CN212208193U

CN212208193U - Noiseless computer heat radiator special for computer

Info

Publication number: CN212208193U
Application number: CN202021261626.5U
Authority: CN
Inventors: 唐雅媛; 罗恩韬
Original assignee: Hunan University of Science and Engineering
Current assignee: Hunan University of Science and Engineering
Priority date: 2020-07-02
Filing date: 2020-07-02
Publication date: 2020-12-22
Anticipated expiration: 2030-07-02

Abstract

The utility model relates to the technical field of computer heat dissipation, and discloses a special noiseless computer heat dissipation device for a computer, which comprises a base, wherein the base is of a hollow cuboid structure, fixed blocks are fixed on two sides of the upper surface of the base, screw rods are in threaded connection with the top ends of the two fixed blocks, the two screw rods respectively penetrate through the two fixed blocks, knobs are fixed on the opposite ends of the two screw rods, first heat-conducting plates are symmetrically arranged between the two fixed blocks on the upper surface of the base, and the opposite ends of the two screw rods are respectively in rotating connection with the opposite sides of the two first heat-conducting plates; when the device works, the semiconductor refrigerating sheet can not produce sound when working, and when the mute fan works, the produced sound is very little, and the user can not be influenced, so that the device can not produce larger noise in the working engineering, and the noise pollution is caused to the periphery.

Description

Noiseless computer heat radiator special for computer

Technical Field

The utility model relates to a computer heat dissipation technical field specifically is a special noiseless formula computer heat abstractor of computer.

Background

The computer components use a large number of integrated circuits, the high temperature is a large enemy of the integrated circuits, not only can cause unstable system operation and short service life, even possibly burn some components, the radiator absorbs the heat, then radiates the heat to the outside of the case, and cools the case, thereby ensuring normal working environment temperature of the computer components in the case, but the traditional computer adopts a plurality of exhaust fans arranged in the case for heat radiation, the heat radiation mode has an unobvious heat radiation effect on computers which operate efficiently for a long time, the noise generated when the exhaust fans radiate the heat is large, and the existing heat radiation device is inconvenient to be arranged on the computer case.

To the above-mentioned problem, chinese patent (cn201921426510.x, a dedicated noiseless formula computer heat abstractor of computer is disclosed), this patent is through the heating panel, the double-screw bolt, cooperation between swing handle and the guide slot is used, be convenient for install the device on the computer machine case, the heat that produces the machine case through the heating panel dispels the heat, aluminium base board receives the heat of heating panel conduction and the heat of machine case conduction simultaneously, carry out rapid cooling processing to aluminium base board through the aqueduct, thereby can carry out quick elimination to the heat, and then cool down the machine case shell, the protecting sheathing adopts double-deck cavity casing and cooperation attraction cotton to use together simultaneously, can fall the noise that device inside water pump and condensate tank produced and make an uproar and isolated with the external world, thereby reach the noiseless purpose in the time of device operation.

However, the computer heat dissipation device disclosed in the prior art realizes water circulation heat dissipation through structures such as a water pump, but the higher moisture of the temperature entering the condenser box can not be cooled well, and the moisture in the condenser box is not completely cooled, and is pumped into the water guide pipe by the water pump to dissipate heat and cool, so that the situation of poor heat dissipation effect is easy to occur.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a not enough to prior art, the utility model provides a special noiseless formula computer heat abstractor of computer has solved the problem that proposes among the above-mentioned background art.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: a noise-free computer heat dissipation device special for a computer comprises a base, wherein the base is of a hollow cuboid structure, fixed blocks are fixed on two sides of the upper surface of the base, screw rods are connected to the top ends of the two fixed blocks in a threaded manner, the two screw rods penetrate through the two fixed blocks respectively, knobs are fixed on the back ends of the two screw rods, first heat conduction plates are symmetrically arranged between the two fixed blocks on the upper surface of the base, opposite ends of the two screw rods are rotatably connected with the back ends of the two first heat conduction plates respectively, a second heat conduction plate is embedded between the two fixed blocks on the upper surface of the base, the lower surfaces of the two first heat conduction plates are attached to the upper surface of the second heat conduction plate, and heat dissipation tubes are fixed inside the base on the lower surface of the second heat conduction plate, the cooling tube is the curved structure, the inside lower fixed surface of base has the heat dissipation case, the both sides of heat dissipation case all are fixed with the pipe, two the pipe is kept away from the one end of heat dissipation case respectively with the both ends fixed connection of cooling tube, the lower fixed surface of heat dissipation case has the semiconductor refrigeration piece, the cold side of semiconductor refrigeration piece is located the inside of heat dissipation case, the hot side is located the outside of heat dissipation case.

Preferably, the first heat-conducting plate, the second heat-conducting plate and the radiating pipe are made of copper materials.

Preferably, heat conduction silica gel sheets are fixed on the opposite sides of the two first heat conduction plates.

