US20030196779A1 - Heatsink device - Google Patents

Heatsink device Download PDF

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Publication number
US20030196779A1
US20030196779A1 US10/123,281 US12328102A US2003196779A1 US 20030196779 A1 US20030196779 A1 US 20030196779A1 US 12328102 A US12328102 A US 12328102A US 2003196779 A1 US2003196779 A1 US 2003196779A1
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United States
Prior art keywords
base board
impeller
heatsink device
air inlet
channels
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Abandoned
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US10/123,281
Inventor
Alex Horng
Ching-Sheng Hong
Ying-Rong Hong
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Sunonwealth Electric Machine Industry Co Ltd
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Sunonwealth Electric Machine Industry Co Ltd
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Priority to US10/123,281 priority Critical patent/US20030196779A1/en
Assigned to SUNONWEALTH ELECTRIC MACHINE INDUSTRY CO., LTD. reassignment SUNONWEALTH ELECTRIC MACHINE INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HONG, CHING-SHENG, HONG, YIN-RONG, HORNG, ALEX
Publication of US20030196779A1 publication Critical patent/US20030196779A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heatsink device, and more particularly to a heatsink device that may drive a larger amount of air flow, and the heatsink air flow may be sucked from one side of the base board and may be carried outward from the other side of the base board.
  • a conventional super thin type fan structure in accordance with the prior art shown in FIG. 7 comprises a base 91 provided with a helical receiving space 92 which is provided with a shaft seat 93 on which a coil seat 94 is mounted.
  • An impeller 95 has a rotation shaft rotatably mounted on the coil seat 94 .
  • a cover plate 96 is mounted on the base 91 , and has an air inlet 97 .
  • the base 91 is provided with an air outlet 98 .
  • the impeller 95 may be rotated to suck the air flow through the air inlet 97 , and the air flow may be blown from the air outlet 98 toward a place needing a heat dissipation.
  • the impeller 95 may be rotated to suck the air flow through the air inlet 97 of the cover plate 96 , and the air flow may be blown outward from the air outlet 98 at one side of the base 91 .
  • the air flow has to turn through 90 degrees from the air inlet 97 to the air outlet 98 , so that the air flow turning through 90 degrees will produce a turbulence.
  • the air inlet side above the air inlet 97 does not have an enough space, the air flow rate will be reduced, thereby decreasing the heatsink effect.
  • the primary objective of the present invention is to provide a heatsink device that may drive a larger amount of air flow, wherein the heatsink air flow may be sucked from one side of the base board and may be carried outward from the other side of the base board, and the heatsink air flow may be conveyed toward larger angles and ranges, so that the heat emitting source combined on the base board 1 may have the optimum heatsink effect.
  • a secondary objective of the present invention is to provide a heatsink device that may drive a larger amount of air flow, without being limited by the top space of the heatsink device, and the driven air flow needs not to turn, so that the heatsink device of the present invention may have a better heatsink effect.
  • a heatsink device comprising a base board provided with multiple fins and multiple channels formed between any two adjacent fins. Each of the channels has a first end formed with an air inlet and a second end formed with an air outlet.
  • the base board is provided with a mounting portion.
  • An impeller is combined on the mounting portion of the base board, and a cover plate is combined on a top of the base board.
  • the impeller includes a power member to drive a blast type vane to rotate. The vane is aligned with the channels formed between the multiple fins, to drive an air flow from the air inlet at one side of the base board to the air outlet at the other side of the base board.
  • FIG. 1 is an exploded perspective view of a heatsiink device in accordance with a first embodiment of the present invention
  • FIG. 2 is a top plan assembly view of the heatsink device as shown in FIG. 1, with the cover plate being removed;
  • FIG. 3 is a plan cross-sectional view of the heatsink device taken along line 3 - 3 as shown in FIG. 2;
  • FIG. 4 is an exploded perspective view of a heatsink device in accordance with a second embodiment of the present invention.
  • FIG. 5 is a top plan assembly view of the heatsink device in accordance with a third embodiment of the present invention, with the cover plate being removed;
  • FIG. 6 is a top plan assembly view of the heatsink device in accordance with a fourth embodiment of the present invention, with the cover plate being removed;
  • FIG. 7 is an exploded perspective cross-sectional assembly view of a conventional super thin type fan structure in accordance with the prior art.
  • a heatsink device in accordance with a first embodiment of the present invention comprises a base board 1 , an impeller 2 , and a cover plate 3 .
  • the base board 1 is made of a metallic material having a better heat conduction feature.
  • the base board 1 has a bottom plate provided with multiple fins 11 , and multiple channels 12 formed between any two adjacent fins 11 .
  • Each of the channels 12 has a first end formed with an air inlet 15 and a second end formed with an air outlet 16 .
  • the base board 1 is provided with a mounting portion 13 for mounting and fixing the impeller 2 .
  • the mounting portion 13 may be located at the air inlet 15 of the base board 1 .
  • the base board 1 is provided with multiple positioning portions 14 , so that the cover plate 3 may be combined on the base board 1 easily.
  • the positioning portion 14 may be a positioning hole or a groove as shown in the figure, so that the positioning member 31 of the cover plate 3 may be snapped on the positioning portion 14 of the base board 1 .
  • the base board 1 may be provided with a receiving chamber 17 which aligns with the position of the power member 21 of the impeller 2 , without disturbing the air flow.
  • the receiving chamber 17 may be used to receive a circuit board 18 that is used to control operation of the power member 21 of the impeller 2 .
  • the impeller 2 includes a power member 21 , such as a motor, to drive a vane 22 to rotate.
  • the vane 22 is a blast type vane that has elongated blades.
  • the impeller 2 may be combined on the mounting portion 13 of the base board 1 in a conventional fixing manner as shown in the figure.
  • the base board 1 is provided with multiple positioning holes 19 for passage of positioning members 23 , such as bolts, which may be screwed into screw bores 24 formed in the power member 21 of the impeller 2 , thereby fixing the impeller 2 .
  • the length of the vane 22 of the impeller 2 is substantially equal to the total width of the multiple fins 11 provided at the air inlet 15 of the base board 1 .
  • the vane 22 when the vane 22 is driven to rotate, a large quantity of air flow may be sucked into the air inlet 15 of the base board 1 .
  • the air flow may be driven to pass through each of the channels 12 of the base board 1 , and may be carried outward from the air outlet 16 of the base board 1 , so as to provide a heatsink effect to the base board 1 or the heat emitting member located at the air outlet 16 of the base board 1 .
  • the cover plate 3 is combined on the top of the channels 12 of the base board 1 by the multiple positioning members 31 , thereby ensuring that the air flow may enter the base board I from the air inlet 15 of the base board 1 , and may be carried outward from the air outlet 16 of the base board 1 .
  • the cover plate 3 may be combined with the base board 1 by a conventional combination method, such as by screwing of bolts, or as shown in the figure, the cover plate 3 is provided with multiple positioning members 31 each provided with a barb, so that the barb of each of the multiple positioning members 31 may be snapped on each of the multiple positioning portions 14 of the base board 1 .
  • the cover plate 3 may be provided with an air inlet 32 aligning with the vane 22 of the impeller 2 , thereby increasing the driving rate of the air flow when the vane 22 of the impeller 2 is rotated.
  • the heatsink device in accordance with a first embodiment of the present invention is assembled.
  • the impeller 2 is combined on the mounting portion 13 of the base board 1
  • the cover plate 3 is combined on the top of the channels 12 of the base board 1 .
  • the vane 22 of the impeller 2 is aligned with the air inlet 15 of the base board 1 and aligned with the air inlet 32 of the cover plate 3 .
  • the vane 22 may drive a larger amount of air flow that may flow in the channels 12 between the fins 11 , and may be carried outward from the air outlet 16 of the base board 1 .
  • the length of the vane 22 of the impeller 2 is substantially equal to the total width of the multiple fins 11 provided at the air inlet 15 of the base board 1 .
  • the heatsink device in accordance with the present invention may obtain the maximum amount of driven air flow, and may have the optimum heatsink effect.
  • FIG. 4 a heatsink device in accordance with a second embodiment of the present invention is shown.
  • the mounting portion 13 may be provided at the mediate position of each of the channels 12 located between the air inlet 15 and the air outlet 16 .
  • the vane 22 of the impeller 2 when the vane 22 of the impeller 2 is rotated, the air flow may be introduced into the base board 1 from the air inlet 15 of the base board 1 , and may be carried outward from the air outlet 16 of the base board 1 .
  • the heatsink device in accordance with the present invention may obtain the maximum amount of driven air flow, and the heat emitting source located under the base board 1 may have the optimum heatsink effect.
  • a heatsink device in accordance with a third embodiment of the present invention comprises a base board 4 , an impeller 2 , and a cover plate 3 .
  • the base board 4 is also provided with multiple fins 41 , and multiple channels 42 formed between any two adjacent fins 41 .
  • Each of the fins 41 has an arcuate shape.
  • the impeller 2 is provided at one end of each of the channels 42 , and is provided at the side of the air inlet 45 .
  • the other end of each of the channels 42 is the air outlet 46 which may be located at one side of the base board 1 .
  • the base board 4 is also provided with a mounting portion 43 for mounting the impeller 2 .
  • the mounting portion 43 may be located between the air inlet 45 and the air outlet 46 , or located at the air inlet 45 .
  • the base board 4 is also provided with multiple positioning portions 44 , so that the cover plate 3 may be combined on the base board 4 easily.
  • the base board 4 may also be provided with a receiving chamber 47 to receive the circuit board 18 .
  • the base board 4 is also provided with multiple fins 41 respectively formed with different arcuate shapes, or formed with locally arcuate shapes and locally oblique plates.
  • the base board 4 is also provided with multiple channels 42 formed between any two adjacent fins 41 .
  • One end of each of the channels 42 is provided with a mounting portion 43 for mounting the impeller 2 which is provided at the side of the air inlet 45 .
  • the other end of each of the channels 42 is the air outlet 46 which may be located at two sides of the base board 1 .
  • the base board 4 is also provided with a mounting portion 43 for mounting the impeller 2 .
  • the mounting portion 43 may be located between the air inlet 45 and the air outlet 46 , or located at the air inlet 45 .
  • the base board 4 is also provided with multiple positioning portions 44 , so that the cover plate 3 may be combined on the base board 4 easily.
  • the base board 4 may also be provided with a receiving chamber 47 to receive the circuit board 18 .
  • the vane of the blast type impeller is aligned with the multiple channels of the base board, and the length of the vane of the impeller is substantially equal to the total width of the multiple fins provided at the air inlet of the base board.
  • the vane may drive a larger quantity of air flow which may carry the heat source from the air inlet at one side of the base board to the air outlet at the other side of the base board and the heat source may be carried outward from the air outlet of the base board, so that the heatsink device may have the optimum heatsink effect.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)

Abstract

A heatsink device includes a base board provided with multiple fins and multiple channels formed between any two adjacent fins. Each of the channels has a first end formed with an air inlet and a second end formed with an air outlet. The base board is provided with a mounting portion. An impeller is combined on the mounting portion of the base board, and a cover plate is combined on a top of the base board. The impeller includes a power member to drive a blast type vane to rotate. The vane is aligned with the channels formed between the multiple fins, to drive an air flow from the air inlet at one side of the base board to the air outlet at the other side of the base board.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention [0001]
  • The present invention relates to a heatsink device, and more particularly to a heatsink device that may drive a larger amount of air flow, and the heatsink air flow may be sucked from one side of the base board and may be carried outward from the other side of the base board. [0002]
  • 2. Description of the Related Art [0003]
  • A conventional super thin type fan structure in accordance with the prior art shown in FIG. 7 comprises a [0004] base 91 provided with a helical receiving space 92 which is provided with a shaft seat 93 on which a coil seat 94 is mounted. An impeller 95 has a rotation shaft rotatably mounted on the coil seat 94. A cover plate 96 is mounted on the base 91, and has an air inlet 97. The base 91 is provided with an air outlet 98. The impeller 95 may be rotated to suck the air flow through the air inlet 97, and the air flow may be blown from the air outlet 98 toward a place needing a heat dissipation. Thus, the impeller 95 may be rotated to suck the air flow through the air inlet 97 of the cover plate 96, and the air flow may be blown outward from the air outlet 98 at one side of the base 91. However, the air flow has to turn through 90 degrees from the air inlet 97 to the air outlet 98, so that the air flow turning through 90 degrees will produce a turbulence. In addition, if the air inlet side above the air inlet 97 does not have an enough space, the air flow rate will be reduced, thereby decreasing the heatsink effect.
    • SUMMARY OF THE INVENTION
  • The primary objective of the present invention is to provide a heatsink device that may drive a larger amount of air flow, wherein the heatsink air flow may be sucked from one side of the base board and may be carried outward from the other side of the base board, and the heatsink air flow may be conveyed toward larger angles and ranges, so that the heat emitting source combined on the [0005] base board 1 may have the optimum heatsink effect.
  • A secondary objective of the present invention is to provide a heatsink device that may drive a larger amount of air flow, without being limited by the top space of the heatsink device, and the driven air flow needs not to turn, so that the heatsink device of the present invention may have a better heatsink effect. [0006]
  • In accordance with the present invention, there is provided a heatsink device, comprising a base board provided with multiple fins and multiple channels formed between any two adjacent fins. Each of the channels has a first end formed with an air inlet and a second end formed with an air outlet. The base board is provided with a mounting portion. An impeller is combined on the mounting portion of the base board, and a cover plate is combined on a top of the base board. The impeller includes a power member to drive a blast type vane to rotate. The vane is aligned with the channels formed between the multiple fins, to drive an air flow from the air inlet at one side of the base board to the air outlet at the other side of the base board. [0007]
  • Further benefits and advantages of the present invention will become apparent after a careful reading of the detailed description with appropriate reference to the accompanying drawings.[0008]
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an exploded perspective view of a heatsiink device in accordance with a first embodiment of the present invention; [0009]
  • FIG. 2 is a top plan assembly view of the heatsink device as shown in FIG. 1, with the cover plate being removed; [0010]
  • FIG. 3 is a plan cross-sectional view of the heatsink device taken along line [0011] 3-3 as shown in FIG. 2;
  • FIG. 4 is an exploded perspective view of a heatsink device in accordance with a second embodiment of the present invention; [0012]
  • FIG. 5 is a top plan assembly view of the heatsink device in accordance with a third embodiment of the present invention, with the cover plate being removed; [0013]
  • FIG. 6 is a top plan assembly view of the heatsink device in accordance with a fourth embodiment of the present invention, with the cover plate being removed; and [0014]
  • FIG. 7 is an exploded perspective cross-sectional assembly view of a conventional super thin type fan structure in accordance with the prior art.[0015]
    • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Referring to the drawings and initially to FIG. 1, a heatsink device in accordance with a first embodiment of the present invention comprises a [0016] base board 1, an impeller 2, and a cover plate 3.
  • The [0017] base board 1 is made of a metallic material having a better heat conduction feature. The base board 1 has a bottom plate provided with multiple fins 11, and multiple channels 12 formed between any two adjacent fins 11. Each of the channels 12 has a first end formed with an air inlet 15 and a second end formed with an air outlet 16. The base board 1 is provided with a mounting portion 13 for mounting and fixing the impeller 2. The mounting portion 13 may be located at the air inlet 15 of the base board 1. In addition, the base board 1 is provided with multiple positioning portions 14, so that the cover plate 3 may be combined on the base board 1 easily. The positioning portion 14 may be a positioning hole or a groove as shown in the figure, so that the positioning member 31 of the cover plate 3 may be snapped on the positioning portion 14 of the base board 1. Further, the base board 1 may be provided with a receiving chamber 17 which aligns with the position of the power member 21 of the impeller 2, without disturbing the air flow. In addition, the receiving chamber 17 may be used to receive a circuit board 18 that is used to control operation of the power member 21 of the impeller 2.
  • The [0018] impeller 2 includes a power member 21, such as a motor, to drive a vane 22 to rotate. The vane 22 is a blast type vane that has elongated blades. The impeller 2 may be combined on the mounting portion 13 of the base board 1 in a conventional fixing manner as shown in the figure. The base board 1 is provided with multiple positioning holes 19 for passage of positioning members 23, such as bolts, which may be screwed into screw bores 24 formed in the power member 21 of the impeller 2, thereby fixing the impeller 2. The length of the vane 22 of the impeller 2 is substantially equal to the total width of the multiple fins 11 provided at the air inlet 15 of the base board 1. Thus, when the vane 22 is driven to rotate, a large quantity of air flow may be sucked into the air inlet 15 of the base board 1. The air flow may be driven to pass through each of the channels 12 of the base board 1, and may be carried outward from the air outlet 16 of the base board 1, so as to provide a heatsink effect to the base board 1 or the heat emitting member located at the air outlet 16 of the base board 1.
  • The [0019] cover plate 3 is combined on the top of the channels 12 of the base board 1 by the multiple positioning members 31, thereby ensuring that the air flow may enter the base board I from the air inlet 15 of the base board 1, and may be carried outward from the air outlet 16 of the base board 1. The cover plate 3 may be combined with the base board 1 by a conventional combination method, such as by screwing of bolts, or as shown in the figure, the cover plate 3 is provided with multiple positioning members 31 each provided with a barb, so that the barb of each of the multiple positioning members 31 may be snapped on each of the multiple positioning portions 14 of the base board 1. In addition, for increasing the air inlet rate when the cover plate 3 is combined with the base board 1, the cover plate 3 may be provided with an air inlet 32 aligning with the vane 22 of the impeller 2, thereby increasing the driving rate of the air flow when the vane 22 of the impeller 2 is rotated.
  • Referring to FIGS. 2 and 3, the heatsink device in accordance with a first embodiment of the present invention is assembled. The [0020] impeller 2 is combined on the mounting portion 13 of the base board 1, and the cover plate 3 is combined on the top of the channels 12 of the base board 1. In addition, the vane 22 of the impeller 2 is aligned with the air inlet 15 of the base board 1 and aligned with the air inlet 32 of the cover plate 3. Thus, when the power member 21 of the impeller 2 drives the vane 22 to rotate, the vane 22 may drive a larger amount of air flow that may flow in the channels 12 between the fins 11, and may be carried outward from the air outlet 16 of the base board 1. In addition, the length of the vane 22 of the impeller 2 is substantially equal to the total width of the multiple fins 11 provided at the air inlet 15 of the base board 1. Thus, the heatsink device in accordance with the present invention may obtain the maximum amount of driven air flow, and may have the optimum heatsink effect.
  • Referring to FIG. 4, a heatsink device in accordance with a second embodiment of the present invention is shown. The [0021] mounting portion 13 may be provided at the mediate position of each of the channels 12 located between the air inlet 15 and the air outlet 16. Thus, when the vane 22 of the impeller 2 is rotated, the air flow may be introduced into the base board 1 from the air inlet 15 of the base board 1, and may be carried outward from the air outlet 16 of the base board 1. Thus, the heatsink device in accordance with the present invention may obtain the maximum amount of driven air flow, and the heat emitting source located under the base board 1 may have the optimum heatsink effect.
  • Referring to FIG. 5, a heatsink device in accordance with a third embodiment of the present invention comprises a [0022] base board 4, an impeller 2, and a cover plate 3.
  • In third embodiment of the present invention, the [0023] base board 4 is also provided with multiple fins 41, and multiple channels 42 formed between any two adjacent fins 41. Each of the fins 41 has an arcuate shape. The impeller 2 is provided at one end of each of the channels 42, and is provided at the side of the air inlet 45. The other end of each of the channels 42 is the air outlet 46 which may be located at one side of the base board 1. The base board 4 is also provided with a mounting portion 43 for mounting the impeller 2. The mounting portion 43 may be located between the air inlet 45 and the air outlet 46, or located at the air inlet 45. In addition, the base board 4 is also provided with multiple positioning portions 44, so that the cover plate 3 may be combined on the base board 4 easily. Further, the base board 4 may also be provided with a receiving chamber 47 to receive the circuit board 18.
  • Referring to FIG. 6, a heatsink device in accordance with a fourth embodiment of the present invention is shown. In third embodiment of the present invention, the [0024] base board 4 is also provided with multiple fins 41 respectively formed with different arcuate shapes, or formed with locally arcuate shapes and locally oblique plates. The base board 4 is also provided with multiple channels 42 formed between any two adjacent fins 41. One end of each of the channels 42 is provided with a mounting portion 43 for mounting the impeller 2 which is provided at the side of the air inlet 45. The other end of each of the channels 42 is the air outlet 46 which may be located at two sides of the base board 1. The base board 4 is also provided with a mounting portion 43 for mounting the impeller 2. The mounting portion 43 may be located between the air inlet 45 and the air outlet 46, or located at the air inlet 45. In addition, the base board 4 is also provided with multiple positioning portions 44, so that the cover plate 3 may be combined on the base board 4 easily. Further, the base board 4 may also be provided with a receiving chamber 47 to receive the circuit board 18. Thus, the larger amount of air flow driven by the heatsink device in accordance with the present invention may be conveyed toward larger angles and ranges, so that the heat emitting source combined on the base board 1 may have the optimum heatsink effect.
