CN212240562U - Cleaning device for grinding disc and grinding equipment - Google Patents
Cleaning device for grinding disc and grinding equipment Download PDFInfo
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- CN212240562U CN212240562U CN202020892125.0U CN202020892125U CN212240562U CN 212240562 U CN212240562 U CN 212240562U CN 202020892125 U CN202020892125 U CN 202020892125U CN 212240562 U CN212240562 U CN 212240562U
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Abstract
The utility model provides a cleaning device and grinding apparatus of abrasive disc, cleaning device are used for cleaning the slot of abrasive disc, cleaning device includes first receipts and releases line driver, second receipts and releases line driver and clean line, the both ends of clean line respectively with first receipts and releases the line driver with the second receives and releases the line driver and links to each other, just clean line can first receipts and releases the line driver and/or follow under the drive of second receipts and releases the line driver the slot removes with the cleanness the slot. Therefore, in the embodiment of the utility model provides an in, through setting up clean line to utilize first receipts and releases line driver and second to receive and release line driver and drive clean line, thereby remove along the slot and realize utilizing clean line to clean the slot of abrasive disc, reduced the possibility of fish tail abrasive disc, help improving the convenience of clean abrasive disc.
Description
Technical Field
The utility model relates to a semiconductor processing technology field especially relates to a cleaning device and grinding device of abrasive disc.
Background
In the semiconductor processing process, the monocrystalline silicon is required to be cut into silicon wafers, and the silicon wafers are further processed into high-surface-quality polished wafers or epitaxial-grown original wafers, so that the process difficulty is reduced for subsequent photoetching and other procedures, and the quality of produced chips is ensured. After wire cutting, the surface of the silicon wafer has wire marks and microcracks, and a double-sided grinding process is generally adopted to reduce or eliminate surface damage, so that the burden of a subsequent production process is reduced. The existing double-sided grinding is generally carried out by using a double-sided grinding machine, the double-sided grinding machine generally comprises two oppositely arranged grinding discs, one grinding disc is fixed and the other grinding disc rotates around the axis of the grinding disc during the use process, so that a silicon wafer positioned between the two grinding discs is ground.
During the grinding process, it is necessary to provide an abrasive, which is usually a mixture of solid particles such as alumina and silica, and a liquid such as water, during the processing process, the abrasive will be discharged from the grooves on the grinding disc, however, the abrasive may be dehydrated during the processing process, so that a part of the solid particles are deposited in the grooves, and these deposited particles will cause the depth of the grooves to become shallow, thereby affecting the subsequent discharge of the abrasive.
In view of these problems, the existing processing method is usually to manually clean the grooves on the grinding disc by an operator with a blade or the like, but this method is time-consuming and labor-consuming, and may cause damage to the surface of the grinding disc, so that the cleaning of the existing grinding disc is inconvenient.
SUMMERY OF THE UTILITY MODEL
An embodiment of the utility model provides a cleaning device and grinding device of abrasive disc to solve the clean comparatively inconvenient problem of current abrasive disc.
In order to solve the technical problem, the utility model discloses a realize like this:
in a first aspect, an embodiment of the present invention provides a cleaning device for an abrasive disc, which is characterized in that, the groove is used for cleaning the abrasive disc, the cleaning device includes a first wire winding and unwinding driver, a second wire winding and unwinding driver and a cleaning wire, two ends of the cleaning wire are respectively connected to the first wire winding and unwinding driver and the second wire winding and unwinding driver, and the cleaning wire can be driven by the first wire winding and unwinding driver and/or the second wire winding and unwinding driver to be followed by the groove to move so as to clean the groove.
Optionally, the polishing device further comprises a pressure plate, the pressure plate is arranged towards the surface of the polishing disc with the groove, and the pressure plate is used for applying pressure towards the direction of the polishing disc to the cleaning line.
Optionally, be provided with a plurality of pressure heads on the pressure disk, each the pressure head orientation the grinding miller setting, the pressure head all is connected with drive arrangement transmission, just drive arrangement is used for adjusting the pressure head with the pressure disk is along the pressure disk is to the ascending distance of grinding miller.