Preferably, a plurality of radiating fins are fixed on the hot surface of the semiconductor refrigerating sheet from left to right, a silent fan is fixed at the bottom end of each radiating fin, and an air outlet of the silent fan is located outside the base.

Preferably, heat-conducting silicone grease is fixed between the top ends of the radiating fins and the hot surface of the semiconductor chilling plate.

Preferably, four corners of the lower surface of the base are respectively fixed with a bottom foot, and the bottom feet are made of rubber.

(III) advantageous effects

The utility model provides a special noiseless formula computer heat abstractor of computer possesses following beneficial effect:

(1) when the utility model is used, the computer is placed on the base, and the semiconductor refrigeration sheet is opened at the same time, then the two screw rods can drive the two first heat-conducting plates to approach each other by rotating the knob, and finally the two first heat-conducting plates can be attached to the outer wall of the computer, when the computer is operated to generate a large amount of heat, the first heat-conducting plate can conduct the heat to the second heat-conducting plate, then the second heat conduction plate will conduct the heat to the heat pipe, the heat pipe will conduct the heat to the air inside, the air inside the radiator can move to the radiator after absorbing a large amount of heat and expanding when being heated, cold air in the radiator can be pushed into the radiator pipe, hot air can enter the radiator pipe, can rapid cooling under the effect of semiconductor refrigeration piece, the circulation is reciprocal, compares in current heat dissipation mode, and this mode can be better dispels the heat to the computer.

(2) The utility model discloses in work, the sound that semiconductor refrigeration piece can not produce in work, and the silence fan is in work, and produced sound is very little, can not cause the influence to the user, and consequently the device can not produce great noise in the engineering of work to cause noise pollution on every side.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the internal structure of the present invention;

fig. 3 is an enlarged schematic structural diagram of a in fig. 2 of the present invention.

In the figure: 1. a base; 2. a fixed block; 3. a knob; 4. a screw; 5. a first heat-conducting plate; 6. a heat-conducting silica gel sheet; 7. footing; 8. a second heat-conducting plate; 9. a heat dissipation box; 10. a radiating pipe; 11. a conduit; 12. a mute fan; 13. heat dissipation fins; 14. a semiconductor refrigeration sheet; 15. and (3) heat-conducting silicone grease.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As shown in fig. 1-3, the utility model provides a technical solution: a noise-free computer heat dissipation device special for a computer comprises a base 1, wherein the base 1 is of a hollow cuboid structure, fixed blocks 2 are fixed on two sides of the upper surface of the base 1, screw rods 4 are in threaded connection with the top ends of the two fixed blocks 2 respectively, the two screw rods 4 penetrate through the two fixed blocks 2 respectively, knobs 3 are fixed on the back ends of the two screw rods 4 respectively, first heat conduction plates 5 are symmetrically arranged between the two fixed blocks 2 on the upper surface of the base 1, opposite ends of the two screw rods 4 are in rotating connection with the back sides of the two first heat conduction plates 5 respectively, a second heat conduction plate 8 is embedded between the two fixed blocks 2 on the upper surface of the base 1, the lower surfaces of the two first heat conduction plates 5 are attached to the upper surface of the second heat conduction plate 8, a heat dissipation pipe 10 is fixed inside the base 1 on the lower surface of the second heat conduction plate 8, and the heat dissipation pipe 10 is, the lower surface of the inside of the base 1 is fixed with a heat dissipation box 9, both sides of the heat dissipation box 9 are fixed with guide pipes 11, one end of each guide pipe 11 far away from the heat dissipation box 9 is respectively fixedly connected with both ends of a heat dissipation pipe 10, the lower surface of the heat dissipation box 9 is fixed with a semiconductor refrigeration sheet 14, the cold surface of each semiconductor refrigeration sheet 14 is positioned inside the heat dissipation box 9, the hot surface is positioned outside the heat dissipation box 9, when the computer is used, the computer is placed on the base 1, the semiconductor refrigeration sheets 14 are simultaneously opened, then the two screw rods 4 can drive the two first heat conduction plates 5 to be close to each other by rotating the knob 3, finally the two first heat conduction plates 5 can be attached to the outer wall of the computer, when the computer works to generate a large amount of heat, the first heat conduction plates 5 can conduct the heat to the second heat conduction plates 8, then the second heat conduction plates 8 can conduct, the cooling tube 10 can be with heat conduction to inside air in, and its inside air absorbs a large amount of heats and expands the back, can move to in the heat dissipation case 9, can push into the cooling tube 10 with the cold air in the heat dissipation case 9, and hot-air can enter into the heat dissipation case 9, can rapid cooling under the effect of semiconductor refrigeration piece 14, and the circulation is reciprocal, compares in current radiating mode, and what this mode can be better dispels the heat to the computer.

Further, the first heat conducting plate 5, the second heat conducting plate 8 and the radiating pipe 10 are made of copper materials, and the copper materials have good heat conducting performance, so that heat generated by a computer can be better conducted.