  • Accordingly, in the heatsink device in accordance with the present invention, the vane of the blast type impeller is aligned with the multiple channels of the base board, and the length of the vane of the impeller is substantially equal to the total width of the multiple fins provided at the air inlet of the base board. Thus, when the vane is driven to rotate, the vane may drive a larger quantity of air flow which may carry the heat source from the air inlet at one side of the base board to the air outlet at the other side of the base board and the heat source may be carried outward from the air outlet of the base board, so that the heatsink device may have the optimum heatsink effect. [0025]
  • Although the invention has been explained in relation to its preferred embodiment as mentioned above, it is to be understood that many other possible modifications and variations can be made without departing from the scope of the present invention. It is, therefore, contemplated that the appended claim or claims will cover such modifications and variations that fall within the true scope of the invention. [0026]

Claims (11)

What is claimed is:
1. A heatsink device, comprising:
a base board, provided with multiple fins, and multiple channels formed between any two adjacent fins, each of the channels having a first end formed with an air inlet and a second end formed with an air outlet, the base board being provided with at least one mounting portion;
an impeller, combined on the mounting portion of the base board, the impeller including a power member to drive a blast type vane to rotate, the vane being aligned with the channels formed between the multiple fins, to drive an air flow from the air inlet at one side of the base board to the air outlet at the other side of the base board; and
a cover plate, combined on a top of the base board.
2. The heatsink device as claimed in claim 1, wherein the channels are arranged in a linear manner.
3. The heatsink device as claimed in claim 1, wherein the channels are arranged in an arcuate manner.
4. The heatsink device as claimed in claim 1, wherein the channels are partially arranged in a linear manner and partially arranged in an arcuate manner, so that the air outlet of the channel is located at two sides of the base board.
5. The heatsink device as claimed in claim 1, wherein the mounting portion is located at a position of the air inlet of the base board.
6. The heatsink device as claimed in claim 1, wherein the mounting portion is located between the air inlet and the air outlet of the base board.
7. The heatsink device as claimed in claim 1, wherein the base board is provided with multiple positioning holes for passage of positioning members which may be screwed into screw bores formed in the impeller, thereby fixing the impeller.
8. The heatsink device as claimed in claim 1, wherein the base board is provided with at least one positioning portion, and the cover plate is provided with at least one positioning member which may be combined on the at least one positioning portion.
9. The heatsink device as claimed in claim 1, wherein the vane of the impeller has a length substantially equal to a total width of the multiple fins.
10. The heatsink device as claimed in claim 1, wherein the cover plate is provided with an air inlet aligning with the vane of the impeller.
11. The heatsink device as claimed in claim 1, wherein the base board is provided with a receiving chamber to receive a circuit board.
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Cited By (12)

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US20040233633A1 (en) * 2003-05-23 2004-11-25 Mei-Ying Lay Structures for coolers with two-way air convection functionality
US20040256085A1 (en) * 2003-06-20 2004-12-23 Barsun Stephan Karl Finned device for removing heat from an electronic component
DE102004004440A1 (en) * 2004-01-28 2005-08-18 Kermi Gmbh Cooling device for electronic component e.g. microprocessor, allows coolant to flow through channel in heat sink
US20060185832A1 (en) * 2005-02-23 2006-08-24 Asia Vital Component Co., Ltd. Heat radiation module with transverse flow fan
USD678852S1 (en) * 2011-11-01 2013-03-26 Astral Pool Australia Pty Ltd Heat sink
US20200196491A1 (en) * 2018-12-14 2020-06-18 Delta Electronics, Inc. Inverter device having heat dissipation mechanism
CN111397049A (en) * 2020-04-20 2020-07-10 珠海格力电器股份有限公司 Semiconductor air conditioner
CN111565544A (en) * 2020-05-12 2020-08-21 岳宇飞 Sweeping type radiator
US11716829B1 (en) * 2020-03-17 2023-08-01 Apple Inc. Integrated fan and heat sink for head-mountable device
US20230247811A1 (en) * 2022-01-31 2023-08-03 Facebook Technologies, Llc Micro-oled display module thermal management
US20240046965A1 (en) * 2022-08-05 2024-02-08 Kioxia Corporation Semiconductor storage device
US12127430B2 (en) 2022-01-31 2024-10-22 Meta Platforms Technologies, Llc Micro-OLED display module thermal management

Cited By (18)

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