Optionally, a distance sensor is further arranged on the pressure plate, and the distance sensor is used for detecting the distance between the groove of the grinding plate and the pressure plate.
Optionally, the wire winding and unwinding device further comprises a synchronous controller, and the synchronous controller is electrically connected with the first wire winding and unwinding driver and the second wire winding and unwinding driver respectively.
Optionally, the first take-up and pay-off driver comprises a first driving motor and a first reel, wherein the first driving motor is used for driving the first reel to rotate around an axis of the first reel so as to wind the cleaning wire on the first reel or release the cleaning wire wound on the first reel; and/or
The second take-up and pay-off driver comprises a second driving motor and a second wire wheel, and the second driving motor is used for driving the second wire wheel to rotate around the axis of the second wire wheel so as to wind the cleaning wire on the second wire wheel or release the cleaning wire wound on the second wire wheel.
Optionally, the first take-up and pay-off line driver and/or the second take-up and pay-off line driver further comprises a guide wheel for adjusting the extending direction of the cleaning line.
Optionally, the cleaning wire is a steel wire rope.
Optionally, the surface of the steel wire rope is provided with a pattern surrounding the axial direction of the steel wire rope.
In a second aspect, the embodiment of the present invention provides a grinding apparatus, including a grinding plate, a groove has been opened on the grinding plate, the grinding apparatus further includes any one of the above cleaning devices for the grinding plate.
Therefore, in the embodiment of the utility model provides an in, through setting up clean line to utilize first receipts and releases line driver and second to receive and release line driver and drive clean line, thereby remove along the slot and realize utilizing clean line to clean the slot of abrasive disc, reduced the possibility of fish tail abrasive disc, help improving the convenience of clean abrasive disc.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive labor.
FIG. 1A is a schematic view of an abrasive disk;
FIG. 1B is a schematic view of another alternative abrasive disk configuration;
FIG. 1C is a schematic view of another alternative abrasive disk configuration;
fig. 2 is a schematic structural view of a cleaning device for an abrasive disk according to an embodiment of the present invention;
fig. 3A is a schematic structural diagram of a platen according to an embodiment of the present invention;
FIG. 3B is a further perspective view of FIG. 3A;
fig. 4 is a schematic view illustrating a cleaning state of the polishing disc according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, of the embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
The utility model provides a cleaning device of abrasive disc 100 for clean abrasive disc 100's slot.
As shown in fig. 1A, fig. 1B and fig. 1C, fig. 1A to fig. 1C are schematic structural diagrams of an abrasive disc 100, and taking the abrasive disc 100 shown in fig. 1A as an example, the abrasive disc 100 is in transmission connection with a sun gear 110 to achieve the grinding of an article to be ground.
The grinding disc 100 is provided with a groove 120, the groove 120 is used for draining the grinding fluid during the grinding process, however, the grinding fluid may lose water, causing solid particles to deposit in the groove 120, and the ground solid particles may also deposit in the groove 120, which is collectively referred to as solid residue in this embodiment.
As shown in fig. 2, in one embodiment, the cleaning device includes a first take-up and pay-off line driver, a second take-up and pay-off line driver, and a cleaning line 500, both ends of the cleaning line 500 are connected to the first take-up and pay-off line driver and the second take-up and pay-off line driver, respectively, and the cleaning line 500 can move along the groove 120 by the first take-up and pay-off line driver and/or the second take-up and pay-off line driver to clean the groove 120.
In this embodiment, the cleaning wire 500 may be a steel wire rope, a steel wire, or the like, and since the residue in the groove 120 of the grinding disc 100 is mainly solid particles such as alumina, silica, or the like, the cleaning wire 500 needs to have certain strength and friction to clean the solid residue in the groove 120.
Further, in one embodiment, the surface of the steel cord is roughened, for example, by providing a pattern around the axis of the steel cord on the surface of the steel cord, so as to increase the friction between the steel cord and the solid residue, thereby improving the removal effect of the solid residue.
