CN212362292U - Semiconductor air conditioner - Google Patents

Abstract

The application provides a semiconductor air conditioner. This air conditioner casing, heat exchange structure subassembly and water collector. The air conditioner shell is respectively provided with an air return inlet, a cold air outlet and a hot air outlet, a hot air flow channel and a cold air flow channel which are relatively independent are formed in the air conditioner shell, the hot air flow channel is communicated with the hot air outlet, and the cold air flow channel is communicated with the cold air outlet. The cooling heat exchange structure is provided with cooling fin runners, and the cooling heat exchange structure is provided with cooling fin runners. The heat dissipation fin flow channels extend in the vertical direction, and the hot air flow channels are located above the heat dissipation fin flow channels. Use the technical scheme of the utility model, can make the hot gas flow pass through the radiating fin runner fast with the help of the power that the hot gas flow rose, thereby improve the wind speed in the radiating fin runner, make heat dissipation heat transfer structure can dispel the heat to the semiconductor refrigeration piece by more efficient, improve the refrigeration efficiency of semiconductor refrigeration piece, thereby improve the refrigeration efficiency of semiconductor air conditioner.

Description

Semiconductor air conditioner

Technical Field

The utility model relates to an air conditioning equipment technical field particularly, relates to a semiconductor air conditioner.

Background

The air conditioner aiming at the kitchen environment is provided with an air duct type form and is arranged in a kitchen ceiling; the air conditioner has the characteristics that the air conditioner is of a single-side air outlet ceiling type, is flush with a ceiling buckle plate after being installed, and the like, is large in engineering installation amount, and is suitable for a kitchen which is not decorated. If want to install this type of kitchen air conditioner, need demolish the furred ceiling, after the installation unit, recover the furred ceiling again, the work load of installation unit is bigger for the installation cost of unit is great, and the user is difficult to accept.

And the most refrigerant refrigeration modes of present unit, the unit at this moment leads to whole unit heavy owing to have big quality devices such as compressor, even if integral type wall hang-up, also have the problem that the unit occupation space is big, it is the common fault to lead to the too big size of market feedback, and the unit is heavy, inconvenient dismouting is clean, consequently, develop a unit that still can easy to assemble after being suitable for the kitchen fitment, the unit installation work load is little simultaneously, the unit is light, easily settle, it will be necessary nature to maintain simple and convenient air conditioner.

In order to solve the problems, some semiconductor air conditioners which are convenient to install and maintain are also available in the market, but the air duct arrangement of the conventional semiconductor air conditioner is not reasonable enough, so that the heat dissipation efficiency of the heat dissipation surface of the semiconductor refrigeration piece is not high enough. Due to the characteristics of the semiconductor refrigerating sheet, when the heat dissipation efficiency of the heat dissipation surface is low, the refrigerating efficiency is low, and the performance of the semiconductor air conditioner is affected.

SUMMERY OF THE UTILITY MODEL

An embodiment of the utility model provides a semiconductor air conditioner to solve among the prior art semiconductor air conditioner exist because the cooling surface radiating efficiency of semiconductor refrigeration piece receives the technical problem that the refrigeration efficiency that the restriction leads to is low.

The embodiment of the application provides a semiconductor air conditioner, includes: the air conditioner comprises an air conditioner shell, wherein the air conditioner shell is respectively provided with a return air inlet, a cold air outlet and a hot air outlet, and a hot air flow channel communicated with the hot air outlet is formed in the air conditioner shell; the heat exchange structure assembly comprises a cold dissipation heat exchange structure, a heat dissipation heat exchange structure and semiconductor refrigerating fins arranged between the cold dissipation heat exchange structure and the heat dissipation heat exchange structure, wherein a cold dissipation fin flow passage is formed in the cold dissipation heat exchange structure, a heat dissipation fin flow passage is formed in the heat dissipation heat exchange structure, two ends of the heat dissipation fin flow passage are respectively communicated with a return air inlet and a hot air flow passage, the heat dissipation fin flow passage extends along the vertical direction or extends along the inclined mode relative to the vertical direction, and the hot air flow passage is positioned above the heat dissipation fin flow passage.

In one embodiment, the hot air outlet is connected at the top of the hot air flow path.

In one embodiment, the hot air outlet is located at the top of the air conditioning case.

In one embodiment, a cold air flow channel communicated with the cold air outlet is further formed in the air conditioner shell, two ends of the cooling dispersion fin flow channel are respectively communicated with the air return opening and the cold air flow channel, and the extension direction of the cooling dispersion fin flow channel is consistent with the air inlet direction of the air return opening.

In one embodiment, the return air inlet is located on the side of the air conditioning casing, and the cooling fin flow channel extends along the horizontal direction or along the inclined manner relative to the horizontal direction.

In one embodiment, the cold airflow passage is arranged in a vertical direction, and the cold airflow outlet is opened at a lower side of the air-conditioning case.

In one embodiment, the number of the air return openings is two, the two air return openings are respectively located at two sides of the air conditioner shell, the number of the heat exchange structure components is also two, the two heat exchange structure components are respectively arranged corresponding to the two air return openings, and the cold air flow channel is formed between the two heat exchange structure components.

In one embodiment, the semiconductor air conditioner further comprises a water pan, and the water pan is arranged at the bottom of the cold air flow channel.

In one embodiment, the bottom of the water pan is provided with a drain hole for draining water.

In one embodiment, the water receiving tray forms at least part of the cold air flow passage, and an air outlet communicated with the cold air outlet is formed on the water receiving tray.

In one embodiment, the semiconductor air conditioner further comprises a water cooling assembly, the water cooling assembly is connected between the water pan and the heat exchange structure assembly, and the water cooling assembly is used for sucking condensed water from the water pan and spraying the condensed water above the heat dissipation and heat exchange structure.

In one embodiment, a water cooling assembly includes: the water pump is arranged in the water receiving tray and is used for sucking water from the water receiving tray; the first end of drain pipe links to each other with the water pump, and the second end of drain pipe is located heat dissipation heat transfer structure's top.

In one embodiment, the water cooling assembly further comprises a spray header mounted at the second end of the drain pipe for spraying the condensed water above the heat dissipation and heat exchange structure.

In one embodiment, the heat exchange structure assembly further comprises an air duct plate, the cold dissipation heat exchange structure and the heat dissipation heat exchange structure are installed between the air duct plates, the air duct plate is provided with a cold dissipation inlet and a cold dissipation outlet which are communicated with the cold dissipation fin flow passages, the cold dissipation inlet is opposite to the air return opening, and the cold dissipation outlet is communicated with the hot air flow passage.

In one embodiment, one heat exchange structure unit is composed of one cold dissipation heat exchange structure, one heat dissipation heat exchange structure and at least one semiconductor refrigeration piece, the number of the heat exchange structure units is multiple, and the multiple heat exchange structure units are arranged adjacently.

In one embodiment, in the thickness direction, the heat dissipation and heat exchange structures of two adjacent heat exchange structure units are arranged oppositely, and the cold dissipation and heat exchange structures of two adjacent heat exchange structure units are arranged oppositely.

In one embodiment, in the width direction, the heat dissipation and heat exchange structures of two adjacent heat exchange structure units are arranged side by side, and the cold dissipation and heat exchange structures of two adjacent heat exchange structure units are arranged side by side.

In one embodiment, a hot air exhaust device is disposed in the hot air flow passage, and a cold air exhaust device is disposed in the cold air flow passage.

In one embodiment, the cold air outlet is provided in plurality, and the plurality of cold air outlets are arranged at intervals.

In the above embodiment, the heat dissipation fin flow channel extends in the vertical direction, and the hot airflow channel is located above the heat dissipation fin flow channel, enters the airflow of the heat dissipation fin flow channel through the air return opening, and is heated by the heat dissipation fin flow channel, so that the hot airflow can quickly pass through the heat dissipation fin flow channel by virtue of the rising force of the hot airflow, and thus the air speed in the heat dissipation fin flow channel is increased, the heat dissipation heat exchange structure can more efficiently dissipate the heat of the semiconductor chilling plate, the refrigeration efficiency of the semiconductor chilling plate is increased, and the refrigeration efficiency of the semiconductor air conditioner is increased.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. In the drawings:

fig. 1 is a schematic perspective view of a semiconductor air conditioner according to the present invention, with a back shell removed;

FIG. 2 is a schematic front view of the semiconductor air conditioner of FIG. 1;

FIG. 3 is a schematic side view of the semiconductor air conditioner of FIG. 1;

FIG. 4 is a schematic structural view illustrating a hot air flow of the embodiment of the semiconductor air conditioner of FIG. 1;

fig. 5 is a schematic structural view illustrating circulation of cold airflow of the embodiment of the semiconductor air conditioner of fig. 1;

fig. 6 is a schematic structural view of a heat exchange structure assembly of the embodiment of the semiconductor air conditioner of fig. 1;

FIG. 7 is an exploded view of the heat exchange structure assembly of FIG. 6;

FIG. 8 is a schematic perspective view of a heat exchange structure unit of the heat exchange structure assembly of FIG. 6;

FIG. 9 is an exploded schematic view of the heat exchange building block of FIG. 8;

FIG. 10 is a schematic structural view of a cold rejection heat exchange structure of the heat exchange structural unit of FIG. 8;

FIG. 11 is a schematic structural view of a heat dissipating and exchanging structure of the heat exchanging structural unit of FIG. 8;

fig. 12 is a schematic structural view of another heat exchange structure assembly of the semiconductor air conditioner according to the present invention;

fig. 13 is a schematic perspective view of a water pan of the semiconductor air conditioner of fig. 1;

fig. 14 is a sectional view schematically showing a structure of a water cooling module of the semiconductor air conditioner of fig. 1;

FIG. 15 is a schematic perspective view of the water cooling assembly of FIG. 14;

fig. 16 is a schematic view showing the installation effect of the embodiment of the semiconductor air conditioner according to the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the following embodiments and accompanying drawings. The exemplary embodiments and descriptions of the present invention are provided to explain the present invention, but not to limit the present invention.

It should be noted that the air duct of the existing semiconductor air conditioner is not reasonable enough, so that the cold dissipating efficiency of the cold dissipating surface of the semiconductor refrigerating sheet is not high enough. Due to the characteristics of the semiconductor refrigerating sheet, when the cooling efficiency of the cooling surface is low, the refrigerating efficiency is low, and the performance of the semiconductor air conditioner is affected. The utility model discloses a semiconductor refrigeration piece refrigerates, semiconductor refrigeration piece can a face temperature reduce after the circular telegram, another face temperature risees, this kind of characteristic of application refrigeration piece, the both sides face of piece that will refrigerate pastes the cold ware that looses tightly, make heat or cold volume transmit on the cold ware that looses, and the channel group who looses cold ware fin direction and formation of ingenious application establishes reasonable wind channel, make the better scattered cold of cold side that looses to semiconductor refrigeration piece, thereby improve the work efficiency of semiconductor refrigeration piece. As shown in fig. 1 and 2, the embodiment of the semiconductor air conditioner of the present invention includes an air conditioner casing 10, a heat exchange structure assembly 20, and a water pan 30. The air-conditioning shell 10 is respectively provided with an air return inlet 11, a cold air outlet 12 and a hot air outlet 13, a hot air channel a and a cold air channel b which are relatively independent are formed in the air-conditioning shell 10, the hot air channel a is communicated with the hot air outlet 13, and the cold air channel b is communicated with the cold air outlet 12. The heat exchange structure assembly 20 includes a heat dissipation and heat exchange structure 21, a heat dissipation and heat exchange structure 22 and semiconductor cooling fins 23. The semiconductor refrigeration sheet 23 is arranged between the cooling and heat dissipation structure 21 and the heat dissipation and heat exchange structure 22. A cooling fin flow passage 211 is formed on the cooling heat exchange structure 21; the heat dissipation and exchange structure 22 is formed with a heat dissipation fin flow channel 221. As shown in fig. 3, 4 and 11, the heat dissipation fin flow channels 221 extend in the vertical direction, and the hot gas flow path a is located above the heat dissipation fin flow channels 221.

Use the technical scheme of the utility model, the cold face that looses of cold heat transfer structure 21 and semiconductor refrigeration piece 23 laminates, and heat dissipation heat transfer structure 22 laminates mutually with the cooling surface of semiconductor refrigeration piece 23. The two ends of the cooling fin flow channel 211 are respectively communicated with the air return opening 11 and the cold airflow channel b, and the two ends of the cooling fin flow channel 221 are respectively communicated with the air return opening 11 and the hot airflow channel a. Because the heat dissipation fin flow channel 221 extends in the vertical direction and the hot air flow channel a is located above the heat dissipation fin flow channel 221, the hot air enters the air flow of the heat dissipation fin flow channel 221 through the air return opening 11, and after the air flow is heated by the heat dissipation fin flow channel 221, the hot air can rapidly pass through the heat dissipation fin flow channel 221 by means of the rising force of the hot air flow, so that the air speed in the heat dissipation fin flow channel 221 is increased, the heat dissipation heat exchange structure 22 can more efficiently dissipate the heat of the semiconductor chilling plate 23, the refrigeration efficiency of the semiconductor chilling plate 23 is increased, and the refrigeration efficiency of the semiconductor air conditioner is increased.

It is required to explain, the utility model discloses an among the technical scheme, heat dissipation heat transfer structure 21 and the heat transfer structure of cold heat transfer structure 22 that looses are two kinds of concepts for having the fin, this and the heat transfer structure on the traditional air conditioner, and the heat transfer structure of traditional air conditioner mainly relies on the refrigerant to circulate in heat transfer structure and carries out the heat transfer, and heat dissipation heat transfer structure 21 in this application and the cold heat transfer structure 22 that looses carry out the heat transfer through the fin with the mode rethread fin of the 23 laminating heat transfer of semiconductor refrigeration piece.

As an alternative, the heat sink fins 221 may also extend in an inclined manner with respect to the vertical, so that the force of the hot gas flow is also used for lift-off.

More preferably, as shown in fig. 1, in the solution of this embodiment, the hot air outlet 13 is connected to the top of the hot air flow channel a, so that the hot air flow in the hot air flow channel a also conforms to the principle of hot air flow rising, and is helpful for discharging the hot air flow. More preferably, the hot air outlet 13 is located at the top of the air conditioning casing 10, which is equivalent to disposing the hot air outlet 13 at the highest position of the air conditioning casing 10, so as to achieve a certain chimney effect.

As shown in fig. 3, 5 and 10, the extending direction of the cooling fin flow channel 211 is the same as the air intake direction of the air return opening 11. In use, hot air in a room enters the air conditioning casing 10 from the air return opening 11, a part of the air flow enters the cooling fin flow passage 211, and a part of the air flow enters the cooling fin flow passage 221. The airflow entering the heat dissipation fin flow channel 221 takes away the heat on the heat dissipation fins, and finally is discharged to the outside from the hot air outlet 13 through the hot air flow channel a; the airflow entering the cooling fin flow passage 211 carries the cooling energy of the cooling fins away, and the cooling energy is discharged to the indoor from the cold air outlet 12 through the cold airflow passage b. The air flow entering from the air return opening 11 can blow the cooling fin flow channel 211 directly, so that the air speed in the cooling fin flow channel 211 can be increased, and the refrigeration efficiency of the semiconductor air conditioner is improved. In a preferred embodiment, the air return opening 11 is located on a side surface of the air conditioning casing 10, the cooling fins are arranged in a horizontal direction, and the cooling fin flow passage 211 extends in the horizontal direction. Thus, the extending direction of the cooling fin flow channel 211 is consistent with the air inlet direction of the air return opening 11, which is beneficial to the air flow entering from the air return opening 11 to blow the cooling fin flow channel 211 directly. Alternatively, the cold air flow passage b is provided in a vertical direction, and the cold air outlet 12 is opened at a lower side of the air-conditioning case 10. Therefore, the wind speed blown out by the cold air flow can be improved by means of the sedimentation effect of the cold air flow.

As shown in fig. 1, in the technical solution of this embodiment, two air return openings 11 are respectively located at two sides of the air conditioning casing 10, two heat exchange structure assemblies 20 are also respectively arranged corresponding to the two air return openings 11, and a cold air flow passage b is formed between the two heat exchange structure assemblies 20. Thus, the efficiency of processing the indoor hot air can be improved, and the indoor air flows into the two heat exchange structure assemblies 20 from the air return openings 11 at both sides of the air-conditioning case 10, respectively, so that more efficient cooling can be performed. Preferably, the return air inlets 11 are all provided with a filter screen to reduce the adhesion of the pollutants in the air to the heat exchange structure assembly 20. Preferably, the filter screen can be detached by pressing the elastic buckle, so that oil stains accumulated in the filter screen can be cleaned conveniently.

