CN212366414U - Chip mounting device for semiconductor laser - Google Patents
Chip mounting device for semiconductor laser Download PDFInfo
- Publication number
- CN212366414U CN212366414U CN202021169070.7U CN202021169070U CN212366414U CN 212366414 U CN212366414 U CN 212366414U CN 202021169070 U CN202021169070 U CN 202021169070U CN 212366414 U CN212366414 U CN 212366414U
- Authority
- CN
- China
- Prior art keywords
- guide rail
- heating
- linear guide
- frame
- suction head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 13
- 238000010438 heat treatment Methods 0.000 claims abstract description 50
- 230000007246 mechanism Effects 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 17
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000010354 integration Effects 0.000 abstract description 2
- 230000009467 reduction Effects 0.000 abstract description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 241000252254 Catostomidae Species 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000010626 work up procedure Methods 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a chip mounting device of a semiconductor laser, which comprises a workbench, wherein a heating operation mechanism, a material groove and a mounting operation mechanism are respectively arranged on the workbench; the heating operation mechanism comprises a first linear guide rail, a propulsion cylinder and a heating platform which are arranged on the workbench, the heating platform is arranged on the first linear guide rail in a sliding mode, the propulsion cylinder is connected with and pushes and pulls the heating platform, a heating groove is formed in the heating platform, and a marking line is arranged in the heating groove; the paster running mechanism is including establishing second linear guide on the workstation, the Y axle guide rail frame slides and establishes on the second linear guide, it is equipped with Y axle operation frame to slide between the Y axle guide rail frame, Y axle operation frame has the lift cylinder, the lift cylinder goes up and down to be connected with the sucking disc frame, be equipped with on the sucking disc frame vacuum suction head. The utility model discloses an integration processing platform improves the paster precision, and reduction in production rises originally.
Description
Technical Field
The utility model belongs to the technical field of the chip paster, concretely relates to semiconductor laser chip paster device.
Background
The traditional paster is pasted under a microscope by conductive adhesive and tweezers, so that the paster precision is in the range of dozens of micrometers, and the heat dissipation of a chip is not good. The conventional automatic paster system is characterized in that a paster workbench is arranged separately, and elements are not in the same coordinate system in the alignment process due to the fact that the material table and the processing table are arranged separately in the process from the material table to the processing table, so that the paster accuracy is influenced due to unstable factors.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a semiconductor laser chip paster device adopts integration processing platform, improves the paster precision, and reduction in production rises originally.
The utility model provides a following technical scheme:
a chip mounting device of a semiconductor laser comprises a workbench, wherein a heating operation mechanism, a material groove and a mounting operation mechanism are respectively arranged on the workbench; the heating operation mechanism comprises a first linear guide rail, a propulsion cylinder and a heating platform which are arranged on the workbench, the propulsion cylinder is arranged between the first linear guide rail, the heating platform is arranged on the first linear guide rail in a sliding manner, the propulsion cylinder is connected with and pushes and pulls the heating platform, a heating groove is formed in the heating platform, and a marking line is arranged in the heating groove; the paster running mechanism comprises a second linear guide rail, a Y-axis guide rail frame and a vacuum suction head, the second linear guide rail, the Y-axis guide rail frame and the vacuum suction head are arranged on the workbench, the Y-axis guide rail frame is arranged on the second linear guide rail in a sliding mode, a Y-axis running frame is arranged between the Y-axis guide rail frames in a sliding mode, a lifting cylinder is arranged below the Y-axis running frame, the lifting cylinder is connected with a suction head frame in a lifting mode, the vacuum suction head is arranged on the suction head frame, the vacuum suction head corresponds to the material groove and the heating groove along with the motion direction of the second linear guide rail, a center mark position is arranged in the material groove, and the center.
Preferably, support plates are arranged on two sides of the heating table respectively, support holes are formed in the support plates, and buckling plates are hinged to the support holes.
Preferably, two ends of the first linear guide rail are provided with limiting blocks.
Preferably, the second linear guide is arranged at the outer side position of the first linear guide, and the Y-axis running frame can run to cross over the material groove and the heating platform.
Preferably, the Y-axis guide rail frame and the Y-axis running frame are respectively connected with an orbital running motor, and the propulsion cylinder, the orbital running motor, the lifting cylinder and the vacuum suction head are controlled by a PLC (programmable logic controller) to run.
The utility model has the advantages that: the paster workstation adopts integrated design and linear guide design, has improved the paster precision of chip greatly, through mechanical operation structure, accomplishes paster work automatically, reduces artifical manufacturing cost.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic view of the overall structure of the present invention;
labeled as: 1. a work table; 2. a heating operation mechanism; 21. propelling the cylinder; 22. a first linear guide rail; 221. a limiting block; 23. a heating stage; 24. heating the groove; 241. marking a line; 25. a bracket hole; 251. buckling the plate; 3. a material groove; 31. a central marker bit; 4. a patch running mechanism; 41. a second linear guide; a Y-axis rail mount; a Y-axis running carriage; 431. a lifting cylinder; 432. a suction cup holder; 44. a vacuum chuck.
