CN212393044U - Flexible circuit board assembly and wireless earphone - Google Patents
Flexible circuit board assembly and wireless earphone Download PDFInfo
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- CN212393044U CN212393044U CN202021428962.4U CN202021428962U CN212393044U CN 212393044 U CN212393044 U CN 212393044U CN 202021428962 U CN202021428962 U CN 202021428962U CN 212393044 U CN212393044 U CN 212393044U
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Abstract
The application discloses a flexible circuit board assembly and a wireless earphone, which comprise a flexible circuit board provided with a first reinforcing area, a second reinforcing area and a third reinforcing area; a first bonding pad used for mounting the charging column is arranged on the first surface of the first reinforcing area, and a first reinforcing layer is arranged on the second surface of the first reinforcing area; a second bonding pad used for mounting the communication microphone is arranged on the first surface of the second reinforcing area, and a second reinforcing layer is arranged on the second surface of the second reinforcing area; the first surface of the third reinforcing area is provided with a connecting piece for conducting electricity, and the second surface of the third reinforcing area is provided with a third reinforcing layer. The first reinforcing layer or the second reinforcing layer is provided with an adhesive layer, and the first surface of the second reinforcing region is also provided with a third bonding pad for fixing the charging column. The flexible circuit board and the wireless earphone provided by the embodiment have the advantages that the production process is simpler, the production difficulty is lower, the production period is short, the cost can be reduced, the thickness of the reinforcing layer can be adjusted flexibly during production through adjusting the thickness of the reinforcing layer, and the trend of miniaturization of the size of the wireless earphone is met.
Description
Technical Field
The utility model belongs to the technical field of wireless earphone, especially, relate to a flexible circuit board assembly and wireless earphone.
Background
The rigid-flex Circuit Board is formed by combining an FPC (Flexible Printed Circuit) and a PCB (rigid Printed Circuit Board) through a laminating process. The prior art provides an FPC in which a reinforcing region is provided on the FPC to replace a hard board portion in a rigid-flex board. Compared with a soft and hard combined board, the FPC also has a certain flexible area and a certain rigid area, and the cost and the production period of the whole FPC board are reduced.
In recent years, with the rapid development of wireless earphone technology, the existing FPC structure is more and more unable to meet the requirements, and it has the following technical defects:
the wireless earphone is assembled by utilizing the existing FPC structure, the production process is various, the production difficulty is high, the production period is longer, the whole occupied space of the FPC structure is still larger, the thickness of the FPC structure cannot be flexibly adjusted, and the trend of miniaturization of the size of the wireless earphone cannot be met.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a flexible circuit board subassembly and wireless earphone to overcome above-mentioned technical defect.
To achieve the purpose, the utility model adopts the following technical proposal:
in a first aspect, the present invention provides a flexible circuit board assembly comprising a flexible circuit board having a first reinforcement region, a second reinforcement region, and a third reinforcement region;
a first bonding pad used for mounting a charging column is arranged on the first surface of the first reinforcing area, and a first reinforcing layer is arranged on the second surface of the first reinforcing area;
a second bonding pad used for mounting the communication microphone is arranged on the first surface of the second reinforcing area, and a second reinforcing layer is arranged on the second surface of the second reinforcing area;
the regional first face of third reinforcement is equipped with and is used for electrically conductive connecting piece, second face to be equipped with the third strengthening layer, perhaps the regional first face of third reinforcement is equipped with the third strengthening layer, the second face is equipped with and is used for electrically conductive connecting piece.
As an optional technical scheme of the utility model, first reinforcement layer or be equipped with on the second reinforcement layer and be used for fixed connection first reinforcement region with the regional adhesive linkage of second reinforcement.
As an optional technical scheme of the utility model, the regional first face of second reinforcement still is equipped with and is used for welded fastening the third pad of post charges, the tail end of post charges passes first pad first strengthening layer the second strengthening layer with the third pad.
