CN212324603U

CN212324603U - Heat dissipation back splint and electronic equipment

Info

Publication number: CN212324603U
Application number: CN202020945688.1U
Authority: CN
Inventors: 李乐乐; 王晨波
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2020-05-28
Filing date: 2020-05-28
Publication date: 2021-01-08
Anticipated expiration: 2030-05-28

Abstract

The embodiment of the utility model provides a heat dissipation back splint and electronic equipment, the heat dissipation back splint includes: the cooling device comprises a shell, a fan assembly, a cooling piece and a refrigerating piece; the shell is provided with an accommodating cavity, and the bottom of the accommodating cavity is provided with a first through hole; the fan assembly, the cooling piece and the refrigerating piece are arranged in the accommodating cavity; the fan assembly is arranged at the bottom of the accommodating cavity and is opposite to the first through hole; a second through hole is formed in the cooling piece, a first hole opening of the second through hole faces the fan assembly, a second hole opening of the second through hole faces the refrigerating piece, and the diameter of the first hole opening is larger than that of the second hole opening; the refrigeration piece is attached to the shell. The utility model discloses heat dissipation back splint, the outer hot-blast formation cold wind that forms behind the casing that gets into by first through-hole can be through the second through-hole blows to refrigeration piece accelerates the heat dissipation cooling of refrigeration piece, and then promote the radiating efficiency of heat dissipation back splint.

Description

Heat dissipation back splint and electronic equipment

Technical Field

The utility model relates to an electronic equipment technical field especially relates to a heat dissipation back splint and electronic equipment.

Background

With the rapid development of the electronic industry, the functions of electronic devices are becoming more and more diversified. Accordingly, batteries for supplying power to the electronic devices and internal devices dissipate more and more heat during use of the electronic devices. This causes the temperature inside the electronic device to rise, which seriously affects the performance of the electronic device.

In practical application, the heat dissipation back clip is used as a heat dissipation device and can be clamped outside a shell of the electronic equipment to quickly cool and dissipate heat of the electronic equipment. In order to improve the heat dissipation efficiency of the heat dissipation back clip, the heat dissipation mode of the heat dissipation back clip is generally realized by combining passive heat dissipation of the heat dissipation fins and active heat dissipation of the fan. In the process of implementing the present application, the inventor finds that at least the following problems exist in the prior art: whether the heat sink passively dissipates heat or the fan actively dissipates heat, the influence of the ambient temperature is large. When the ambient temperature is higher, the heat dissipation effect of the heat dissipation back clip is also poorer.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model provides a heat dissipation back splint and electronic equipment to it is big to solve current heat dissipation back splint and receive ambient temperature to influence, when ambient temperature is higher, the poor problem of heat dissipation back splint radiating effect.

In order to solve the technical problem, the present application is implemented as follows:

in a first aspect, an embodiment of the utility model discloses a heat dissipation back splint, include: the cooling device comprises a shell, a fan assembly, a cooling piece and a refrigerating piece;

the shell is provided with an accommodating cavity, and the bottom of the accommodating cavity is provided with a first through hole;

the fan assembly, the cooling piece and the refrigerating piece are arranged in the accommodating cavity;

the fan assembly is arranged at the bottom of the accommodating cavity and is opposite to the first through hole;

a second through hole is formed in the cooling piece, a first hole opening of the second through hole faces the fan assembly, a second hole opening of the second through hole faces the refrigerating piece, and the diameter of the first hole opening is larger than that of the second hole opening;

the refrigeration piece is attached to the shell.

In a second aspect, an embodiment of the present invention provides an electronic device, including: the heat dissipation back splint.

The embodiment of the utility model provides an in, when giving electronic equipment heat dissipation through the heat dissipation back splint, can place electronic equipment on the casing of heat dissipation back splint, the heat of electronic equipment side just can be led through the casing and send to the refrigeration piece on and spill through the refrigeration piece like this. And because the diameter of the first orifice is larger than that of the second orifice, when hot air outside the shell is blown to the refrigeration piece through the second through hole, the throttling expansion effect can be formed at the position of the second through hole to cool the hot air to form cold air, and therefore, in practical application, even if the environment temperature is higher, the hot air entering the shell from the first through hole can be throttled and cooled through the second through hole to form cold air to be blown to the refrigeration piece, so that the heat dissipation and cooling of the refrigeration piece are accelerated, and the cooling and heat dissipation of the electronic equipment on the shell of the heat dissipation back clamp are accelerated. Therefore, the embodiment of the utility model provides a radiating efficiency of heat dissipation back splint is higher.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural view of a heat dissipation back clip according to an embodiment of the present invention;

FIG. 2 is a schematic view of the heat dissipation back clip shown in FIG. 1 in another direction;

FIG. 3 is an exploded view of the heat sink clip of FIG. 1;

FIG. 4 is a cross-sectional view of the heat dissipation back clip shown in FIG. 1;

fig. 5 is a schematic cross-sectional three-dimensional structure of the heat dissipation back clip shown in fig. 4.

Description of reference numerals:

1: an electronic device; 10: a housing; 20: a fan assembly; 30: a cooling member; 40: a refrigeration member; 101: a first through hole; 31: a second through hole; 301: a first orifice; 302: a second orifice; 50: a gap; 102: a third through hole; 201: a centrifugal fan; 11: a support plate; 12: a base; 13: a receiving cavity.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application are capable of operation in sequences other than those illustrated or described herein. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

The heat dissipation back clip provided by the embodiment of the present application is described in detail through specific embodiments and application scenarios thereof with reference to the accompanying drawings.

An embodiment of the utility model provides a heat dissipation back splint, include: the cooling device comprises a shell, a fan assembly, a cooling piece and a refrigerating piece; the shell is provided with an accommodating cavity, and the bottom of the accommodating cavity is provided with a first through hole; the fan assembly, the cooling piece and the refrigerating piece are arranged in the accommodating cavity; the fan assembly is arranged at the bottom of the accommodating cavity and is opposite to the first through hole; a second through hole is formed in the cooling piece, a first hole opening of the second through hole faces the fan assembly, a second hole opening of the second through hole faces the refrigerating piece, and the diameter of the first hole opening is larger than that of the second hole opening; the refrigeration piece is attached to the shell.

The embodiment of the utility model provides an in, when giving electronic equipment heat dissipation through the heat dissipation back splint, can with electronic equipment place in on the casing of heat dissipation back splint, the heat of electronic equipment side just can be led through the casing and send to the refrigeration piece on and spill through the refrigeration piece like this. Because the diameter of the first hole is larger than that of the second hole, when hot air outside the shell is blown to the refrigerating piece through the second through hole, the second through hole can form a throttling expansion effect to cool the hot air to form cold air, and therefore, in practical application, even if the environment temperature is high, the hot air entering the shell from the first through hole can also be throttled and cooled through the second through hole to form cold air to be blown to the refrigerating piece, the heat dissipation and cooling of the refrigerating piece are accelerated, and the cooling and heat dissipation of the electronic equipment are accelerated. Therefore, the embodiment of the utility model provides a radiating efficiency of heat dissipation back splint is higher.

The embodiment of the utility model provides an electronic equipment can be for smart mobile phone, computer, multimedia player, electronic reader, wearable equipment etc..

In practical application, the electronic equipment can generate heat in the use process, so that the electronic equipment can be placed on the heat dissipation back splint to cool and dissipate the heat of the electronic equipment through the heat dissipation back splint. The electronic device and the heat dissipation back clip may be matched in various ways, for example, the heat dissipation back clip is disposed on the back of the electronic device through the clip, or the heat dissipation back clip is provided with an electronic device accommodating groove, the electronic device is disposed in the accommodating groove, and the like.

Referring to fig. 1, a schematic structural diagram of a heat dissipation back splint of the present invention is shown. Referring to fig. 2, there is shown another schematic view of the heat dissipation back clip shown in fig. 1 according to the present invention. Referring to fig. 3, there is shown an exploded view of the heat dissipating back clip of fig. 1 according to the present invention. Referring to fig. 4, a cross-sectional structure diagram of the heat dissipation back clip shown in fig. 1 is shown. Referring to fig. 5, a cross-sectional three-dimensional structural view of the heat-dissipating back clip of fig. 4 is shown.

As shown in fig. 1 to 5, the heat dissipation back clip may specifically include: the housing 10, the fan assembly 20, the cooling member 30 and the refrigerating member 40; the housing 10 is provided with an accommodating cavity 13, and the bottom of the accommodating cavity 13 is provided with a first through hole 101; the fan assembly 20, the cooling piece 30 and the refrigerating piece 40 are arranged in the accommodating cavity 13; the fan assembly 20 is arranged at the bottom of the accommodating cavity 13 and is opposite to the first through hole 101; the cooling element 30 is provided with a second through hole 31, a first orifice 301 of the second through hole 31 faces the fan assembly 20, a second orifice 302 of the second through hole 31 faces the refrigerating element 40, and the diameter of the first orifice 301 is larger than that of the second orifice 302; the cooling member 40 is attached to the housing 10. The embodiment of the utility model provides a heat dissipation back splint the heat dissipation receive ambient temperature to influence lessly, even if ambient temperature is higher, form the cold wind after the hot-blast also can throttle the cooling through second through-hole 31 by first through-hole 101 entering and blow to refrigeration piece 40, refrigerate the heat dissipation cooling of piece 40 with higher speed, and then accelerate electronic equipment's heat dissipation cooling, consequently, heat dissipation back splint radiating efficiency is higher.

It can be understood that the cold air and the hot air described in the embodiment of the present application are relative concepts, and the temperature of the air entering the housing from the first through hole 101 is higher than that of the air blown out from the second through hole 31, so that the air entering from the first through hole 101 can be referred to as hot air, and the air blown out from the second through hole 31 to the cooling member 40 is referred to as cold air. For example, the temperature of the wind entering through the first through hole 101 may be 25 ℃ which is the same as the ambient temperature, and may be referred to as hot wind, and the temperature of the wind blowing toward the cooling member 40 through the second through hole 31 may be 20 ℃, and may be referred to as cold wind. Of course, the temperature difference between the cold air and the hot air can be 5-10 ℃ or 0.1-0.5 ℃. The temperature range and the temperature difference range of the cold air and the hot air are not particularly limited in the embodiment of the application.

In this application embodiment, the heat dissipation form of heat dissipation back splint can be understood as cooling heat dissipation through refrigeration piece 40 initiative heat conduction heat dissipation and through the heat dissipation mode that fan assembly 20 initiative blowing heat dissipation combined together, because refrigeration piece 40 can initiatively absorb the heat on casing 10 and will the heat is led to one side with cooling piece 30 is dispelled, cooling piece 30 goes up first drill way 301 of second through-hole 31 and is passed through fan assembly 20 and first through-hole 101 intercommunication, the second drill way 302 of second through-hole 31 is relative with refrigeration piece 40, consequently, fan assembly 20 can drive the hot-blast of getting into by first through-hole 101 and send to second through-hole 31, form cold wind after the cooling through second through-hole 31 and blow off, the cold wind that blows off can take away the heat that refrigeration piece 40 led off again, consequently, this application embodiment the heat dissipation efficiency of heat dissipation back splint can obtain effective the promotion.

In the embodiment of the present application, the second through hole 31 is disposed on the cooling member 30, and it can also be understood that the second through hole 31 is formed by the cooling member 30. Specifically, the temperature reducing member 30 includes first and second opposing surfaces; the opening of the second through hole 31 on the first surface is a first orifice 301, the opening of the second through hole 31 on the second surface is a second orifice 302, and the diameter of the first orifice 301 is larger than that of the second orifice 302.

In practical applications, since the first surface and the second surface are opposite sides of the temperature reducing member 30, the diameter of the first aperture 301 larger than the diameter of the second aperture 302 can also be understood as: the cross-sectional area of the first aperture 301 on said first surface is larger than the cross-sectional area of the second aperture 302 on said second surface.

In the embodiment of the present application, the diameter of the first aperture 301 is larger than that of the second aperture 302, and the cross-sectional shapes of the first aperture 301 and the second aperture 302 are not limited (the cross-sectional shapes of the first aperture 301 and the second aperture 302 are not limited to be circular, and the cross-sectional shapes of the first aperture 301 and the second aperture 302 may also be square, triangular or other deformed planar structures), and the diameter of the first aperture 301 is larger than that of the second aperture 302, and the following can be understood as follows: the smallest dimension in the cross-sectional shape of the first aperture 301 is larger than the largest dimension in the cross-sectional shape of the second aperture 302.

In practical applications, since the diameter of the first aperture 301 is larger than the diameter of the second aperture 302, the fan assembly 20 can blow more air into the second through hole 31 through the first aperture 301, where the temperature of the wind is substantially the same as the ambient temperature, which is called hot wind. After a large amount of hot air is blown into the second through hole 31 by the fan assembly 20, because the diameter of the second orifice is smaller than that of the first orifice 301, the air is throttled at the second orifice 302, a large amount of gas is compressed in the second through hole 31, the fan assembly 20 applies work to the gas, the internal energy of the gas is increased, after the gas is released through the second orifice 302, the outward diffusion volume of the gas is increased, the pressure is reduced, the external work is applied in the air expansion process, the internal energy is reduced, and the temperature is reduced, so that the temperature of the air blown out from the second orifice 302 is reduced, cold air is formed, and the process is equivalent to a throttling expansion effect. Since the second aperture 302 faces the cooling element 40, the cold air can rapidly take away the heat dissipated by the cooling element 40, so as to accelerate the heat dissipation of the cooling element 40, and further improve the cooling and heat dissipation capability of the heat dissipation back clip.

