CN212136884U

CN212136884U - Semiconductor laser heat sink

Info

Publication number: CN212136884U
Application number: CN202020698384.XU
Authority: CN
Inventors: 不公告发明人
Original assignee: Shanxi Badou Technology Co ltd
Current assignee: Shanxi Badou Technology Co ltd
Priority date: 2020-04-30
Filing date: 2020-04-30
Publication date: 2020-12-11
Anticipated expiration: 2030-04-30

Abstract

The utility model discloses a semiconductor laser is heat sink, including laser instrument, chip and miniature fan, the chip is installed to the inside bottom of laser instrument, the last surface mounting of laser instrument has miniature fan, the upper surface of chip is equipped with heat sink. Compared with the prior art, the semiconductor laser heat sink has the following advantages: through laser instrument, the chip, cooperation between micro fan and the heat sink, the laser instrument carries out the normal function in-process, the air current that micro fan bottom produced partly can blow to the inside of through-hole through the inclined hole, the air current in the flow in-process promptly can carry out the heat with the inside rubber ring of through-hole and blow away, thereby can increase the area of contact of heat sink and air current, then be favorable to the heat in the heat sink to conduct, promote the heat dissipation effect of heat sink to the chip, then do benefit to semiconductor laser's permanent stable use and work as.

Description

Semiconductor laser heat sink

Technical Field

The utility model relates to a semiconductor laser technical field specifically is a semiconductor laser is heat sink.

Background

The semiconductor laser is the most practical and important laser, has small volume and long service life, can be pumped by adopting a simple current injection mode, has working voltage and current compatible with an integrated circuit, can be monolithically integrated with the semiconductor laser, and is widely applied to the fields of material processing, free space communication, medical treatment and the like. With the widespread use of high power semiconductor lasers, reliability becomes an important factor limiting their applications. In semiconductor laser, along with output's improvement, also higher and higher to the requirement of laser instrument heat-sinking capability, mode competition can appear in the device when the temperature risees, and simultaneously, the spectral width grow of spectrum, therefore, the heat dissipation becomes the important index that influences device life-span and reliability, relate to the good or bad and success or failure of laser instrument device performance, some semiconductor laser of current can be at the miniature radiator fan of top installation of shell, come to cool down its inside chip of cooperation heat sink, but in the present semiconductor laser heat sink mostly be heat conduction graphite plate and make, the air current area of contact that heat sink and miniature fan blow off is comparatively limited, be unfavorable for the heat in the heat sink to derive, the heat sink is general to the radiating effect of chip, be unfavorable for the permanent stable use of semiconductor laser and work as.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor laser is heat sink to heat sink is mostly the heat conduction graphite plate to make in solving the present semiconductor laser that proposes in the above-mentioned background art, and heat sink is comparatively limited with the air current area of contact that miniature fan blew off, is unfavorable for the heat in the heat sink to derive, and heat sink is general to the radiating effect of chip, is unfavorable for semiconductor laser's permanent stable use and works as the problem.

In order to achieve the above object, the utility model provides a following technical scheme: a semiconductor laser heat sink comprises a laser, a chip and a micro fan, wherein the chip is installed at the bottom end inside the laser, the micro fan is installed on the upper surface of the laser, and the heat sink is arranged on the upper surface of the chip;

the heat sink comprises a graphite plate, a silica gel heat conduction sleeve, a through hole, a rubber ring, a support rod and an inclined hole;

the graphite plate is located the top of chip, the outer wall of graphite plate has cup jointed silica gel heat conduction cover, the lower surface of silica gel heat conduction cover is laminated with the upper surface of chip mutually, the front surface of silica gel heat conduction cover has from left to right opened a plurality of through-holes in proper order, the through-hole runs through silica gel heat conduction cover and graphite plate in proper order, the inside of through-hole is equipped with two rubber rings, two it is fixed continuous through branch between the rubber ring, the outside the outer wall of rubber ring and the inner wall interference fit of through-hole, a plurality of inclined holes have been seted up to the upper surface of silica gel heat conduction cover, the inclined hole runs through a part that silica gel heat conduction cover and graphite plate in proper order and is linked together with the through-hole.

Preferably, the graphite plate is located directly below the micro fan.

Preferably, the ratio of the upper end to the lower end of the inner diameter of the inclined hole is 3: 1.

