CN212256333U - Fingerprint side key structure - Google Patents
Fingerprint side key structure Download PDFInfo
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- CN212256333U CN212256333U CN202021836416.4U CN202021836416U CN212256333U CN 212256333 U CN212256333 U CN 212256333U CN 202021836416 U CN202021836416 U CN 202021836416U CN 212256333 U CN212256333 U CN 212256333U
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- key structure
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Abstract
The utility model discloses a fingerprint side key structure, which belongs to the field of fingerprint identification modules and comprises a biological identification chip and a circuit board, wherein the circuit board comprises a hard circuit board and a flexible circuit board, and the hard circuit board is communicated with the flexible circuit board; the biological identification chip is arranged on the upper part of the hard circuit board and is communicated with the hard circuit board, and a decorative layer is also arranged outside the biological identification chip; one side of the flexible circuit board, which is far away from the hard circuit board, is connected with a reinforcing plate, and a packaging layer is arranged between the decorative layer and the biological identification chip; the utility model also provides a manufacturing approach of this fingerprint side key structure, this application is through the optimization to product structure and manufacturing approach, makes product manufacturing process simpler cost lower, adopts independent mould cavity encapsulation, has saved most cutting work, and realizes edge chamfer well, optimizes the touch and feels, has higher commercial value and practical value.
Description
Technical Field
The utility model relates to a fingerprint identification technical field, more specifically say, relate to fingerprint side key structure.
Background
Fingerprint identification technology corresponds a person to his fingerprint, and by comparing his fingerprint with a pre-stored fingerprint, his true identity can be verified. The skin lines of every person (including fingerprints) are different from pattern to pattern, break points and cross points and are unique, and by means of the uniqueness and the stability, the fingerprint identification technology can be created. The skin lines including fingerprints of each person are different from pattern to pattern, break points and cross points, and are unique and invariable throughout the life. Unlike manual processing, common biometric technology companies do not store images of fingerprints directly, but use different digitization algorithms to find and compare features of fingerprints on the fingerprint images. Each fingerprint has several unique and measurable characteristic points, each characteristic point has about 5-7 characteristics, and the ten fingers generate a minimum of 4900 independently measurable characteristics, which is enough to indicate that the fingerprint identification is a more reliable identification mode.
Most of neotype smart machine all are equipped with fingerprint identification's function at present, and most of smart machine set up the fingerprint module in order to make things convenient for the unblock in the front of equipment, and the smart machine that also has a lot of accounts for the ratio sets up the fingerprint module at the back and the side of equipment, and this also provides diversified selection for the consumer.
When the fingerprint side key of prior art production, thereby need adopt the CNC technology to cut the whole manufacturing of accomplishing the discernment module to the chip in its technology, such operation technology is complicated, be CN106914653B name as a cell-phone fingerprint key substrate's cutting process's utility model patent just used the fingerprint key substrate that the cell-phone was made to the CNC technology, although the base plate result of use that finally makes is good, but require high to the processing equipment, require that the CNC equipment need dispose optics and show other system, and require high to the chip composing, because partial product thickness is great, and the material is unfavorable for CNC processing, the CNC cutter life-span is shorter, comprehensive cost is than higher. Meanwhile, edge chamfering cannot be realized well in the process, so that touch feeling cannot be optimized by increasing chamfers.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem that will solve is: the fingerprint side key structure is provided to solve the problems of complex process, high cost and poor hand feeling of the fingerprint side key when the conventional process is used for producing the fingerprint side key;
the utility model discloses another technical problem who solves is: the preparation method of the fingerprint side key structure is simple to operate and does not need complex equipment.
The utility model adopts the technical proposal that: a fingerprint side key structure comprises a biological identification chip and a circuit board, wherein the circuit board comprises a hard circuit board and a flexible circuit board, and the hard circuit board is communicated with the flexible circuit board; the biological identification chip is arranged on the upper part of the hard circuit board and is communicated with the hard circuit board, and a decorative layer is also arranged outside the biological identification chip; one side of the flexible circuit board, which is far away from the hard circuit board, is connected with a reinforcing plate.
Preferably, a packaging layer is further arranged between the decoration layer and the biological identification chip.
Preferably, the hard circuit board specifically includes a first solder resist layer, a first circuit layer, a substrate, a second circuit layer, and a second solder resist layer, which are sequentially arranged from top to bottom.
Preferably, the second circuit layer and the second solder resist layer are retracted compared with the flexible circuit board and the substrate to form glue stopping grooves at two ends.
Preferably, the biological identification chip is connected with the hard circuit board through a gold wire.
As a preferred scheme, the packaging layer is made of epoxy plastic packaging material, and a chamfer and a hanging table are arranged on the packaging layer.
Preferably, the packaging layer wraps the biological identification chip and the gold wire.
Preferably, the hard circuit board is connected and conducted with the flexible circuit board through solder paste, and a connection gap between the hard circuit board and the flexible circuit board is filled with underfill.
Preferably, the chip is connected to the rigid circuit board by a first adhesive, and the reinforcing plate is connected to the flexible circuit board by a second adhesive.
Preferably, the first circuit layer and the second circuit layer are made of copper, the first solder mask layer and the second solder mask layer are made of solder resist ink, the substrate is made of FR4, and the underfill is epoxy resin glue.
Preferably, the chamfer is an R angle or a C angle surrounding the periphery of the package layer, the hanging table is a step surrounding the periphery of the package layer, and the widths of the steps at different positions may be different.
The utility model discloses still provide the manufacturing approach of fingerprint side key structure, including following step:
s1, manufacturing a hard circuit board in array arrangement, and hollowing out two ends of the second circuit layer and the second solder mask layer at two ends of the hard circuit board;
step S2, attaching the biological identification chip on the upper surface of the hard circuit board;
step S3, connecting and conducting the biological recognition chip and the hard circuit board by using a gold thread;
step S4, packaging the upper surface of the hard circuit board by a mould;
step S5, coating a decorative layer on the surface and the side wall of the packaging layer in a spraying mode;
step S6, cutting the hard circuit board by adopting a laser process, and dividing the hard circuit board arranged in an array into single-grain states;
step S7, welding the hard circuit board on the flexible circuit board;
and step S8, performing bottom filling on the connection gap between the hard circuit board and the flexible circuit board.
Preferably, in step S4, the mold is provided with independent cavities, the independent cavities correspond to the chips arranged in the array one to form independent packages, and the mold cavity is provided with a chamfer, so that a chamfer is formed on the package layer.
Compared with the prior art, the utility model does not need to adopt complicated cutting equipment to cut the chip, has lower requirement on the whole chip and does not need to reserve a cutting channel with larger size for the chip; the utility model optimizes the product structure and the manufacturing method, so that the product manufacturing process is simpler and the cost is lower, the independent die cavity is adopted for packaging, most of cutting work is saved, the edge chamfering is well realized, and the touch hand feeling is optimized; the utility model discloses a fingerprint side key device structure is comparatively simple, and the method of making is also easy relatively, and the comprehensive cost is lower, has higher spreading value and use value, is fit for most smart machine uses on the market.
Drawings
FIG. 1 is a schematic illustration of example 2 of the present application;
fig. 2(a) is a front view of a rigid circuit board in an embodiment of the present application;
FIG. 2(b) is a side view of a rigid circuit board in an embodiment of the present application;
FIG. 2(c) is a rear view of a rigid circuit board in an embodiment of the present application;
FIG. 3(a) is a front view of a rigid circuit board after attaching a chip according to an embodiment of the present application;
FIG. 3(b) is a side view of the rigid circuit board after attaching the chip in the embodiment of the present application;
FIG. 4(a) is a front view of a rigid circuit board after gold wire bonding in the embodiment of the present application;
FIG. 4(b) is a side view of the rigid circuit board after gold wire bonding in the embodiment of the present application;
FIG. 5(a) is a front view of a rigid circuit board after packaging in an embodiment of the present application;
FIG. 5(b) is a side view of a rigid circuit board after packaging in an embodiment of the present application;
FIG. 5(c) is a schematic view of a package mold in an embodiment of the present application;
fig. 6(a) is a front view of a hard circuit board after spraying a decorative layer in the embodiment of the present application;
FIG. 6(b) is a side view of the hard circuit board after spraying the decorative layer in the embodiment of the present application;
