CN212461669U - Metal terminal structure for welding all-solid-state holographic shooting chip - Google Patents
Metal terminal structure for welding all-solid-state holographic shooting chip Download PDFInfo
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- CN212461669U CN212461669U CN202021334744.4U CN202021334744U CN212461669U CN 212461669 U CN212461669 U CN 212461669U CN 202021334744 U CN202021334744 U CN 202021334744U CN 212461669 U CN212461669 U CN 212461669U
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Abstract
The utility model discloses a be used for all solid-state holography chip welded metal terminal structure, include the bottom terminal seat that forms by the processing of heat-insulating material and the top terminal seat that forms by the processing of heat-insulating material, the top of bottom terminal seat contacts with the bottom of top terminal seat, and fixes on the terminal seat of bottom and inlay and be equipped with two sets of metal pins, and every group metal pin all includes a plurality of metal pins that are a straight line and distribute, be the rectangular ring on the terminal seat of top and seted up a plurality of circular cavities, and seted up first circular through hole on the bottom inner wall of circular cavity. The utility model provides an all solid-state holography chip when self produces great heat, the automatic metal pin that carries out the disconnection with corresponding of chip pin in the all solid-state holography chip, and all solid-state holography chip cooling of stewing has effectively avoided self to take place to damage because of the high temperature this moment.
Description
Technical Field
The utility model relates to an all solid-state holography chip technical field especially relates to a be used for all solid-state holography chip welded metal terminal structure.
Background
The all-solid-state holography chip is a processing chip based on a holography technology, when the all-solid-state holography chip is welded on a PCB (printed circuit board), a chip pin of the all-solid-state holography chip needs to be welded and fixed on the PCB by using a metal terminal, but when the all-solid-state holography chip generates large heat by itself due to the welding mode, the all-solid-state holography chip cannot be automatically disconnected from the PCB, and further cannot be statically placed for cooling, so that the all-solid-state holography chip is easily damaged due to a large amount of heat generated by itself, and therefore the metal terminal structure for welding the all-solid-state holography chip is provided.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the shortcoming that exists among the prior art, and the metal terminal structure who is used for all solid-state holography chip welding that proposes.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the metal terminal structure for welding the all-solid-state holographic shooting chip comprises a bottom terminal seat processed by a heat insulating material and a top terminal seat processed by the heat insulating material, wherein the top of the bottom terminal seat is contacted with the bottom of the top terminal seat, two groups of metal pins are fixedly embedded on the bottom terminal seat, each group of metal pins comprises a plurality of metal pins which are linearly distributed, a plurality of circular cavities are formed in the top terminal seat in a rectangular ring shape, a first circular through hole is formed in the inner wall of the bottom of each circular cavity, a circular guide column integrally processed with the top of the bottom terminal seat is arranged inside each first circular through hole in a rolling mode, a first rectangular movable through hole positioned inside each circular cavity is formed in each circular guide column, a rectangular guide rod is contacted with the inner wall of the bottom of each first rectangular movable through hole, and two ends of each rectangular guide rod extend to the outside of each circular guide column, the device is characterized in that the device is fixedly adhered to the side wall of a round cavity, a spring in a compressed state is fixedly installed between the top of a rectangular guide rod and the inner wall of the top of a first rectangular movable through hole, a rectangular invagination groove arranged at the bottom of a top terminal base is arranged among a plurality of round cavities, a cylindrical placing cylinder fixedly adhered to the top of a bottom terminal base is arranged inside the rectangular invagination groove, the top of the cylindrical placing cylinder is provided with an opening and is contacted with the inner wall of the top of the rectangular invagination groove, a round piston is installed inside the cylindrical placing cylinder in a sealing and sliding manner, the bottom of the round piston and the inside of the cylindrical placing cylinder jointly form a placing cavity, liquid mercury is filled inside the placing cavity, an all-solid-state holographic shooting chip is arranged above the top terminal base and comprises a chip pin corresponding to the position of a metal, the chip pins are fixedly embedded on the top terminal seat, the bottom ends of the chip pins are arranged to be of a V-shaped structure and extend to the inside of the rectangular sunken groove, the outer bottom of each chip pin is in electric contact with two metal conducting strips symmetrically arranged, the two metal conducting strips symmetrically arranged and the top of the corresponding metal pin are integrally processed, the top of the top terminal seat and the bottom of the all-solid-state holographic shooting chip are fixedly bonded with the same heat absorbing sheet, the bottom of the heat absorbing sheet is in annular bonding and is fixedly provided with a heat conducting rod fixedly embedded with the top terminal seat, and the bottom ends of the heat conducting rods are fixedly bonded with the same circular heat exchange sheet fixedly bonded with the bottom of the circular piston.