Preferably, the heat sink is connected with the micro fan through a connecting rod;

the connecting rod comprises a supporting plate, a clamping groove, a clamping ball, a short rod, a circular groove, an inserting rod, an upright rod and a butterfly rubber sleeve;

the two extension boards are respectively located the left and right sides of silica gel heat conduction sleeve, a part of the extension board runs through the silica gel heat conduction sleeve and is fixedly connected with the graphite plate, a clamping groove is formed in the upper surface of the extension board, a clamping ball is clamped in the clamping groove, a short rod is fixedly connected to the top end of the clamping ball, a circular groove is formed in the center of the top end of the short rod, an insertion rod is inserted into the circular groove, the outer wall of the insertion rod is in clearance fit with the inner wall of the circular groove, a vertical rod is fixedly connected to the top end of the insertion rod, the top end of the vertical rod is fixedly connected to the left and right sides of the bottom end of the lower surface of the miniature fan respectively, a butterfly rubber sleeve is fixedly connected to the periphery of the bottom end of the.

Preferably, the distance between the inner wall of the butterfly rubber sleeve and the outer wall of the inserted rod is 0.5-1 mm.

Preferably, the clamping ball and the clamping groove form a clamping structure.

Compared with the prior art, the beneficial effects of the utility model are that: compared with the prior art, the semiconductor laser heat sink has the following advantages: through laser instrument, the chip, cooperation between micro fan and the heat sink, the laser instrument carries out the normal function in-process, the air current that micro fan bottom produced partly can blow to the inside of through-hole through the inclined hole, the air current in the flow in-process promptly can carry out the heat with the inside rubber ring of through-hole and blow away, thereby can increase the area of contact of heat sink and air current, then be favorable to the heat in the heat sink to conduct, promote the heat dissipation effect of heat sink to the chip, then do benefit to semiconductor laser's permanent stable use and work as.

Through the cooperation between laser instrument, miniature fan, heat sink and the connecting rod, when the laser instrument carries out the deashing maintenance and maintains, can dismantle heat sink, the inclined hole in the heat sink is cleared up with the inside remaining a small amount of dusts of through-hole together to the in-process to the inside deashing operation of laser instrument shell to in-process in the same place, so that keep the radiating effect of inside each part of laser instrument.

Through the cooperation between heat sink, extension board, quarter butt, butterfly rubber sleeve and the pole setting, the butterfly rubber sleeve can produce certain downward effort to the quarter butt, can keep heat sink fully to contact with the chip to ensure the heat sink to the normal heat dissipation of chip.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of a connection structure of the chip, the heat sink and the support plate in FIG. 1;

FIG. 3 is a schematic view of the connection structure of the graphite plate, the silica gel heat-conducting sleeve and the rubber ring in FIG. 2;

FIG. 4 is a schematic view of the connection structure of the support plate, the ball retainer and the short rod of FIG. 2;

fig. 5 is a schematic view showing a connection structure of the short pole, the insert pole and the stand pole of fig. 1.

