CN212209450U

CN212209450U - Semiconductor test machine and stitching device of needle measuring machine

Info

Publication number: CN212209450U
Application number: CN202021018909.7U
Authority: CN
Inventors: 卞杰锋
Original assignee: Suzhou Fullway Electronic Technology Co ltd
Current assignee: Suzhou Fullway Electronic Technology Co ltd
Priority date: 2020-06-05
Filing date: 2020-06-05
Publication date: 2020-12-22
Anticipated expiration: 2030-06-05

Abstract

The utility model discloses a semiconductor testing machine and stitching device of needle testing machine, which comprises a testing carrier, a testing groove, a guiding chute, a moving block, a transverse telescopic rod, a longitudinal telescopic rod and a pressure plate, when a semiconductor boat testing work is needed, firstly, the boat to be tested can be placed in the testing groove, according to the different needs of the actual boat type, the moving block is pushed by manpower to move to the position corresponding to the four corners of the boat in the guiding chute, then the horizontal distance of the pressure plate is adjusted in real time by the transverse telescopic rod, so that the pressure plate can be just opposite to the position above the corners of the boat, the longitudinal distance of the pressure plate is adjusted by the longitudinal telescopic rod, the pressure plate can be contacted and fixed with the corners of the boat, the boat displacement caused by the equipment shaking in the testing process is avoided, the testing effect is influenced, and simultaneously, the stitching device can be suitable for the boat testing of different types and specifications, the efficiency of device use is improved.

Description

Semiconductor test machine and stitching device of needle measuring machine

Technical Field

The utility model relates to a semiconductor test technical field specifically is a semiconductor test machine and needle testing machine's compression fittings.

Background

A probe testing machine used in wafer testing in the semiconductor production and manufacturing process is used for transforming a wafer boat bearing table of a probe testing wafer transmission mechanism, and is divided into two parts in terms of appearance; one is the main body of the machine, another is the chip transmission mechanism and its name is the main operation part, the main body part places the wafer and the probe card under the testing head of the tester for testing, and the main work of the wafer transmission mechanism is to transmit the wafer in the wafer boat to the carrier for testing, the production and manufacture of the semiconductor forms a perfect production flow in the continuous development, generally, the chip circuit design-the wafer manufacture-the wafer test-the wafer cutting and grinding-the chip packaging-the finished chip test, in the semiconductor production and manufacture process, the wafer test is especially important for the cost control of the chip, the wafer test can find out the chip with function defect, not enter the later stage of the packaging with larger cost, save the whole cost, and provide the improved direction for the former process-the wafer manufacture, therefore, the wafer test is an essential important link in the whole manufacturing process of the semiconductor, the wafer test equipment is changed from manual operation to semi-automatic operation, and then the wafer test equipment is changed to the existing full-automatic probe tester, and the efficiency, the stability and the safety are all improved in multiples.

The wafer all bears in the wafer boat box in whole manufacturing process, and a wafer boat is a batch, and a box bears 25 wafers usually, and well time measuring puts the wafer boat on the wafer boat plummer of needle measuring board, and this step is all by manual operation, and when personnel placed the wafer on toward the plummer, often can take place to place the not in place condition, perhaps equipment rocks and also can lead to the wafer to take place the skew in the test process to influence the whole effect of test.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor test machine and stitching device of machine is surveyed to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides a stitching device of semiconductor test machine and needle measuring machine, includes the test microscope carrier, test groove has been seted up at the top of test microscope carrier, the direction spout has all been seted up to the both sides of test groove, the inboard all slidable mounting of direction spout has the movable block, the rotation hole has all been seted up at the top of movable block, the inboard all activity grafting in rotation hole has the pole setting, top one side fixed mounting of pole setting has horizontal telescopic link, the bottom of horizontal telescopic link all fixed mounting has vertical telescopic link, the bottom of vertical telescopic link all fixed mounting has the pressure disk.

As a further aspect of the present invention: four corners of the bottom of the test loading platform are all provided with adsorption grooves, and the inner sides of the adsorption grooves are all fixedly provided with suckers.

As a further aspect of the present invention: the test groove penetrates through the movable mounting with the inner wall of the vertical direction of the guide chute and is provided with an adjusting rod, the surface of the adjusting rod and the inner wall of the penetrating position of the guide chute are provided with threads, one end, opposite to the adjusting rod, of the adjusting rod is movably provided with a rotating shaft, one end, opposite to the rotating shaft, of the clamping plate is fixedly provided with the clamping plate, and the width of the clamping plate is the same as that of the test groove.

