CN212277182U - Heat radiation structure of illumination power supply management chip - Google Patents
Heat radiation structure of illumination power supply management chip Download PDFInfo
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- CN212277182U CN212277182U CN202021164724.7U CN202021164724U CN212277182U CN 212277182 U CN212277182 U CN 212277182U CN 202021164724 U CN202021164724 U CN 202021164724U CN 212277182 U CN212277182 U CN 212277182U
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- management chip
- heat dissipation
- heat
- heating panel
- inserted sheet
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Abstract
The utility model discloses a heat radiation structure of illumination power supply management chip relates to power management chip technical field, including circuit board, circuit board's upper end surface is provided with the management chip body, the upper end surface of managing the chip body is provided with the heating panel. A lighting power supply manages heat radiation structure of chip, setting through the inserted sheet that dispels heat, the inserted sheet that dispels heat mainly plays the radiating effect to the management chip body when using, can be timely when the inserted sheet heat conduction heat of dispelling heat through heat conduction limit piece when using dispels the heat, be of value to the improvement radiating effect, through the setting of connect slot and connection inserted block, connect slot and connect the inserted block can be according to the in-service use condition to the installation of pegging graft of heat dissipation inserted sheet when using, can install different quantity as required when using, the mountable is in the position of difference on the heating panel, the effect of using is better for traditional mode.
Description
Technical Field
The utility model relates to a power management chip technical field, concretely relates to lighting power management chip's heat radiation structure.
Background
The power management chip is mainly responsible for identifying the power supply amplitude of a CPU (Central processing Unit), generating corresponding short rectangular waves and pushing a rear-stage circuit to output power, and can generate certain heat when the power management chip is used for a long time, and the untimely heat dissipation can cause the burnout of the power management chip, and usually can dissipate heat of a cooling fin arranged on the power management chip.
However, the existing heat dissipation sheet is inconvenient to use, firstly, the existing heat dissipation sheet is single and fixed in structure and cannot be adjusted according to the use condition when in use, and the existing heat dissipation sheet is general in heat dissipation effect and cannot well dissipate heat of the power management chip when in use.
SUMMERY OF THE UTILITY MODEL
A primary object of the present invention is to provide a heat dissipation structure for an illumination power management chip, which can effectively solve the problems of the background art.
In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a lighting power supply manages heat radiation structure of chip, includes circuit board, circuit board's upper end surface is provided with the management chip body, the upper end surface of management chip body is provided with the heating panel, heating panel upper end surface is provided with the heat dissipation inserted sheet, connecting slot has been seted up at the middle part of heating panel, the lower extreme surface of heat dissipation inserted sheet is provided with connects the inserted block, the both sides surface of heat dissipation inserted sheet all is provided with heat conduction limit piece, fixed slot has been seted up to the lower extreme surface of heating panel.
Preferably, a fixing groove is formed between the circuit main board and the management chip body, and the outer surface of the upper end of the circuit main board is detachably connected with the outer surface of the lower end of the management chip body through the fixing groove.
Preferably, heat dissipation inserted sheet and heat conduction limit piece and be connected the inserted block and form through the processing of mechanical equipment, and heat dissipation inserted sheet and heat conduction limit piece and be connected the inserted block structure for integrated into one piece, heat dissipation inserted sheet and heat conduction limit piece and the material of being connected the inserted block are the aluminum alloy material.
Preferably, the heat dissipation plate and the connecting slot are formed by opening mechanical equipment, and the heat dissipation plate and the fixed slot are formed by opening mechanical equipment.
Preferably, the fixed card slot is the same as the management chip body in specification and size, and the connecting slot is the same as the connecting plug block in specification and size.
Preferably, the material of heating panel is the aluminum alloy material, be provided with heat conduction silicone grease between the management chip body and the heating panel, the upper end surface of the management chip body can be dismantled through the internal surface all around of heat conduction silicone grease and heating panel and be connected.