Detailed Description
As shown in fig. 1, a semiconductor laser chip mounting device comprises a workbench 1, wherein a heating operation mechanism 2, a material tank 3 and a mounting operation mechanism 4 are respectively arranged on the workbench 1; the heating operation mechanism 2 comprises a first linear guide rail 22, a propulsion cylinder 21 and a heating platform 23 which are arranged on the workbench 1, the propulsion cylinder 21 is arranged between the first linear guide rails 22, the heating platform 23 is arranged on the first linear guide rail 22 in a sliding mode, and two ends of the first linear guide rail 22 are provided with limiting blocks 221 to prevent the heating platform 23 from running out. The propulsion cylinder 21 is connected with and pushes and pulls the heating platform 23, a heating groove 24 is formed in the heating platform 23, a marking line 241 is arranged in the heating groove 24, support plates are respectively arranged on two sides of the heating platform 23, a support hole 25 is formed in each support plate, a buckle plate 251 is hinged to each support hole 25 and used for connecting and arranging a nitrogen protection device, and an air blowing pipe of the nitrogen protection device corresponds to the heating groove to achieve rapid cooling; the patch running mechanism 4 comprises a second linear guide rail 41 arranged on the workbench 1, a Y-axis guide rail frame 42 and a vacuum suction head 44, the Y-axis guide rail frame 42 is arranged on the second linear guide rail 41 in a sliding mode, a Y-axis running frame 43 is arranged between the Y-axis guide rail frames 42 in a sliding mode, the second linear guide rail 41 is arranged at the outer side position of the first linear guide rail 22, and the Y-axis running frame 43 can run to stretch over the material groove 3 and the heating table 23. A lifting cylinder 431 is arranged below the Y-axis running frame 43, the lifting cylinder 431 is connected with a sucker frame 432 in a lifting mode, a vacuum sucker 44 is arranged on the sucker frame 432, the vacuum sucker 44 corresponds to the material groove 3 and the heating groove 24 along with the moving direction of the second linear guide rail 41, a central marking position 31 is arranged in the material groove 3, and the central marking position 31 corresponds to the vacuum suckers 44 one by one. Further, the Y-axis rail mount 42 and the Y-axis moving mount 43 are respectively connected to an orbiting motor, and the propulsion cylinder 21, the orbiting motor, the lift cylinder 431, and the vacuum suction head 44 are controlled by a PLC controller to operate, thereby completing an automatic control process of the patch mounting.
As shown in fig. 1, in the using process of a semiconductor laser chip mounting device, a vacuum suction head 44 is adopted to adjust the position of a chip to be mounted in a material tank 3 according to a central mark position 31, in the adjusting and adsorbing process, a lifting cylinder 431 is used for driving a suction disc rack 432 to move up and down so as to drive the vacuum suction head 44 to work up and down, and the large-distance up-and-down adjustment can be carried out by adopting a Y-axis running rack 43 to move up and down on a Y-axis guide rail rack 42; the adjusted patch raw material is transversely moved into the heating groove 24 through the vacuum suction head 44, and the mark line 241 in the heating groove 24 is convenient for marking the relative position, so that the patch is more accurate; after the patch pressing is completed by the up-and-down operation of the vacuum suction head 44 in the heating groove 24 again, the propulsion cylinder 21 pulls back the heating table 23, and a nitrogen protection device can be connected to quickly cool the patch chip, so that the final patch working is completed.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. A chip mounting device of a semiconductor laser is characterized by comprising a workbench, wherein a heating operation mechanism, a material groove and a mounting operation mechanism are respectively arranged on the workbench; the heating operation mechanism comprises a first linear guide rail, a propulsion cylinder and a heating platform which are arranged on the workbench, the propulsion cylinder is arranged between the first linear guide rail, the heating platform is arranged on the first linear guide rail in a sliding manner, the propulsion cylinder is connected with and pushes and pulls the heating platform, a heating groove is formed in the heating platform, and a marking line is arranged in the heating groove; the paster running mechanism comprises a second linear guide rail, a Y-axis guide rail frame and a vacuum suction head, the second linear guide rail, the Y-axis guide rail frame and the vacuum suction head are arranged on the workbench, the Y-axis guide rail frame is arranged on the second linear guide rail in a sliding mode, a Y-axis running frame is arranged between the Y-axis guide rail frames in a sliding mode, a lifting cylinder is arranged below the Y-axis running frame, the lifting cylinder is connected with a suction head frame in a lifting mode, the vacuum suction head is arranged on the suction head frame, the vacuum suction head corresponds to the material groove and the heating groove along with the motion direction of the second linear guide rail, a center mark position is arranged in the material groove, and the center.
2. A semiconductor laser chip mounting device as claimed in claim 1, wherein support plates are respectively disposed on two sides of the heating stage, and support holes are disposed on the support plates, and the support holes are hinged with pinch plates.
3. A semiconductor laser chip mounting device as claimed in claim 1 wherein the first linear guide has two ends provided with a limiting block.
4. A semiconductor laser chip mounting device as claimed in claim 1 wherein said second linear guide is disposed outside of said first linear guide, said Y-axis carriage being movable to traverse over said material slot and said heating stage.
5. A semiconductor laser chip mounting device as claimed in claim 1, wherein said Y-axis rail frame and said Y-axis running frame are respectively connected to an orbiting motor, and said propulsion cylinder, said orbiting motor, said lifting cylinder and said vacuum suction head are controlled by a PLC controller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021169070.7U CN212366414U (en) | 2020-06-22 | 2020-06-22 | Chip mounting device for semiconductor laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021169070.7U CN212366414U (en) | 2020-06-22 | 2020-06-22 | Chip mounting device for semiconductor laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212366414U true CN212366414U (en) | 2021-01-15 |
Family
ID=74151187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021169070.7U Expired - Fee Related CN212366414U (en) | 2020-06-22 | 2020-06-22 | Chip mounting device for semiconductor laser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212366414U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111600194A (en) * | 2020-06-22 | 2020-08-28 | 江苏飞格光电有限公司 | Semiconductor laser chip mounting device and method |
-
2020
- 2020-06-22 CN CN202021169070.7U patent/CN212366414U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111600194A (en) * | 2020-06-22 | 2020-08-28 | 江苏飞格光电有限公司 | Semiconductor laser chip mounting device and method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210115 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |