CN212138174U - Novel chip radiator - Google Patents
Novel chip radiator Download PDFInfo
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- CN212138174U CN212138174U CN202020693937.2U CN202020693937U CN212138174U CN 212138174 U CN212138174 U CN 212138174U CN 202020693937 U CN202020693937 U CN 202020693937U CN 212138174 U CN212138174 U CN 212138174U
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- 239000007788 liquid Substances 0.000 claims abstract description 67
- 238000001816 cooling Methods 0.000 claims abstract description 28
- 238000003780 insertion Methods 0.000 claims abstract description 14
- 230000037431 insertion Effects 0.000 claims abstract description 14
- 238000012546 transfer Methods 0.000 claims description 5
- 238000013461 design Methods 0.000 abstract description 4
- 239000003507 refrigerant Substances 0.000 abstract description 3
- 238000006243 chemical reaction Methods 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 4
- 238000005265 energy consumption Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000002826 coolant Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Abstract
The utility model discloses a novel chip radiator belongs to data center refrigerated technical field. The novel chip radiator comprises a liquid inlet, a liquid inlet header pipe, a Y-shaped liquid pipeline, a nozzle, a cavity, a gas return port, an insulating insertion piece, a fan switch and the like. The utility model discloses a pipeline to the radiator carries out multistage design for can evenly flow through liquid pipeline at different levels after the refrigerant flows into novel chip radiator, and realize the even high-efficient cooling to the chip through strikeing the efflux. Simultaneously, novel chip radiator still sets up insulating inserted sheet, but automatic conversion becomes the forced air cooling radiating mode when novel chip radiator breaks down and overhauls, and then guarantees the normal work of server.
Description
Technical Field
The utility model belongs to the technical field of data center refrigerated, particularly, relate to a novel chip radiator.
Background
In recent years, data centers are developing more and more rapidly, but problems of large energy consumption, large heat generation and the like exist all the time, the heat generation of the data centers is mainly generated by chips, and when the temperature of the chips exceeds 70 ℃, the reliability of a system is reduced by 50% every time the temperature is increased by 10 ℃. In addition, the failure of the electronic device exceeding 55% is caused by the over-high temperature of the chip, so the performance of the chip radiator is directly related to the normal operation of the server and the problem of the operating efficiency. The existing chip heat dissipation mode mostly adopts air cooling and is characterized in that a fan is used for carrying out forced convection heat transfer on the surface of a chip, but the fan heat dissipation mode has the problems of low efficiency, high noise, space restriction and the like. Another chip heat dissipation method is liquid cooling, including methods such as microchannel liquid cooling, liquid spray cooling, liquid impingement cooling, etc., and has the advantages of excellent heat dissipation effect, convenient use, etc., and is widely concerned.
In the prior art relating to chip liquid cooling, chinese patent CN110473847A proposes a flat-type chip radiator suitable for a spray liquid cooling server, which uses a heat conductive material to make a base and fins, a liquid pool is arranged in the center of the base, and a coolant flow channel is formed by utilizing arrangement gaps of surrounding annular fins, when the spray liquid cooling server is started, the coolant at the top of the server is sprayed into the liquid pool to contact with the chip for heat exchange and continuously exchange heat through the surrounding coolant flow channel. Chinese patent CN102798308A proposes a method for processing a micro-channel heat sink and a micro-channel, which forms a micro-channel heat sink unit combination with uniform heat dissipation capability by dividing four square areas on a square substrate to process multiple micro-channels, and this patent optimizes the problems of poor distribution uniformity and uneven heat dissipation of micro-channels. Although the problems of low heat dissipation efficiency of the radiator and poor distribution uniformity of the internal micro-pipeline are solved by the prior art, other problems still exist, such as large flow resistance loss of the internal pipeline of the radiator, high energy consumption, uneven heat dissipation, lack of protective measures for effectively solving the problem of faults and the like.
