CN212489260U - External circulation cavity structure for semiconductor temperature control bed - Google Patents
External circulation cavity structure for semiconductor temperature control bed Download PDFInfo
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- CN212489260U CN212489260U CN202020668087.0U CN202020668087U CN212489260U CN 212489260 U CN212489260 U CN 212489260U CN 202020668087 U CN202020668087 U CN 202020668087U CN 212489260 U CN212489260 U CN 212489260U
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- guide hole
- water tank
- temperature control
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- circulating water
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Abstract
The utility model discloses an extrinsic cycle chamber structure for semiconductor temperature control bed, including circulation tank, its characterized in that: the semiconductor mounting platform is arranged on the outer side of the circulating water tank, a plurality of mounting holes are formed in the other side of the circulating water tank, and the mounting holes are located at the corner positions of the circulating water tank; the end face of the circulating water tank is provided with a water inlet port and a water outlet port, wherein the water inlet port and the water outlet port are located on the same side or different sides of the circulating water tank, a water guide hole is formed between the water inlet port and the water outlet port, the length of the water guide hole is far larger than that of the circulating water tank, and a secondary water guide hole is formed in the water guide hole. The utility model discloses improve the novelty, as an auxiliary structure, its inside water guide hole contains secondary water guide hole, can increase the heat exchange area, can improve the heat exchange rate.
Description
Technical Field
The utility model relates to an extrinsic cycle chamber structure for semiconductor temperature control bed.
Background
The invention is applied to a heat exchange structure of a semiconductor temperature control bed, the semiconductor temperature control bed mainly comprises a water heating mattress, water guide pipes, a heat exchange box and a control box, wherein an inner core cavity is arranged in the heat exchange box, a semiconductor refrigeration chip is arranged on the outer wall of the inner core cavity, the inner core cavity is made of heat conduction metal, one group of water guide pipes are used for feeding cold water to the inner core cavity through a water pump, the cold water is heated under the action of the semiconductor chip, then hot water is generated at the output end of the cold water, the hot water is conveyed to the mattress through another pipeline, so that the temperature of the mattress can be raised, an outer circulation cavity is arranged outside the inner core cavity, a water guide pore passage is arranged in the outer circulation cavity and is used for dissipating low temperature on the other side of a semiconductor chip, in the prior art, the pipeline is hollow, the low temperature is taken away by flowing water so as to dissipate the, however, the present invention is designed for the purpose of single structure and poor heat exchange effect.
SUMMERY OF THE UTILITY MODEL
In order to solve the above prior art problems, the utility model provides an extrinsic cycle chamber structure for semiconductor temperature control bed can improve more than not enough.
The utility model relates to an extrinsic cycle chamber structure for semiconductor temperature control bed, including circulating water tank, circulating water tank is flat structure, can adopt materials such as steel, cast iron, aluminium, copper, alloy to make, in order to be as small-size structure, portable and installation, and its size is restricted to 100 ~ 120mm long, 60 ~ 80mm wide, and 15 ~ 25mm thick, the circulating water tank outside sets up the semiconductor mount table, and the opposite side sets up a plurality of mounting holes, the mounting hole is located circulating water tank arris position; the end face of the circulating water tank is provided with a water inlet port and a water outlet port, wherein the water inlet port and the water outlet port are located on the same side or different sides of the circulating water tank, a water guide hole is formed between the water inlet port and the water outlet port, the length of the water guide hole is far larger than that of the circulating water tank, and a secondary water guide hole is formed in the water guide hole.
Further, the secondary water guide hole is positioned on the inner wall of the water guide hole.
Furthermore, the end face of the circulating water tank is also provided with a connecting eyelet which is used for connecting a plurality of water guide holes and used as an auxiliary interface.
Furthermore, a connecting port is arranged on the circulating water tank.
Furthermore, the inner wall of the water guide hole is provided with an anti-rust layer which is sprayed with anti-rust paint or polytetrafluoroethylene.
Further, threads are arranged in the mounting hole.
Furthermore, an anti-rust layer is arranged in the mounting hole, and anti-rust grease is smeared on the anti-rust layer.
Furthermore, the surface of the semiconductor mounting table is provided with an adhesive layer, and the adhesive layer is made of metal adhesive, such as anaerobic metal adhesive, and can be kept for a long time.
Furthermore, a protective layer is arranged at the corner position of the circulating water tank.
The utility model discloses improve the novelty, as an auxiliary structure of semiconductor heat transfer case, its inside water guide hole contains secondary water guide hole, can increase heat exchange area, can improve the heat exchange rate.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is another schematic structural diagram of the present invention.
Fig. 3 is a schematic cross-sectional view of the present invention.
Fig. 4 is a usage effect diagram of the present invention.