Preferably, a first ball contacting with the outer side of the circular guide column is movably embedded on the side wall of the first circular through hole in an annular shape.
Preferably, the heat absorbing sheet is provided with a pin through hole matched with the chip pin in position, and the pin through hole is fixedly adhered to the outer side of the chip pin through the inner side wall of the pin through hole.
Preferably, the round piston is provided with a heat conducting rod mounting through hole corresponding to the heat conducting rod in position, and the side wall of the heat conducting rod mounting through hole is fixedly bonded with the outer side of the heat conducting rod through glue.
Preferably, the metal conductive sheet includes a first conductive part integrally processed with the top of the metal pin, a second conductive part integrally processed with the first conductive part is obliquely arranged on the top of the first conductive part, a third conductive part integrally processed with the second conductive part is obliquely arranged on the top of the second conductive part, and a junction between the third conductive part and the second conductive part is an arc-shaped chamfer electrically contacting with the chip pin.
Preferably, the same elastic pad in a stretched state is bonded and fixed between the two first conductive portions which are symmetrically arranged.
Preferably, the distance between the top of the circular piston and the top of the cylindrical placing cylinder is larger than the distance between the top of the rectangular guide rod and the inner wall of the top of the first rectangular movable through hole.
The utility model provides an all solid-state holography chip when self produces great heat, the automatic metal pin that carries out the disconnection with corresponding of chip pin in the all solid-state holography chip, and all solid-state holography chip cooling of stewing has effectively avoided self to take place to damage because of the high temperature this moment.
Drawings
Fig. 1 is a schematic structural view of a metal terminal structure for welding an all-solid-state hologram chip according to the present invention;
fig. 2 is a schematic front view of a metal terminal structure for welding an all-solid-state hologram chip according to the present invention;
FIG. 3 is an enlarged view of portion A-A of FIG. 2;
fig. 4 is the utility model provides a be arranged in all solid-state holography chip welded metal terminal structure metal conducting strip's structural schematic.
In the figure: 1 bottom terminal seat, 2 metal pins, 201 metal conducting sheet, 2011 first conducting part, 2012 second conducting part, 2013 third conducting part, 2014 circular arc chamfer, 202 elastic pad, 3 top terminal seat, 4 circular chamber, 5 first circular through hole, 6 first ball, 7 circular guide post, 8 first rectangular movable through hole, 9 rectangular guide rod, 10 spring, 11 rectangular inner sunken groove, 12 cylindrical placing cylinder, 13 circular piston, 14 liquid mercury, 15 heat absorbing sheet, 16 all-solid-state holography chip, 17 chip pins, 18 heat conducting rod, 19 circular heat exchange sheet.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-4, a metal terminal structure for welding an all-solid-state hologram chip comprises a bottom terminal base 1 processed by a heat insulating material and a top terminal base 3 processed by a heat insulating material, wherein the top of the bottom terminal base 1 is contacted with the bottom of the top terminal base 3, two groups of metal pins 2 are fixedly embedded on the bottom terminal base 1, each group of metal pins 2 comprises a plurality of metal pins 2 distributed linearly, a plurality of circular chambers 4 are arranged on the top terminal base 3 in a rectangular ring shape, a first circular through hole 5 is arranged on the bottom inner wall of each circular chamber 4, a circular guide post 7 integrally processed with the top of the bottom terminal base 1 is arranged inside each circular through hole 5 in a rolling manner, a first rectangular movable through hole 8 positioned inside each circular chamber 4 is arranged on each circular guide post 7, and a rectangular guide rod 9 is contacted on the bottom inner wall of each first rectangular movable through hole 8, the two ends of a rectangular guide rod 9 extend to the outside of the circular guide column 7 and are fixedly bonded on the side wall of the circular