative to the second connecting arm 402; the suction means 404 is connected to the third connecting arm 403, the suction means 404 being rotatable with respect to the third connecting arm 403. The wafer scanning device scans the positions and the number of the wafers in the wafer transmission box and the wafer box, a basis is provided for the actions of the first connecting arm 401, the second connecting arm 402, the third connecting arm 403 and the suction device 404, the first connecting arm 401, the second connecting arm 402, the third connecting arm 403 and the suction device 404 act in sequence, the wafers in the wafer transmission box are sucked according to the scanning result of the wafer scanning device and are placed on the reference searching and reading device 3, after the wafers pass through the reference searching and reading device, the first connecting arm 401, the second connecting arm 402, the third connecting arm 403 and the suction device 404 act in sequence, the wafers are placed in the wafer box, the inverted basket carrying of the wafers is completed, and the reference edges and marking information of the wafers are recorded.
The robot body 400 is fixedly mounted on the frame 1 through connecting pieces such as bolts, the robot body 400 comprises a housing, a robot control device and a lifting device, the robot control device is fixedly mounted in the housing, the robot control device is respectively connected with the lifting device, a first connecting arm 401, a second connecting arm 402 and a third connecting arm 403, the first connecting arm 401, the second connecting arm 402, the third connecting arm 403 and the suction device 404 are controlled to move, the lifting device is connected with the housing, the lifting device is arranged in the housing and can extend out of the housing, the lifting device is connected with the first connecting arm 401, the first connecting arm 401 is driven to ascend and descend, and the suction device 404 can grab wafers with different heights. The robot control device is preset with an edited program, so that the first connecting arm 401, the second connecting arm 402, the third connecting arm 403 and the suction device 404 act according to a preset program to realize the grabbing and placing actions of the wafer.
The robot control device may be a PLC controller, which is a commercially available product, and is selected according to actual needs, where no specific requirement is made, and the robot control device is electrically connected to the control device, and the control device sends information to the robot control device, so that the robot control device controls the first connecting arm 401, the second connecting arm 402, the third connecting arm 403, and the suction device 404 to operate.
The lifting device can be an air cylinder, a hydraulic cylinder, a gear and rack transmission or other lifting devices, and is selected according to actual requirements, and no specific requirements are made here. Preferably, in this embodiment, this elevating gear is the cylinder, rotates with the one end of first connecting arm 401 at the free end of the telescopic link of cylinder and is connected for first connecting arm 401 carries out the oscilaltion and moves under the effect of cylinder, and can rotate along the telescopic link of cylinder, carries out snatching, carrying of wafer.
The first connecting arm 401 is a rod-shaped structure, a space is provided inside the first connecting arm, one end of the first connecting arm 401 is rotatably connected with the lifting device through a first rotating shaft, meanwhile, the first rotating shaft is connected with the driving device of the first connecting arm 401 through transmission at the end of the first connecting arm 401, the driving device of the first connecting arm 401 drives the first rotating shaft to rotate, and the first connecting arm 401 can freely rotate relative to the lifting device. The driving device of the first connecting arm 401 is a motor, and the transmission device is a gear transmission. The two ends of the first rotating shaft are respectively fixedly connected with the first connecting arms 401, the gears are mounted on the first rotating shaft, the driving devices of the first connecting arms 401 are fixedly mounted in the inner space of the first connecting arms 401, the gears are mounted on the driving devices of the first connecting arms 401, and through meshing transmission of the gears, the motor drives the first rotating shaft to rotate so as to drive the first connecting arms 401 to rotate.
The third connecting arm 403 is of a rod-shaped structure, and has a space inside, the third connecting arm 403 and the end of the second connecting arm 402 far away from the end connected to the first connecting arm 401 are connected through a third rotating shaft, so that the third connecting arm 403 can be rotatably connected to the second connecting arm 402, two ends of the third rotating shaft are fixedly connected to the third connecting arm 403, and the third rotating shaft is rotatably connected to the second connecting arm 402 through a bearing, a driving device for the third connecting arm 403 is fixedly installed in the space inside the third connecting arm 403, and the driving device for the third connecting arm 403 is connected to the third rotating shaft through a transmission device, so that the third rotating shaft rotates under the action of the driving device for the third connecting arm 403. In this embodiment, the transmission device is a gear transmission, the driving device of the third connecting arm 403 is a motor, a gear is mounted on the third rotating shaft, a gear is mounted on the driving device of the third connecting arm 403, and the driving device of the third connecting arm 403 drives the third connecting arm 403 to rotate through the meshing of the gears.
The other end of the third connecting arm 403 is fixedly connected with the suction device 404, so that the suction device 404 is moved by the third connecting arm 403.
The driving device of the first connecting arm 401, the driving device of the second connecting arm 402 and the driving device of the third connecting arm 403 are all electrically connected with the robot control device, and the rotation angles of the first connecting arm 401, the second connecting arm 402 and the third connecting arm 403 of the robot control device are convenient for grabbing and carrying wafers.