To the above problem, the utility model discloses a novel chip radiator designs through the pipeline to the radiator for can evenly flow in each level Y type liquid pipeline after the refrigerant flows in novel chip radiator, and cool down the chip through impingement cooling. The utility model discloses a pipeline structure of optimizing has reduced pipeline resistance loss, has reduced the energy consumption, and evenly distributed's pipeline makes novel chip radiator heat dissipation more even to through the mode that sets up insulating inserted sheet, make the accessible change heat transfer mode when the liquid cooling part breaks down or overhauls in the novel chip radiator continue to dispel the heat to the server.
Disclosure of Invention
The utility model discloses a novel chip radiator, the utility model aims at providing a novel chip radiator designs through the pipeline to the radiator for can evenly flow in each grade Y type liquid pipeline behind the novel chip radiator of refrigerant inflow, and cool down to the chip through impingement cooling.
For realizing the purpose of the utility model, the utility model discloses the implementation adopts following technical scheme:
realize the utility model discloses a purpose technical scheme provides a novel chip radiator, and the device includes: a liquid inlet; a liquid inlet header pipe; a Y-shaped liquid conduit; a nozzle; a cavity; an air return port; insulating insertion sheets; a fan switch; a chip fan.
As a preferred example, the structural features of the novel chip heat sink are as follows:
as a preferred example, the output end of a liquid inlet header pipe in the novel chip radiator is connected with the input end of a Y-shaped liquid pipeline, and the tail end of a five-stage pipeline of the Y-shaped liquid pipeline is connected with the inner wall of the novel chip radiator; the input end of the liquid inlet header pipe, namely a liquid inlet, is arranged on the inner wall of the novel chip radiator and penetrates through the outer wall; the air return port of the cavity is arranged on the outer wall of the novel chip radiator, penetrates through the inner wall and is positioned at the lower part of the liquid inlet; the lower surface of the Y-shaped liquid pipeline is superposed with the upper surface of the cavity, and the nozzle is arranged on the superposed surface of the Y-shaped liquid pipeline and the cavity and penetrates through the superposed surface; the insulating insertion sheet (7) is arranged on the outer wall of the novel chip radiator and is arranged on the different side of the liquid inlet (1) and the air return port (6).
The Y-shaped liquid pipeline is characterized by comprising five stages of pipelines, wherein the pipelines at all stages are arranged according to a certain relation, namely: the included angle between the first-stage pipelines is beta1120 DEG, length L of the primary pipe1The relation with the radius R of the novel chip radiator is L10.135205; each primary pipeline is divided into two secondary pipelines, and the connecting point of the primary pipeline and the secondary pipeline is connected with the included angle beta between the straight line formed by the circle center of the novel chip radiator and the secondary pipeline238.96 DEG, length L of secondary pipeline2The relation with the radius R of the novel chip radiator is L2-0.43395; each secondary pipeline is divided into two tertiary pipelines, and the connecting point of the secondary pipeline and the tertiary pipeline is connected with the included angle beta between the straight line formed by the circle center of the novel chip radiator and the tertiary pipeline338.39 DEG, length L of the three-stage pipeline3The relation with the radius R of the novel chip radiator is L30.355811; each third-level pipeline is divided into two fourth-level pipelines, and the connecting point of the third-level pipeline and the fourth-level pipeline is connected with a straight line formed by the circle center of the novel chip radiator and the included angle between the straight line and the fourth-level pipeline is beta432.66 deg., length L of the four-stage pipe4The relation with the radius R of the novel chip radiator is L40.189372; each four-stage pipeline is divided into two five-stage pipelines, and the included angle between a straight line formed by connecting the connection points of the four-stage pipelines and the five-stage pipelines with the center of a circle of the novel chip radiator and the five-stage pipeline is beta532.66 ° length L of five-stage pipeline5The relation with the radius R of the novel chip radiator is L5/R＝-0.0462；
The ratio of the pipe diameter of the first-stage pipeline to the pipe diameter of the second-stage pipeline is D1/D2＝21/3The ratio of the pipe diameter of the second-stage pipeline to the pipe diameter of the third-stage pipeline is D2/D3＝21/3The ratio of the pipe diameter of the third-level pipeline to the pipe diameter of the fourth-level pipeline is D3/D4＝21/3The ratio of the pipe diameter of the fourth-stage pipeline to the pipe diameter of the fifth-stage pipeline is D4/D5＝21/3；
As a preferred example, when the novel chip radiator normally works, the insulating insertion piece is inserted into the fan switch, the fan switch is jacked open by the insulating insertion piece, the chip fan is in a power-off state at the moment, the chip fan stops working, and the cooling mode is the novel chip radiator impact cooling; when novel chip radiator broke down and overhauld, insulating inserted sheet extracted from the fan switch, and the fan switch recovery is connected, and the chip fan is in the on state, and the cooling method is fan convection heat transfer cooling to guarantee the normal work of server.