FIG. 7(a) is a front view of a cutting trace in an embodiment of the present application;
FIG. 7(b) is a schematic diagram of a single hard circuit board after cutting in the embodiment of the present application;
FIG. 8 is a schematic diagram of a rigid circuit board and a flexible circuit board after being soldered according to an embodiment of the present application;
FIG. 9 is a schematic view of example 1 of the present application;
in the figure, 1-a hard circuit board 11-a first solder mask 12-a first circuit layer 13-a substrate 14-a second circuit layer 15-a second circuit layer 2-a chip 3-a first adhesive 4-a gold wire 5-a packaging layer 6-a decorative layer 7-a flexible circuit board 8-a second adhesive 9-a reinforcing plate 100-a chamfer 200-a hanging platform 300-a glue stopping groove 400-a solder paste 500-an underfill 600-a cutting track 700-a mould 701-an independent cavity 702-a cavity chamfer
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1:
as shown in fig. 9, the fingerprint side key structure of the present invention generally includes a decoration layer 6, a biological identification chip 2, a hard circuit board 1, a flexible circuit board 7 and a reinforcement plate 9, which are sequentially arranged from top to bottom; the hard circuit board 1 specifically comprises a first group of welding layers, a first circuit layer 12, a substrate 13, a second circuit layer 14 and a second solder mask layer 15 which are arranged from top to bottom in sequence;
the reinforcing plate 9 sets up in the device bottom, just be connected through second adhesive 8 between the upper surface of reinforcing plate 9 and the lower surface of softness circuit board 7, the upper surface of softness circuit board 7 is connected and switches on with stereoplasm circuit board 1 through tin cream 400, just clearance between softness circuit board 7 and the stereoplasm circuit board 1 (second circuit layer 14) is filled in order to strengthen the joint strength of the two through underfill 500, the top of stereoplasm circuit board 1 is first solder mask 11, the upper surface of first solder mask 11 is provided with biological identification chip 2, specifically, biological identification chip 2 is connected with the upper surface of first solder mask 11 through the first adhesive 3 of lower surface coating to biological identification chip 2 switches on with stereoplasm circuit board 1 through a plurality of gold threads 4.
Example 2:
as shown in fig. 1, the fingerprint side key structure of the present invention generally includes a decoration layer 6, a packaging layer 5, a biological identification chip 2, a hard circuit board 1, a flexible circuit board 7 and a reinforcement plate 9, which are sequentially arranged from top to bottom; the hard circuit board 1 specifically comprises a first group of welding layers, a first circuit layer 12, a substrate 13, a second circuit layer 14 and a second solder mask layer 15 which are arranged in sequence from top to bottom, and two sides of the second circuit layer 14 and the second solder mask layer 15 at the bottom are retracted inwards compared with the shapes of the flexible circuit board 7 and the substrate 13 to form glue stopping grooves 300 at two sides; the packaging layer 5 is made of epoxy plastic packaging material, and the packaging layer 5 is filled between the decorative layer 6 and the biological identification chip 2.
The reinforcing plate 9 sets up in the device bottom, just be connected through second adhesive 8 between the upper surface of reinforcing plate 9 and the lower surface of softness circuit board 7, the upper surface of softness circuit board 7 is connected and switches on with stereoplasm circuit board 1 through tin cream 400, just clearance between softness circuit board 7 and the stereoplasm circuit board 1 (second circuit layer 14) is filled in order to strengthen the joint strength of the two through underfill 500, the top of stereoplasm circuit board 1 is first solder mask 11, the upper surface of first solder mask 11 is provided with biological identification chip 2, specifically, biological identification chip 2 is connected with the upper surface of first solder mask 11 through the first adhesive 3 of lower surface coating to biological identification chip 2 switches on with stereoplasm circuit board 1 through a plurality of gold threads 4.
Still be provided with chamfer 100 and hanging platform 200 on the packaging layer 5, decorative layer 6 wraps up the top surface and the lateral wall of packaging layer 5 completely, and chamfer 100 is for the R angle or the C angle of encircleing 5 appearance a week of packaging layer, and hanging platform 200 is for the step of encircleing 5 appearance a week of packaging layer, and the step width of different positions can be inconsistent, specifically designs according to the demand of reality, and packaging layer 5 wraps up gold thread 4 and biological identification chip 2 completely.
