CN206773626U - A kind of quick heat radiating module - Google Patents

A kind of quick heat radiating module Download PDF

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Publication number
CN206773626U
CN206773626U CN201720350469.7U CN201720350469U CN206773626U CN 206773626 U CN206773626 U CN 206773626U CN 201720350469 U CN201720350469 U CN 201720350469U CN 206773626 U CN206773626 U CN 206773626U
Authority
CN
China
Prior art keywords
installing plate
copper pipe
heat
straight
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201720350469.7U
Other languages
Chinese (zh)
Inventor
阮仕涛
冯木青
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Prafly Technology Co Ltd
Original Assignee
Shenzhen Prafly Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Prafly Technology Co Ltd filed Critical Shenzhen Prafly Technology Co Ltd
Priority to CN201720350469.7U priority Critical patent/CN206773626U/en
Application granted granted Critical
Publication of CN206773626U publication Critical patent/CN206773626U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A kind of quick heat radiating module, for being radiated to processor, including the installing plate that bottom surface is plane, the bottom surface of the installing plate offers the straight-line groove extended along a first direction, there is heat dissipation copper pipe in the straight-line groove, there is at least one copper pipe support being crossed on straight-line groove, copper pipe support clamping heat dissipation copper pipe simultaneously causes heat dissipation copper pipe surface to be abutted with the bottom surface of straight-line groove, and a part for the heat dissipation copper pipe is connected to the sites of heat generation of processor on the installing plate;The installing plate front has the radiating fin that multiple length directions extend in a first direction.The heat that the present apparatus is sent by the heat dissipation copper pipe absorption processor in straight-line groove, heat dissipation copper pipe absorb heat transfer arrive installing plate, then by radiating fin heat transfer into air, this heat radiation module use heat dissipation copper pipe heat transference efficiency it is high the characteristics of.The present apparatus does not need fan active heat removal, has the advantages of noiseless, heat dispersion is good, energy-conserving and environment-protective.

Description

A kind of quick heat radiating module
Technical field
Processor heat sink field is the utility model is related to, particularly a kind of passive mute heat dissipation module.
Background technology
At present, known computer CPU radiator is to add local groups of fins into being adjacent to by fin chassis by fan CPU diverging part, then by fan against fin dry and solve its heat dissipation problem, still, this mode exist locality and The problems such as fan voice is big, while fan is electrical appliance in itself, does not also meet energy-conserving and environment-protective requirement.
Utility model content
To solve the above problems, the utility model provides a kind of quick heat radiating module, this heat radiation module can be complete Jing Yin In the case of, to the effective quick heat radiating of processor.
To achieve the above object, the technical solution adopted in the utility model is:
A kind of quick heat radiating module, for being radiated to processor, including the installing plate that bottom surface is plane, the installing plate Bottom surface offers the straight-line groove extended along a first direction, has heat dissipation copper pipe in the straight-line groove, on the installing plate with across At least one copper pipe support being located on straight-line groove, copper pipe support clamping heat dissipation copper pipe simultaneously cause heat dissipation copper pipe surface and straight line The bottom surface of groove abuts, and a part for the heat dissipation copper pipe is connected to the sites of heat generation of processor;The installing plate front has more The radiating fin that individual length direction extends in a first direction;
As preferable, the both sides of the edge of the installing plate second direction vertical with first direction perpendicular to installing plate simultaneously Extend to the positive direction of installing plate, the edge of the second direction of the installing plate has wall extension, and the installing plate, peace The edge and wall extension of loading board formed it is step-like, and between the edge and wall extension of the second direction of the installing plate formed keep away position Structure.
As preferable, the installing plate and radiating fin are aluminium sheet, and the installing plate and radiating fin one into Type.
As preferable, the longitudinal cross-section of the radiating fin is taper, and its root width is more than top width.
As preferable, the copper pipe support includes the plates being crossed on straight-line groove, and the plates lead to installing plate Cross mode connects for screw.
As preferable, installing plate bottom surface has a bit-avoiding slot, and the installing plate, which corresponds to bit-avoiding slot position and had, to be used to set this The mounting hole of power switch.
As preferable, the area of the installing plate bottom surface and the mainboard size of the installation processor match, and pacify Loading board bottom surface is fitted in mainboard surface.
It is using the beneficial effects of the utility model:
The heat that the present apparatus is sent by the heat dissipation copper pipe absorption processor in straight-line groove, the heat that heat dissipation copper pipe absorbs pass Be delivered to installing plate, then by radiating fin heat transfer into air, this heat radiation module using heat dissipation copper pipe heat transfer imitate The characteristics of rate is high, it can quickly absorb heat caused by radiator.The present apparatus does not need fan active heat removal, has noiseless, scattered The advantages of hot property is good, energy-conserving and environment-protective.
Brief description of the drawings
Fig. 1 is the utility model quick heat radiating module overall structure diagram.
Fig. 2 is the utility model quick heat radiating module back structures schematic diagram.
Fig. 3 is the utility model quick heat radiating module side structure schematic diagram.
Reference includes:
100- installing plate 110- heat dissipation copper pipe 120- copper pipe supports
130- processors installation position 141- bit-avoiding slot 142- power supply mounting holes
143- indicator lamp mounting hole 150- wall extensions 160- keeps away bit architecture
210- radiating fin 300- power knobs are covered on 200-
Embodiment
The utility model is described in detail below in conjunction with accompanying drawing.
As shown in Figure 1-Figure 3, the present embodiment provides a kind of quick heat radiating module, for being radiated to processor, including bottom surface For the installing plate 100 of plane, the bottom surface of installing plate 100 offers the straight-line groove extended along a first direction, has in the straight-line groove There is heat dissipation copper pipe 110, there is at least one copper pipe support 120 being crossed on straight-line groove on bottom plate, the copper pipe support 120 clamps Heat dissipation copper pipe 110 simultaneously causes the surface of heat dissipation copper pipe 110 to be abutted with the bottom surface of straight-line groove, and a part for heat dissipation copper pipe 110 is connected to The sites of heat generation of processor;The front of installing plate 100 has the radiating fin 210 that multiple length directions extend in a first direction.
Specifically, by the installation of this heat radiation module on a processor, there is processor installation position 130 by part so that place The part that reason device produces heat is abutted on heat dissipation copper pipe 110, and heat is passed on installing plate 100 by heat dissipation copper pipe 110, and is led to Cross in the surrounding air of the transmission of radiating fin 210, there is straight-line groove so that heat dissipation copper pipe 110 can in this implementation on installing plate 100 It is placed in straight-line groove, the bottom surface of the side surface of heat dissipation copper pipe 110 1 and installing plate 100 is generally aligned in the same plane interior, copper pipe support 120 Avoid processor position.
The both sides of the edge of the second direction vertical with first direction of installing plate 100 are perpendicular to installing plate 100 and to installing plate 100 positive direction extension, the edge of the second direction of installing plate 100 has wall extension 150, and installing plate 100, installing plate 100 edge and wall extension 150 forms step-like, and is formed between the edge of the second direction of installing plate 100 and wall extension 150 Keep away bit architecture 160.
As described in Figure 3, the conduct of bit architecture 160 that keeps away in the lower section of the position of power knob 300 in the present embodiment is avoided leading Output end interface keeps away bit architecture 160 in front of plate, and to avoid mainboard rear defeated for bit architecture 160 conduct of keeping away installing plate 100 above Go out end interface keeps away bit architecture 160.The area of the bottom surface of installing plate 100 matches with installing the mainboard size of the processor, and The bottom surface of installing plate 100 is fitted in mainboard surface, and when this heat radiation module is arranged on mainboard, the surface of installing plate 100 is fitted in The surface of mainboard, installing plate 100 have the function that to radiate to mainboard.
Installing plate 100 and radiating fin 210 are aluminium sheet, and the installing plate 100 and radiating fin 210 are integrally formed. Radiating fin 210 is integrally formed with installing plate 100, and its heat transfer efficiency is higher.In the present embodiment, the longitudinal direction of radiating fin 210 Section is taper, and its root width is more than top width.
Copper pipe support 120 includes the plates being crossed on straight-line groove, and the plates are connected with installing plate 100 by screw Connect.The bottom surface of installing plate 100 has bit-avoiding slot 141, and the corresponding position of bit-avoiding slot 141 of installing plate 100, which has, to be used to set this power knob 300 power supply mounting hole 142.The corresponding indicator lamp peace that two display computer work states are provided with the side of power supply mounting hole 142 Fill hole 143.
Above content is only preferred embodiment of the present utility model, for one of ordinary skill in the art, according to this reality , in specific embodiments and applications can be so that many changes may be made, as long as these changes are without departing from this with new thought The design of utility model, belongs to the scope of protection of the utility model.