As shown in fig. 4 and 5, in the embodiment of the present application, the second through hole 31 is sectioned by a plane passing through the axis of the second through hole 31, and the section may be in the shape of a tapered hole. The conical top of the conical hole is a second orifice 302, and the second orifice 302 faces the refrigeration piece 40, that is, the conical top of the conical hole faces the refrigeration piece 40; the conical bottom of the conical hole is a first hole 301, the first hole 301 faces the fan assembly 20, namely, the conical bottom of the conical hole faces the fan assembly 20, so that when gas passes through the conical hole, a throttling expansion effect is formed through the conical hole, cold air is blown out from a second hole 302, the heat dissipation of the refrigeration sheet 40 can be accelerated, and the heat dissipation efficiency of the heat dissipation back clamp is further improved. Of course, it should be understood that the taper of the tapered hole described in the embodiments of the present application is not an absolute taper, and may also be a through hole similar to a taper, or an isosceles trapezoid, a shape similar to an isosceles trapezoid, or the like.

It can be understood that, on the premise of not affecting the ventilation effect, the diameter of the second hole 302 is reduced as much as possible, or the difference between the diameter of the first hole 301 and the diameter of the second hole 302 is increased as much as possible, so that the difference between the temperature of the hot air entering the first hole 301 and the temperature of the cold air blown out from the second hole 302 is increased by using the throttling expansion effect, thereby improving the heat dissipation efficiency of the heat dissipation back clip.

Optionally, the aperture of the second through hole 31 decreases in sequence along the direction from the first aperture 301 to the second aperture 302.

In the embodiment of the present application, along the direction of first drill way 301 to second drill way 302, the aperture of second drill way 31 diminishes in proper order, can make the windage of second drill way 31 less, fan assembly 20 blows in wind when second through-hole 31, fan assembly 20 more converts the work of doing gas into gaseous internal energy, so that gaseous second drill way 302 through second through-hole 31 is when being released, gaseous diffusion inflation in-process is to external work outward, the internal energy reduces more (the increase of difference value in the gas), the temperature of the wind that makes second drill way 302 blow out is lower, and then accelerate the heat dissipation of piece 40, promote the heat dissipation cooling performance of heat dissipation refrigeration back splint.

Optionally, the ratio of the diameter of the first orifice 301 to the diameter of the second orifice 302 is a ratio value; the diameter ratio is positively correlated to the static pressure of the fan assembly 20.

In practical applications, the ratio of the diameter of the first aperture 301 to the diameter of the second aperture 302 may be set to a ratio value, and since the ratio value is in positive correlation with the static pressure of the fan assembly 20, within a certain range, the larger the ratio value (it can also be understood that the larger the difference between the first aperture 301 and the second aperture 302 is), the higher the static pressure provided by the fan assembly 20 is. The skilled person can set the size of the first and

second apertures

301, 302 and the static pressure of the fan assembly 20 matching the value of the said diameter ratio according to the actual requirements.

Optionally, the second through hole 31 may further include a first variable diameter portion and a second variable diameter portion connected to each other; wherein the second diameter-changing part is close to the refrigerating part 40; in the direction from the first aperture 301 to the second aperture 302, the aperture of the first variable diameter portion decreases in order and the aperture of the second variable diameter portion increases in order.

In the embodiment of the present application, the second through hole 31 includes the first variable diameter portion and the second variable diameter portion that link to each other, through the aperture of the first variable diameter portion reduces in proper order, the aperture of the second variable diameter portion increases in proper order to make the air fluidity through the second through hole 31 better, the windage is littleer. Moreover, the work done by the fan assembly 20 to the gas is more converted into the internal energy of the gas, so that the internal energy of the gas is increased, and after the gas is released through the second orifice 302, the internal energy of the gas doing to the outside is reduced, the internal energy changes more, the gas temperature is lower, namely, the cold air temperature is lower, and the cooling and heat dissipation of the electronic device 1 by the heat dissipation back clip are more facilitated.

For example, in the embodiment of the present application, the second through hole 31 is sectioned along the axial direction thereof, the sectional shape may be similar to an hourglass shape, in order to make the air more easily enter from the first hole 301, in practical applications, the diameter of the first hole 301 is increased as much as possible, the hole diameter of the second through hole 31 is minimized at the middle part where the first diameter-changing part and the second diameter-changing part are connected, so as to achieve the effect of throttling and cooling the entering hot air, and then the diameter of the second hole 302 facing the cooling element 40 is increased, so as to make the acting area of the cold air blown out through the second hole 302 on the cooling element 40 larger, and the wind resistance smaller.

In the embodiment of the present application, in order to further reduce the wind resistance of the second through hole 31, the edge shape of the second through hole 31 may also be optimized. For example, the edge of the second through hole 31 extends along a parabolic line, a streamline line or a spiral line, so as to facilitate air to enter from the first aperture 301 more quickly, flow in the second through hole 31 and then be blown out from the second aperture 302, and reduce the wind resistance of the second through hole.

Optionally, in a direction from the first aperture 301 to the second aperture 302, a length of the first variable-diameter portion is greater than or equal to a length of the second variable-diameter portion.

In practical applications, in order to convert more work applied to the gas by the fan assembly 20 into gas internal energy, so that after the gas is released through the second orifice 302, the gas expands to do work to the outside, the difference between the internal energy decreases is larger, and the temperature of the cold air formed is lower, therefore, along the direction from the first orifice 301 to the second orifice 302, the length of the first variable-diameter portion may be set to be greater than or equal to the length of the second variable-diameter portion. Of course, it is understood that a person skilled in the art may also set the length of the second variable diameter portion to be greater than the length of the first variable diameter portion, which is not limited in the embodiments of the present application.

Optionally, the cooling member 40 is a semiconductor cooling plate, and a heating surface of the semiconductor cooling plate is opposite to the second aperture 302.

In practical application, because the semiconductor refrigeration piece does not need any refrigerant, does not have vibrations, noise when pollution-free work, long service life, moreover, the semiconductor refrigeration piece is small, consequently, the heat dissipation back splint that uses the semiconductor refrigeration piece also correspondingly has more green, does not have vibrations, noise to and long service life, small advantage. Moreover, the semiconductor refrigeration piece with smaller volume and area can generate effective refrigeration and heat conduction effects, so that the layout of the heat dissipation back clip using the semiconductor refrigeration piece is simpler, the volume can be correspondingly smaller, the weight is lighter, and the appearance is more attractive.

Of course, the cooling element 40 in the embodiment of the present application may also be a heat pump using a refrigerant in the conventional sense. For example, the cooling member 40 may be a heat exchanger formed by a plurality of cooling pipes, and the refrigerant in the pipes absorbs the heat conducted from the electronic device 1 on the housing 10 and conducts the heat to the side close to the cooling member 30 for dissipation. Because the heat pump using the refrigerant is more stable and reliable, and the refrigeration effect is higher, the heat pump system used as the heat dissipation back clip of the refrigeration piece 40 also has the advantages of stability, reliability and high refrigeration effect.

In the embodiment of the present application, the cooling element 40 may also be a heat sink made of a high thermal conductive metal material, such as a copper alloy heat sink, an aluminum alloy heat sink, and the like. In practical application, because the coefficient of heat conductivity of copper alloy, aluminum alloy etc. is higher, consequently, the refrigeration piece 40 of above-mentioned material also can be with the heat on the casing 10 fast conduction to the side that is close to with cooling piece 30 to carry out the heat exchange through cold wind that second drill way 302 blew out and refrigeration piece 40, the heat that will refrigerate the piece 40 effluvium fast. It is understood that the refrigerating element 40 can be selected and set by a person skilled in the art according to actual needs, and the embodiment of the present application is not limited thereto.

Optionally, a gap 50 is provided between the cooling member 30 and the cooling member 40.

In this application embodiment, in order to make the heat that the refrigeration piece 40 led and sent give off more fast, can also make the relative interval setting of cooling piece 30 and refrigeration piece 40 to make and form clearance 50 between cooling piece 30 and the refrigeration piece 40, thereby make the cold wind that second drill way 302 blew out can take away the heat that refrigeration piece 40 gave off fast. It can be understood that, in order to make the heat exchange efficiency between the cooling air blown out from the second aperture 302 and the cooling element 40 higher, the second aperture 302 can be made opposite to the cooling element 40, so that the cooling air blown out from the second aperture 302 can quickly exchange heat with the heating surface of the cooling element 40, and the heat dissipation of the heating surface of the cooling element 40 can be made faster.

In practice, the width of the gap 50 is also related to the wind resistance of the second aperture 302 in the direction from the refrigeration member 40 to the temperature reduction member 30. The smaller the width of the gap 50, the greater the windage of the second orifice 302 and the higher the gas pressure, the greater the width of the gap 50, and the smaller the windage of the second orifice 302, the lower the gas pressure. Of course, it will be appreciated that the width of the gap 50 is not linearly related to the wind resistance blown out by the second aperture 302, and that the wind resistance does not increase indefinitely as the gap 50 decreases, and decreases indefinitely as the gap 50 increases, but rather decreases to a certain extent or increases to a certain extent to stabilize. The width of the gap 50 can be set by one skilled in the art according to actual test or wind resistance requirements, and the embodiment of the present application is not limited thereto.

Optionally, a third through hole 102 is further provided on the housing 10; the third through hole 102 is provided in the housing 10 in the circumferential direction of the gap 50.

In practical application, along the circumferential direction of the gap 50, the third through hole 102 is provided on the housing 10 as an air outlet on the housing, so that the wind resistance can be effectively reduced, and the distance from the second aperture 302 to the third through hole (or, the distance from the second aperture 302 to the air outlet duct outside the housing 10) can be reduced, thereby improving the heat dissipation efficiency of the heat dissipation back clip.

It can be understood that the third through hole 102 can also be disposed at a predetermined position on the housing 10, for example, the third through hole 102 is disposed on the opposite side of the housing 10, and the third through hole 102 is not disposed on the other sides, so that when the heat dissipation back clip is held by a hand, the side without the third through hole 102 can be held, thereby preventing a hand from being scalded by hot air blown out from the third through hole 102, and thus, the user experience can be effectively improved.

In this embodiment, the aperture size of the third through hole 102 is related to the heat dissipation efficiency of the heat dissipation back clip, or the aperture size of the third through hole 102 is related to the wind resistance, so that, in practical application, the aperture of the third through hole 102 can be set as large as possible, so as to further reduce the wind resistance and improve the heat dissipation efficiency of the heat dissipation back clip. Of course, since the aperture of the third through hole 102 is also related to the strength of the housing 10, the third through hole 102 may be a circular or square hole arranged in an array, so that the third through hole 102 has the advantages of small wind resistance and high strength of the housing 10 at the third through hole 102. It is understood that, a person skilled in the art may set the number, shape, size, etc. of the third through holes 102 according to actual requirements, and the embodiment of the present application is not limited in this respect.

Alternatively, the fan assembly 20 may comprise at least one centrifugal fan 201, the static pressure of the centrifugal fan 201 being greater than a preset static pressure value.

In the embodiment of the present application, because centrifugal fan 201 can produce higher static pressure at the during operation to be favorable to blowing in more by the gas that first through-hole 101 got into in second through-hole 31, compress the acting to gas in second through-hole 31, consequently, use centrifugal fan 201 more to be favorable to making the hot-blast second through-hole 31 that first through-hole 101 got into carry out the throttle cooling, improve the mobility of air, and then promote the radiating efficiency that the heat dissipation back splint.

In practical applications, the preset static pressure value may be a minimum static pressure value that satisfies the heat dissipation efficiency of the heat dissipation back clip. When the number of the centrifugal fans 201 is N and the types of the centrifugal fans 201 are the same, the static pressure values of the N centrifugal fans 201 may be overlapped, and thus the static pressure value of each centrifugal fan needs to be greater than the ratio of the minimum static pressure value to N. Of course, it can be understood that a certain air volume loss is also caused by mutual interference among the plurality of centrifugal fans, so that the static pressures of the plurality of centrifugal fans 201 are not simply and directly added, but are added within a certain error range, and a person skilled in the art can set the static pressure value of each centrifugal fan according to actual requirements.

In the embodiment of the present application, when the fan assembly 20 includes a plurality of centrifugal fans 201, the models (static pressure values) of the plurality of centrifugal fans 201 may be the same or different. For example, in the case where the number of the centrifugal fans 201 is plural, the same model is selected for the plural centrifugal fans 201, which facilitates both the layout of the plural fan assemblies in the casing 10 and the selection of the plural centrifugal fans 201. Or, because the heat transferred by the electronic device on the casing 10 is not uniform, the centrifugal fans 201 of different models can be selected according to the heat distribution of the electronic device on the casing 10, the centrifugal fan 201 with higher static pressure is arranged in the region with higher heat transfer on the casing 10 with the electronic device, and the centrifugal fan with lower static pressure is arranged in the region with lower heat transfer on the casing with the electronic device, that is, the distribution of the centrifugal fans 201 and the model of the centrifugal fan 201 are arranged according to the heat transfer distribution of the electronic device on the casing 10, so that the heat dissipation effect of the heat dissipation back clip on the electronic device can be better.

Optionally, the number of the second through holes 31 is multiple; the second through holes 31 are distributed on the cooling part 30 according to a predetermined shape that matches the distribution shape of the at least one centrifugal fan.

In the embodiment of the present application, in order to make the cooling effect of the second through hole 31 better and make the wind resistance smaller, a plurality of second through holes 31 may be further provided, and the plurality of second through holes 31 are provided to be distributed according to a preset shape. For example, the second through hole 31 is matched with the distribution shape of at least one centrifugal fan 201, so that each centrifugal fan 201 is opposite to the first aperture 301 of the second through hole 31, thereby reducing the wind resistance entering the second through hole 31, and making the centrifugal fan 201 do more work on the gas and convert the more work into the internal energy of the gas, so that when the gas is released from the second aperture 302, the more work is done on the outside in the process of outward diffusion and expansion of the gas, the difference value of the internal energy in the front and the back is larger, the temperature of the wind blown out from the second aperture 302 is lower, the heat dissipation effect of the refrigeration sheet 40 is better, and further the heat dissipation performance of the heat dissipation back clip is higher.

In practical applications, when the electronic device 1 is placed on the heat dissipation back clip, the temperature zones transmitted to the heat dissipation back clip housing 10 by the electronic device 1 are different due to different device layouts inside the electronic device 1, and therefore, a plurality of second through holes 31 can be further arranged to match with the temperature zones of the electronic device 1 on the heat dissipation back clip. For example, in the area where the temperature of the electronic device 1 is higher on the heat dissipation back clip, the second through holes 31 are arranged in a larger number and have a larger density, so that more cold air can cool and dissipate the area where the temperature is higher, in the area where the temperature of the electronic device 1 is relatively lower on the heat dissipation back clip, the number of the second through holes 31 is arranged in a smaller number and has a smaller density, so that the energy utilization rate is increased, and the resource waste is avoided.

In the embodiment of the present application, when the number of the second through holes 31 is plural, the sizes of the plural second through holes 31 may be the same or different. For example, in order to reduce the processing difficulty and the processing cost, a plurality of second through holes 31 with the same size may be provided in the cooling member 30. Specifically, when the cooling member 30 is a plate, a plurality of tapered holes may be provided in the cooling member 30 as the second through holes 31. Alternatively, in order to enhance the cooling effect of the second through holes 31, a plurality of second through holes 31 may be provided with different sizes. For example, the diameters of the first hole 301 and the second hole 302 of the second through holes 31 are different, so that the cooling effect of the second through hole 31 of each size is different, thereby avoiding energy waste and enabling the cooling effect of the heat dissipation back clip to be more reasonable.

It is understood that, a person skilled in the art may set the number, shape and size of the second through holes 31 according to practical situations, set the diameter size and shape of the first apertures 301 and the diameter size and shape of the second apertures 302 of the second through holes 31 according to cooling requirements, and arrange the plurality of second through holes 31 on the cooling member 30, and the above examples given in the embodiments of the present application are not limiting to the present application.

Alternatively, the housing 10 may include a base 12 and a support plate 11; the supporting plate 11 and the base 12 form a containing cavity 13; the first through hole 101 is arranged on the base 12; the cooling member 40 is attached to the supporting plate 11.

In the embodiment of the application, the supporting plate 11 can be used for supporting the electronic device 1, and therefore, the supporting plate 11 can be a plastic plate with good heat conduction performance and certain elasticity, so that the electronic device 1 can be buffered and protected, the electronic device 1 is prevented from being scratched, and the heat of the electronic device 1 can be quickly conducted to the cooling plate.

In practical applications, in order to enable the heat of the electronic device 1 to be more quickly transferred to the cooling element 40, the supporting plate 11 may be a metal plate made of a high thermal conductive metal material, for example, the supporting plate 11 may be a copper alloy plate or an aluminum alloy plate, and the like, and because the thermal conductivity coefficient of the copper alloy, the aluminum alloy and the like is higher, the heat of the electronic device 1 can be more quickly and better conducted to the cooling surface of the cooling element 40, so that the heat is absorbed by the cooling surface of the cooling element 40 and is conducted to the heating surface of the cooling element 40 to be dissipated.