cavity 4, a spring 10 in a compressed state is fixedly installed between the top of the rectangular guide rod 9 and the inner wall of the top of the first rectangular movable through hole 8, a rectangular invagination groove 11 arranged at the bottom of the top terminal seat 3 is arranged among the circular cavities 4, a cylindrical placing cylinder 12 fixedly bonded with the top of the bottom terminal seat 1 is arranged inside the rectangular invagination groove 11, the top of the cylindrical placing cylinder 12 is provided with an opening and is contacted with the inner wall of the top of the rectangular invagination groove 11, a circular piston 13 is installed inside the cylindrical placing cylinder 12 in a sealing and sliding manner, the bottom of the circular piston 13 and the inside of the cylindrical placing cylinder 12 jointly form a placing cavity, liquid mercury 14 is filled inside the placing cavity, an all-solid-state holographic shooting chip 16 is arranged above the top terminal seat 3, the all-solid-state holographic chip 16 comprises chip pins 17 corresponding to the metal pins 2, the chip pins 17 are fixedly embedded on the top terminal block 3, the bottom ends of the chip pins 17 are arranged into a V-shaped structure and extend into the rectangular recessed groove 11, two symmetrically arranged metal conducting plates 201 are electrically contacted with the bottom of the outer side of each chip pin 17, the two symmetrically arranged metal conducting plates 201 are integrally processed with the top of the corresponding metal pin 2, the metal conducting plates 201 comprise first conducting parts 2011 integrally processed with the top of the metal pin 2, second conducting parts 2012 integrally processed with the first conducting parts 2011 are obliquely arranged at the top of the first conducting parts 2011, third conducting parts 2013 integrally processed with the second conducting parts 2012 are obliquely arranged at the top of the second conducting parts 2012, and circular arc-shaped chamfers 2014 electrically contacted with the chip pins 17 are arranged at the joints of the third conducting parts 2013 and the second conducting parts 2012, the bonding is fixed with same cushion 202 that is in tensile state between the first conductive part 2011 that two symmetries set up, and the top of top terminal seat 3 and the bottom bonding of all solid-state holography chip 16 are fixed with same heat absorbing sheet 15, and the bottom of heat absorbing sheet 15 is annular bonding fixed with the fixed heat conduction stick 18 that inlays the dress with top terminal seat 3, and the bottom bonding of a plurality of heat conduction sticks 18 is fixed with same circular heat exchanger fin 19 with circular piston 13 bottom bonding fixed, the utility model provides an all solid-state holography chip 16 is when self produces great heat, and chip pin 17 in the all solid-state holography chip 16 is automatic to carry out the disconnection with the metal pin 2 that corresponds, and all solid-state holography chip 16 cooled off that stews this moment, has effectively avoided self to take place to damage because of high temperature.
In the utility model, the side wall of the first circular through hole 5 is annularly and movably embedded with a first ball 6 contacting with the outer side of the circular guide post 7, the heat absorbing sheet 15 is provided with a pin through hole with the position matched with the chip pin 17, the inner side wall of the pin through hole is fixedly bonded with the outer side of the chip pin 17 by glue, the circular piston 13 is provided with a heat conducting bar mounting through hole with the position corresponding to the heat conducting bar 18, the side wall of the heat conducting bar mounting through hole is fixedly bonded with the outer side of the heat conducting bar 18 by glue, the distance between the top of the circular piston 13 and the top of the cylindrical placing cylinder 12 is larger than the distance between the top of the rectangular guide rod 9 and the inner wall of the top of the first rectangular movable through hole 8, when the all-solid-state holography chip 16 generates larger heat, the chip pin 17 in the all-solid-state holography chip 16 automatically disconnects with the corresponding metal pin 2, at this time, the all-solid-state hologram chip 16 is cooled by standing, so that the damage of the all-solid-state hologram chip due to high temperature is effectively avoided.
