CN111397049A

CN111397049A - Semiconductor air conditioner

Info

Publication number: CN111397049A
Application number: CN202010314041.3A
Authority: CN
Inventors: 余凯; 薛寒冬; 谢有富; 邓朝胜
Original assignee: Gree Electric Appliances Inc of Zhuhai
Current assignee: Gree Electric Appliances Inc of Zhuhai
Priority date: 2020-04-20
Filing date: 2020-04-20
Publication date: 2020-07-10

Abstract

The application provides a semiconductor air conditioner. This air conditioner casing, heat exchanger subassembly and water collector. The air conditioner shell is respectively provided with an air return inlet, a cold air outlet and a hot air outlet, and a hot air flow channel and a cold air flow channel which are relatively independent are formed in the air conditioner shell. The cooling heat exchanger is provided with cooling fins, and cooling channels are formed among the cooling fins; radiating fins are formed on the radiating heat exchanger, and radiating flow channels are formed among the radiating fins. The inlet of the heat dissipation flow channel and the inlet of the cold dissipation flow channel are opposite to the air return opening, the hot air flow channel is located on the upper side of the heat exchanger assembly, and the outlet of the heat dissipation flow channel is located on the upper side of the heat exchanger assembly. According to the technical scheme, the airflow channel is arranged by means of the temperature characteristic of the airflow, so that the operation of the airflow is smoother, and in addition, the inlet of the heat dissipation flow channel and the inlet of the cold dissipation flow channel are opposite to the air return port, so that the flow velocity of the airflow is not interfered by other parts.

Description

Semiconductor air conditioner

Technical Field

The invention relates to the technical field of air conditioning equipment, in particular to a semiconductor air conditioner.

Background

The air conditioner aiming at the kitchen environment is provided with an air duct type form and is arranged in a kitchen ceiling; the air conditioner has the characteristics that the air conditioner is of a single-side air outlet ceiling type, is flush with a ceiling buckle plate after being installed, and the like, is large in engineering installation amount, and is suitable for a kitchen which is not decorated. If want to install this type of kitchen air conditioner, need demolish the furred ceiling, after the installation unit, recover the furred ceiling again, the work load of installation unit is bigger for the installation cost of unit is great, and the user is difficult to accept.

And the most refrigerant refrigeration modes of present unit, the unit at this moment leads to whole unit heavy owing to have big quality devices such as compressor, even if integral type wall hang-up, also have the problem that the unit occupation space is big, it is the common fault to lead to the too big size of market feedback, and the unit is heavy, inconvenient dismouting is clean, consequently, develop a unit that still can easy to assemble after being suitable for the kitchen fitment, the unit installation work load is little simultaneously, the unit is light, easily settle, it will be necessary nature to maintain simple and convenient air conditioner.

In order to solve the problems, some semiconductor air conditioners which are convenient to install and maintain are also available in the market, but the air duct arrangement of the conventional semiconductor air conditioner is not reasonable enough, so that the heat dissipation efficiency of the heat dissipation surface of the semiconductor refrigeration piece is not high enough. Due to the characteristics of the semiconductor refrigerating sheet, when the heat dissipation efficiency of the heat dissipation surface is low, the refrigerating efficiency is low, and the performance of the semiconductor air conditioner is affected.

Disclosure of Invention

The embodiment of the invention provides a semiconductor air conditioner, which aims to solve the technical problem that in the prior art, the semiconductor air conditioner has low refrigerating efficiency due to the fact that the radiating efficiency of a radiating surface of a semiconductor refrigerating sheet is limited.