The first and second take-up and pay-off drivers are used for driving the cleaning wire 500 to move. Taking the structure of the first wire take-up and pay-off driver as an example, in one embodiment, the wire take-up and pay-off driver includes a driving member and a wire wheel, and specifically, a motor or the like can be used as the driving member to drive the wire wheel to rotate so as to take up and pay off, where take-up refers to winding the cleaning wire 500 on the wire wheel, and pay-off refers to driving the wire to rotate in the take-up direction, so that the length of the cleaning wire 500 not wound on the wire wheel can be increased.
Specifically, as shown in fig. 2, the first take-up and pay-off line driver includes a first driving motor 200 and a first reel 210, and the first driving motor 200 drives the first reel 210 to rotate around its axis through a first driving belt 230 to wind the cleaning line 500 on the first reel 210 or release the cleaning line 500 wound on the first reel 210. The second wire take-up and pay-off driver has a structure similar to that of the first wire take-up and pay-off driver, and includes a second driving motor 300 and a second wire wheel 310, wherein the second driving motor 300 drives the second wire wheel 310 to rotate around its axis through a second driving belt 330 so as to wind the cleaning wire 500 on the second wire wheel 310 or release the cleaning wire 500 wound on the second wire wheel 310.
In addition, the first wire drawing and releasing driver and the second wire drawing and releasing driver may further include guide wheels 220 and 320 to adjust the extending direction of the cleaning wire 500.
Obviously, the specific structure of the first take-up and pay-off driver and the second take-up and pay-off driver is not limited thereto as long as the take-up and pay-off functions can be realized.
Thus, in the embodiment of the present invention, through setting up the cleaning wire 500, and utilize the first line driver of receiving and releasing and the second line driver of receiving and releasing to drive the cleaning wire 500, thereby it is clean to utilize the groove 120 of cleaning wire 500 to the abrasive disc 100 to realize along the removal of slot 120, has reduced the possibility of fish tail abrasive disc 100, helps improving the convenience of clean abrasive disc 100.
Optionally, the cleaning device for the polishing disc 100 further includes a pressure plate disposed toward the surface of the polishing disc 100 where the groove 120 is opened, and the pressure plate is configured to apply a pressure to the cleaning wire 500 in a direction toward the polishing disc 100.
It should be understood that the connection strength between the part of the solid residue in the groove 120 and the abrasive disk 100 is strong, and it is difficult to effectively clean the solid residue by only the cleaning wire 500, therefore, in the present embodiment, a pressure plate is further provided, which can apply a pressure to the cleaning wire 500 in the direction toward the abrasive disk 100, as the friction force f is equal to the friction coefficient μmultiplied by the positive pressure N, the friction coefficient between the cleaning wire 500 and the solid residue is fixed, and the friction force between the cleaning wire 500 and the solid residue can be increased by increasing the positive pressure by using the pressure plate, so that the residue in the groove 120 can be more easily removed, which helps to improve the cleaning effect on the groove 120.
In an alternative embodiment, a plurality of pressing heads are disposed on the pressing plate 600, each pressing head is disposed toward the grinding plate 100, and each pressing head is in transmission connection with a driving device, wherein the driving device can be an air cylinder or an oil cylinder, and the driving device is used for adjusting the distance between the pressing head and the pressing plate 600 in the direction from the pressing plate 600 to the grinding plate 100.
It should be appreciated that the amount of solid residue varies for different regions of the abrasive disc 100, and therefore, the present embodiment further provides a platen 600 including a plurality of pressure heads to selectively adjust the pressure applied to each region, thereby reducing the possibility of scratching the abrasive disc 100 in regions with less solid residue due to excessive pressure between the cleaning line 500 and the abrasive disc 100.
Further, in one embodiment, a distance sensor 610 is disposed on the platen 600, and the distance sensor 610 is used for detecting the distance between the groove 120 of the grinding disc 100 and the platen 600.
