CN212448950U - Coarse storage tank for low-temperature glass solder - Google Patents
Coarse storage tank for low-temperature glass solder Download PDFInfo
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- CN212448950U CN212448950U CN202020347033.4U CN202020347033U CN212448950U CN 212448950 U CN212448950 U CN 212448950U CN 202020347033 U CN202020347033 U CN 202020347033U CN 212448950 U CN212448950 U CN 212448950U
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Abstract
The utility model relates to a thick storage tank technical field specifically is a thick storage tank of low temperature glass solder, including mount and holding vessel, the holding vessel is installed on the mount, the holding vessel includes interior appearance chamber and defeated material chamber, the work or material rest is installed in the outside of mount, upward install the feed pipeline on the work or material rest, the apex angle position in defeated material chamber is connected with the feed pipeline, defeated material pump is installed at the pipeline top of feed pipeline, the turnover joint is installed to the bottom of feed pipeline, the feed pipeline connects external discharging pipe through the turnover, be provided with the control by temperature change chamber on the lateral wall in appearance chamber, the mount inboard is provided with the inner support, install the heat exchange pipeline on the inner support, the heat exchange pipeline imbeds on the lateral wall of holding vessel and laminates mutually with the control by temperature change chamber. The utility model discloses a heat exchange mechanism guarantees that holding vessel 2 is in a low temperature environment, guarantees the quality of built-in material.
Description
Technical Field
The utility model relates to a thick storage tank technical field specifically is a thick storage tank of low temperature glass solder.
Background
With the development of scientific technology, the technology of encapsulating with glass solder has become an indispensable technology for manufacturing various high-quality electric light sources, high vacuum electron tubes and other photoelectric devices, and the number of materials capable of encapsulating with glass solder has increased, such as various metals and alloys, various ceramics and glass, etc. The glass solder-metal package has many excellent performances such as good sealing performance, pressure resistance, corrosion resistance and the like, so that the glass solder-metal package is widely used in the industries such as batteries, electronics, automobiles, household appliances, medical treatment, illumination, instruments, military industry and the like
Chinese patent (No. CN 207631867U) discloses a glass fiber reinforced plastic storage tank body and a glass fiber reinforced plastic storage tank, the whole device mainly has the effect of sealed storage, and the storage environment of glass solder cannot be effectively regulated and planned, so that the storage quality of the glass solder has risks.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a thick storage tank of low temperature glass solder to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model provides a thick storage tank of low temperature glass solder, includes mount and holding vessel, the holding vessel is installed on the mount, the holding vessel includes interior appearance chamber and defeated material chamber, the work or material rest is installed in the outside of mount, go up and install the feed pipeline on the work or material rest, the apex angle position in defeated material chamber is connected with the feed pipeline, the defeated material pump is installed at the pipeline top of feed pipeline, the turnover joint is installed to the bottom of feed pipeline, the feed pipeline connects external discharging pipe through the turnover, be provided with the temperature control chamber on the lateral wall in appearance chamber, the mount inboard is provided with the inner support, install the heat exchange pipeline on the inner support, the heat exchange pipeline imbeds to the lateral wall of holding vessel on and laminate mutually with the temperature control chamber.
As a further aspect of the present invention: the bottom of mount still installs the working shaft, the hot outlet pipe of working shaft is connected with the top of heat exchange pipeline, the cold outlet pipe of working shaft is connected with the bottom of heat exchange pipeline.
As a further aspect of the present invention: the material conveying cavity is designed in an inverted triangle, one side of the material conveying cavity is flush with the content cavity, the other side of the material conveying cavity is in a slope structure,
as a further aspect of the present invention: the sealed end of holding vessel is provided with and covers plywood, gas sealing layer and composite waterproof layer.
As a further aspect of the present invention: the top oblique side of the fixing frame is further provided with a pressurizing frame, the pressurizing frame is provided with an air transmission pump, the air transmission pump is externally connected with an air supply pipeline, the air transmission pump is connected with a transfer cavity through an air transmission guide pipe, and the transfer cavity is communicated with a material conveying cavity through a second-stage guide pipe.