As an optional technical scheme of the utility model, the adhesive linkage is double faced adhesive tape.
As an optional technical scheme of the utility model, first strengthening layer the second strengthening layer with the third strengthening layer is any one material constitution in polyimide, metal, polyethylene terephthalate PET and the FR4 resin.
As an optional technical solution of the present invention, the connecting member is a gold finger, a plug, a socket or a bonding pad for connecting other circuit boards.
As an optional technical solution of the present invention, the flexible circuit board further includes a first connection region and a second connection region, the first reinforcement region passes through the first connection region is connected to the second reinforcement region, the second reinforcement region passes through the second connection region is connected to the third reinforcement region.
In a second aspect, the utility model provides a wireless earphone, including the shell, still include:
the flexible circuit board assembly as described above;
the charging column penetrates through the shell and is used for charging;
the connecting member is electrically connected to the battery.
As an optional technical scheme of the utility model, flexible circuit board subassembly passes through with the earphone circuit board the connecting piece electricity is connected.
As an optional technical scheme of the utility model, flexible circuit board subassembly sets up shell bottom or lateral part, it is right with earphone box charging contact the battery charges.
Compared with the prior art, the embodiment of the utility model provides a following beneficial effect has:
install the post that charges and the conversation miaow in first reinforcement region and second reinforcement region through first pad and second pad respectively, then use after regional folding first reinforcement, second reinforcement region and third reinforcement, charge wireless earphone through post, flexible circuit board and connecting piece return circuit that charges.
The embodiment of the utility model provides a pair of flexible circuit board assembly and wireless earphone, flexible circuit board assembly have integrateed the post of charging and have talkbacked the miaow, can simplify the production processes and reduce the production degree of difficulty to shorten production cycle, and can be through the thickness of adjustment strengthening layer during production, adjust the thickness after this flexible circuit board assembly is folding in a flexible way, with the trend of catering to the miniaturization of wireless earphone size.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
The structure, ratio, size and the like shown in the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by people familiar with the technology, and are not used for limiting the limit conditions which can be implemented by the present invention, so that the present invention has no technical essential significance, and any structure modification, ratio relationship change or size adjustment should still fall within the range which can be covered by the technical content disclosed by the present invention without affecting the efficacy and the achievable purpose of the present invention.
Fig. 1 is a front structural view of a flexible circuit board according to a first embodiment;
fig. 2 is a rear structure view of a flexible circuit board according to the first embodiment;
fig. 3 is a structural diagram of a flexible circuit board assembly according to an embodiment before folding;
fig. 4 is a folded structural view of a flexible circuit board assembly according to an embodiment;
fig. 5 is a front structural view of a flexible circuit board according to a second embodiment;
fig. 6 is a rear structure view of the flexible circuit board according to the second embodiment;
fig. 7 is a folded structural view of the flexible circuit board assembly provided in the second embodiment;
fig. 8 is another structural diagram of the flexible circuit board assembly provided in the second embodiment after being folded.
Illustration of the drawings:
the flexible printed circuit board comprises a flexible printed circuit board 10, a first reinforcing region 11, a second reinforcing region 12, a third reinforcing region 13, a first pad 14, a second pad 15, a connecting piece 16, a third pad 17, a first connecting region 18, a second connecting region 19, a first reinforcing layer 21, a second reinforcing layer 22, a third reinforcing layer 23, a charging post 20, a talking microphone 30 and an adhesive layer 40.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the embodiments of the present invention are clearly and completely described with reference to the drawings in the embodiments of the present invention, and obviously, the embodiments described below are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Example one
Referring to fig. 1 to 4, the present embodiment provides a flexible circuit board assembly, which can be applied to a wireless headset, including a flexible circuit board 10, where the flexible circuit board 10 includes a first reinforcing region 11, a second reinforcing region 12, and a third reinforcing region 13. The flexible circuit board 10 has a flexible region (a portion without a reinforcing layer) and a rigid region (a portion with a reinforcing layer) by providing the first reinforcing layer 21, the second reinforcing layer 22, and the third reinforcing layer 23 on the back surfaces (i.e., the second surfaces) of the first reinforcing region 11, the second reinforcing region 12, and the third reinforcing region 13, respectively.