It should be understood that, under the same conditions, the more residue in the groove 120, the smaller the distance between the groove 120 and the platen 600, and the distance sensor 610 is provided in this embodiment to detect the distance between the groove 120 and the platen 600 support, and the controller 620 is further used to control and adjust the position of each pressure head, so as to help reduce the possibility that the cleaning wire 500 will scratch the abrasive disc 100 due to excessive pressure.
It should be understood that the distance sensor 610 may be selected from a photoelectric sensor, an ultrasonic sensor, and the like for measuring distance, and is not further limited herein.
Optionally, a synchronous controller 400 is further included, the synchronous controller 400 is electrically connected to the first wire take-up and pay-off driver and the second wire take-up and pay-off driver respectively, and the synchronous controller 400 is configured to control the first wire take-up and pay-off driver and the second wire take-up and pay-off driver to drive the cleaning wire 500 to move at the same speed.
The synchronous controller 400 is used for controlling the first take-up and pay-off line driver and the second take-up and pay-off line driver to synchronously rotate, so that the length of the cleaning line 500 between the first take-up and pay-off line driver and the second take-up and pay-off line driver is certain in the using process, the phenomenon that the tightening degree of the cleaning line 500 is changed due to the length change of the cleaning line 500 between the first take-up and pay-off line driver and the second take-up and pay-off line driver is avoided, and the influence possibly caused on the cleaning effect is reduced.
The utility model also provides a grinding device, including the abrasive disc, the slot has been seted up on the abrasive disc, grinding device still includes above arbitrary cleaning device of abrasive disc.
Since the technical solution of this embodiment includes all the technical solutions of the above-mentioned cleaning device for an abrasive disc, at least all the technical effects can be achieved, and details are not described here.
Next, a method of using the cleaning device for an abrasive disk will be further described.
When the cleaning device is implemented, under the condition that the cleaning wire penetrates through the groove of the grinding disc and two ends of the cleaning wire are respectively connected with the first take-up and pay-off driver and the second take-up and pay-off driver, one of the first take-up and pay-off driver and the second take-up and pay-off driver is controlled to take up the wire and the other one is controlled to pay off the wire, so that the cleaning wire moves in the groove along the extending direction of the groove to clean the groove.
In the using process, under the condition that the cleaning wire 500 penetrates through the groove 120 of the grinding disc 100 and the two ends of the cleaning wire 500 are respectively connected with the first take-up and pay-off driver and the second take-up and pay-off driver, one of the first take-up and pay-off driver and the second take-up and pay-off driver is controlled to take up the wire, and the other one of the first take-up and pay-off driver and the second take-up and pay-off driver is controlled to drive the cleaning wire 500 to move along the groove 120, so that the residues in the groove 120 are removed through the cleaning wire 500.
Optionally, the controlling one of the first take-up and pay-off driver and the second take-up and pay-off driver to take up wires and before the other one of the first take-up and pay-off drivers pays off wires further includes:
securing a first end of the cleaning wire to the first take-up and pay-off wire drive;
controlling the second ends of the cleaning wires to sequentially penetrate through the grooves;
securing a second end of the cleaning wire to the second take-up and pay-off wire drive;
and controlling the second take-up and pay-off driver to take up the cleaning wire so as to tighten the cleaning wire.
When the cleaning wire is used, one end of the cleaning wire 500 can be fixed on one wire wheel of one wire take-up and pay-off driver, then the other end of the cleaning wire 500 sequentially penetrates through the grooves 120, then the other end of the cleaning wire 500 is fixed on the other wire wheel, and finally, one of the wire take-up and pay-off drivers is controlled to rotate to tighten the cleaning wire 500.
Referring to fig. 1A and 2, in the polishing disc 100 shown in fig. 1A, one end of the cleaning wire 500 is fixed on the second wire wheel 310, and then the other end of the cleaning wire 500 is threaded in from the position No. 1, threaded out from the position No. 2, threaded in from the position No. 3, threaded out from the position No. 4, … …, and so on, and finally threaded out from the position No. 36 and fixed on the first wire wheel 210, so that the second driving motor 300 is controlled to tighten the cleaning wire 500.
