CN210868546U

CN210868546U - Power device connection structure

Info

Publication number: CN210868546U
Application number: CN201921628896.2U
Authority: CN
Inventors: 廖球新; 汪威佑; 温世标; 郑伟伟; 雷晶晶; 王明旺; 王华文
Original assignee: Sunwoda Electric Vehicle Battery Co Ltd
Current assignee: Xinwangda Power Technology Co ltd
Priority date: 2019-09-27
Filing date: 2019-09-27
Publication date: 2020-06-26
Anticipated expiration: 2029-09-27

Abstract

The utility model provides a power device connecting structure, which comprises a PCB, power devices and metal bars; the power device comprises a heat dissipation pin, a driving pin and a functional pin; the metal row is embedded into the PCB, the heat dissipation pins are welded to the metal row, and the driving pins and the functional pins are welded to the PCB. The utility model discloses can solve calorific capacity that traditional power device installation caused big, bulky, processing difficulty, easily damage scheduling problem because of mechanical stress and temperature impact.

Description

Power device connection structure

Technical Field

The utility model relates to a circuit components and parts connect the field, especially relate to a power device connection structure.

Background

With the rapid development of high-tech industries such as new energy automobiles, intelligent manufacturing, high-end equipment and the like, the application of power devices is more and more extensive. Because the power device has higher heat productivity under large current, the thermal resistance of the PCB material is larger, and the heat dissipation capacity of the pad copper foil is limited, the common power device assembly mode can not ensure that the power device obtains good heat dissipation to the maximum extent, and the best performance is exerted.

Therefore, special heat dissipation measures are generally adopted to ensure that the power device is not damaged due to the over-high junction temperature. The existing heat dissipation measures have high requirements on production processes and complex procedures, so that the reliability and success rate of production and processing can be ensured. Meanwhile, the volume of the power device after installation is usually large, which causes obstacles in structural design and space utilization.

The requirement on the structural design is high in practical application.

Disclosure of Invention

The utility model provides a power device connection structure can solve calorific capacity that traditional power device installation caused big, bulky, processing difficulty, easily damage scheduling problem because of mechanical stress and temperature impact.

In order to achieve the above effects, the utility model provides a power device connecting structure, which comprises a PCB board, a power device and a metal bar; the power device comprises a heat dissipation pin, a driving pin and a functional pin; the metal row is embedded into the PCB, the heat dissipation pins are welded to the metal row, and the driving pins and the functional pins are welded to the PCB.

As a further improvement the utility model discloses a metal row middle section sets up a recessed region, and the design has on the recessed region to hinder welds the silk screen printing, can avoid the solder to cause the welding badly to flow all around from the pad, sets up simultaneously hinder and weld the accurate locate function of silk screen printing ability butt welding, facilitate for production.

As a further improvement, the PCB board is provided with a groove corresponding to the concave region of the metal bar, the concave region of the metal bar can be just embedded into the groove of the PCB board, and the metal bar is in the same horizontal plane with the PCB board, thereby effectively saving space.

The utility model provides a power device connection structure, on welding the metal row through the heat dissipation pin with power device, with drive pin and function pin welding PCB board, effectively solve power device's heat dissipation problem, simultaneously in order to reduce the assembly space, the utility model discloses set up recessed region and set up the fluting corresponding with the recessed region of metal row on the PCB board at the metal row, make the metal row can imbed in the PCB board, and have on the recessed region of metal row to hinder the silk screen printing, make the solder can not flow from the pad.

Drawings

Fig. 1 is a schematic view of an overall structure of a power device connection structure.

Fig. 2 is a side view of a power device connection structure.

The PCB comprises a PCB (printed circuit board) 1, a metal row 2, a metal row sunken area 21 and a power device 3.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.

It should be understood that, if there are words of description of directions or positional relationships such as "upper", "lower", "left", "right", etc., for convenience of description of the drawings, it does not mean that some components or structures must be installed or arranged according to a specific direction or position, and in the following description, unless otherwise specifically limited, the terms "installed" and "connected" should be interpreted broadly, such as fixedly connected, detachably connected, or integrally connected, directly connected, or indirectly connected.

As a specific embodiment of the present invention, as shown in fig. 1 and 2, the power device includes a PCB (1), a metal bar (2), and a power device (21). Two parallel rectangular grooves are arranged on the PCB (1). The metal bar (2) is a rectangular metal sheet, a metal bar concave area (21) is arranged in the middle section of the metal bar (2), the length and the width of the groove of the metal bar concave area (21) and the PCB (1) are equal, the metal bar concave area (21) is just embedded into the PCB (1), and the top surface of the metal bar concave area (21) and the top surface of the PCB (1) form a same horizontal line, so that the space can be reduced, and convenience is provided for subsequent assembly of components.

The rough solder mask silk screen printing is arranged on the concave area (21) of the metal bar, so that poor welding caused by the flowing of solder from the metal bar (2) is avoided, meanwhile, the solder mask silk screen printing can accurately mark the welding position of a power device, the device positioning during batch production is facilitated, and the feasibility and the simplicity of the process are guaranteed.

The power device (3) comprises a heat dissipation pin, a driving pin and a function pin, the heat dissipation pin of the power device (3) is welded on the metal bar (2), heat generated by the power device (3) is led to the metal bar (2) through the heat dissipation pin, and the heat is dispersed through the metal bar (2). Meanwhile, the driving pin and the functional pin on the power device (3) are welded on the PCB (1), mechanical stress and temperature impact borne by the power device (3) due to the fact that the power device is assembled on different materials can be absorbed by the driving pin or the functional pin with certain deformation capacity, and power performance and reliability of the power device (3) under the assembling mode are guaranteed.

It should be understood that the above-mentioned embodiments are only provided for facilitating the understanding of the technical solutions provided by the present invention for those skilled in the art, and do not mean that the present invention only has the above-mentioned embodiments, and all technical solutions identical to the principle of the present invention are all within the protection scope of the present invention.

Claims

1. A power device connection structure characterized in that: the PCB comprises a PCB, a power device and a metal bar; the power device comprises a heat dissipation pin, a driving pin and a functional pin; the metal row is embedded into the PCB, the heat dissipation pins are welded to the metal row, and the driving pins and the functional pins are welded to the PCB.

2. The power device connection structure of claim 1, wherein said metal row is provided with a recessed area.

3. The power device connection structure of claim 2, wherein the recessed areas of the metal rows are provided with solder mask screen printing.

4. The power device connecting structure as claimed in claim 1, wherein the PCB board is provided with a slot corresponding to the recessed area of the metal row, and when the metal row is embedded in the recess of the PCB board, the metal row and the PCB board are located at the same horizontal plane.