As a preferred example, each stage of pipeline of the Y-shaped liquid pipeline is provided with a plurality of nozzles, the diameter of each nozzle is not less than 0.2mm, the center distance between adjacent nozzles is not less than 1mm, and the height of the cavity is not less than 2 mm.
The Y-shaped liquid pipeline is characterized in that n (n is more than 1) grade can be set according to different heat dissipating capacities and sizes of chips.
Compared with the prior art, the example of the utility model has the following beneficial effects: the utility model discloses a novel chip radiator adopts Y type liquid pipeline design, reducible pipeline flow resistance, and then the reduce system energy consumption. Meanwhile, the cooling efficiency of the radiator can be further improved after the Y-shaped liquid pipeline is combined with the impingement cooling, and the chip is cooled more uniformly; the utility model discloses a novel chip radiator is through setting up insulating inserted sheet, to the duplicate protection effect that the chip played, when novel chip radiator liquid cooling part breaks down or overhauls, can directly trun into the radiating mode of fan, continues to dispel the heat to the server chip.
Drawings
FIG. 1 is a schematic diagram of a novel chip heat sink structure;
FIG. 2 is a front view of the novel chip heat sink;
FIG. 3 is a schematic diagram of the various stages of the novel Y-shaped liquid tube of the chip heat sink;
FIG. 4 is a schematic diagram of a novel chip radiator Y-shaped liquid pipeline five-stage pipeline;
FIG. 5 is a schematic view of the novel chip heat sink after it has been pulled away from the fan switch;
FIG. 6 is a schematic diagram of the novel chip heat sink after insertion into a fan switch;
the figure shows that: 1. a liquid inlet; 2. a liquid inlet header pipe; 3. a Y-shaped liquid conduit; 4. a nozzle; 5. a cavity; 6. an air return port; 7. Insulating insertion sheets; 8. a fan switch; 9. a chip fan.
Detailed Description
The technical solution of the embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
As shown in fig. 1-6, the novel chip heat sink of the embodiment of the present invention comprises a liquid inlet 1; 2. a liquid inlet header pipe; 3. a Y-shaped liquid conduit; 4. a nozzle; 5. a cavity; 6. an air return port; 7. insulating insertion sheets; 8. a fan switch; 9. A chip fan.
As shown in figures 1-6: the novel chip radiator is characterized in that the output end of a liquid inlet header pipe 2 is connected with the input end of a Y-shaped liquid pipeline 3, and the tail end of a five-stage pipeline of the Y-shaped liquid pipeline 3 is connected with the inner wall of the novel chip radiator; the input end of the liquid inlet header pipe 2, namely the liquid inlet 1, is arranged on the inner wall of the novel chip radiator and penetrates through the outer wall; the air return port 6 of the cavity is arranged on the outer wall of the novel chip radiator, penetrates through the inner wall and is positioned at the lower part of the liquid inlet 1; the lower surface of the Y-shaped liquid pipeline 3 is superposed with the upper surface of the cavity 5, and the nozzle is arranged on the superposed surface of the Y-shaped liquid pipeline 3 and the cavity 5 and penetrates through the superposed surface; insulating inserted sheet 7 is installed on novel chip radiator outer wall, at inlet 1 and the different side of return air inlet 6.