More preferably, in the technical solution of the present embodiment, the number of the cold air outlets 12 is plural, and the plural cold air outlets 12 are arranged at intervals to increase the air supply amount. More preferably, as shown in fig. 2, there are two cold air outlets 12, and the two cold air outlets 12 are respectively provided with a wind sweeping mechanism, so as to meet the requirement of multi-directional air supply.

As shown in fig. 6 and 7, optionally, the heat exchange structure assembly 20 further includes air duct plates 24, and the cold heat dissipation and exchange structure 21 and the heat dissipation and exchange structure 22 are installed between the air duct plates 24. The air duct plate 24 is provided with a cold dissipating inlet 241 and a cold dissipating outlet 242 which are communicated with the cold dissipating fin flow path 211, the cold dissipating inlet 241 is opposite to the air return opening 11, and the cold dissipating outlet 242 is communicated with the hot air flow channel a. When the heat exchange structure assembly 20 is installed, the cold dissipation inlet 241 of the air duct plate 24 is directly opposite to the air return opening 11, and the cold dissipation outlet 242 is communicated with the hot air flow passage a. In the technical solution of this embodiment, the air duct plate 24 functions to relatively separate the cooling fin flow channel 211 of the cooling heat exchange structure 21 and the cooling fin flow channel 221 of the cooling heat exchange structure 22. As another alternative embodiment, as shown in fig. 12, the air duct plate 24 may cover the top of the heat dissipation and heat exchange structure 22, and the air duct plate 24 is provided with a heat dissipation inlet and a heat dissipation outlet 243 communicated with the heat dissipation fin flow channels 221.

As shown in fig. 7, 8 and 9, one heat dissipation and exchange structure 21, one heat dissipation and exchange structure 22 and at least one semiconductor cooling fin 23 form one heat exchange structure unit c, the number of the heat exchange structure units c is multiple, and the multiple heat exchange structure units c are adjacently arranged. Specifically, at least one semiconductor refrigeration piece 23 is assembled between one cooling heat exchange structure 21 and one cooling heat exchange structure 22, fins of one cooling heat exchange structure 21 and fins of one cooling heat exchange structure 22 are opposite to each other, a cooling fin flow channel 211 and a cooling fin flow channel 221 which are not interfered by cold and heat are formed, the characteristics of the section cooling device are ingeniously utilized, and the internal space of the unit is effectively utilized. When the heat exchanger is installed, a cold heat dissipation structure 21 and a heat dissipation structure 22 can be fastened together by bolts. It should be further noted that the advantage of using a plurality of heat exchange structure units c is that the operation of the plurality of heat exchange structure units c is independent and does not affect each other, thereby improving the fault tolerance rate; meanwhile, when the heat exchanger is overhauled, only the heat exchange structure unit c of the part with the fault needs to be disassembled, and the maintenance difficulty is reduced. Therefore, the fault tolerance rate of the heat exchange structure of the semiconductor air conditioner can be improved, when a certain part of the heat exchange structure breaks down, the operation of other parts of the heat exchange structure is not influenced, and the heat exchange structure is accurate and convenient to overhaul.

More preferably, as shown in fig. 7, in the technical solution of the present embodiment, in the thickness direction, the heat dissipation and heat exchange structures 22 of two adjacent heat exchange structure units c are disposed oppositely, and the cold dissipation and heat exchange structures 21 of two adjacent heat exchange structure units c are disposed oppositely. The advantage of this is that the hot side is close to the hot side between two adjacent heat exchange structure units c; the cold side is close to the laminating with cold one side, and the effectual cold and hot short circuit of two adjacent heat exchange structure unit c that has prevented, the phenomenon of neutralization. Meanwhile, the air channel is orderly and compact in formation, the air resistance is smaller, and the air quantity is favorably provided.

As a more preferable embodiment, in the width direction, the heat dissipation and heat exchange structures 22 of two adjacent heat exchange structure units c are arranged side by side, and the cold dissipation and heat exchange structures 21 of two adjacent heat exchange structure units c are arranged side by side, so as to improve the cooling capacity.

