CN212367627U

CN212367627U - Improved structure of flexible circuit board bonding pad

Info

Publication number: CN212367627U
Application number: CN202021302507.XU
Authority: CN
Inventors: 秦刚
Original assignee: Nanjing Xinda Shangpin Intelligent Technology Co ltd
Current assignee: Nanjing Xinda Shangpin Intelligent Technology Co ltd
Priority date: 2020-07-06
Filing date: 2020-07-06
Publication date: 2021-01-15
Anticipated expiration: 2030-07-06

Abstract

The utility model relates to a circuit board manufacturing technology field just discloses a flexible line way board pad improves structure, including flexible circuit board, T type hole has been seted up to flexible circuit board's inside, and flexible circuit board passes through T type hole fixedly connected with T type head, the top fixedly connected with bracing piece of T type head, the top fixedly connected with pad base of bracing piece, fixedly connected with limit baffle I respectively at the positive back of pad base. Through protruding radian control and the limiting displacement of limit baffle I and limit baffle II of pad base, realized that the electronic component pin can directly get into contact with the pad base in limit baffle I and limit baffle II, when liquid soldering tin drips from the electric iron, liquid soldering tin is fully welded at limit baffle I and II insides of limit baffle with electronic component's pin, has improved the welded accuracy, has avoided the rosin joint condition of leaking the welding.

Description

Improved structure of flexible circuit board bonding pad

Technical Field

The utility model relates to a circuit board manufacturing technology field specifically is a flexible line way board pad improves structure.

Background

As the demand for micro circuits increases, the flexible circuit board industry is under rapid development, and the flexible circuit board has high wiring density, good bending property, light weight, and can be better used for the assembly of three-dimensional space.

In the welding process, pins of electronic elements are required to be placed on the bonding pads, welding is carried out through the electric soldering iron, if careless operation is carried out, false welding and missing welding can be caused, poor element contact is caused, and the false welding points causing faults are required to be found out from electronic equipment with thousands of welding points subsequently, so that the production efficiency is reduced, and the production cost is increased; when the electronic element is taken down again due to welding errors, repeated operation causes overhigh temperature, the welding disc falls off and is adhered to the electronic element, so that the whole circuit board is scrapped, the production cost is improved, and available resources are wasted.

SUMMERY OF THE UTILITY MODEL

Not enough to current flexible line way board pad, the utility model provides a flexible line way board pad improves structure possesses the advantage of preventing rosin joint, hourglass welding, has solved the problem that above-mentioned background art provided.

The utility model provides a following technical scheme: the utility model provides a flexible line way board pad improves structure, includes the flexible circuit board, T type hole has been seted up to the inside of flexible circuit board, the flexible circuit board passes through T type hole fixedly connected with T type head, the top fixedly connected with bracing piece of T type head, the top fixedly connected with pad base of bracing piece, fixedly connected with limit baffle I respectively is fixed on the positive back of pad base, fixedly connected with limit baffle II respectively is fixed in the both sides of pad base.

Preferably, the flexible circuit board is located at a distance of ten micrometers from the bottom end of the pad base.

Preferably, the height of the limiting baffle I and the height of the limiting baffle II are forty microns.

Preferably, the height of the pad mount is twenty microns.

Preferably, the T-shaped hole is T-shaped, and the width of the T-shaped hole is ten micrometers wider than that of the upper structure.

Preferably, the height of the T-head is ten microns.

With current flexible line way board pad contrast, the utility model discloses possess following beneficial effect:

1. this flexible line way board pad improves structure, protruding radian control and limit baffle I through the pad base and the limiting displacement of limit baffle II, realized that the electronic component pin can directly get into contact with the pad base in limit baffle I and limit baffle II, when liquid soldering tin drips from the electric iron, liquid soldering tin is fully welded at limit baffle I and II insides of limit baffle with electronic component's pin, welded accuracy has been improved, the rosin joint condition of leaking the welding has been avoided.

2. This flexible line way board pad improves structure, through T type head and bracing piece at the downthehole fixed link of T type, makes the pad be difficult for droing, when having reduced because of welding error takes off electronic component, the pad adhesion is on electronic component, and the risk of harm circuit board has reduced the welding cost.

Drawings

FIG. 1 is a schematic view of the present invention in a front view;

FIG. 2 is a perspective view of the present invention;

fig. 3 is a schematic top view of the structure of the present invention.

In the figure: 1. a flexible circuit board; 2. a T-shaped hole; 3. a T-shaped head; 4. a support bar; 5. a pad base; 6. a limiting baffle I; 7. and a limiting baffle II.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, an improved structure of a flexible circuit board pad comprises a flexible circuit board 1, a T-shaped hole 2 is formed in the flexible circuit board 1, the T-shaped hole 2 is T-shaped and has a width ten micrometers wider than that of a structure above, the stability of the pad is improved, the flexible circuit board 1 is fixedly connected with a T-shaped head 3 through the T-shaped hole 2, the height of the T-shaped head 3 is ten micrometers, the top end of the T-shaped head 3 is fixedly connected with a support rod 4, the top end of the support rod 4 is fixedly connected with a pad base 5, the flexible circuit board 1 is ten micrometers away from the bottom end of the pad base 5, the die opening edge can be clamped in, poor contact caused by a film is avoided, the height of the pad base 5 is twenty micrometers, a height difference exists between the height 6 and the height 7, so as to limit pins, a limit baffle i 6 is fixedly connected to the front back of the pad base 5 respectively, the height, and two sides of the bonding pad base 5 are respectively and fixedly connected with a limiting baffle II 7.

The working principle is as follows: during the use, lay flat flexible circuit board 1, make the pad expose on the circuit board, put into limit baffle I6 and limit baffle II 7 with correct position electronic component's pin, heat soldering tin into liquid on the electric iron, on instiling into the pad base 5 around the electronic component, soldering tin gathers above pad base 5 and the inside of limit baffle I6 and limit baffle II 7 and solidifies, get rid of unnecessary soldering tin after, the test finishes promptly and welds successfully.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Also in the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and for simplicity of description, and do not indicate or imply that the equipment or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. In addition, in the drawings of the present invention, the filling pattern is only for distinguishing the pattern layer, and is not limited to any other pattern.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a flexible line way board pad improves structure, includes flexible circuit board (1), its characterized in that: t type hole (2) have been seted up to the inside of flexible circuit board (1), flexible circuit board (1) is through T type hole (2) fixedly connected with T type head (3), top fixedly connected with bracing piece (4) of T type head (3), top fixedly connected with pad base (5) of bracing piece (4), fixedly connected with limit baffle I (6) respectively is just backed at pad base (5), fixedly connected with limit baffle II (7) respectively is in the both sides of pad base (5).

2. The improved structure of the bonding pad of the flexible circuit board as claimed in claim 1, wherein: the distance between the flexible circuit board (1) and the bottom end of the pad base (5) is ten microns.

3. The improved structure of the bonding pad of the flexible circuit board as claimed in claim 1, wherein: the height of the limiting baffle I (6) and the height of the limiting baffle II (7) are forty microns.

4. The improved structure of the bonding pad of the flexible circuit board as claimed in claim 1, wherein: the height of the pad base (5) is twenty microns.

5. The improved structure of the bonding pad of the flexible circuit board as claimed in claim 1, wherein: the T-shaped hole (2) is T-shaped, and the width of the T-shaped hole is ten microns wider than that of the upper structure.

6. The improved structure of the bonding pad of the flexible circuit board as claimed in claim 1, wherein: the height of the T-shaped head (3) is ten microns.