As a further aspect of the present invention: the relative side surface of grip block all pastes and is provided with the conflict pad, and the material of conflict pad is for having the elastic rubber material of good shrink.

As a further aspect of the present invention: the number of the moving blocks arranged in the guide sliding groove is two.

As a further aspect of the present invention: the outer end of the adjusting rod is fixedly provided with an adjusting knob, and the outer edge of the adjusting knob is provided with anti-skid grains.

Compared with the prior art, the beneficial effects of the utility model are that:

1. when semiconductor wafer boat test work is required to be carried out, at first, the wafer boat to be tested can be placed inside the test slot, according to the different requirements of the model specifications of the actual wafer boat, the movable block is pushed manually to move to the position corresponding to the four corners of the wafer boat inside the guide sliding groove, then the horizontal distance of the pressure plate is adjusted in real time through the transverse telescopic rod, the pressure plate can be just opposite to the position above the corners of the wafer boat, the longitudinal distance of the pressure plate is adjusted through the longitudinal telescopic rod, the pressure plate can be in contact and fixed with the corners of the wafer boat, the wafer boat is prevented from shifting due to the fact that equipment shakes in the test process, the test effect is influenced, meanwhile, the device can be suitable for the wafer boat test pressing fit of different model specifications, and the use efficiency of the.

2. Can carry out the screw thread wrench movement through artifical wrench movement regulation pole according to the model specification of actual brilliant boat, realize the regulation to the distance between the grip block, make conflict fill up can conflict with the both sides surface of brilliant boat and carry out horizontal spacing with the pressure disk cooperation, make the stability of test better.

Drawings

Fig. 1 is a plan view of a semiconductor testing machine and a stitching device of a needle testing machine.

Fig. 2 is a schematic view of the inner side structure of the guide chute of the stitching device of the semiconductor testing machine and the needle testing machine.

Fig. 3 is a bottom view of a semiconductor tester and a stitching device of a prober.

Shown in the figure: 1. testing the carrier; 2. a moving block; 3. a guide chute; 4. a transverse telescopic rod; 5. a platen; 6. a touch pad; 7. a rotating shaft; 8. a clamping plate; 9. a test slot; 10. anti-skid lines; 11. rotating the hole; 12. erecting a rod; 13. a longitudinal telescopic rod; 14. a suction cup; 15. adjusting a knob; 16. adjusting a rod; 17. and (4) an adsorption tank.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1 to 3, in an embodiment of the present invention, a stitching device for a semiconductor testing machine and a needle testing machine includes a testing carrier 1, a testing slot 9 is disposed on the top of the testing carrier 1, guide chutes 3 are disposed on both sides of the testing slot 9, moving blocks 2 are slidably mounted on inner sides of the guide chutes 3, rotation holes 11 are disposed on top of the moving blocks 2, vertical rods 12 are movably inserted into inner sides of the rotation holes 11, transverse telescopic rods 4 are fixedly mounted on one side of the top of the vertical rods 12, longitudinal telescopic rods 13 are fixedly mounted on bottoms of the transverse telescopic rods 4, a platen 5 is fixedly mounted on bottom ends of the longitudinal telescopic rods 13, the moving blocks 2 are manually pushed to move inside the guide chutes 3 to positions corresponding to four corners of a wafer boat according to different specifications of the actual boat, and then the horizontal distance of the platen 5 is adjusted in real time by the transverse telescopic rods 4, make pressure disk 5 can just be to corner top position department of boat, adjust pressure disk 5's longitudinal distance through longitudinal telescoping rod 13, make pressure disk 5 can carry out the contact with the edge of boat and fix, avoid among the test procedure equipment to rock and lead to the boat aversion, influence the effect of test, can make the device be applicable to the boat test pressfitting of different model specifications simultaneously, the efficiency of device use has been improved, adsorption tank 17 has all been seted up to four edges in the bottom of test microscope carrier 1, and the equal fixed mounting in inboard of adsorption tank 17 has sucking disc 14, multiplicable test microscope carrier 1 is whole can with the planar absorption of equipment, increase the holistic stability of device.