In the utility model, when the all-solid-state holography chip 16 generates large heat due to work, the heat absorbing sheet 15 at the bottom of the all-solid-state holography chip 16 absorbs the heat generated by the all-solid-state holography chip 16, the heat absorbing sheet 15 transmits the heat to the round heat exchanging sheet 19 through the heat conducting rod 18, the round heat exchanging sheet 19 causes the liquid mercury 14 to expand due to the absorbed heat, the liquid mercury 14 drives the round piston 13 to slide upwards on the side wall of the cylindrical placing cylinder 12, the round piston 13 drives the heat conducting rods 18 to move upwards, because the heat conducting rods 18 are fixedly embedded with the top terminal seat 3, the heat conducting rods 18 drive the top terminal seat 3 to move upwards together, the top terminal seat 3 drives the all-solid-state holography chip 16 to move upwards through the heat absorbing sheet 15, and simultaneously the top terminal seat 3 also drives the round cavity 4 and the first round through hole 5 to move upwards, first circular through hole 5 upwards slides in the outside of circular guide post 7 through first ball 6, circular cavity 4 drives rectangle guide bar 9 and upwards moves in the inside position of first rectangle activity through-hole 8, rectangle guide bar 9 compresses corresponding spring 10, all-solid-state holography chip 16 drives its chip pin 17 and upwards moves, the top of metal conducting plate 201 is removed to the bottom of chip pin 17, make chip pin 17 and the 2 disconnection of metal pin that correspond, make all-solid-state holography chip 16 cool off that stews, effectively avoided self to take place to damage because of high temperature.
In the description of the present application, it should be further noted that, unless otherwise explicitly stated or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may include, for example, a fixed connection, a detachable connection, an integral connection, a mechanical connection, an electrical connection, a direct connection, a connection through an intermediate medium, and a connection between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to specific circumstances.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (7)
1. A metal terminal structure for welding of all solid-state holography chip, include bottom terminal seat (1) that forms by the processing of heat insulating material and top terminal seat (3) that forms by the processing of heat insulating material, its characterized in that, the top of bottom terminal seat (1) contacts with the bottom of top terminal seat (3), and fixed the inlaying on bottom terminal seat (1) is equipped with two sets of metal pin (2), and every group metal pin (2) all include a plurality of metal pin (2) that are a sharp distribution, be rectangular ring shape on top terminal seat (3) and seted up a plurality of circular cavity (4), and seted up first circular through hole (5) on the bottom inner wall of circular cavity (4), the inside roll of first circular through hole (5) is installed and is processed circular guide post (7) that form with bottom terminal seat (1) top integration, sets up first rectangle activity through-hole (8) that are located circular cavity (4) inside on circular guide post (7) ) The bottom inner wall of the first rectangular movable through hole (8) is contacted with a rectangular guide rod (9), two ends of the rectangular guide rod (9) extend to the outside of the circular guide column (7) and are fixedly bonded on the side wall of the circular cavity (4), a spring (10) in a compression state is fixedly mounted between the top of the rectangular guide rod (9) and the top inner wall of the first rectangular movable through hole (8), a rectangular invagination groove (11) formed in the bottom of the top terminal base (3) is formed between the circular cavities (4), a cylindrical placing cylinder (12) fixedly bonded with the top of the bottom terminal base (1) is arranged inside the rectangular invagination groove (11), the top of the cylindrical placing cylinder (12) is set to be an opening and is contacted with the top inner wall of the rectangular invagination groove (11), a circular piston (13) is slidably mounted in the cylindrical placing cylinder (12) in an inner sealing manner, the bottom of the round piston (13) and the inside of the cylindrical placing cylinder (12) jointly form a placing cavity, liquid mercury (14) is filled in the placing cavity, an all-solid-state holographic shooting chip (16) is arranged above the top terminal seat (3), the all-solid-state holographic shooting chip (16) comprises chip pins (17) corresponding to the positions of the metal pins (2), the chip pins (17) are fixedly embedded on the top terminal seat (3), the bottom ends of the chip pins (17) are set to be V-shaped structures and extend to the inside of the rectangular inner sunken groove (11), the bottom of the outer side of each chip pin (17) is electrically contacted with two symmetrically arranged metal conductive sheets (201), the two symmetrically arranged metal conductive sheets (201) and the tops of the corresponding metal pins (2) are integrally processed, the top of the top terminal seat (3) and the bottom of the all-solid-state holographic shooting chip (16) are adhered and fixed with the same heat absorbing sheet (15), the bottom of the heat absorbing sheet (15) is in an annular shape and is fixedly bonded with a heat conducting rod (18) fixedly embedded with the top terminal seat (3), and the bottom ends of the heat conducting rods (18) are fixedly bonded with a same round heat exchange sheet (19) fixedly bonded with the bottom of the round piston (13).