As shown in fig. 4, the thick lines in fig. 4 represent trenches through which the cleaning lines 500 are formed, so that the thick line trenches 120 shown in fig. 4 can be cleaned in one cleaning process.
After the cleaning of the grooves 120 is completed, the cleaning wire 500 is inserted into other grooves 120 for cleaning again, for example, the polishing disc 100 may be rotated by 90 degrees to adjust the direction of the grooves 120, and then the cleaning wire 500 is inserted into the longitudinal grooves 120 for cleaning, and this is repeated for a plurality of times until finally the cleaning of all the grooves 120 can be realized.
For other shapes of abrasive discs 100, such as the abrasive disc 100 shown in fig. 1B or fig. 1C, it is sufficient to selectively adjust the winding pattern of the cleaning wires 500 to pass through the grooves 120.
In practice, cleaning of each groove 120 on the abrasive disk 100 may be accomplished by one or more cleaning operations depending on the shape of the abrasive disk 100 and the distribution of the grooves 120.
Alternatively, when the method for cleaning the abrasive disc 100 is applied to the cleaning apparatus for the abrasive disc 100 including the pressure distance sensor 610, the controlling one of the first take-up and pay-off line driver and the second take-up and pay-off line driver to take up the wire and the other to pay off the wire includes:
the distance between the platen 600 and the groove 120 is detected by the distance sensor 610, and the pressure head is driven by the driving device to move closer to the grinding plate 100, wherein the distance between the pressure head and the grinding plate 100 decreases as the distance between the groove 120 and the platen 600 decreases.
In this embodiment, the pressure between the cleaning wire 500 and the polishing disk 100 is adjusted by the platen 600 during the movement of the cleaning wire 500 by the take-up and pay-off wire driver.
Specifically, if the distance sensor 610 detects that the distance between the platen 600 and the groove 120 is smaller, it proves that the solid residue at the position is more, and at this time, the driving ram is moved in a direction to approach the abrasive disk 100 to apply a greater pressure to the cleaning wire 500, thereby increasing the friction between the cleaning wire 500 and the residue, and improving the cleaning effect on the solid residue.
Optionally, the controlling one of the first take-up and pay-off driver and the second take-up and pay-off driver to take up and pay off the other one of the first take-up and pay-off driver and the second take-up and pay-off driver includes:
controlling the first take-up and pay-off driver to take up wires at a first speed, and controlling the second take-up and pay-off driver to pay off wires at the first speed for a first time length;
controlling the first take-up and pay-off driver to take up wires at a second speed, and controlling the second take-up and pay-off driver to pay off wires at the second speed, wherein the first speed is lower than the second speed and lasts for a second time length;
controlling the first pay-off and take-up driver to pay off at a third speed, and controlling the second pay-off and take-up driver to take up at the third speed for a third time;
and after a third time length, controlling the first wire take-up and pay-off driver to pay off at a fourth speed, and controlling the second wire take-up and pay-off driver to take up at the fourth speed, wherein the third speed is lower than the fourth speed and lasts for a fourth time length.
It can be understood that, during the cleaning process, the cleaning wire 500 is first controlled to move at a low speed in one direction to ensure whether the cleaning wire 500 is firmly connected, if there is no problem, the moving speed of the cleaning wire 500 is increased to clean each groove 120, and after the cleaning is continued for a certain period of time, the cleaning wire 500 is controlled to gradually decelerate until it stops. Next, the cleaning wire 500 is controlled to move reversely, and similarly to the previous process, the cleaning wire 500 is controlled to move at a low speed to ensure that the cleaning wire 500 is connected firmly and no abnormal condition such as wire breakage occurs, the cleaning wire 500 is controlled to accelerate, and after the cleaning is continued for a period of time, the cleaning wire 500 is controlled to decelerate gradually until the cleaning wire stops.
In practice, the moving speed of the cleaning line may be set according to practical situations, for example, the first speed may be set to 1 meter per minute, and the second speed may be set to 50 meters per minute, but is not limited thereto.