The suction device 404 is a vacuum chuck, preferably a ceramic chuck, which is connected to a vacuum pump through a connecting pipeline, the vacuum pump is electrically connected to a robot controller through a control switch, and the robot controller controls the start and stop of the vacuum pump according to a signal of the control switch, and controls the vacuum chuck to grasp and release the wafer.
The shape of the vacuum chuck can be Y-shaped, or flat plate type, or other shapes, and is selected according to actual requirements, and is not required in particular.
The wafer scanning device is a scanning sensor, and is used for scanning the number of wafers in the wafer transfer box and the wafer box and the positions of the wafers, so that the robot control device can control the lifting device, the first connecting arm 401, the second connecting arm 402, the third connecting arm 403 and the suction device 404 to move according to the positions of the wafers, and the wafers are captured and placed.
As shown in fig. 5, the reference searching and code reading apparatus 3 includes a reference searching rotation apparatus 303, a reference edge detection apparatus 301, a wafer information reading apparatus 300 and a carrying apparatus 302, wherein the carrying apparatus 302 is connected to the reference searching rotation apparatus 303 for carrying a wafer, the carrying apparatus 302 rotates under the action of the reference searching rotation apparatus 303, the reference edge detection apparatus 301 is connected to the carrying apparatus 302, and the reference edge detection apparatus 301 and the carrying apparatus 302 are correspondingly disposed for searching a reference edge for the wafer; the wafer information reading device 300 is disposed on two sides of the carrier 302 for reading the wafer information. The wafer is placed on the carrying device 302, the carrying device 302 rotates under the action of the reference searching rotating device 303, the wafer rotates along with the carrying device 302, in the process of rotating the wafer, the reference edge detection device 301 detects the reference edge of the wafer, and the wafer information reading device 300 reads the information of the wafer.
The reference finding rotating device 303 is a motor, and an output shaft bearing device 302 of the motor is fixedly connected, so that the bearing device 302 can rotate under the rotation of the output shaft of the motor. The carrying device 302 is a tray made of transparent material, so that the reference edge detection device 301 can detect the reference edge position of the wafer conveniently, and the wafer information reading device 300 can read the wafer information conveniently. The clamping pieces are arranged on the peripheral sides of the tray to limit the wafer, so that the wafer is prevented from falling off in the rotating process.
The reference finding rotating device 303 is fixedly installed in the installation shell, the installation shell is fixedly installed on the frame 1, the reference edge detection devices 301 are fixedly installed on the installation shell, the number of the reference edge detection devices 301 is multiple, the reference edge detection devices are symmetrically arranged on the periphery of the bearing device 302, and the reference edge positions of the wafer are detected from different positions. The reference edge detection device 301 is a linear sensor, preferably a distance measurement sensor, and determines the position of the reference edge of the wafer by detecting the distance of the wafer, and is a commercially available product and selected according to actual requirements.
The wafer information reading devices 300 are fixedly installed on the frame 1, and the number of the wafer information reading devices 300 is two, the two wafer information reading devices 300 are arranged up and down and are respectively located at the upper side and the lower side of the bearing device 302, and the two wafer information reading devices 300 arranged up and down cover the edge of the wafer in the vertical direction, so that the marking information at the two sides of the wafer can be conveniently read, and the related information of the wafer can be determined. The wafer information reading apparatus 300 is a code reader, is a commercially available product, and is selected according to actual requirements, and is preferably an HTT code reader.
The reference searching rotating device 303, the reference edge detecting device 301 and the wafer information reading device 300 are all electrically connected with the control device, the control device controls the reference searching rotating device 303 to act, the wafer is placed and then rotates, and the rotation is stopped after the wafer is detected; the reference edge detection device 301 and the wafer information reading device 300 transmit the detected and read reference edge position and marking information of the wafer to the control device, the control device controls the robot device 4 to act, and the detected wafer is placed in the wafer box, so that the basket turnover of the wafer is completed.
When the automatic parameter searching and reading equipment carries out inverted basket carrying on wafers, an operator places a wafer transmission box containing wafers which are not searched for the parameter reading on the wafer loading and unloading device 2, simultaneously places an empty wafer box on the wafer loading and unloading device 2, carries out positioning through the positioning piece 210, inserts the plug connector 202 of the cover opening mechanism 20 into the plug hole on the wafer transmission box cover, moves the moving piece, and takes down the wafer transmission box cover; the robot device 4 acts, the wafer scanning device acts, the quantity and the position information of the wafers in the wafer transfer box are determined, the robot body 400 controls the first connecting arm 401, the second connecting arm 402, the third connecting arm 403 and the suction device 404 to act, the wafers are taken, the wafers are placed on the reference reading code device 3, the reference edge detection device 301 detects the positions of the reference edges of the wafers, the wafer information reading device 300 reads marking information of the wafers, the information of the wafers is determined, the reference edge detection device 301 and the wafer information reading device 300 transmit the detected information to the control device, the control device uploads the information to an upper system, and the display device displays related information; meanwhile, the control device controls the robot device 4 to act, the detected wafers are placed in the wafer box, the basket-falling action of one wafer is completed, after all the wafers finish the flow, the sealing operation is carried out, the basket-falling operation of the wafers is completed, the edge-finding code reading can be automatically carried out, the increase of particles caused by manual edge-finding is avoided, the code reading efficiency is high, the automation degree is high, manual participation is reduced, and the working efficiency is improved.
