CN210569346U - Split type semiconductor cooling system - Google Patents
Split type semiconductor cooling system Download PDFInfo
- Publication number
- CN210569346U CN210569346U CN201921193175.3U CN201921193175U CN210569346U CN 210569346 U CN210569346 U CN 210569346U CN 201921193175 U CN201921193175 U CN 201921193175U CN 210569346 U CN210569346 U CN 210569346U
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- CN
- China
- Prior art keywords
- box
- refrigeration chip
- cooling system
- radiator
- cold box
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model provides a split type semiconductor cooling system, including box and cooling portion, the cooling portion is located the box outside, the cooling portion is including leading cold box, refrigeration chip, radiator fan, lead the cold box pass through the pipeline with the box forms the backward flow, lead the outside of cold box sunken have with the corresponding recess of refrigeration chip, the refrigeration chip is located in the recess, the radiator laminating lead being equipped with of cold box the lateral surface of refrigeration chip is used for absorbing the heat of refrigeration chip, radiator fan be used for with the heat of radiator gives off. The utility model discloses the cooling effect is better.
Description
Technical Field
The utility model relates to a cooling system especially relates to a split type semiconductor cooling system.
Background
The existing semiconductor refrigeration integrates a refrigeration part and a box body, so that the refrigeration efficiency is low, and therefore, how to effectively provide a cooling system with high-efficiency refrigeration is particularly important.
SUMMERY OF THE UTILITY MODEL
Therefore, there is a need for a split semiconductor cooling system, which uses split heat dissipation, is equipped with multiple heat dissipation members, and uses a special installation method to achieve better cooling effect.
The utility model provides a split type semiconductor cooling system, including box and cooling portion, the cooling portion is located the box outside, the cooling portion is including leading cold box, refrigeration chip, radiator fan, lead the cold box pass through the pipeline with the box forms the backward flow, lead the outside of cold box sunken have with the corresponding recess of refrigeration chip, the refrigeration chip is located in the recess, the radiator laminating lead being equipped with of cold box the lateral surface of refrigeration chip is used for absorbing the heat of refrigeration chip, radiator fan be used for with the heat of radiator gives off.
Preferably, a power pump is arranged on the pipeline to provide power for liquid backflow.
Preferably, the pipe through which the cooling liquid passes is coated with an insulating layer.
Preferably, the heat-insulating layer is heat-insulating cotton.
Preferably, the outer side of the box body is provided with a heat preservation layer.
Preferably, the heat-insulating layer is made of heat-insulating foam.
The utility model discloses with cooling portion and box separation, and refrigeration chip has been adopted, radiator and radiator fan's heat radiation structure, be provided with the recess on leading the cold box, the refrigeration chip sets up in the recess, make the refrigeration chip can be closer to the inner face of leading the cold box and refrigerate to the liquid that leads the cold box in better, and the radiator is the laminating leads the lateral surface that is equipped with the refrigeration chip of cold box, so can further absorb refrigeration chip heat and lead the heat of cold box better, improve the refrigeration efficiency of refrigeration chip, in addition radiator fan's effect, make refrigeration efficiency improve greatly.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is an exploded view of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
As shown in fig. 1-2, the utility model provides a split type semiconductor cooling system, including box 1 and cooling portion 2, the box 1 outside is located to cooling portion 2, and cooling portion 2 has first import and first export including leading cold box 21, refrigeration chip 22, radiator 23, radiator fan 24 on leading cold box 21, has second import and second export on the box 1, and the second export is connected through pipeline 3 in first import, and the second import is connected through pipeline 4 in first export, so forms the circulation. During installation, the pipeline can be connected to each water gap through a quick straight joint, so that the requirement of quick disassembly and installation is met. The power pump 5 can be connected to the pipes 3 and/or 4 to provide power for liquid backflow, and the liquid flows out of the box body 1, enters the cold guide box 21, is refrigerated and then flows back into the box body 1 from the cold guide box 21.
The diameter and length of the pipes 3 and 4 can be set according to the actual needs. The pipelines 3 and 4 can be respectively coated with heat insulating layers 31 and 34, for example, heat insulating cotton can be used for insulating cooled liquid, and the temperature of the cooled liquid is prevented from rising due to the fact that the cooled liquid absorbs external heat in the flowing process. In order to facilitate the heat preservation of the box 1, a heat preservation layer 11 may be provided outside the box 1, for example, using heat preservation foam.
The cooling box 21 is provided with a concave groove 211 corresponding to the refrigeration chip 22, the refrigeration chip 22 is disposed in the concave groove 211, the radiator 23 is attached to the outer side surface of the cooling box 21, where the refrigeration chip 22 is disposed, and is used for absorbing heat of the refrigeration chip 22, the heat dissipation fan 24 is used for dissipating heat of the radiator 23, the heat dissipation fan 24 can be fixed by the fan cover 241, and the fan cover 241 can be fixed on the radiator 23.
The utility model has the advantages that: the utility model discloses with cooling portion 2 and 1 separation of box, box 1 is as the liquid reserve tank, leads cold box 21 as small-size liquid reserve tank, can save and is carrying out cryogenic liquid, is favorable to improving refrigeration speed, the utility model discloses a refrigeration chip 22, radiator 23 and radiator fan 24's heat radiation structure, be provided with recess 211 on leading cold box 21, refrigeration chip 22 sets up in recess 211, make refrigeration chip 22 can be more close to the inner face of leading cold box 21 and refrigerate to leading the liquid in the cold box 21 better, and radiator 23 is the laminating and leads the lateral surface that is equipped with refrigeration chip 22 of cold box 21, so can further absorb refrigeration chip 22 heat and lead the heat of cold box 21 better, improve refrigeration chip 22's refrigeration efficiency, in addition radiator fan 24's effect, make refrigeration efficiency improve greatly.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention should be included in the present invention.
Claims (6)
1. The utility model provides a split type semiconductor cooling system, includes box and cooling portion, its characterized in that, the cooling portion is located the box outside, the cooling portion is including leading cold box, refrigeration chip, radiator fan, lead the cold box pass through the pipeline with the box forms the backward flow, lead the outside of cold box sunken have with the corresponding recess of refrigeration chip, the refrigeration chip is located in the recess, the radiator laminating lead being equipped with of cold box the lateral surface of refrigeration chip is used for absorbing the heat of refrigeration chip, radiator fan be used for with the heat of radiator gives off.
2. The split semiconductor cooling system according to claim 1, wherein a power pump is provided on the pipe to power the liquid return flow.
3. The split semiconductor cooling system according to claim 1, wherein the pipe through which the cooling liquid passes is coated with an insulating layer.
4. The split semiconductor cooling system according to claim 3, wherein the insulating layer is made of insulating cotton.
5. The split semiconductor cooling system according to claim 1, wherein an insulating layer is provided on an outer side of the case.
6. The split semiconductor cooling system according to claim 5, wherein the insulating layer is made of insulating foam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921193175.3U CN210569346U (en) | 2019-07-26 | 2019-07-26 | Split type semiconductor cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921193175.3U CN210569346U (en) | 2019-07-26 | 2019-07-26 | Split type semiconductor cooling system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210569346U true CN210569346U (en) | 2020-05-19 |
Family
ID=70641359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921193175.3U Expired - Fee Related CN210569346U (en) | 2019-07-26 | 2019-07-26 | Split type semiconductor cooling system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210569346U (en) |
-
2019
- 2019-07-26 CN CN201921193175.3U patent/CN210569346U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200519 Termination date: 20210726 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |