CN212324311U

CN212324311U - Microphone (CN)

Info

Publication number: CN212324311U
Application number: CN202021264805.4U
Authority: CN
Inventors: 胡恒宾; 曾鹏
Original assignee: AAC Acoustic Technologies Shenzhen Co Ltd
Current assignee: AAC Technologies Holdings Shenzhen Co Ltd
Priority date: 2020-06-30
Filing date: 2020-06-30
Publication date: 2021-01-08
Anticipated expiration: 2030-06-30
Also published as: WO2022000646A1

Abstract

The utility model provides a microphone, its include the circuit board, with circuit board lid connects the shell that forms accommodating space and accept in ASIC chip and MEMS chip in the accommodating space, a serial communication port, the shell includes the at least two-layer metal-back shell that the interval set up and locates adjacent two between the metal-back shell and with the shielding shell that the metal-back interval set up. Compared with the prior art, the utility model discloses a microphone increases the number of piles and the thickness of shielding layer and forms multilayer metal reflection interface and interplate filter capacitance on the basis of not obviously increasing microphone height and volume to can effectively shield and filtering electromagnetic wave radiation's interference.

Description

Microphone (CN)

[ technical field ] A method for producing a semiconductor device

The utility model relates to an acoustoelectric field especially relates to a microphone.

[ background of the invention ]

With the development of wireless communication, more and more mobile phone users are around the world, and the requirements of the users on the mobile phones are not only satisfied with the call but also capable of providing a high-quality call effect.

The microphone in the related art comprises a circuit board, a shell which is connected with the circuit board in a covering mode to form an accommodating space, and an ASIC chip and an MEMS chip which are accommodated in the accommodating space, wherein the ASIC chip and the MEMS chip are fixedly arranged on the circuit board, and the shell is a metal shell. However, the microphone in the related art has only an electromagnetic shielding structure of a single metal casing, so that the microphone is susceptible to electromagnetic wave interference, thereby seriously affecting the performance of the micro-electromechanical microphone.

Therefore, there is a need to provide a new microphone to solve the above technical problems.

[ Utility model ] content

An object of the utility model is to provide a microphone, this microphone increase the number of piles and the thickness of shielding layer and form multilayer metal reflection interface and interplate filter capacitance on the basis of not obviously increasing microphone height and volume to can effectively shield and filtering electromagnetic wave radiation's interference.

In order to achieve the above object, the utility model provides a microphone, including the circuit board, with the circuit board lid connects the shell that forms accommodating space and accept in ASIC chip and MEMS chip in the accommodating space, the shell includes the metal-back that at least two-layer interval set up and locates adjacent two between the metal-back and with the shielding shell that the metal-back interval set up.

Preferably, the metal shell is in surface contact connection with the circuit board.

Preferably, the metal shell is in point contact with the circuit board.

Preferably, at least one of the metal shells of the at least two layers of metal shells is electrically connected with the circuit board.

Preferably, at least two layers of the metal shell are both electrically connected with the circuit board in a non-electrical mode.

Preferably, the shielding case is an electromagnetic shielding film or a conductive adhesive.

Preferably, the electromagnetic shielding film includes a carrier film, an insulating layer, a metal layer, an adhesive film layer and a protective layer, which are sequentially stacked.

Preferably, the housing comprises two metal shells which are arranged at intervals, and the at least two metal shells are made of different metal materials.

Compared with the prior art, the utility model discloses a microphone through inciting somebody to action the shell sets up including the interval at least two-layer metal-back and locates adjacent two between the metal-back and with the shielding shell that the metal-back interval set up can increase the number of piles and the thickness of shielding layer and form multilayer metal reflection interface and interplate filter capacitance on the basis of not obviously increasing microphone height and volume to can effectively shield and filtering electromagnetic wave radiation's interference.

[ description of the drawings ]

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained without inventive work, wherein:

fig. 1 is a schematic perspective view of a microphone according to a preferred embodiment of the present invention;

FIG. 2 is an exploded view of the microphone shown in FIG. 1;

FIG. 3 is a cross-sectional view of the microphone shown in FIG. 1 taken along line A-A;

fig. 4 is a schematic structural view of an electromagnetic shielding film of the microphone shown in fig. 3;

fig. 5 is a schematic structural diagram of another embodiment of the microphone of the present invention.

[ detailed description ] embodiments

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1 to 4, the microphone includes a circuit board 1, a housing 2 covering the circuit board 1 to form a receiving space a, and an ASIC chip 3 and an MEMS chip 5 received in the receiving space a.

The housing 2 comprises at least two layers of metal shells 21 arranged at intervals and a shielding shell 23 arranged between two adjacent metal shells 21 and arranged at intervals with the metal shells 21. The shell comprises at least two layers of metal shells 21 arranged at intervals and a shielding shell 23 arranged between every two adjacent metal shells 21 and arranged at intervals with the metal shells 21, so that the number and thickness of shielding layers can be increased on the basis of not obviously increasing the height and the volume of the microphone, and a multilayer metal reflection interface and an inter-plate filter capacitor are formed, thereby effectively shielding and filtering the interference of electromagnetic wave radiation.

Each layer of the metal shell 21 may be made of the same metal material, or may be made of different metal materials. In the present embodiment, it is preferable that each layer of the metal shell 21 is made of different metal materials. Since the metal shells 21 are made of different metal materials, the metal shells 21 have shielding bands which are not completely overlapped.