It should be noted that, in the technical solution of the present application, the width direction and the thickness direction refer to the directions shown in fig. 7, and the directions are for more clearly explaining the technical solution of the present invention, and do not constitute a limitation on the structure of the semiconductor air conditioner.

Optionally, as shown in fig. 1, a hot air exhaust device a1 is disposed in the hot air flow path a, and a cold air exhaust device b1 is disposed in the cold air flow path b. The hot air exhaust device a1 provides the motive force for the air flow in the hot air flow passage a, and the cold air exhaust device b1 provides the motive force for the air flow in the cold air flow passage b. Optionally, the hot air exhaust device a1 and the cold air exhaust device b1 are both centrifugal fans, and each centrifugal fan includes a motor and a centrifugal fan blade in driving connection with the motor. The hot airflow channel a is because hot-blast needs in time to loose cold of unit exhaust, and the exhaust hot-blast can be carried outdoor through the pipeline, and the distance of carrying is long, needs the strong exhaust system of anti static pressure ability, the utility model discloses a centrifugal fan blade, and this centrifugal fan blade arranges on the main wind channel of airing exhaust, produces enough big negative pressure and can make the wind channel on every heat transfer structure unit c can both form the wind field, and then makes heat transfer structure unit c efficiency improve. Optionally, in the technical solution of this embodiment, the cold air exhaust device b1 is installed in the water pan 30.

As shown in fig. 5, the cold air flow exhausting mode is: under the action of the cold air exhaust device b1, the air flow enters the cold fin flow channel 211 of the heat exchange structure 21 from the air return openings 11 at both sides of the air conditioner case 10 through the cold air dissipation inlets 241 on the air duct plate 24, after heat exchange, enters the cold air flow channel b in the middle through the cold air dissipation outlets 242, and further passes through the cold air exhaust device b1 toward the cold air exhaust device b1 to be exhausted through the cold air outlet 12. The cold air exhaust device b1 is arranged on the cold air flow channel b, so that a wind field can be formed on each air channel of each heat exchange structure unit c on a small main air channel, and the influence on the unit performance due to the uneven wind field is effectively avoided.

As shown in fig. 4, the hot air flow exhaust mode is: under the action of the hot air exhaust device a1, the air flow reaches the heat exchange structure assembly 20 from the air return openings 11 at both sides of the air conditioning casing 10, and due to the obstruction of the air duct plate 24, the air flow can only enter the heat dissipation fin flow channel 221 through the opening of the heat dissipation fin flow channel 221 at the bottom of the heat exchange structure assembly 20, and then heats up gradually and enters the hot air flow channel a, and further passes through the hot air exhaust device a1 and is exhausted from the hot air outlet 13.

As shown in fig. 4 and 13, as a preferred embodiment, the semiconductor air conditioner further includes a water collector 30, and the water collector 30 is disposed at the bottom of the cold airflow path b. Thus, the condensed water condensed on the heat dissipation and exchange structure 22 can flow into the water receiving tray 30 under the guiding action of the cold airflow channel b. More preferably, the bottom of the water pan 30 is provided with a drainage hole 32, and the drainage hole 32 is used for draining water, so that condensed water in the water pan 30 can be drained in time, and overflow is avoided. More preferably, after the water receiving tray 30 is assembled, the periphery of the water receiving tray is sealed, so that the air passing through the cold air flow channel b is prevented from leaking outwards to influence the refrigeration effect.

As an alternative embodiment, the water receiving tray 30 forms at least a part of the cold air flow passage b, and an air outlet 31 communicated with the cold air outlet 12 is formed on the water receiving tray 30. That is, the cold air flow firstly passes through the air outlet 31 and then blows into the room through the cold air outlet 12.