Compared with the prior art, the utility model discloses following beneficial effect has: this a heat radiation structure of illumination power supply management chip, setting through the heat dissipation inserted sheet, the heat dissipation inserted sheet mainly plays the radiating effect to the management chip body when using, can be timely when heat dissipation inserted sheet conduction heat through heat conduction limit piece dispels the heat when using, be of value to improving the radiating effect, through connection slot and the setting of connecting the inserted block, connection slot can peg graft the installation to the heat dissipation inserted sheet according to the in-service use condition with connecting the inserted block when using, can install different quantity as required when using, the mountable is in the position that the heating panel is different, the effect of using is better for traditional mode.
Drawings
Fig. 1 is a schematic diagram of an overall structure of a heat dissipation structure of a lighting power management chip according to the present invention;
fig. 2 is a top view of a heat dissipation plate 3 of a heat dissipation structure of a lighting power management chip according to the present invention;
fig. 3 is a structural diagram of a heat dissipation structure heat dissipation insert 4 of a lighting power management chip of the present invention;
fig. 4 is a bottom view of the heat dissipation plate 3 of the heat dissipation structure of the lighting power management chip of the present invention.
In the figure: 1. a circuit main board; 2. managing the chip body; 3. a heat dissipation plate; 4. a heat dissipation insert; 5. connecting the slots; 6. connecting the plug blocks; 7. a heat conducting edge block; 8. and fixing the clamping groove.
Detailed Description
In order to make the technical means, the creation features, the achievement purposes and the functions of the present invention easy to understand, the present invention will be further explained below with reference to the following embodiments and the accompanying drawings, but the following embodiments are only the preferred embodiments of the present invention, and not all embodiments are included. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative work belong to the protection scope of the present invention.
Specific embodiments of the present invention will be described below with reference to the accompanying drawings.
As shown in fig. 1-4, a heat radiation structure of illumination power supply management chip, including circuit board 1, the upper end surface of circuit board 1 is provided with management chip body 2, the upper end surface of management chip body 2 is provided with heating panel 3, heating panel 3 upper end surface is provided with heat dissipation inserted sheet 4, connecting slot 5 has been seted up at the middle part of heating panel 3, heat dissipation inserted sheet 4's lower extreme surface is provided with connection inserted block 6, heat dissipation inserted sheet 4's both sides surface all is provided with heat conduction limit piece 7, fixed slot 8 has been seted up to heating panel 3's lower extreme surface.
Further, a fixing groove is formed between the circuit main board 1 and the management chip body 2, the outer surface of the upper end of the circuit main board 1 is detachably connected with the outer surface of the lower end of the management chip body 2 through the fixing groove, and the management chip body 2 mainly plays a role in managing and controlling equipment when in use.
Further, heat dissipation inserted sheet 4 forms through the mechanical equipment processing with being connected inserted block 6 with heat conduction limit piece 7, and heat dissipation inserted sheet 4 and heat conduction limit piece 7 with be connected inserted block 6 and be the integrated into one piece structure, heat dissipation inserted sheet 4 and heat conduction limit piece 7 are the aluminum alloy material with the material of being connected inserted block 6, heat dissipation inserted sheet 4 mainly plays the radiating effect to management chip body 2 when using, can be timely when heat dissipation inserted sheet 4 conducts the heat through heat conduction limit piece 7 when using dispels the heat, be of value to the improvement radiating effect.
Further, heating panel 3 and connecting slot 5 are seted up through mechanical equipment and are formed, and heating panel 3 and fixed slot 8 are seted up through mechanical equipment and are formed, and connecting slot 5 can be pegged graft the installation to heat dissipation inserted sheet 4 with connecting plug 6 when using according to the in-service use condition, can install different quantity as required when using, the mountable is in the position of difference on heating panel 3.
Furthermore, fixed slot 8 is the same with the specification and size of management chip body 2, and connection slot 5 is the same with the specification and size of connecting inserted block 6, and fixed slot 8 makes things convenient for heating panel 3 card to put on the surface of management chip body 2 when using, makes its management chip body 2 also contact with heating panel 3 all around, can be better to its radiating effect.
Further, the material of heating panel 3 is the aluminum alloy material, is provided with heat conduction silicone grease between management chip body 2 and the heating panel 3, and the upper end surface of management chip body 2 can be dismantled with the internal surface all around of heating panel 3 through heat conduction silicone grease and be connected, and heat conduction between management chip body 2 and the heating panel 3 is benefited to heat conduction.