The metal shell 21 and the circuit board 1 may be connected in a surface contact manner or in a point contact manner, and at least one of the metal shells 21 in at least two layers of the metal shells 21 is electrically connected with the circuit board 1 (for example, the metal shells 21 and the circuit board 1 may be electrically connected by a conductive material, laser welding, or the like), or at least two layers of the metal shells 21 are both electrically connected with the circuit board 1 (for example, the metal shells 21 and the circuit board 1 are connected by a non-conductive material).

As shown in fig. 3, the metal case 21 has two layers, and correspondingly, the shield case 23 has one layer. The metal shells 21 are respectively a first metal shell 21a and a second metal shell 21b spaced apart from the first metal shell, and the shielding shell 23 is disposed between the first metal shell 21a and the second metal shell 21b and spaced apart from the first metal shell 21a and the second metal shell 21 b.

The shielding case 23 may be an electromagnetic shielding film or a conductive adhesive. In the present embodiment, the shielding case 23 may be an electromagnetic shielding film.

As shown in fig. 4, the electromagnetic shielding film (i.e., the shielding case 23) includes a carrier film 231, an insulating layer 233, a metal layer 235, an adhesive film layer 237, and a protective layer 239, which are sequentially stacked, and the carrier film 231 is closer to the first metal case 21a than the protective layer 239. It should be noted that the effective shielding band of the electromagnetic shielding film is mainly related to the magnetic permeability, and the material and thickness of the electromagnetic shielding film affect the magnetic permeability, so as to change the effective shielding band, for example, a certain metallized polyethylene fiber conductive paper is taken as the electromagnetic shielding film, and the preferable shielding band is 10MHz-100 MHz.

As shown in fig. 3, the ASIC chip 3 is fixed to the wiring board 1; the MEMS chip 5 divides the accommodating space A into a first sound cavity B and a second sound cavity C, the MEMS chip 5 is fixed on the circuit board 1 and forms the first sound cavity B by enclosing with the circuit board 1, and a sound hole 7 communicated with the first sound cavity B penetrates through the circuit board 1. When external sound waves act on the MEMS chip 5 through the sound hole 7, the MEMS chip 5 generates electric signals, and the electric signals generated by the MEMS chip 5 are output to an external circuit through the ASIC chip 3 and the circuit board 1. It is understood that in other embodiments, the ASIC chip may be fixed to the housing; the MEMS chip can also be fixed on the shell and forms the first sound cavity with the enclosure on the shell in an enclosing way, and the circuit board is provided with a sound hole communicated with the second sound cavity in a penetrating way.

In the embodiment shown in fig. 3, the ASIC chip 3 is electrically connected to the wiring board 1 through a first wire 8, the MEMS chip 5 is electrically connected to the wiring board 1 through a second wire 9, and the first wire 8 and the second wire 9 are electrically connected through a circuit embedded in the wiring board 1. It will be appreciated that in other embodiments, the first conductor may not be provided and the ASIC chip 3 may be electrically connected to the second conductor directly through circuitry embedded in the wiring board 1.

Referring to fig. 5, fig. 5 is a schematic structural diagram of another embodiment of a microphone according to the present invention.

The metal case 21 has three layers, and correspondingly, the shield case 23 has two layers. The metal shells 21 are respectively a first metal shell 21a, a second metal shell 21b spaced from the first metal shell, and a third metal shell 21c spaced from the second metal shell 21b, and the shielding shells 23 are respectively a first shielding shell 23a disposed between the first metal shell 21a and the second metal shell 21b and spaced from the first metal shell 21a and the second metal shell 21b, and a second shielding shell 23b disposed between the second metal shell 21b and the third metal shell 21c and spaced from the second metal shell 21b and the third metal shell 21 c.

In the present embodiment, the first shield shell 23a and the second shield shell 23b have shield wavelength bands that do not completely overlap.

Of course, in other embodiments, the metal shell 21 may also be a metal shell with four layers or even more, and correspondingly, the shielding shell 23 may be three layers or even more; when the number of the shielding cases 23 is at least two, it is preferable that the shielding cases 23 of the respective layers have shielding wavelength bands that do not completely overlap.

Compared with the prior art, the utility model discloses a microphone is through inciting somebody to action shell 2 sets to including the interval set up at least two-layer metal-back 21 and locates adjacent two between the metal-back 21 and with the shielding shell 23 that the metal-back 21 interval set up can increase the number of piles and the thickness of shielding layer and form multilayer metal reflection interface and interplate filter capacitance on the basis of not obviously increasing microphone height and volume to can effectively shield and filtering electromagnetic wave radiation's interference.

The above embodiments of the present invention are only described, and it should be noted that, for those skilled in the art, modifications can be made without departing from the inventive concept, but these all fall into the protection scope of the present invention.

Claims

1. A microphone comprises a circuit board, a shell which is connected with the circuit board in a covering mode to form an accommodating space, and an ASIC chip and an MEMS chip which are accommodated in the accommodating space.

2. The microphone of claim 1, wherein the metal shell is in surface contact with the circuit board.

3. The microphone of claim 1, wherein the metal shell is in point contact with the circuit board.

4. The microphone of claim 2 or 3, wherein at least one of the at least two layers of metal shells is electrically connected to the circuit board.

5. The microphone of claim 2 or 3, wherein at least two layers of the metal shell are both non-electrically connected to the circuit board.

6. The microphone of claim 1, wherein the shielding shell is an electromagnetic shielding film or a conductive adhesive.

7. The microphone of claim 6, wherein the electromagnetic shielding film comprises a carrier film, an insulating layer, a metal layer, an adhesive film layer and a protective layer, which are sequentially stacked.

8. The microphone of claim 6, wherein the at least two metal shells are made of different metal materials.