The figure is as follows: the device comprises a circulating water tank 1, a mounting hole 2, a water inlet port 3, a water outlet port 4, a mounting groove 5, a semiconductor mounting table 6, a water guide hole 7, a secondary water guide hole 8, a connecting hole 9, a connecting port 10, a triangular inner core 11 and a semiconductor chip 12.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
As shown in fig. 1-3, the utility model relates to an external circulation cavity structure for semiconductor temperature control bed, which comprises a circulation water tank 1, wherein the circulation water tank 1 is of a flat structure and can be made of steel, cast iron, aluminum, copper, alloy and other materials, a semiconductor mounting table 6 is arranged on the outer side of the circulation water tank 1, a plurality of mounting holes 2 are arranged on the other side of the circulation water tank 1, and the mounting holes 2 are positioned at the edges and corners of the circulation water tank 1; the terminal surface of circulation tank 1 sets up inlet port 3 and outlet port 4, and wherein inlet port 3 and outlet port 4 are located circulation tank 1's homonymy or different side, set up water guide hole 7 between inlet port 3 and the outlet port 4, the length of water guide hole 7 is far greater than circulation tank 1 length, set up secondary water guide hole 7 in the water guide hole 7.
The secondary water guide hole is positioned on the inner wall of the water guide hole.
The end face of the aforementioned circulation water tank 1 is also provided with a connection hole 9.
The aforementioned circulation tank 1 is provided with a connection port 10.
And an anti-rust layer is arranged on the inner wall of the water guide hole 7 and is sprayed with anti-rust paint or polytetrafluoroethylene.
The mounting hole 2 is internally provided with threads.
An anti-rust layer is arranged in the mounting hole 2.
The surface of the semiconductor mounting stage 6 is provided with an adhesive layer, and a metal adhesive such as an anaerobic metal adhesive is selected, so that the semiconductor mounting stage can be maintained for a long time.
The corner position of the circulating water tank 1 is provided with a protective layer, and the protective layer adopts a thickening treatment mode.
As shown in fig. 4, when in use, the circulating water tank 1 is installed on the outer wall of the triangular inner core 12, the triangular inner core is provided with a plurality of pore channels, and the semiconductor chip is arranged between the triangular inner core and the circulating water tank, so that an inner circulation and an outer circulation can be formed, the inner circulation heats through one side of the semiconductor chip, the outer circulation is used for refrigerating outside the semiconductor chip, so that the outer circulating water tank is used for dissipating low temperature, water enters from the water inlet port through the bent water guide hole, then the heat exchange is fully exerted through the bent water guide hole, and then the water flows out from the water outlet port, the dissipation of the low temperature is realized, when the cold and hot directions of the semiconductor refrigerating chip are changed, the conditions of.
Claims (9)
1. The utility model provides an extrinsic cycle chamber structure for semiconductor temperature controlled bed, includes circulation tank, its characterized in that: the semiconductor mounting platform is arranged on the outer side of the circulating water tank, a plurality of mounting holes are formed in the other side of the circulating water tank, and the mounting holes are located at the corner positions of the circulating water tank; the end face of the circulating water tank is provided with a water inlet port and a water outlet port, wherein the water inlet port and the water outlet port are located on the same side or different sides of the circulating water tank, a water guide hole is formed between the water inlet port and the water outlet port, the length of the water guide hole is far larger than that of the circulating water tank, and a secondary water guide hole is formed in the water guide hole.
2. The external circulation cavity structure for the semiconductor temperature control bed as claimed in claim 1, wherein: the secondary water guide hole is positioned on the inner wall of the water guide hole.
3. The external circulation cavity structure for the semiconductor temperature control bed as claimed in claim 1, wherein: and the end surface of the circulating water tank is also provided with a connecting eyelet.
4. The external circulation cavity structure for the semiconductor temperature control bed as claimed in claim 1, wherein: and a connecting port is arranged on the circulating water tank.
5. The external circulation cavity structure for the semiconductor temperature control bed as claimed in claim 1, wherein: and an anti-rust layer is arranged on the inner wall of the water guide hole.
6. The external circulation cavity structure for the semiconductor temperature control bed as claimed in claim 1, wherein: and threads are arranged in the mounting holes.
7. The external circulation cavity structure for the semiconductor temperature control bed as claimed in claim 6, wherein: and an anti-rust layer is arranged in the mounting hole.
8. The external circulation cavity structure for the semiconductor temperature control bed as claimed in claim 1, wherein: and an adhesive layer is arranged on the surface of the semiconductor mounting table.
9. The external circulation cavity structure for the semiconductor temperature control bed as claimed in claim 1, wherein: and a protective layer is arranged at the corner position of the circulating water tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020668087.0U CN212489260U (en) | 2020-04-28 | 2020-04-28 | External circulation cavity structure for semiconductor temperature control bed |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020668087.0U CN212489260U (en) | 2020-04-28 | 2020-04-28 | External circulation cavity structure for semiconductor temperature control bed |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212489260U true CN212489260U (en) | 2021-02-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020668087.0U Active CN212489260U (en) | 2020-04-28 | 2020-04-28 | External circulation cavity structure for semiconductor temperature control bed |
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| CN (1) | CN212489260U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114941917A (en) * | 2022-05-05 | 2022-08-26 | 三峡大学 | Semiconductor temperature difference sheet heating and refrigerating integrated system and method |
-
2020
- 2020-04-28 CN CN202020668087.0U patent/CN212489260U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114941917A (en) * | 2022-05-05 | 2022-08-26 | 三峡大学 | Semiconductor temperature difference sheet heating and refrigerating integrated system and method |
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