As shown in fig. 14, in the technical solution of this embodiment, the semiconductor air conditioner further includes a water cooling assembly 50, the water cooling assembly 50 is connected between the water pan 30 and the heat exchange structure assembly 20, and the water cooling assembly 50 is configured to suck condensed water from the water pan 30 and spray the condensed water above the heat dissipation and exchange structure 22. Therefore, the utility model discloses an among the technical scheme, just can shift the comdenstion water that produces in the work to on heat dissipation heat transfer structure 22's the radiating fin, supplementary cooling to heat dissipation heat transfer structure 22 to can improve heat exchange structure assembly 20's refrigeration efficiency. In addition, since the heat dissipation fins and the heat dissipation fin flow channels 221 of the heat dissipation and heat exchange structure 22 extend in the vertical direction, the condensed water can be helped to flow downwards along the heat dissipation fins under the action of gravity.

As an alternative implementation manner, as shown in fig. 15, in the technical solution of this embodiment, the water cooling assembly 50 includes a water pump 51 and a water discharge pipe 52, the water pump 51 is installed in the water collector 30 for sucking water from the water collector 30, a first end of the water discharge pipe 52 is connected to the water pump 51, and a second end of the water discharge pipe 52 is located above the heat dissipation and heat exchange structure 22. In use, water is drawn from the drip tray 30 by the water pump 51 and condensed water is sprayed over the heat exchange structure 22 through the drain pipe 52. More preferably, the water cooling assembly 50 further comprises a shower head 53, and the shower head 53 is installed at the second end of the drain pipe 52 and is used for spraying the condensed water above the heat dissipation and exchange structure 22. The spray header 53 sprays water to the heat dissipation and heat exchange structure 22, so that the spraying of the condensed water can be more uniform. Preferably, the spray header 53 is provided with a plurality of small holes, so that the condensed water can be uniformly sprinkled on the heat dissipation and heat exchange structure 2.

More preferably, as shown in fig. 1, the semiconductor air conditioner further includes a controller 40, and the controller 40 is disposed in the air conditioning case 10 to control various components in the semiconductor air conditioner. It should be further noted that, when the positive and negative electrodes of the semiconductor refrigeration sheet 23 in the heat exchange structural unit c are connected in the opposite directions, the refrigeration and heating air flows are just exchanged.

As shown in fig. 16, the semiconductor air conditioner of the present invention may be installed on a wall 70, and the hot air outlet 13 may directly pass through the glass 71 on the wall 70 through the air duct 60.

It should be noted that the utility model discloses a semiconductor air conditioner is particularly useful for the kitchen, and this semiconductor air conditioner does not have the compressor, only the fan operation, and noise value is low to 41dB, improves user's experience effect greatly, and the air supply demand of many people when the kitchen activity has been satisfied in the design of two air outlets, and the unit only needs at the indoor location simultaneously, and installation work volume is far less than traditional air conditioner, has reduced installation cost.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not intended to limit the present invention, and it will be apparent to those skilled in the art that various modifications and variations can be made in the embodiments of the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (19)

1. A semiconductor air conditioner, comprising:

the air conditioner comprises an air conditioner shell (10), wherein an air return opening (11), a cold air outlet (12) and a hot air outlet (13) are respectively formed in the air conditioner shell (10), and a hot air channel (a) communicated with the hot air outlet (13) is formed in the air conditioner shell (10);

the heat exchange structure assembly (20) comprises a heat dissipation heat exchange structure (21), a heat dissipation heat exchange structure (22) and semiconductor refrigeration sheets (23) arranged between the heat dissipation heat exchange structure (21) and the heat dissipation heat exchange structure (22), wherein a heat dissipation fin flow channel (211) is formed on the heat dissipation heat exchange structure (21), a heat dissipation fin flow channel (221) is formed on the heat dissipation heat exchange structure (22), two ends of the heat dissipation fin flow channel (221) are respectively communicated with the air return opening (11) and the hot air flow channel (a), the heat dissipation fin flow channel (221) extends along the vertical direction or extends along a mode inclined relative to the vertical direction, and the hot air flow channel (a) is positioned above the heat dissipation fin flow channel (221).

2. The semiconductor air conditioner according to claim 1, wherein the hot wind outlet (13) is connected to the top of the hot wind flow path (a).

3. Semiconductor air conditioner according to claim 2, characterized in that the hot air outlet (13) is located at the top of the air conditioning casing (10).

4. The semiconductor air conditioner of claim 1, wherein a cold air flow channel (b) communicated with the cold air outlet (12) is further formed in the air conditioning casing (10), two ends of the cooling fin flow channel (211) are respectively communicated with the air return opening (11) and the cold air flow channel (b), and the extension direction of the cooling fin flow channel (211) is consistent with the air inlet direction of the air return opening (11).