Compared with the prior art, the beneficial effects of the utility model are that:
the storage tank is used for temporary storage of materials, the fixing frame is used for fixed installation of the storage tank, the glass solder is stored in the inner cavity, the delivery cavity is designed in a slope mode so as to be convenient for supply and output of the glass solder, and the feeding frame is a material output end of the glass solder and is used for conveying the glass solder to industrial welding operation. The whole tank body adopts three protective measures of air seal, liquid seal and external closure, and the whole sealing performance is kept.
In order to guarantee the storage environment of low temperature glass solder, this application is provided with heat exchange mechanism between mount and holding vessel, through the high specific volume characteristics of water to the heat exchange pipeline is the heat transmission medium, thereby adjusts the temperature of holding vessel, leads to the hot water outward winter and heaies up, leads to cold water outward summer and cools down, thereby wholly guarantees that the holding vessel is in a low temperature environment, guarantees the quality of built-in material.
Third, in order to improve the smooth and easy nature of defeated material, this application still is provided with pressure boost frame, comes the discharge of supplementary built-in material through letting in inert gas outward, improves and arranges the material effect, is provided with the transfer chamber during gas transmission moreover to cushion holistic jar body atmospheric pressure, be the slowing down formula and ventilate, avoid pressing unstablely, cause danger.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application. Also, the drawings and the description are not intended to limit the scope of the present concepts in any way, but rather to illustrate the concepts of the present disclosure to those skilled in the art by reference to specific embodiments.
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic structural diagram of the heat exchange pipeline of the present invention.
Fig. 3 is an enlarged view of the area a in fig. 1 according to the present invention.
In the figure: 1-a fixed frame, 11-an inner support, 13-a heat exchange pipeline, 14-a water supply pump, 15-a hot water outlet pipe, 16-a cold water outlet pipe, 2-a storage tank, 21-a temperature control cavity, 22-an inner containing cavity, 23-a material conveying cavity, 3-a material feeding frame, 31-a material conveying pump, 32-a material supply pipeline, 33-a turnover joint, 34-a material discharging pipe, 4-, 41-a pressurizing frame, 42-a middle turning cavity, 43-a gas conveying pump, 44-a gas conveying pipe, 51-a cover plate, 52-a gas sealing layer and 53-a composite waterproof layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, examples of which are shown in the drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements, unless otherwise indicated.
It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The first embodiment is as follows:
referring to fig. 1 to 3, a rough storage tank for low-temperature glass solders includes a fixing frame 1 and a storage tank 2, the storage tank 2 is installed on the fixing frame 1, the storage tank 2 includes an inner cavity 22 and a material delivery cavity 23, the material delivery cavity 23 is designed in an inverted triangle, one side of the material delivery cavity 23 is flush with the inner cavity 22, the other side of the material delivery cavity 23 is in a slope structure, a material loading frame 3 is installed on the outer side of the fixing frame 1, a material supply pipeline 32 is installed on the material loading frame 3, the vertex angle position of the material delivery cavity 23 is connected with the material supply pipeline 32, a material supply pump 31 is installed at the top of the material supply pipeline 32, a turnover joint 33 is installed at the bottom of the material supply pipeline 32, and the material supply pipeline 32 is externally connected. The sealed end of the storage tank 2 is provided with a cover plate 51, a gas-tight layer 52 and a composite waterproof layer 53 (shown in fig. 3).
The storage tank 2 is used for temporary storage of materials, the fixing frame 1 is used for fixed installation of the storage tank 2, the glass solder is stored in the inner containing cavity 22, the material conveying cavity 23 is designed in a slope mode so as to facilitate supply and output of the glass solder, and the material loading frame 3 is a material output end of the glass solder and conveys the glass solder to industrial welding operation. The whole tank body adopts three protective measures of air seal, liquid seal and external closure, and the whole sealing performance is kept.
The side wall of the inner accommodating cavity 22 is provided with a temperature control cavity 21, the inner side of the fixing frame 1 is provided with an inner support 11, the inner support 11 is provided with a heat exchange pipeline 13, the heat exchange pipeline 13 is embedded into the side wall of the storage tank 2 and is attached to the temperature control cavity 21, the bottom layer of the fixing frame 1 is also provided with a water supply pump 14, a hot water outlet pipe 15 of the water supply pump 14 is connected with the top of the heat exchange pipeline 13, and a cold water outlet pipe 16 of the water supply pump 14 is connected with the bottom of the heat exchange pipeline 13.