The embodiment of the application provides a semiconductor air conditioner, includes: the air conditioner comprises an air conditioner shell, wherein the air conditioner shell is respectively provided with a return air inlet, a cold air outlet and a hot air outlet, a hot air flow channel and a cold air flow channel which are relatively independent are formed in the air conditioner shell, the hot air flow channel is communicated with the hot air outlet, and the cold air flow channel is communicated with the cold air outlet; the heat exchanger assembly comprises a heat dissipation heat exchanger, a cold dissipation heat exchanger and semiconductor refrigeration sheets, wherein the semiconductor refrigeration sheets are arranged between the heat dissipation heat exchanger and the cold dissipation heat exchanger, the heat dissipation heat exchanger is attached to a heat dissipation surface of the semiconductor refrigeration sheets, the cold dissipation heat exchanger is attached to a cold dissipation surface of the semiconductor refrigeration sheets, heat dissipation fins are formed on the heat dissipation heat exchanger, heat dissipation flow passages are formed among the heat dissipation fins, cold dissipation fins are formed on the cold dissipation heat exchanger, cold dissipation flow passages are formed among the cold dissipation fins, two ends of each heat dissipation flow passage are respectively communicated with a return air inlet and a hot air flow passage, and two ends of each cold dissipation flow passage are respectively communicated with a return air inlet and a cold; the inlet of the heat dissipation flow channel and the inlet of the cold dissipation flow channel are opposite to the air return opening, the hot air flow channel is positioned at the upper side of the heat exchanger assembly, the outlet of the heat dissipation flow channel is positioned at the upper side of the heat exchanger assembly, the cold air flow channel is positioned at the lower side of the heat exchanger assembly, and the outlet of the cold dissipation flow channel is positioned at the lower side of the heat exchanger assembly.

In one embodiment, the cold distribution flow channel extends obliquely with respect to the vertical.

In one embodiment, the heat dissipation channel includes a curved air inlet channel and a straight air delivery channel, a first end of the air inlet channel forms an inlet of the heat dissipation channel, a second end of the air inlet channel is communicated with the first end of the air delivery channel, and a second end of the air delivery channel forms an outlet of the heat dissipation channel.

In one embodiment, the inlet of the heat dissipation channel is located on the underside of the heat exchanger assembly, the heat dissipation channel being curved upwards.

In one embodiment, the hot air outlet is located at an upper side of the air conditioning case, and the cold air outlet is located at a lower side of the air conditioning case.

In one embodiment, the number of the air return openings is two, and the two air return openings are respectively located on two sides of the air conditioner shell, and the inlet of the heat dissipation flow passage and the inlet of the cold dissipation flow passage are also respectively distributed on two sides of the heat exchanger assembly.

In one embodiment, the heat exchanger assembly further comprises an air duct plate, the heat dissipation heat exchanger and the cold dissipation heat exchanger are mounted between the air duct plate, the air duct plate is provided with a heat dissipation inlet connected with the inlet of the heat dissipation flow channel and a heat dissipation outlet connected with the outlet of the heat dissipation flow channel, the heat dissipation inlet is opposite to the air return opening, and the heat dissipation outlet is communicated with the hot air flow channel.

In one embodiment, one heat-dissipation heat exchanger, one cold-dissipation heat exchanger and at least one semiconductor refrigeration piece constitute one heat exchanger unit, and the heat exchanger unit is a plurality of, and a plurality of heat exchanger units set up adjacently.

In one embodiment, the heat exchanger units of two adjacent heat exchanger units are arranged opposite to each other in the thickness direction.

In one embodiment, the heat-dissipating heat exchangers of adjacent two heat exchanger units are disposed opposite to each other in the thickness direction.

In one embodiment, the air conditioning case further includes: the collecting cover is covered on the upper side of the heat exchanger assembly; and the air exhaust part is arranged on the flow collecting cover, and the inside of the flow collecting cover is communicated with the inside of the air exhaust part to form a hot air flow channel.

In one embodiment, a hot air exhaust device is mounted within the exhaust component.

In one embodiment, the middle of the lower side of the heat exchanger assembly is provided with an avoidance space, and the avoidance space forms a cold airflow channel.

In one embodiment, a cool air exhaust device is installed in the evacuation space.

In one embodiment, the semiconductor air conditioner further comprises a water pan disposed below the heat exchanger assembly.

In one embodiment, the bottom of the water pan is provided with a drain hole for draining water.

In one embodiment, the semiconductor air conditioner further comprises a controller disposed within the air conditioner housing.

In one embodiment, a filter screen is mounted on the return air inlet.

In one embodiment, the back surface of the air conditioner shell is provided with a hanging part which is used for matching with a hanging structure of a wall body.

In the above embodiment, the hot airflow channel is located on the upper side of the heat exchanger assembly, and the outlet of the heat dissipation flow channel is located on the upper side of the heat exchanger assembly, and enters the airflow of the heat dissipation flow channel through the air return opening, and after the airflow is heated by the heat dissipation flow channel, the hot airflow can rapidly pass through the heat dissipation flow channel by virtue of the rising force of the hot airflow, so that the air speed in the heat dissipation flow channel is increased, the semiconductor chilling plate can be cooled by the heat dissipation heat exchanger more efficiently, the refrigeration efficiency of the semiconductor chilling plate is increased, and the refrigeration efficiency of the semiconductor air. In addition, because the cold air flow channel is positioned at the lower side of the heat exchanger assembly and the outlet of the cold dissipation flow channel is positioned at the lower side of the heat exchanger assembly, the air flow entering the cold dissipation flow channel from the air return opening can better pass through the cold dissipation flow channel to enter the cold air flow channel by virtue of the settling force of the cold air flow after being refrigerated by the cold dissipation flow channel, and then is discharged from the cold air outlet. The airflow channel is arranged by means of the temperature characteristic of the airflow, so that the operation of the airflow is smoother, and in addition, the inlet of the heat dissipation flow channel and the inlet of the cold dissipation flow channel are opposite to the air return opening, so that the flow speed of the airflow is not interfered by other parts.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic view of an external front structure of an embodiment of a semiconductor air conditioner according to the present invention;

fig. 2 is a schematic view of an external rear structure of the semiconductor air conditioner of fig. 1;

fig. 3 is a schematic structural view of the semiconductor air conditioner of fig. 2 with a rear case removed;

fig. 4 is a partial structural schematic view of the semiconductor air conditioner of fig. 3;

fig. 5 is a schematic structural view illustrating a hot air flow of the semiconductor air conditioner of fig. 1;

fig. 6 is a structural view illustrating a circulation of a cold airflow of the semiconductor air conditioner of fig. 1;

FIG. 7 is a first angled schematic view of a heat exchanger assembly of the semiconductor air conditioner of FIG. 1;

FIG. 8 is a second angled structural schematic of the heat exchanger assembly of FIG. 7;

fig. 9 is a schematic structural view of a heat exchanger unit of a semiconductor air conditioner according to the present invention;

fig. 10 is a rear view schematically illustrating the structure of a heat exchanger unit of the semiconductor air conditioner of fig. 9;

FIG. 11 is a schematic sectional view of the underside of the heat exchanger assembly of FIG. 8;

fig. 12 is a schematic view illustrating an installation effect of an embodiment of a semiconductor air conditioner according to the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the following embodiments and accompanying drawings. The exemplary embodiments and descriptions of the present invention are provided to explain the present invention, but not to limit the present invention.

It should be noted that the air duct of the existing semiconductor air conditioner is not reasonable enough, so that the cold dissipating efficiency of the cold dissipating surface of the semiconductor refrigerating sheet is not high enough. Due to the characteristics of the semiconductor refrigerating sheet, when the cooling efficiency of the cooling surface is low, the refrigerating efficiency is low, and the performance of the semiconductor air conditioner is affected. The semiconductor refrigerating sheet is adopted for refrigerating, the temperature of one surface of the semiconductor refrigerating sheet is reduced and the temperature of the other surface of the semiconductor refrigerating sheet is increased after the semiconductor refrigerating sheet is electrified, the two side surfaces of the refrigerating sheet are attached to the cold dissipating device by applying the characteristic of the refrigerating sheet, so that heat or cold is transferred to the cold dissipating device, the fin direction of the cold dissipating device and the formed channel are ingeniously utilized to form a reasonable air duct, the cold dissipating side of the semiconductor refrigerating sheet is enabled to dissipate better, and the working efficiency of the semiconductor refrigerating sheet is improved. As shown in fig. 1, 3 and 4, the embodiment of the semiconductor air conditioner of the present invention includes an air conditioning case 10 and a heat exchanger assembly 20. The air-conditioning shell 10 is respectively provided with an air return inlet 11, a cold air outlet 12 and a hot air outlet 13, a hot air channel a and a cold air channel b which are relatively independent are formed in the air-conditioning shell 10, the hot air channel a is communicated with the hot air outlet 13, and the cold air channel b is communicated with the cold air outlet 12. The heat exchanger assembly 20 comprises a heat radiation heat exchanger 21, a cold radiation heat exchanger 22 and a semiconductor refrigerating sheet 23, the semiconductor refrigerating sheet 23 is arranged between the heat radiation heat exchanger 21 and the cold radiation heat exchanger 22, the heat radiation heat exchanger 21 is attached to the heat radiation surface of the semiconductor refrigerating sheet 23, and the cold radiation heat exchanger 22 is attached to the cold radiation surface of the semiconductor refrigerating sheet 23. Radiating fins are formed on the radiating heat exchanger 21, radiating flow channels 211 are formed among the radiating fins, radiating fins are formed on the radiating heat exchanger 22, radiating flow channels 221 are formed among the radiating fins, two ends of each radiating flow channel 211 are respectively communicated with the air return opening 11 and the hot air flow channel a, and two ends of each radiating flow channel 221 are respectively communicated with the air return opening 11 and the cold air flow channel b. As shown in fig. 5 and 6, the inlet of the heat dissipation channel 211 and the inlet of the cold dissipation channel 221 are both opposite to the air return opening 11, the hot air flow channel a is located at the upper side of the heat exchanger assembly 20, the outlet of the heat dissipation channel 211 is located at the upper side of the heat exchanger assembly 20, the cold air flow channel b is located at the lower side of the heat exchanger assembly 20, and the outlet of the cold dissipation channel 221 is located at the lower side of the heat exchanger assembly 20.

By applying the technical scheme of the invention, as the hot air flow channel a is positioned at the upper side of the heat exchanger assembly 20 and the outlet of the heat dissipation flow channel 211 is positioned at the upper side of the heat exchanger assembly 20, the hot air flow enters the air flow of the heat dissipation flow channel 211 through the air return opening 11, and after being heated by the heat dissipation flow channel 211, the hot air flow can quickly pass through the heat dissipation flow channel 211 by virtue of the rising force of the hot air flow, so that the air speed in the heat dissipation flow channel 211 is improved, the heat dissipation heat exchanger 22 can more efficiently dissipate the heat of the semiconductor chilling plates 23, the refrigeration efficiency of the semiconductor chilling plates 23 is improved, and. In addition, since the cold air flow channel b is located at the lower side of the heat exchanger assembly 20 and the outlet of the cooling air dispersing channel 221 is located at the lower side of the heat exchanger assembly 20, after the air flow entering the cooling air dispersing channel 221 from the air return opening 11 is cooled by the cooling air dispersing channel 221, the cold air flow can better pass through the cooling air dispersing channel 221 to enter the cold air flow channel b by virtue of the settling force of the cold air flow and then be discharged from the cold air outlet 12. In addition, the inlet of the heat dissipation flow channel 211 and the inlet of the cold dissipation flow channel 221 are opposite to the air return opening 11, so that the flow speed of the air flow is not interfered by other components.

As shown in fig. 9, in the solution of the present embodiment, the cold dissipation channel 221 extends obliquely with respect to the vertical direction, and after entering the cold dissipation channel 221, the airflow directly enters the cold airflow channel b obliquely downward and is discharged from the cold airflow outlet 12. Optionally, as shown in fig. 10, the heat dissipation channel 211 includes a curved air inlet channel and a linear air delivery channel, a first end of the air inlet channel forms an inlet of the heat dissipation channel 211, a second end of the air inlet channel is communicated with the first end of the air delivery channel, and a second end of the air delivery channel forms an outlet of the heat dissipation channel 211. The air flow entering from the first end of the air inlet channel enters the linear air delivery channel under the flow guiding action of the bent air inlet channel and then blows into the hot air flow channel a from the second end of the air delivery channel.