The first pad 14 is used for the patch mounting of the charging post 20, and the charging post 20 includes a positive post and a negative post, and thus, there are two first pads 14.
The second pad 15 is used for mounting the talking microphone 30.
The connector 16 is an electrical conductor for passing current from the charging post 20 to the interior of the wireless headset, i.e. for charging the battery inside the wireless headset.
In this embodiment, the connecting member 16 is a gold finger.
The first reinforcing region 11 and the second reinforcing region 12 are connected by a first connecting region 18, and folding is achieved. The second reinforcing region 12 and the third reinforcing region 13 are connected by a second connecting region 19, and folding is achieved.
Therefore, compared with the prior art, the flexible circuit board assembly integrates the charging post 20 and the communication microphone 30, which can simplify the production process and reduce the production difficulty, thereby shortening the production period. In addition, when the reinforcing layers (the first reinforcing layer 21, the second reinforcing layer 22, and the third reinforcing layer 23) are provided, the thickness of the folded flexible circuit board assembly can be flexibly adjusted by adjusting the thickness of the reinforcing layers, so as to meet the trend of miniaturization of the wireless headset.
Alternatively, each of the three reinforcing layers may be made of any one of polyimide, metal (e.g., steel), polyethylene terephthalate PET, and FR4 resin.
In this embodiment, the gold finger may be disposed on the back surface of the flexible circuit board 10, and the third stiffening layer 23 may be disposed on the front surface of the flexible circuit board 10.
After the flexible circuit board assembly is folded, in order to ensure that the first reinforcing region 11 and the second reinforcing region 12 are firmly fixed and prevent deviation, the following two methods are used for realizing:
an adhesive layer 40 is provided on the first reinforcing layer 21 or the second reinforcing layer 22, and when the flexible circuit board assembly is folded, the first reinforcing layer 21 and the second reinforcing layer 22 are bonded and fixed to each other by the adhesive layer 40, thereby fixing the first reinforcing region 11 and the second reinforcing region 12. Specifically, the adhesive layer 40 is a double-sided tape.
A third pad 17 is provided on the front surface of the second reinforcing region 12. When the charging post 20 is mounted, the tail end of the charging post 20 is sequentially passed through the first pad 14, the first reinforcing layer 21, the second reinforcing layer 22, and the third pad 17, and the tail end of the charging post 20 is fixed by soldering to the third pad 17, thereby fixing the first reinforcing region 11 and the second reinforcing region 12. When the first reinforcing region 11 and the second reinforcing region 12 are folded, the tail end of the charging post 20 may pass through the first pad 14, the first reinforcing layer 21, the second reinforcing layer 22 and the third pad 17, so as to achieve precise alignment, and prevent the first reinforcing region 11 and the second reinforcing region 12 from being misaligned after being folded.
In both of the above methods, the first reinforcing region 11 and the second reinforcing region 12 can be fixed. The difference is that the cost of the fixing method of the adhesive layer 40 is lower in terms of cost, and the thickness of the flexible circuit board assembly obtained by the welding fixing method is smaller after being folded, and the occupied space is smaller. Of course, the two methods can be adopted for fixing at the same time, double insurance is achieved, and adverse effects caused by failure of any one fixing mode are avoided.
Example two
Referring to fig. 5 to 8, the present embodiment provides a flexible circuit board assembly, which can be applied to a wireless headset, including a flexible circuit board 10, where the flexible circuit board 10 includes a first reinforcing region 11, a second reinforcing region 12, and a third reinforcing region 13. The flexible printed circuit board 10 has a flexible region (a portion without a reinforcing layer) and a rigid region (a portion with a reinforcing layer) by providing the first reinforcing layer 21 and the second reinforcing layer 22 on the back surface (i.e., the second surface) of the first reinforcing region 11 and the second reinforcing region 12, respectively, and providing the third reinforcing layer 23 on the front surface (i.e., the first surface) of the third reinforcing region 13.