2. The metal terminal structure for all-solid-state hologram chip bonding according to claim 1, wherein a first ball (6) contacting with the outside of the circular guide post (7) is movably embedded in a ring shape on the side wall of the first circular through hole (5).
3. The metal terminal structure for all-solid-state chip bonding of the hologram according to claim 1, wherein the heat sink sheet (15) is formed with a through hole for pin insertion matching with the chip pin (17), and the inner sidewall of the through hole for pin insertion is fixed to the outer side of the chip pin (17) by gluing.
4. The metal terminal structure for all-solid-state hologram chip bonding according to claim 1, wherein the circular piston (13) is formed with a heat conducting rod mounting through hole corresponding to the heat conducting rod (18), and a side wall of the heat conducting rod mounting through hole is fixed to an outer side of the heat conducting rod (18) by gluing.
5. The metal terminal structure for all-solid-state hologram chip soldering according to claim 1, wherein the metal conductive sheet (201) comprises a first conductive part (2011) integrally processed with the top of the metal pin (2), a second conductive part (2012) integrally processed with the first conductive part is obliquely arranged at the top of the first conductive part (2011), a third conductive part (2013) integrally processed with the second conductive part is obliquely arranged at the top of the second conductive part (2012), and a junction of the third conductive part (2013) and the second conductive part (2012) is arranged as an arc-shaped chamfer (2014) electrically contacting with the chip pin (17).
6. The metal termination structure for all-solid-state holography chip bonding according to claim 5, wherein the same elastic pad (202) in a stretched state is bonded and fixed between the two first conductive parts (2011) which are symmetrically arranged.
7. The metal terminal structure for all-solid-state hologram chip bonding according to claim 1, wherein the distance between the top of the circular piston (13) and the top of the cylindrical placing cylinder (12) is larger than the distance between the top of the rectangular guide bar (9) and the inner wall of the top of the first rectangular through hole (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021334744.4U CN212461669U (en) | 2020-07-09 | 2020-07-09 | Metal terminal structure for welding all-solid-state holographic shooting chip |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021334744.4U CN212461669U (en) | 2020-07-09 | 2020-07-09 | Metal terminal structure for welding all-solid-state holographic shooting chip |
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| CN212461669U true CN212461669U (en) | 2021-02-02 |
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| CN202021334744.4U Active CN212461669U (en) | 2020-07-09 | 2020-07-09 | Metal terminal structure for welding all-solid-state holographic shooting chip |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117059670A (en) * | 2023-10-12 | 2023-11-14 | 深圳市冠禹半导体有限公司 | Silicon carbide diode and manufacturing method thereof |
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2020
- 2020-07-09 CN CN202021334744.4U patent/CN212461669U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117059670A (en) * | 2023-10-12 | 2023-11-14 | 深圳市冠禹半导体有限公司 | Silicon carbide diode and manufacturing method thereof |
| CN117059670B (en) * | 2023-10-12 | 2024-01-16 | 深圳市冠禹半导体有限公司 | Silicon carbide diode and manufacturing method thereof |
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