In order to guarantee the storage environment of low temperature glass solder, this application is provided with heat exchange mechanism between mount 1 and holding vessel 2, through the high specific volume characteristics of water to heat exchange pipeline 13 is the heat transmission medium, thereby adjusts the temperature to holding vessel 2, leads to the hot water outward winter and heaies up, leads to cold water outward summer and cools down, thereby wholly guarantees that holding vessel 2 is in a low temperature environment, guarantees the quality of built-in material.
Example two:
referring to fig. 1, this embodiment is a further optimization of the embodiment, on the basis of which, a pressurizing frame 41 is further installed on the oblique side of the top of the fixing frame 1, an air transfer pump 43 is installed on the pressurizing frame 41, an air supply pipeline is externally connected to the air transfer pump 43, the air transfer pump 43 is further connected to a transfer chamber 42 through an air transfer conduit 44, and the transfer chamber 42 is further communicated with the material conveying chamber 23 through a secondary conduit 45.
In order to improve the smooth and easy nature of defeated material, this application still is provided with pressure boost frame 41, comes the discharge of supplementary built-in material through letting in inert gas outward, improves and arranges the material effect, is provided with transfer chamber 42 during defeated gas moreover to cushion holistic jar body atmospheric pressure, be the formula of slowing down and ventilate, avoid pressing unstablely, cause danger.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (5)
1. The utility model provides a thick storage tank of low temperature glass solder, includes mount (1) and holding vessel (2), holding vessel (2) are installed on mount (1), its characterized in that, holding vessel (2) are including interior appearance chamber (22) and defeated material chamber (23), work or material rest (3) are installed to the outside of mount (1), upward install feed pipeline (32) on work or material rest (3), the apex angle position of defeated material chamber (23) is connected with feed pipeline (32), defeated material pump (31) are installed at the pipeline top of feed pipeline (32), turnover joint (33) are installed to the bottom of feed pipeline (32), feed pipeline (32) are through turnover joint (33) external discharging pipe (34), be provided with temperature control chamber (21) on the lateral wall of interior appearance chamber (22), mount (1) inboard is provided with inner support (11), and a heat exchange pipeline (13) is arranged on the inner support (11), and the heat exchange pipeline (13) is embedded into the side wall of the storage tank (2) and attached to the temperature control cavity (21).
2. The coarse storage tank for low-temperature glass solder according to claim 1, characterized in that a water supply pump (14) is further installed on the bottom layer of the fixing frame (1), a hot water outlet pipe (15) of the water supply pump (14) is connected with the top of the heat exchange pipeline (13), and a cold water outlet pipe (16) of the water supply pump (14) is connected with the bottom of the heat exchange pipeline (13).
3. The crude tank for low-temperature glass solder according to claim 1, characterized in that the feed cavity (23) is of inverted triangular design, one side of the feed cavity (23) being flush with the inner cavity (22) and the other side being of ramp-like configuration.
4. The crude storage tank for low-temperature glass solder according to any of claims 1 to 3, characterized in that the sealed end of the storage tank (2) is provided with a cover plate (51), a gas-tight layer (52) and a composite waterproof layer (53).
5. The rough storage tank for low-temperature glass solders according to claim 1 or 2, wherein a pressurizing frame (41) is further installed on the top oblique side of the fixing frame (1), an air transfer pump (43) is installed on the pressurizing frame (41), an external air supply pipeline of the air transfer pump (43) is connected to the air transfer pump (43), the air transfer pump (43) is further connected to a transfer cavity (42) through an air transfer conduit (44), and the transfer cavity (42) is further communicated with the transfer cavity (23) through a secondary conduit (45).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020347033.4U CN212448950U (en) | 2020-03-18 | 2020-03-18 | Coarse storage tank for low-temperature glass solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020347033.4U CN212448950U (en) | 2020-03-18 | 2020-03-18 | Coarse storage tank for low-temperature glass solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212448950U true CN212448950U (en) | 2021-02-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020347033.4U Active CN212448950U (en) | 2020-03-18 | 2020-03-18 | Coarse storage tank for low-temperature glass solder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212448950U (en) |
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2020
- 2020-03-18 CN CN202020347033.4U patent/CN212448950U/en active Active
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