As shown in fig. 2 to 8, the method for manufacturing a side key of a fingerprint of the present invention specifically includes the following steps:
step S1, as shown in fig. 2, firstly, manufacturing the hard circuit board 1 arranged in an array, and hollowing out the second circuit layer 14 and the second solder mask layer 15 at two ends of the hard circuit board 1 to form glue stopping grooves 300 at two sides;
step S2, as shown in fig. 3, attaching the biometric chip 2 to the upper surface of the hard circuit board 1, i.e. the upper surface of the first solder mask layer 11;
step S3, as shown in fig. 4, connecting and connecting the biometric identification chip 2 and the hard circuit board 1 by gold wires 4;
step S4, as shown in fig. 5, a mold 700 is used to encapsulate the upper surface of the hard circuit board 1, an independent cavity 701 is provided on the mold 700, the independent cavity 701 corresponds to the biological identification chips 2 arranged in an array one by one to form an independent encapsulation, and a cavity chamfer 702 is provided in the cavity of the mold 700, so that a chamfer 100 is formed on the encapsulation layer 5;
step S5, as shown in fig. 6, coating the decorative layer 6 on the surface and the sidewall of the packaging layer 5 by spraying;
step S6, as shown in fig. 7, cutting the hard circuit board 1 by using a laser process, and dividing the hard circuit board 1 arranged in an array into single pieces, wherein a cutting track 600 is shown in fig. 7(a) (b);
step S7, as shown in fig. 8, soldering the hard circuit board 1 to the flexible circuit board 7;
step S8, as shown in fig. 8, bottom filling is performed on the connection gap between the rigid circuit board 1 and the flexible circuit board 7 to complete the fixation of the two;
after the above processes are completed, the manufacturing of the fingerprint side key structure is finished after the adhesive and the underfill 500 are dried.
While the above is directed to the preferred embodiment of the present invention, it is not intended that it be limited, except as by the appended claims. The present invention is not limited to the above embodiments, and the specific structure thereof allows for changes, all the changes made within the protection scope of the independent claims of the present invention are within the protection scope of the present invention.
Claims (10)
1. The utility model provides a fingerprint side key structure, includes biological identification chip and circuit board, its characterized in that: the circuit board comprises a hard circuit board and a flexible circuit board, and the hard circuit board is communicated with the flexible circuit board; the biological identification chip is arranged on the upper part of the hard circuit board and is communicated with the hard circuit board, and a decorative layer is also arranged outside the biological identification chip; one side of the flexible circuit board, which is far away from the hard circuit board, is connected with a reinforcing plate.
2. A fingerprint side key structure according to claim 1, wherein: and a packaging layer is also arranged between the decorative layer and the biological identification chip.
3. A fingerprint side key structure according to claim 1, wherein: the hard circuit board specifically comprises a first solder mask layer, a first circuit layer, a substrate, a second circuit layer and a second solder mask layer which are sequentially arranged from top to bottom.
4. A fingerprint side key structure according to claim 2, wherein: the biological identification chip is conducted with the hard circuit board through a gold thread, and the packaging layer wraps the biological identification chip and the gold thread.
5. A fingerprint side key structure according to claim 2, wherein: the material of packaging layer is epoxy plastic envelope material, just be provided with chamfer and string platform on the packaging layer.
6. The side key structure of fingerprint according to claim 5, wherein: the chamfer is the R angle or the C angle of encircleing packaging layer appearance a week, the string platform is the step of encircleing packaging layer appearance a week.
7. A fingerprint side key structure according to claim 3, wherein: the first circuit layer and the second circuit layer are made of copper, and the first solder mask layer and the second solder mask layer are made of solder resist ink.
8. A fingerprint side key structure according to claim 3, wherein: the second circuit layer and the second solder mask layer are retracted compared with the flexible circuit board and the substrate to form glue stopping grooves at two ends.
9. A fingerprint side key structure according to claim 1, wherein: the biological identification chip is connected with the hard circuit board through a first adhesive, and the reinforcing plate is connected with the flexible circuit board through a second adhesive.
10. A fingerprint side key structure according to claim 1, wherein: the hard circuit board is connected and conducted with the flexible circuit board through solder paste, and a connecting gap between the hard circuit board and the flexible circuit board is filled with underfill.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021836416.4U CN212256333U (en) | 2020-08-28 | 2020-08-28 | Fingerprint side key structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021836416.4U CN212256333U (en) | 2020-08-28 | 2020-08-28 | Fingerprint side key structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212256333U true CN212256333U (en) | 2020-12-29 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021836416.4U Active CN212256333U (en) | 2020-08-28 | 2020-08-28 | Fingerprint side key structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212256333U (en) |
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2020
- 2020-08-28 CN CN202021836416.4U patent/CN212256333U/en active Active
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