Optionally, a buffer pad may be further disposed on one side of the supporting plate 11 away from the cooling element 40, so that on one hand, friction between the electronic device 1 and the supporting plate 11 may be improved, and damage to the electronic device 1 caused by sliding of the electronic device 1 on the supporting plate 11 is avoided, and on the other hand, the buffer and protection effects may be further performed on the electronic device 1, so as to avoid appearance damage to the electronic device 1 caused by hard contact between the electronic device 1 and the supporting plate 11.

In the embodiment of the application, in order to make electronic equipment 1 set up more conveniently on the heat dissipation back splint, still can set up the holding tank that holds electronic equipment 1 on the heat dissipation back splint, backup pad 11 sets up in the tank bottom of holding tank, just so can avoid electronic equipment 1 to slide on the heat dissipation back splint and damage.

To sum up, the embodiment of the utility model provides a heat dissipation back splint include following advantage at least:

the embodiment of the utility model provides an in, when giving electronic equipment heat dissipation through the heat dissipation back splint, can with electronic equipment place in on the casing of heat dissipation back splint, the heat of electronic equipment side just can be led through the casing and send to the refrigeration piece on and spill through the refrigeration piece like this. And because the diameter of the first orifice is larger than that of the second orifice, when hot air outside the shell is blown to the refrigeration piece through the second through hole, the throttling expansion effect can be formed at the position of the second through hole to cool the hot air to form cold air, and therefore, in practical application, even if the environment temperature is higher, the hot air entering the shell from the first through hole can be throttled and cooled through the second through hole to form cold air to be blown to the refrigeration piece, so that the heat dissipation and cooling of the refrigeration piece are accelerated, and the cooling and heat dissipation of the electronic equipment on the shell of the heat dissipation back clamp are accelerated. Therefore, the embodiment of the utility model provides a radiating efficiency of heat dissipation back splint is higher.

The embodiment of the application also provides electronic equipment which specifically comprises the heat dissipation back clip.

In practical application, the heat dissipation back splint can be used as an accessory of the electronic equipment, so that the electronic equipment can be cooled and dissipated by utilizing the heat dissipation back splint in the using process.

The embodiment of the utility model provides an in, when giving electronic equipment heat dissipation through the heat dissipation back splint, can with electronic equipment place in on the casing of heat dissipation back splint, the heat of electronic equipment side just can be led through the casing and send to the refrigeration piece on and spill through the refrigeration piece like this. And because the diameter of the first orifice is larger than that of the second orifice, when hot air outside the shell is blown to the refrigeration piece through the second through hole, the throttling expansion effect can be formed at the position of the second through hole to cool the hot air to form cold air, and therefore, in practical application, even if the environment temperature is higher, the hot air entering the shell from the first through hole can be throttled and cooled through the second through hole to form cold air to be blown to the refrigeration piece, so that the heat dissipation and cooling of the refrigeration piece are accelerated, and the cooling and heat dissipation of the electronic equipment on the shell of the heat dissipation back clamp are accelerated.

It should be noted that, in the present specification, the embodiments are all described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other.

While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. A heat-dissipating clip, comprising: the cooling device comprises a shell, a fan assembly, a cooling piece and a refrigerating piece;

the refrigeration piece is attached to the shell.

2. The heat dissipating back clip of claim 1, wherein the second through holes have successively decreasing diameters in a direction from the first aperture to the second aperture.

3. The heat sink clip of claim 1, wherein a gap is provided between the temperature reducing member and the cooling member.

4. The heat dissipating back clip of claim 3, wherein the housing further comprises a third through hole;

the third through hole is provided in the housing along a circumferential direction of the gap.

5. The heat dissipating clip of claim 1, wherein the cooling member is a semiconductor cooling fin having a heating surface opposite the second aperture.

6. The heat dissipating back clip of claim 1, wherein the housing comprises a base and a support plate;

the supporting plate and the base form the accommodating cavity;

the first through hole is arranged on the base;

the refrigerating piece is attached to the supporting plate.

7. The heat dissipation clip as defined in claim 1, wherein the ratio of the diameter of the first aperture to the diameter of the second aperture is a ratio value;

the diameter ratio is in positive correlation with the static pressure of the fan assembly.

8. The heat dissipating back clip of claim 1, wherein the fan assembly comprises at least one centrifugal fan;

and the static pressure value of the centrifugal fan is greater than the preset static pressure value.

9. The heat dissipating back clip of claim 8, wherein the number of the second through holes is plural;

the plurality of second through holes are distributed on the cooling piece according to a preset shape, and the preset shape is matched with the distribution shape of the at least one centrifugal fan.

10. An electronic device, characterized in that the electronic device comprises: the heat dissipating back clip of any one of claims 1 to 9.