5. The semiconductor air conditioner according to claim 4, wherein the air return opening (11) is located at a side of the air conditioning case (10), and the cooling fin flow passage (211) extends in a horizontal direction or in a manner inclined with respect to the horizontal direction.

6. The semiconductor air conditioner according to claim 5, wherein the cool air flow passage (b) is provided in a vertical direction, and the cool air outlet (12) is opened at a lower side of the air-conditioning case (10).

7. The semiconductor air conditioner according to claim 6, wherein there are two air return openings (11) respectively located at both sides of the air conditioning case (10), and there are two heat exchange structure members (20) respectively located corresponding to the two air return openings (11), and the cold air flow passage (b) is formed between the two heat exchange structure members (20).

8. The semiconductor air conditioner according to claim 4, further comprising a water receiving tray (30), wherein the water receiving tray (30) is disposed at the bottom of the cold airflow passage (b).

9. The semiconductor air conditioner as claimed in claim 8, wherein a drain hole (32) is formed at the bottom of the water pan (30), and the drain hole (32) is used for draining water.

10. The semiconductor air conditioner according to claim 8, wherein the water receiving tray (30) constitutes at least a portion of the cold air flow passage (b), and an air outlet (31) communicating with the cold air outlet (12) is formed on the water receiving tray (30).

11. The semiconductor air conditioner according to claim 8, further comprising a water cooling assembly (50), wherein the water cooling assembly (50) is connected between the water pan (30) and the heat exchange structure assembly (20), and the water cooling assembly (50) is used for sucking condensed water from the water pan (30) and spraying the condensed water above the heat dissipation and exchange structure (22).

12. The semiconductor air conditioner according to claim 11, wherein the water cooling module (50) comprises:

the water pump (51) is arranged in the water receiving tray (30) and is used for sucking water from the water receiving tray (30);

and a drain pipe (52), wherein a first end of the drain pipe (52) is connected with the water pump (51), and a second end of the drain pipe (52) is positioned above the heat dissipation and heat exchange structure (22).

13. The semiconductor air conditioner according to claim 12, wherein the water cooling assembly (50) further comprises a shower head (53), the shower head (53) is mounted at the second end of the drain pipe (52) for spraying condensed water above the heat dissipation and heat exchange structure (22).

14. The semiconductor air conditioner of claim 1, wherein the heat exchange structure assembly (20) further comprises an air duct plate (24), the heat dissipation and exchange structure (21) and the heat dissipation and exchange structure (22) are installed between the air duct plate (24), the air duct plate (24) is provided with a cold dissipation inlet (241) and a cold dissipation outlet (242) communicated with the cold dissipation fin flow passage (211), the cold dissipation inlet (241) is opposite to the air return opening (11), and the cold dissipation outlet (242) is communicated with the hot air flow passage (a).

15. The semiconductor air conditioner according to claim 1, wherein one of the heat dissipation and heat exchange structures (21), one of the heat dissipation and heat exchange structures (22) and at least one of the semiconductor cooling fins (23) form a heat exchange structure unit (c), the number of the heat exchange structure units (c) is plural, and the plural heat exchange structure units (c) are adjacently arranged.

16. The semiconductor air conditioner according to claim 15, wherein in the thickness direction, the heat dissipation and heat exchange structures (22) of two adjacent heat exchange structure units (c) are oppositely arranged, and/or the cold dissipation and heat exchange structures (21) of two adjacent heat exchange structure units (c) are oppositely arranged.

17. The semiconductor air conditioner according to claim 15, wherein the heat dissipation and heat exchange structures (22) of two adjacent heat exchange structure units (c) are arranged side by side, and the cold dissipation and heat exchange structures (21) of two adjacent heat exchange structure units (c) are arranged side by side in the width direction.

18. The semiconductor air conditioner according to claim 4, wherein a hot air exhaust device (a1) is provided in the hot air flow path (a), and a cold air exhaust device (b1) is provided in the cold air flow path (b).

19. The semiconductor air conditioner according to claim 1, wherein the cool air outlet (12) is plural, and the cool air outlets (12) are spaced apart from each other.

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