More preferably, the inlet of the heat dissipation channel 211 is located at the lower side of the heat exchanger assembly 20, and the heat dissipation channel 211 is bent upward. Thus, the airflow can pass through the longer heat dissipation flow channel 211 to fully take away the heat on the heat dissipation flow channel 211.

As shown in fig. 1, in the solution of the present embodiment, the hot air outlet 13 is located at the upper side of the air conditioning casing 10, and the cold air outlet 12 is located at the lower side of the air conditioning casing 10, so as to conform to the air duct arrangement of the heat exchanger assembly 20. In a more preferred embodiment, the cold air outlet 12 is provided with a wind sweeping mechanism to meet the requirement of multi-directional air supply.

As an alternative embodiment, as shown in fig. 3, 5 and 6, two air return openings 11 are respectively located at two sides of the air conditioning casing 10, and the inlet of the heat dissipation channel 211 and the inlet of the cold dissipation channel 221 are also respectively distributed at two sides of the heat exchanger assembly 20. Thus, the efficiency of processing the hot air in the room can be improved, and the air in the room flows into the heat exchanger assembly 20 from the air return openings 11 at both sides of the air-conditioning case 10, respectively, so that more efficient cooling can be performed. With respect to the above arrangement structure of the air return opening 11, both the heat dissipation heat exchanger 21 and the cold dissipation heat exchanger 22 in the heat exchanger assembly 20 may be arranged in a symmetrical structure. Preferably, the return air inlets 11 are all provided with a filter screen to reduce the adhesion of the pollutants in the air to the heat exchanger assembly 20. Preferably, the filter screen can be detached by pressing the elastic buckle, so that oil stains accumulated in the filter screen can be cleaned conveniently.

As shown in fig. 7 and 8, in the technical solution of this embodiment, the heat exchanger assembly 20 further includes an air duct plate 24, the heat dissipation heat exchanger 21 and the cold dissipation heat exchanger 22 are installed between the air duct plate 24, the air duct plate 24 is provided with a heat dissipation inlet 241 connected to an inlet of the heat dissipation flow channel 211 and a heat dissipation outlet 242 connected to an outlet of the heat dissipation flow channel 211, the heat dissipation inlet 241 is opposite to the air return opening 11, and the heat dissipation outlet 242 is communicated with the hot air flow channel a. When the heat exchanger assembly 20 is installed, the heat dissipation inlet 241 of the air duct plate 24 is directly opposite to the air return opening 11, and the heat dissipation outlet 242 is communicated with the hot air flow path a. In the technical solution of the present embodiment, the air duct plate 24 functions to relatively separate the cooling flow channel 221 of the cooling-heat exchanger 21 and the cooling flow channel 211 of the cooling-heat exchanger 22. Alternatively, the air duct plate 24 may be provided with a cold dissipation inlet connected to the inlet of the cold dissipation channel 221 and a cold dissipation outlet connected to the outlet of the cold dissipation channel 221.

As shown in fig. 8, 9 and 10, a heat-dissipating heat exchanger 21, a heat-dissipating heat exchanger 22 and at least one semiconductor cooling fin 23 form a heat exchanger unit c, the number of heat exchanger units c is multiple, and the heat exchanger units c are adjacently arranged, so that the characteristics of the section bar air cooler are ingeniously utilized, and the internal space of the unit is effectively utilized. When mounting, bolts may be used to fasten one heat rejection heat exchanger 21 and one heat rejection heat exchanger 22 together. It should be further noted that the advantage of using a plurality of heat exchanger units c is that the operation of the plurality of heat exchanger units c is independent and does not affect each other, thereby improving the fault tolerance rate; meanwhile, when the heat exchanger unit c is overhauled, only the heat exchanger unit c of the part with the fault needs to be disassembled, and the maintenance difficulty is reduced. Therefore, the fault rate of the heat exchanger of the semiconductor air conditioner can be improved, when a certain part of the heat exchanger breaks down, the operation of other parts of the heat exchanger is not influenced, and meanwhile, the heat exchanger is accurate and convenient to overhaul.