Further, the opposite sides of two first heat-conducting plates 5 all are fixed with heat conduction silica gel sheet 6, and heat conduction silica gel sheet 6 can be with the produced heat conduction of computer to first heat-conducting plate 5 on, can increase the frictional force between first heat-conducting plate 5 and the computer simultaneously to can be more firm fix the computer on base 1.

Furthermore, a plurality of heat dissipation fins 13 are fixed on the hot surface of the semiconductor refrigeration sheet 14 from left to right, a mute fan 12 is fixed at the bottom end of the heat dissipation fins 13, an air outlet of the mute fan 12 is located outside the base 1, the heat dissipation fins 13 can conduct heat generated by the semiconductor refrigeration sheet 14, and then the heat on the heat dissipation fins 13 can be discharged through the mute fan 12.

Further, a heat-conducting silicone grease 15 is fixed between the top end of the heat-radiating fin 13 and the hot surface of the semiconductor chilling plate 14, so that heat generated by the work of the semiconductor chilling plate 14 can be better conducted to the heat-radiating fin 13.

Further, four corners of the lower surface of the base 1 are all fixed with feet 7, the feet 7 are made of rubber materials, the whole device can be supported, and the situation that the whole device slides together with a computer in the use process is avoided.

To sum up, the utility model discloses a work flow: when the computer cooling device is used, a computer is placed on the base 1, the semiconductor cooling sheet 14 is simultaneously opened, then the two screw rods 4 can drive the two first heat conduction plates 5 to approach each other by rotating the knob 3, finally the two first heat conduction plates 5 can be attached to the outer wall of the computer, when the computer works to generate a large amount of heat, the first heat conduction plates 5 can conduct the heat to the second heat conduction plates 8, then the second heat conduction plates 8 can conduct the heat to the radiating pipe 10, the radiating pipe 10 can conduct the heat to the inside air, the inside air can move into the radiating box 9 after absorbing a large amount of heat and expanding after being heated, cold air in the radiating box 9 can be pushed into the radiating pipe 10, hot air can enter the radiating box 9, the temperature can be rapidly cooled under the action of the semiconductor cooling sheet 14, the circulation is repeated, compared with the existing radiating mode, the mode can better dissipate heat of the computer.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a special noiseless formula computer heat abstractor of computer, includes base (1), its characterized in that: the base (1) is of a hollow cuboid structure, the two sides of the upper surface of the base (1) are both fixed with fixed blocks (2), the top ends of the two fixed blocks (2) are both connected with screw rods (4) in a threaded manner, the two screw rods (4) respectively penetrate through the two fixed blocks (2), the back ends of the two screw rods (4) are both fixed with knobs (3), the upper surface of the base (1) is positioned between the two fixed blocks (2) and is symmetrically provided with first heat-conducting plates (5), the opposite ends of the two screw rods (4) are respectively connected with the back sides of the two first heat-conducting plates (5) in a rotating manner, the upper surface of the base (1) is positioned between the two fixed blocks (2) and is embedded with second heat-conducting plates (8), and the lower surfaces of the two first heat-conducting plates (5) are both attached to the upper surface of the second heat-conducting plates (8), the lower surface of second heat-conducting plate (8) is located the inside of base (1) is fixed with cooling tube (10), cooling tube (10) are curve column structure, the inside lower fixed surface of base (1) has heat dissipation case (9), the both sides of heat dissipation case (9) all are fixed with pipe (11), two pipe (11) are kept away from the one end of heat dissipation case (9) respectively with the both ends fixed connection of cooling tube (10), the lower fixed surface of heat dissipation case (9) has semiconductor refrigeration piece (14), the cold side of semiconductor refrigeration piece (14) is located the inside of heat dissipation case (9), the hot side is located the outside of heat dissipation case (9).

2. The noiseless computer cooling device of claim 1, wherein: the first heat-conducting plate (5), the second heat-conducting plate (8) and the radiating pipe (10) are made of copper materials.

3. The noiseless computer cooling device of claim 1, wherein: and heat-conducting silica gel sheets (6) are fixed on the opposite sides of the two first heat-conducting plates (5).

4. The noiseless computer cooling device of claim 1, wherein: a plurality of radiating fins (13) are fixed on the hot surface of the semiconductor refrigerating sheet (14) from left to right, a silent fan (12) is fixed at the bottom end of each radiating fin (13), and an air outlet of the silent fan (12) is located outside the base (1).

5. The noiseless computer cooling device of claim 4, wherein: and heat-conducting silicone grease (15) is fixed between the top ends of the radiating fins (13) and the hot surface of the semiconductor refrigerating sheet (14).

6. The noiseless computer cooling device of claim 1, wherein: four corners of the lower surface of the base (1) are respectively fixed with a bottom foot (7), and the bottom feet (7) are made of rubber.