First and second pads 14 and 15 are provided on the front surfaces (i.e., first surfaces) of the first and second reinforcing regions 11 and 12, respectively, and a connector 16 is provided on the back surface of the third reinforcing region 13.
The first pad 14 is used for the patch mounting of the charging post 20, and the charging post 20 includes a positive post and a negative post, and thus, there are two first pads 14.
The second pad 15 is used for mounting the talking microphone 30.
The connector 16 is an electrical conductor for transferring current from the charging post 20 to the interior of the wireless headset, in particular for charging a battery inside the wireless headset.
In this embodiment, the connector 16 is a plug.
The first reinforcing region 11 and the second reinforcing region 12 are connected by a first connecting region 18, and folding is achieved. The second reinforcing region 12 and the third reinforcing region 13 are connected by a second connecting region 19, and folding is achieved.
Therefore, compared with the prior art, the flexible circuit board assembly integrates the charging post 20 and the communication microphone 30, which can simplify the production process and reduce the production difficulty, thereby shortening the production period. In addition, when the reinforcing layers (the first reinforcing layer 21, the second reinforcing layer 22, and the third reinforcing layer 23) are provided, the thickness of the folded flexible circuit board assembly can be flexibly adjusted by adjusting the thickness of the reinforcing layers, so as to meet the trend of miniaturization of the wireless headset.
The three reinforcing layers can be made of any one of polyimide, steel and FR4 grade materials.
In this embodiment, the plug may be disposed on the front surface of the flexible circuit board 10, and the third stiffening layer 23 may be disposed on the back surface of the flexible circuit board 10.
After the flexible circuit board assembly is folded, in order to ensure that the first reinforcing region 11 and the second reinforcing region 12 are firmly fixed and prevent deviation, the following two methods are used for realizing:
an adhesive layer 40 is provided on the first reinforcing layer 21 or the second reinforcing layer 22, and when the flexible circuit board assembly is folded, the first reinforcing layer 21 and the second reinforcing layer 22 are bonded and fixed to each other by the adhesive layer 40, thereby fixing the first reinforcing region 11 and the second reinforcing region 12. Specifically, the adhesive layer 40 is a double-sided tape.
A third pad 17 is provided on the front surface of the second reinforcing region 12. When the charging post 20 is mounted, the tail end of the charging post 20 is sequentially passed through the first pad 14, the first reinforcing layer 21, the second reinforcing layer 22, and the third pad 17, and the tail end of the charging post 20 is fixed by soldering to the third pad 17, thereby fixing the first reinforcing region 11 and the second reinforcing region 12. When the first reinforcing region 11 and the second reinforcing region 12 are folded, the tail end of the charging post 20 may pass through the first pad 14, the first reinforcing layer 21, the second reinforcing layer 22 and the third pad 17, so as to achieve precise alignment, and prevent the first reinforcing region 11 and the second reinforcing region 12 from being misaligned after being folded.
In both of the above methods, the first reinforcing region 11 and the second reinforcing region 12 can be firmly fixed. The difference is that the fixing method of the adhesive layer 40 is lower in cost. In consideration of thickness, the thickness of the flexible circuit board assembly obtained by the welding and fixing mode is smaller after the flexible circuit board assembly is folded, and the occupied space is smaller. Of course, the two methods can be adopted for fixing at the same time, double insurance is achieved, and adverse effects caused by failure of any one fixing mode are avoided.
It should be noted that the connecting members 16 may be provided as pads as needed. The flexible circuit board assembly is connected with other circuit boards in the wireless earphone through the welding disc.