Y type liquid pipeline 3, its characterized in that includes five grades of pipelines, and the pipeline of each grade arranges according to certain relation, promptly: the included angle between the first-stage pipelines is beta1120 DEG, length L of the primary pipe1The relation with the radius R of the novel chip radiator isL10.135205; each primary pipeline is divided into two secondary pipelines, and the connecting point of the primary pipeline and the secondary pipeline is connected with the included angle beta between the straight line formed by the circle center of the novel chip radiator and the secondary pipeline238.96 DEG, length L of secondary pipeline2The relation with the radius R of the novel chip radiator is L2-0.43395; each secondary pipeline is divided into two tertiary pipelines, and the connecting point of the secondary pipeline and the tertiary pipeline is connected with the included angle beta between the straight line formed by the circle center of the novel chip radiator and the tertiary pipeline338.39 DEG, length L of the three-stage pipeline3The relation with the radius R of the novel chip radiator is L30.355811; each third-level pipeline is divided into two fourth-level pipelines, and the connecting point of the third-level pipeline and the fourth-level pipeline is connected with a straight line formed by the circle center of the novel chip radiator and the included angle between the straight line and the fourth-level pipeline is beta432.66 deg., length L of the four-stage pipe4The relation with the radius R of the novel chip radiator is L40.189372; each four-stage pipeline is divided into two five-stage pipelines, and the included angle between a straight line formed by connecting the connection points of the four-stage pipelines and the five-stage pipelines with the center of a circle of the novel chip radiator and the five-stage pipeline is beta532.66 ° length L of five-stage pipeline5The relation with the radius R of the novel chip radiator is L5/R＝0.0462；
The ratio of the pipe diameter of the first-stage pipeline to the pipe diameter of the second-stage pipeline is D1/D2＝21/3The ratio of the pipe diameter of the second-stage pipeline to the pipe diameter of the third-stage pipeline is D2/D3＝21/3The ratio of the pipe diameter of the third-level pipeline to the pipe diameter of the fourth-level pipeline is D3/D4＝21/3The ratio of the pipe diameter of the fourth-stage pipeline to the pipe diameter of the fifth-stage pipeline is D4/D5＝21/3；
The Y-shaped liquid pipeline is characterized in that n (n is more than 1) level can be set according to different heat dissipating capacities and sizes of chips.
When the novel chip radiator normally works, the insulating insertion sheet 7 is inserted into the fan switch 15, the fan switch 15 is jacked open by the insulating insertion sheet 7, the chip fan 16 is in a power-off state at the moment, the chip fan 16 stops working, and the cooling mode is novel chip radiator impact cooling; when novel chip radiator breaks down and overhauls, insulating inserted sheet 7 extracts from fan switch 15, and fan switch 15 reconnection is in the on-state, and chip fan 16 is in the circular telegram state, and the cooling method is fan convection heat transfer cooling to guarantee the normal work of server.
A plurality of nozzles 4 are arranged on each stage of pipeline of the Y-shaped liquid pipeline 3, the diameter of each nozzle 4 is not less than 0.2mm, the center distance between every two adjacent nozzles 4 is not less than 1mm, and the height of each cavity 5 is not less than 2 mm.
The above-mentioned embodiments, further detailed description of the objects, technical solutions and advantages of the present invention, it should be understood that the above-mentioned embodiments are only specific embodiments of the present invention, and are not intended to limit the present invention, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (3)
1. A novel chip radiator is characterized in that: comprises a liquid inlet (1), a liquid inlet header pipe (2), a Y-shaped liquid pipeline (3), a nozzle (4), a cavity (5), an air return port (6), an insulating insertion sheet (7), a fan switch (8) and a chip fan (9),
the output end of a liquid inlet header pipe (2) in the novel chip radiator is connected with the input end of a Y-shaped liquid pipeline (3), and the end of a five-stage pipeline of the Y-shaped liquid pipeline (3) is connected with the inner wall of the novel chip radiator; the input end of the liquid inlet header pipe (2), namely the liquid inlet (1), is arranged on the inner wall of the novel chip radiator and penetrates through the outer wall; an air return port (6) of the cavity (5) is formed in the outer wall of the novel chip radiator, penetrates through the inner wall and is positioned at the lower part of the liquid inlet (1); the lower surface of the Y-shaped liquid pipeline (3) is superposed with the upper surface of the cavity (5), and the nozzle (4) is arranged on the superposed surface of the Y-shaped liquid pipeline (3) and the cavity (5) and penetrates through the superposed surface; the insulating insertion sheet (7) is arranged on the outer wall of the novel chip radiator and is arranged on the different side of the liquid inlet (1) and the air return port (6).