By adopting the technical scheme, the automatic parameter searching and reading equipment is compact in structure and convenient to mount and dismount, is provided with the wafer loading and unloading device, the robot device and the parameter searching and reading device, can automatically and accurately search the reference edge, read the marking number and carry the inverted basket, effectively avoids the risk of artificial error reading and granularity increase, improves the code reading efficiency, reduces the labor intensity, reduces the labor cost, is high in automation degree, and can accurately, quickly and efficiently carry out crystal carrying and parameter searching and code reading.
The embodiments of the present invention have been described in detail, but the description is only for the preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. All the equivalent changes and improvements made according to the application scope of the present invention should still fall within the patent coverage of the present invention.
Claims (10)
1. An automatic reference searching and reading device, characterized in that: comprises the steps of (a) preparing a mixture of a plurality of raw materials,
the wafer loading and unloading device is used for placing the wafer transfer box and the wafer box;
the robot device is used for grabbing and transferring the wafer;
the reference searching and reading device is used for reading the relevant information of the wafer and searching the reference edge;
the wafer loading and unloading device is communicated with the reference searching and code reading device through the robot device, the wafers in the wafer transfer boxes on the wafer loading and unloading device are taken out and placed on the reference searching and code reading device, and after the reference searching and code reading, the wafers are placed on the wafer boxes for inverted basket carrying.
2. The auto-lookup reference code device as claimed in claim 1 wherein: the wafer loading and unloading device comprises a positioning mechanism, an uncovering mechanism and a loading and unloading control device, wherein the positioning mechanism and the uncovering mechanism are both electrically connected with the loading and unloading control device, and the loading and unloading control device controls the uncovering mechanism to act according to the information of the positioning mechanism.
3. The auto-lookup reference code device according to claim 1 or 2, wherein: the robot device comprises a wafer scanning device and a suction and carrying device, the wafer scanning device is arranged on the suction and carrying device, wherein,
the wafer scanning device is used for detecting the positions and the number of the wafers in the wafer transfer box and the wafer box;
the sucking and carrying device is used for sucking and carrying wafers.
4. The auto-lookup reference code device as claimed in claim 3 wherein: the sucking and carrying device comprises a robot body, a sucking device, a first connecting arm, a second connecting arm and a third connecting arm, wherein,
one end of the first connecting arm is connected with the robot body, the other end of the first connecting arm is connected with the second connecting arm, the first connecting arm can rotate and lift relative to the robot body, and meanwhile, the second connecting arm can rotate relative to the first connecting arm;
the other end of the second connecting arm is connected with the third connecting arm, and the third connecting arm can rotate relative to the second connecting arm;
the suction device is connected with the third connecting arm, and the suction device can rotate relative to the third connecting arm.
5. The auto-lookup reference code device as claimed in claim 4 wherein: the suction device is a vacuum chuck.
6. The auto-lookup reference code device as claimed in claim 5 wherein: the wafer scanning device is a scanning sensor.
7. The auto-lookup parameter reading device according to claim 1 or 2 or 4 or 5 or 6, wherein: the parameter searching and reading device comprises a parameter searching and rotating device, a reference edge detection device, a wafer information reading device and a bearing device, wherein,
the bearing device is connected with the parameter searching rotating device and is used for bearing the wafer;
the reference edge detection device is connected with the reference searching rotating device, and the reference edge detection device and the bearing device are correspondingly arranged and used for searching a reference edge for the wafer;
the wafer information reading device is arranged on two sides of the bearing device and used for reading the wafer information.
8. The auto-lookup reference code device as claimed in claim 7 wherein: the reference edge detection device is a linear sensor.
9. The auto-lookup reference code device as claimed in claim 8 wherein: the wafer information reading device is a code reader.
10. The auto-lookup reference code device according to any of claims 1-2, 4-6, 8-9 wherein: the automatic parameter searching and reading equipment further comprises a control device, wherein the control device is respectively electrically connected with the wafer loading and unloading device, the parameter searching and reading device and the robot device and controls the wafer loading and unloading device, the parameter searching and reading device and the robot device to act.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020177844.4U CN211920126U (en) | 2020-02-17 | 2020-02-17 | Automatic look for reference code reading equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020177844.4U CN211920126U (en) | 2020-02-17 | 2020-02-17 | Automatic look for reference code reading equipment |
Publications (1)
| Publication Number | Publication Date |
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| CN211920126U true CN211920126U (en) | 2020-11-13 |
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| CN111186701A (en) * | 2020-02-17 | 2020-05-22 | 天津中环领先材料技术有限公司 | Automatic look for reference code reading equipment |
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