An adjusting rod 16 penetrates through the inner wall of the test slot 9 in the direction perpendicular to the guide chute 3, threads are arranged on the surface of the adjusting rod 16 and the inner wall of the penetrating position of the guide chute 3, a rotating shaft 7 is movably arranged at one end opposite to the adjusting rod 16, a clamping plate 8 is fixedly arranged at one end opposite to the rotating shaft 7, the width of the clamping plate 8 is the same as that of the test slot 9, the adjusting rod 16 can be manually twisted to perform thread twisting according to the model specification of an actual boat, the distance between the clamping plates 8 can be adjusted, the collision pads 6 can be collided with the surfaces of the two sides of the boat to be matched with the pressure plate 5 for transverse limiting, the collision pads 6 are adhered to the surface of one side opposite to the clamping plate 8, the collision pads 6 can be made of rubber materials with good contraction elasticity, the friction force between the collision pads and the surfaces of the two sides of the boat is good, the inside movable block 2 quantity that sets up of guide chute 3 all is two, can correspond each other with four corners of brilliant boat, adjusts the outer end of pole 16 and all fixedly mounted has adjust knob 15, and adjust knob 15 all is provided with non-slip texture 10 along the outer edge, can make and adjust the wrench movement in-process more convenient laborsaving.

The utility model discloses a theory of operation is: when semiconductor wafer boat testing work is required, firstly, a wafer boat to be tested can be placed in a test slot 9, according to the requirement of different model specifications of the actual wafer boat, a movable block 2 is manually pushed to move to the positions corresponding to four corners of the wafer boat in a guide chute 3, then the horizontal distance of a pressure plate 5 is adjusted in real time through a transverse telescopic rod 4, the pressure plate 5 can be just opposite to the positions above the corners of the wafer boat, the longitudinal distance of the pressure plate 5 is adjusted through a longitudinal telescopic rod 13, the pressure plate 5 can be in contact and fixed with the corners of the wafer boat, the wafer boat displacement caused by shaking of equipment in the testing process is avoided, the testing effect is influenced, meanwhile, the device can be suitable for wafer boat testing pressing of different model specifications, the using efficiency of the device is improved, and the screw thread twisting can be carried out through a manual twisting adjusting rod 16 according to the model specifications of the actual wafer boat, the realization is to the regulation of distance between the grip block 8, makes conflict pad 6 can conflict with the both sides surface of brilliant boat and carry out horizontal spacing with the cooperation of pressure disk 5, makes the stability of test better.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims

1. The utility model provides a semiconductor test machine and stitching device of machine is surveyed to needle, includes test microscope carrier (1), its characterized in that: the test platform is characterized in that a test slot (9) is formed in the top of the test platform (1), guide sliding grooves (3) are formed in two sides of each test slot (9), moving blocks (2) are slidably mounted in the inner sides of the guide sliding grooves (3), rotating holes (11) are formed in the tops of the moving blocks (2), vertical rods (12) are movably inserted in the inner sides of the rotating holes (11), transverse telescopic rods (4) are fixedly mounted on one side of the tops of the vertical rods (12), longitudinal telescopic rods (13) are fixedly mounted at the bottoms of the transverse telescopic rods (4), and pressure plates (5) are fixedly mounted at the bottoms of the longitudinal telescopic rods (13).

2. The bonding apparatus of a semiconductor testing machine and a prober as claimed in claim 1, wherein: four corners of the bottom of the test carrier (1) are all provided with adsorption grooves (17), and the inner sides of the adsorption grooves (17) are all fixedly provided with suckers (14).

3. The bonding apparatus of a semiconductor testing machine and a prober as claimed in claim 1, wherein: the utility model discloses a test slot, including the guide chute (3), the inner wall of test slot (9) and guide chute (3) vertical direction runs through movable mounting and has adjusted pole (16), the surface of adjusting pole (16) and the inner wall of guide chute (3) department of running through all are provided with the screw thread, the equal movable mounting of the one end relative of adjusting pole (16) has pivot (7), the equal fixed mounting of the one end relative of pivot (7) has grip block (8), and the width of grip block (8) is the same with the width of test slot (9).

4. The bonding apparatus of a semiconductor testing machine and a prober as claimed in claim 3, wherein: the surface of one side opposite to the clamping plate (8) is provided with a touch pad (6) in a sticking mode, and the touch pad (6) is made of rubber with good contraction elasticity.

5. The bonding apparatus of a semiconductor testing machine and a prober as claimed in claim 1, wherein: the number of the moving blocks (2) arranged in the guide sliding groove (3) is two.

6. The bonding apparatus of a semiconductor testing machine and a prober as claimed in claim 3, wherein: the outer end of the adjusting rod (16) is fixedly provided with an adjusting knob (15), and the outer edge of the adjusting knob (15) is provided with anti-skid grains (10).