In the solution of the present embodiment, as shown in fig. 11, the cooling heat exchangers 22 of two adjacent heat exchanger units c are arranged to face each other in the thickness direction. Namely, the heat exchanger unit c1 and the heat exchanger unit c2 are arranged between the air duct plates 24, the cold heat dissipation exchanger 22 of the heat exchanger unit c1 and the cold heat dissipation exchanger 22 of the heat exchanger unit c2 are oppositely arranged, and the cold side is close to and attached to the cold side, so that the phenomena of cold and hot short circuit and neutralization of the two adjacent heat exchanger units c are effectively prevented. Meanwhile, the air channel is orderly and compact in formation, the air resistance is smaller, and the air quantity is favorably provided. As an embodiment not shown in the drawings, it is also possible to dispose the heat radiation heat exchangers 21 of the adjacent two heat exchanger units c in opposition in the thickness direction. Namely, two heat exchanger units c are installed at the outer sides of the heat exchanger unit c1 and the heat exchanger unit c2, respectively.

As shown in fig. 11, in the solution of the present embodiment, an avoidance space is opened at the middle of the lower side of the heat exchanger assembly 20, and the avoidance space constitutes a cold airflow channel b. In the solution of the present embodiment, the evacuation space is opened only in the middle of the lower side of the heat exchanger unit c 1. As shown in fig. 9 and 10, the lower middle portion of the heat exchanger unit c2 is not opened. More preferably, a cold air discharge device b1 is installed in the evacuation space.

As shown in fig. 3, 4 and 5, optionally, in the solution of the present embodiment, the air conditioning casing 10 further includes a collecting hood 14 and an air exhausting member 15, the collecting hood 14 is covered on the upper side of the heat exchanger assembly 20, the air exhausting member 15 is mounted on the collecting hood 14, and the inside of the collecting hood 14 is communicated with the inside of the air exhausting member 15 to form a hot air flow channel a. The collecting cover 14 is located at the upper side of the heat exchanger assembly 20, and can effectively recover the hot air flow discharged from the heat exchanger assembly 20, so that the hot air flow is conveyed to the hot air outlet 13 through the air exhausting part 15 and is discharged. More preferably, a hot air discharge device a1 is installed in the discharge member 15.

The hot air exhaust device a1 provides the motive force for the air flow in the hot air flow passage a, and the cold air exhaust device b1 provides the motive force for the air flow in the cold air flow passage b. Optionally, the hot air exhaust device a1 and the cold air exhaust device b1 are both centrifugal fans, and each centrifugal fan includes a motor and a centrifugal fan blade in driving connection with the motor. The hot air discharged by the unit needs to be dissipated in time, the hot air discharged by the unit can be conveyed outdoors through a pipeline, the conveying distance is long, and an exhaust system with strong static pressure resistance is needed. Optionally, in the technical solution of this embodiment, the cold air exhaust device b1 is installed in the water pan 30.

As shown in fig. 6, the cold air flow exhausting mode is: under the action of the cold air exhaust device b1, the air flow enters the cold air dispersing channel 221 of the cold air dispersing heat exchanger 22 from the air return openings 11 on both sides of the air conditioner case 10 through the cold air dispersing inlets 241 on the air channel plate 24, after heat exchange, enters the cold air flow channel b through the cold air dispersing outlets, and then passes through the cold air exhaust device b1 toward the cold air exhaust device b1 to be exhausted through the cold air outlet 12. The cold air exhaust device b1 is arranged on the cold air flow channel b, so that an air field can be formed on each air channel of each heat exchanger unit c on a small main air channel, and the influence on the unit performance due to uneven air field is effectively avoided.

As shown in fig. 5, the hot air flow exhaust mode is: under the action of the hot air exhaust device a1, the air flow reaches the heat exchanger assembly 20 from the air return openings 11 at both sides of the air conditioning casing 10, and due to the obstruction of the air duct plate 24, the air flow can only enter the heat dissipation flow passage 211 through the inlet of the heat dissipation flow passage 211 of the heat exchanger assembly 20, and then is gradually heated upwards and enters the hot air flow passage a, and further passes through the hot air exhaust device a1 and is exhausted from the hot air outlet 13.

As shown in fig. 4 and 5, in the technical solution of this embodiment, the semiconductor air conditioner further includes a water pan 30, and the water pan 30 is disposed below the heat exchanger assembly 20. Thus, the condensed water condensed on the heat-dissipating heat exchanger 22 can flow into the drip tray 30 by the guiding action of the cold airflow channel b. More preferably, the bottom of the water pan 30 is provided with a drainage hole 31, and the drainage hole 31 is used for draining water, so that condensed water in the water pan 30 can be drained in time, and overflow is avoided. More preferably, after the water receiving tray 30 is assembled, the periphery of the water receiving tray is sealed, so that the air passing through the cold air flow channel b is prevented from leaking outwards to influence the refrigeration effect.

In addition, it should be noted that the cooling water discharge channel 221 extends obliquely with respect to the vertical direction, which also helps the condensed water to be discharged into the drain pan 30 along the cooling water discharge channel 221.

As shown in fig. 3, in the solution of the present embodiment, the semiconductor air conditioner further includes a controller 40, and the controller 40 is disposed in the air conditioning casing 10 to control various components in the semiconductor air conditioner. It should be noted that, when the positive and negative electrodes of the semiconductor cooling plate 23 in the heat exchanger unit c are connected in opposite directions, the cooling and heating air flows are just exchanged.

As shown in fig. 12, the semiconductor air conditioner of the present invention may be installed on a wall 50, and the hot air outlet 13 may directly pass through the glass 51 on the wall 50 through the duct 60. Preferably, as shown in fig. 2, a hanging portion 16 is provided on the back surface of the air conditioning case 10, and the hanging portion 16 is used for matching with the hanging structure of the wall 50.

The semiconductor air conditioner is particularly suitable for kitchens, the semiconductor air conditioner is not provided with a compressor, only operates a fan, has a noise value as low as 41dB, greatly improves the experience effect of users, meets the air supply requirement of a plurality of people during kitchen activities due to the design of double air outlets, and is only required to be installed indoors, so that the installation engineering quantity is far lower than that of the traditional air conditioner, and the installation cost is reduced.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes may be made to the embodiment of the present invention by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor air conditioner, comprising:

the air conditioner comprises an air conditioner shell (10), wherein an air return opening (11), a cold air outlet (12) and a hot air outlet (13) are respectively formed in the air conditioner shell (10), a hot air channel (a) and a cold air channel (b) which are relatively independent are formed in the air conditioner shell (10), the hot air channel (a) is communicated with the hot air outlet (13), and the cold air channel (b) is communicated with the cold air outlet (12);

the heat exchanger assembly (20) comprises a heat radiation heat exchanger (21), a heat radiation heat exchanger (22) and a semiconductor refrigeration sheet (23), the semiconductor refrigeration sheet (23) is arranged between the heat dissipation heat exchanger (21) and the heat dissipation heat exchanger (22), the heat-radiating heat exchanger (21) is attached to the heat-radiating surface of the semiconductor refrigerating sheet (23), the heat dissipation and cooling heat exchanger (22) is attached to the heat dissipation surface of the semiconductor refrigeration sheet (23), radiating fins are formed on the radiating heat exchanger (21), radiating flow channels (211) are formed among the radiating fins, the cooling heat exchanger (22) is provided with cooling fins, cooling channels (221) are formed among the cooling fins, two ends of the heat dissipation flow passage (211) are respectively communicated with the air return inlet (11) and the hot gas flow passage (a), two ends of the cold dissipation flow channel (221) are respectively communicated with the air return opening (11) and the cold air flow channel (b);

the inlet of the heat dissipation flow channel (211) and the inlet of the cold dissipation flow channel (221) are opposite to the air return opening (11), the hot flow channel (a) is located on the upper side of the heat exchanger assembly (20), the outlet of the heat dissipation flow channel (211) is located on the upper side of the heat exchanger assembly (20), the cold flow channel (b) is located on the lower side of the heat exchanger assembly (20), and the outlet of the cold dissipation flow channel (221) is located on the lower side of the heat exchanger assembly (20).