It should be noted that, the utility model relates to a heat dissipation structure of lighting power management chip, when using, can put the heating panel 3 card on the surface of the management chip body 2 through the fixed slot 8 first, can paint a layer of heat conduction silicone grease on the management chip body 2 and the heating panel 3 to increase the heat conductivity between the management chip body 2 and the heating panel 3, when using, can insert the connection plug 6 at the lower end of the heat dissipation plug 4 and the connection slot 5 in the heating panel 3, thus the heat dissipation plug 4 is fixed on the heating panel 3, when using, can determine the position of inserting and the quantity of inserting according to the needs of actual conditions, it is convenient when using, when using for a long time, the heat generated by the management chip body 2 can be conducted to the heating panel 3, the heating panel 3 can conduct the heat to the heat dissipation plug 4, the heat dissipation plug 4 is when conducting the heat, the heat is from going up to conduct, and the heat can be quick when passing through heat conduction limit piece 7 dispels, and heat conduction limit piece 7 can be effectual the radiating rate of accelerating heat dissipation inserted sheet 4, is of value to improving the radiating effect, and is comparatively practical.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only preferred examples of the present invention, and is not intended to limit the present invention, and that the present invention can have various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall into the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a heat radiation structure of illumination power management chip, includes circuit mainboard (1), its characterized in that: circuit mainboard (1), the upper end surface of circuit mainboard (1) is provided with the management chip body (2), the upper end surface of the management chip body (2) is provided with heating panel (3), heating panel (3) upper end surface is provided with heat dissipation inserted sheet (4), connecting slot (5) have been seted up at the middle part of heating panel (3), the lower extreme surface of heat dissipation inserted sheet (4) is provided with connects inserted block (6), the both sides surface of heat dissipation inserted sheet (4) all is provided with heat conduction limit piece (7), fixed slot (8) have been seted up to the lower extreme surface of heating panel (3).
2. The heat dissipation structure of a lighting power management chip as set forth in claim 1, wherein: a fixing groove is formed between the circuit main board (1) and the management chip body (2), and the outer surface of the upper end of the circuit main board (1) is detachably connected with the outer surface of the lower end of the management chip body (2) through the fixing groove.
3. The heat dissipation structure of a lighting power management chip as set forth in claim 1, wherein: heat dissipation inserted sheet (4) and heat conduction limit piece (7) and be connected inserted block (6) and form through the processing of mechanical equipment, and heat dissipation inserted sheet (4) and heat conduction limit piece (7) and be connected inserted block (6) and be the integrated into one piece structure, heat dissipation inserted sheet (4) and heat conduction limit piece (7) and the material of being connected inserted block (6) are the aluminum alloy material.
4. The heat dissipation structure of a lighting power management chip as set forth in claim 1, wherein: the heat dissipation plate (3) and the connecting slot (5) are formed by being arranged through mechanical equipment, and the heat dissipation plate (3) and the fixed clamping groove (8) are formed by being arranged through mechanical equipment.
5. The heat dissipation structure of a lighting power management chip as set forth in claim 1, wherein: the fixed clamping groove (8) is the same as the management chip body (2) in specification and size, and the connecting slot (5) is the same as the connecting plug block (6) in specification and size.
6. The heat dissipation structure of a lighting power management chip as set forth in claim 1, wherein: the material of heating panel (3) is the aluminum alloy material, be provided with heat conduction silicone grease between the management chip body (2) and heating panel (3), the upper end surface of the management chip body (2) can be dismantled through the internal surface all around of heat conduction silicone grease and heating panel (3) and be connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021164724.7U CN212277182U (en) | 2020-06-22 | 2020-06-22 | Heat radiation structure of illumination power supply management chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021164724.7U CN212277182U (en) | 2020-06-22 | 2020-06-22 | Heat radiation structure of illumination power supply management chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212277182U true CN212277182U (en) | 2021-01-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021164724.7U Active CN212277182U (en) | 2020-06-22 | 2020-06-22 | Heat radiation structure of illumination power supply management chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212277182U (en) |
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2020
- 2020-06-22 CN CN202021164724.7U patent/CN212277182U/en active Active
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