Claims (6)

  1. A kind of 1. quick heat radiating module, for being radiated to processor, it is characterised in that:Including the installing plate that bottom surface is plane, institute The bottom surface for stating installing plate offers the straight-line groove extended along a first direction, has heat dissipation copper pipe, the installation in the straight-line groove There is at least one copper pipe support being crossed on straight-line groove, copper pipe support clamping heat dissipation copper pipe simultaneously causes heat dissipation copper pipe on plate Surface abuts with the bottom surface of straight-line groove, and a part for the heat dissipation copper pipe is connected to the sites of heat generation of processor;The installing plate Front has the radiating fin that multiple length directions extend in a first direction;
    The both sides of the edge of the installing plate second direction vertical with first direction are perpendicular to installing plate and to the front of installing plate Direction extension, the edge of the second direction of the installing plate has a wall extension, and the edge of the installing plate, installing plate and prolongs Stretch wall formed it is step-like, and between the edge and wall extension of the second direction of the installing plate formed keep away bit architecture.
  2. 2. quick heat radiating module according to claim 1, it is characterised in that:The installing plate and radiating fin are aluminium Plate, and the installing plate and radiating fin are integrally formed.
  3. 3. quick heat radiating module according to claim 1, it is characterised in that:The longitudinal cross-section of the radiating fin is cone Shape, its root width are more than top width.
  4. 4. quick heat radiating module according to claim 1, it is characterised in that:The copper pipe support includes being crossed on straight-line groove On plates, the plates are connected by screw with installing plate.
  5. 5. quick heat radiating module according to claim 1, it is characterised in that:The installing plate bottom surface has bit-avoiding slot, institute State installing plate and correspond to bit-avoiding slot position with the mounting hole for being used to set this power switch.
  6. 6. quick heat radiating module according to claim 1, it is characterised in that:The area of the installing plate bottom surface and installation institute The mainboard size for stating processor matches, and installing plate bottom surface is fitted in mainboard surface.
CN201720350469.7U 2017-04-01 2017-04-01 A kind of quick heat radiating module Expired - Fee Related CN206773626U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201720350469.7U CN206773626U (en) 2017-04-01 2017-04-01 A kind of quick heat radiating module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201720350469.7U CN206773626U (en) 2017-04-01 2017-04-01 A kind of quick heat radiating module

Publications (1)

Publication Number Publication Date
CN206773626U true CN206773626U (en) 2017-12-19

Family

ID=60630852

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201720350469.7U Expired - Fee Related CN206773626U (en) 2017-04-01 2017-04-01 A kind of quick heat radiating module

Country Status (1)

Country Link
CN (1) CN206773626U (en)

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20171219

Termination date: 20200401