2. The new chip heat sink and integrated cabinet as claimed in claim 1, wherein the Y-type liquid tubeThe channel (3) comprises five stages of pipelines, and the pipelines at each stage are arranged according to a certain relationship, namely: the included angle between the first-stage pipelines is beta1120 DEG, length L of the primary pipe1The relation with the radius R of the novel chip radiator is L10.135205; each primary pipeline is divided into two secondary pipelines, and the connecting point of the primary pipeline and the secondary pipeline is connected with the included angle beta between the straight line formed by the circle center of the novel chip radiator and the secondary pipeline238.96 DEG, length L of secondary pipeline2The relation with the radius R of the novel chip radiator is L20.43395; each secondary pipeline is divided into two tertiary pipelines, and the connecting point of the secondary pipeline and the tertiary pipeline is connected with the included angle beta between the straight line formed by the circle center of the novel chip radiator and the tertiary pipeline338.39 DEG, length L of the three-stage pipeline3The relation with the radius R of the novel chip radiator is L30.355811; each third-level pipeline is divided into two fourth-level pipelines, and the connecting point of the third-level pipeline and the fourth-level pipeline is connected with a straight line formed by the circle center of the novel chip radiator and the included angle between the straight line and the fourth-level pipeline is beta432.66 deg., length L of the four-stage pipe4The relation with the radius R of the novel chip radiator is L40.189372; each four-stage pipeline is divided into two five-stage pipelines, and the included angle between a straight line formed by connecting the connection points of the four-stage pipelines and the five-stage pipelines with the center of a circle of the novel chip radiator and the five-stage pipeline is beta532.66 ° length L of five-stage pipeline5The relation with the radius R of the novel chip radiator is L5/R＝0.0462；
The ratio of the pipe diameter of the first-stage pipeline to the pipe diameter of the second-stage pipeline is D1/D2＝21/3The ratio of the pipe diameter of the second-stage pipeline to the pipe diameter of the third-stage pipeline is D2/D3＝21/3The ratio of the pipe diameter of the third-level pipeline to the pipe diameter of the fourth-level pipeline is D3/D4＝21/3The ratio of the pipe diameter of the fourth-stage pipeline to the pipe diameter of the fifth-stage pipeline is D4/D5＝21/3；
When the novel chip radiator normally works, the insulating insertion piece (7) is inserted into the fan switch (8), the fan switch (8) is jacked open by the insulating insertion piece (7), the chip fan (9) is in a power-off state at the moment, the chip fan (9) stops working, and the cooling mode is novel chip radiator impact cooling; when novel chip radiator broke down and overhauld, insulating inserted sheet (7) are pulled out from fan switch (8), and fan switch (8) reconnection is in the on-state, and chip fan (9) are in the circular telegram state, and the cooling method is fan convection heat transfer cooling to guarantee the normal work of server.
3. The novel chip radiator as claimed in claim 1, wherein each stage of the Y-shaped liquid pipeline (3) is provided with a plurality of nozzles (4), the diameter of each nozzle (4) is not less than 0.2mm, the center distance between adjacent nozzles (4) is not less than 1mm, and the height of the cavity (5) is not less than 2 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020693937.2U CN212138174U (en) | 2020-04-29 | 2020-04-29 | Novel chip radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020693937.2U CN212138174U (en) | 2020-04-29 | 2020-04-29 | Novel chip radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212138174U true CN212138174U (en) | 2020-12-11 |
Family
ID=73692421
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020693937.2U Expired - Fee Related CN212138174U (en) | 2020-04-29 | 2020-04-29 | Novel chip radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212138174U (en) |
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2020
- 2020-04-29 CN CN202020693937.2U patent/CN212138174U/en not_active Expired - Fee Related
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| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
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Granted publication date: 20201211 |