In this way, the cleaning wire 500 is controlled to operate at a low speed to detect whether there is a malfunction, and then, by controlling the cleaning wire 500 to operate at a high speed, the cleaning effect can be improved, and at the same time, by controlling the cleaning wire 500 to reciprocate, it is helpful to further improve the cleaning effect on the grooves 120 on the abrasive disc 100.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. The cleaning device for the grinding disc is characterized by comprising a first take-up and pay-off driver, a second take-up and pay-off driver and a cleaning wire, wherein two ends of the cleaning wire are respectively connected with the first take-up and pay-off driver and the second take-up and pay-off driver, and the cleaning wire can move along the groove under the driving of the first take-up and pay-off driver and/or the second take-up and pay-off driver so as to clean the groove.
2. The apparatus according to claim 1, further comprising a platen disposed toward a surface of the abrasive disk on which the grooves are opened, the platen being configured to apply a pressure to the cleaning wire in a direction toward the abrasive disk.
3. The abrasive disk cleaning apparatus according to claim 2, wherein a plurality of pressing heads are provided on the pressing plate, each of the pressing heads is disposed toward the abrasive disk, the pressing heads are each drivingly connected to a driving device, and the driving device is configured to adjust a distance between the pressing head and the pressing plate in a direction from the pressing plate to the abrasive disk.
4. The abrasive disk cleaning apparatus according to claim 3, wherein a distance sensor is further provided on the platen for detecting a distance between the grooves of the abrasive disk and the platen.
5. The cleaning device for an abrasive disk according to any one of claims 1 to 4, further comprising a synchronization controller electrically connected to the first take-up and pay-off line driver and the second take-up and pay-off line driver, respectively.
6. The cleaning device for the abrasive disk according to any one of claims 1 to 4, wherein the first take-up and pay-off line driver comprises a first driving motor and a first pulley, the first driving motor being for driving the first pulley to rotate about its axis to wind the cleaning wire on the first pulley or to release the cleaning wire wound on the first pulley; and/or
The second take-up and pay-off driver comprises a second driving motor and a second wire wheel, and the second driving motor is used for driving the second wire wheel to rotate around the axis of the second wire wheel so as to wind the cleaning wire on the second wire wheel or release the cleaning wire wound on the second wire wheel.
7. An abrasive disk cleaning device as claimed in claim 6, wherein said first take-up and pay-off line driver and/or said second take-up and pay-off line driver further comprises a guide wheel for adjusting the extending direction of said cleaning line.
8. The cleaning apparatus for an abrasive disk according to claim 1, wherein the cleaning wire is a wire rope.
9. The apparatus for cleaning an abrasive disc as claimed in claim 8, wherein the surface of the wire rope is provided with a pattern around an axial direction of the wire rope.
10. A grinding apparatus comprising a grinding disc having grooves formed therein, the grinding apparatus further comprising a cleaning device for the grinding disc of any one of claims 1 to 9.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020892125.0U CN212240562U (en) | 2020-05-25 | 2020-05-25 | Cleaning device for grinding disc and grinding equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202020892125.0U CN212240562U (en) | 2020-05-25 | 2020-05-25 | Cleaning device for grinding disc and grinding equipment |
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| CN212240562U true CN212240562U (en) | 2020-12-29 |
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| CN202020892125.0U Active CN212240562U (en) | 2020-05-25 | 2020-05-25 | Cleaning device for grinding disc and grinding equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117260526A (en) * | 2023-10-31 | 2023-12-22 | 南通星维海威精密机械有限公司 | Grinding equipment and grinding method for pressure valve |
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2020
- 2020-05-25 CN CN202020892125.0U patent/CN212240562U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117260526A (en) * | 2023-10-31 | 2023-12-22 | 南通星维海威精密机械有限公司 | Grinding equipment and grinding method for pressure valve |
| CN117260526B (en) * | 2023-10-31 | 2024-06-14 | 南通星维海威精密机械有限公司 | Grinding equipment and grinding method for pressure valve |
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