EXAMPLE III
The present embodiment provides a wireless headset, including:
outer casing
The flexible circuit board assembly of any preceding embodiment.
The charging post 20 penetrates the housing for charging;
the connector 16 is electrically connected to the battery.
The flexible circuit board assembly is electrically connected to the earphone circuit board by a connector 16.
The flexible circuit board assembly is arranged at the bottom or the side part of the shell and is in contact with the charging contact of the earphone box to charge the battery.
The charging post 20 in the above embodiment is connected to a charging contact of the earphone box to get electricity, and then the electric energy is transmitted to the earphone circuit board through the flexible circuit board 10 and the connecting piece 16 (gold finger or plug), so as to charge the battery.
The wireless earphone that this embodiment provided, the production process is simpler, the degree of difficulty is lower to can be through the thickness of adjusting the strengthening layer during production, the thickness after this flexible circuit board subassembly is folded in a flexible way to cater to the miniaturized trend of wireless earphone size.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (10)
1. A flexible circuit board assembly is characterized by comprising a flexible circuit board provided with a first reinforcing area, a second reinforcing area and a third reinforcing area;
a first bonding pad used for mounting a charging column is arranged on the first surface of the first reinforcing area, and a first reinforcing layer is arranged on the second surface of the first reinforcing area;
a second bonding pad used for mounting the communication microphone is arranged on the first surface of the second reinforcing area, and a second reinforcing layer is arranged on the second surface of the second reinforcing area;
the regional first face of third reinforcement is equipped with and is used for electrically conductive connecting piece, second face to be equipped with the third strengthening layer, perhaps the regional first face of third reinforcement is equipped with the third strengthening layer, the second face is equipped with and is used for electrically conductive connecting piece.
2. The flexible circuit board assembly of claim 1, wherein an adhesive layer is disposed on the first reinforcing layer or the second reinforcing layer for fixedly connecting the first reinforcing region and the second reinforcing region.
3. The flexible circuit board assembly according to claim 1 or 2, wherein the first surface of the second reinforcing region is further provided with a third pad for solder-fixing the charging post, and the tail end of the charging post passes through the first pad, the first reinforcing layer, the second reinforcing layer and the third pad.
4. The flexible circuit board assembly of claim 2, wherein the adhesive layer is a double-sided tape.
5. The flexible circuit board assembly of claim 1, wherein the first reinforcing layer, the second reinforcing layer and the third reinforcing layer are made of any one of polyimide, metal, polyethylene terephthalate (PET) and FR4 resin.
6. The flexible circuit board assembly of claim 1, wherein the connector is a gold finger, a plug, a socket, or a pad for connecting to a circuit board.
7. The flexible circuit board assembly of claim 1, further comprising a first connection region and a second connection region, the first stiffening region connecting the second stiffening region through the first connection region, the second stiffening region connecting the third stiffening region through the second connection region.
8. A wireless headset comprising a housing, further comprising:
the flexible circuit board assembly of any one of claims 1-7;
the charging column penetrates through the shell and is used for charging;
the connecting member is electrically connected to the battery.
9. The wireless headset of claim 8, wherein the flexible circuit board assembly is electrically connected to the headset cord through the connector.
10. The wireless headset of claim 9, wherein the flexible circuit board assembly is disposed on the bottom or side of the housing and contacts a headset case charging contact to charge the battery.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021428962.4U CN212393044U (en) | 2020-07-20 | 2020-07-20 | Flexible circuit board assembly and wireless earphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021428962.4U CN212393044U (en) | 2020-07-20 | 2020-07-20 | Flexible circuit board assembly and wireless earphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212393044U true CN212393044U (en) | 2021-01-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021428962.4U Active CN212393044U (en) | 2020-07-20 | 2020-07-20 | Flexible circuit board assembly and wireless earphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212393044U (en) |
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2020
- 2020-07-20 CN CN202021428962.4U patent/CN212393044U/en active Active
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