2. The semiconductor air conditioner according to claim 1, wherein the cooling dispersion flow channel (221) extends obliquely with respect to a vertical direction.

3. The semiconductor air conditioner of claim 2, wherein the heat dissipation channel (211) comprises a curved air inlet channel and a straight air delivery channel, a first end of the air inlet channel forms an inlet of the heat dissipation channel (211), a second end of the air inlet channel is communicated with the first end of the air delivery channel, and a second end of the air delivery channel forms an outlet of the heat dissipation channel (211).

4. The semiconductor air conditioner according to claim 3, wherein an inlet of the heat dissipation flow channel (211) is located at a lower side of the heat exchanger assembly (20), and the heat dissipation flow channel (211) is bent upward.

5. The semiconductor air conditioner according to claim 1, wherein the hot air outlet (13) is located at an upper side of the air conditioning case (10), and the cold air outlet (12) is located at a lower side of the air conditioning case (10).

6. The semiconductor air conditioner according to claim 1, wherein the number of the air return openings (11) is two, and the inlets of the heat dissipation flow channel (211) and the cold dissipation flow channel (221) are respectively distributed on both sides of the heat exchanger assembly (20).

7. The semiconductor air conditioner according to claim 6, wherein the heat exchanger assembly (20) further comprises an air duct plate (24), the heat dissipation heat exchanger (21) and the heat dissipation heat exchanger (22) are installed between the air duct plates (24), the air duct plate (24) is provided with a heat dissipation inlet (241) connected to an inlet of the heat dissipation flow channel (211) and a heat dissipation outlet (242) connected to an outlet of the heat dissipation flow channel (211), the heat dissipation inlet (241) is opposite to the air return opening (11), and the heat dissipation outlet (242) is communicated with the hot air flow channel (a).

8. The semiconductor air conditioner according to claim 1, wherein one heat-dissipating heat exchanger (21), one heat-dissipating heat exchanger (22) and at least one semiconductor cooling fin (23) constitute one heat exchanger unit (c), the heat exchanger unit (c) is plural, and the plural heat exchanger units (c) are adjacently disposed.

9. The semiconductor air conditioner according to claim 8, wherein the heat-radiating heat exchangers (22) of adjacent two of the heat exchanger units (c) are disposed opposite to each other in the thickness direction.

10. The semiconductor air conditioner according to claim 9, wherein the heat radiation heat exchangers (21) of adjacent two of the heat exchanger units (c) are disposed to be opposed to each other in the thickness direction.

11. The semiconductor air conditioner according to claim 1, wherein the air conditioning case (10) further comprises:

a collecting hood (14) which is arranged on the upper side of the heat exchanger assembly (20);

and the air exhausting component (15) is arranged on the collecting cover (14), and the inside of the collecting cover (14) is communicated with the inside of the air exhausting component (15) to form the hot air flow channel (a).

12. The semiconductor air conditioner according to claim 11, wherein a hot air discharge device (a1) is installed in the discharge member (15).

13. The semiconductor air conditioner according to claim 6, wherein an avoidance space is opened at a middle portion of a lower side of the heat exchanger assembly (20), and the avoidance space constitutes the cold airflow passage (b).

14. The semiconductor air conditioner according to claim 13, wherein a cool air discharging device (b1) is installed in the escape space.

15. The semiconductor air conditioner according to claim 1, further comprising a water tray (30), wherein the water tray (30) is disposed below the heat exchanger assembly (20).

16. The semiconductor air conditioner as claimed in claim 15, wherein a drain hole (31) is formed at the bottom of the water pan (30), and the drain hole (31) is used for draining water.

17. The semiconductor air conditioner according to claim 1, further comprising a controller (40), wherein the controller (40) is provided in the air conditioning case (10).

18. The semiconductor air conditioner according to claim 1, wherein a filter screen is installed on the return air inlet (11).

19. The semiconductor air conditioner according to claim 1, wherein the air conditioner case (10) is provided at a rear surface thereof with a hanging portion (16), and the hanging portion (16) is adapted to be engaged with a hanging structure of a wall body.