In the figure: 1. the laser device comprises a laser device, 2, a chip, 3, a micro fan, 4, a heat sink, 401, a graphite plate, 402, a silica gel heat conduction sleeve, 403, a through hole, 404, a rubber ring, 405, a support rod, 406, an inclined hole, 5, a connecting rod, 501, a support plate, 502, a clamping groove, 503, a clamping ball, 504, a short rod, 505, a circular groove, 506, an insertion rod, 507, a vertical rod, 508 and a butterfly rubber sleeve.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, the present invention provides a technical solution: a semiconductor laser heat sink comprises a laser 1, a chip 2 and a micro fan 3, wherein the chip 2 is installed at the bottom end inside the laser 1, the micro fan 3 is installed on the upper surface of the laser 1, a power line of the micro fan 3 is electrically connected with a power supply module inside the laser 1, a lead wire above a shell of the laser 1 is long enough, the micro fan 3 is fixedly connected with the shell of the laser 1 through a bolt, the bottom end of the micro fan 3 is located inside the shell of the laser 1, a heat dissipation groove is processed on the shell of the laser 1, a heat sink 4 is arranged on the upper surface of the chip 2, the heat sink 4 comprises a graphite plate 401, a silica gel heat conduction sleeve 402, a through hole, a rubber ring 404, a support rod 405 and an inclined hole 406, the graphite plate 401 is located above the chip 2, the silica gel heat conduction sleeve 402 is sleeved on the outer wall of the graphite plate 401, the graphite plate 401 is made of a heat conduction and, the heat conducting structure can conduct uniform heat conduction and is a known heat radiating element, so that redundant description is not needed, the lower surface of the silica gel heat conducting sleeve 402 is attached to the upper surface of the chip 2, the silica gel heat conducting sleeve 402 is made of the same material as a silica gel heat conducting pad in the prior art, and has good heat conducting capacity, high-grade pressure resistance, certain flexibility and good attaching force, a plurality of through holes 403 are sequentially formed in the front surface of the silica gel heat conducting sleeve 402 from left to right, the through holes 403 sequentially penetrate through the silica gel heat conducting sleeve 402 and a graphite plate 401, two rubber rings 404 are arranged inside the through holes 403, the rubber rings 404 are made of silicon rubber and have excellent heat conducting performance, the two rubber rings 404 are fixedly connected through supporting rods 405, the outer wall of the outer side rubber ring 404 is in interference fit with the inner wall of the through holes, a plurality of inclined holes 406 are formed in the upper surface of the silica gel heat conducting sleeve 402 and a part of the graphite plate 401 are communicated with the through holes 403, the graphite plate 401 is located right below the micro fan 3, when air flow generated in the operation process of the micro fan 3 can blow towards the direction of the chip 2, the heat sink 4 is matched to conduct heat to the chip 2 quickly, the ratio of the upper end to the lower end of the inner diameter of the inclined hole 406 is 3:1, when air holes are blown into the inclined hole 406, the air flow rate at the bottom end of the inclined hole 406 can be enhanced to a certain degree, and the heat dissipation operation of the heat sink 4 is facilitated.

The heat sink 4 is connected with the micro fan 3 through a connecting rod 5, the connecting rod 5 comprises a support plate 501, a clamping groove 502, a clamping ball 503, a short rod 504, a circular groove 505, an inserting rod 506, upright rods 507 and a butterfly rubber sleeve 508, the two support plates 501 are respectively positioned at the left side and the right side of the silica gel heat conduction sleeve 402, a part of the support plate 501 penetrates through the silica gel heat conduction sleeve 402 to be fixedly connected with a graphite plate 401, the upper surface of the support plate 501 is provided with the clamping groove 502, the clamping ball 503 is clamped inside the clamping groove 502, the top end of the clamping ball 503 is fixedly connected with the short rod 504, the center of the top end of the short rod 504 is provided with the circular groove 505, the inserting rod 506 is inserted inside the circular groove 505, the outer wall of the inserting rod 506 is in clearance fit with the inner wall of the circular groove 505, the top ends of the inserting rod 506 are fixedly connected with the upright rods 507, the top ends of the two upright rods 507 are respectively fixedly connected at the, the butterfly rubber sleeve 508 has certain toughness, when the butterfly rubber sleeve 508 is in a compressed state, the short rod 504 can generate a certain downward acting force, the lower surface of the silica gel heat conduction sleeve 402 can be attached to the upper surface of the chip 2, the bottom end of the butterfly rubber sleeve 508 is fixedly connected with the short rod 504, the distance between the inner wall of the butterfly rubber sleeve 508 and the outer wall of the insertion rod 506 is 0.5-1mm, so that the butterfly rubber sleeve 508 is prevented from influencing the up-down movement of the insertion rod 506, the clamping ball 503 and the clamping groove 502 form a clamping structure, namely, the clamping groove 502 can exert a certain acting force on the clamping ball 503, and the clamping ball 503 cannot be separated from the clamping groove 502 when not pulled out by strong external force.

When the laser 1 is in normal operation, the bottom end of the micro fan 3 can generate gas flow to blow towards the inside of the laser 1, and the heat generated in the operation process of the chip 2 can be effectively absorbed and conducted by the silica gel heat conduction sleeve 402 and the graphite plate 401, and the heat is discharged through the heat dissipation groove on the housing of the laser 1 together with the air flow generated at the bottom end of the micro fan 3, it is worth explaining that a part of the air flow can blow towards the inside of the through hole 403 through the inclined hole 406 during the period, that is, the air flow in the flow process can blow away the heat with the rubber ring 404 inside the through hole 403, so that the contact area between the heat sink 4 and the air flow can be increased, the heat conduction in the heat sink 4 is facilitated, the heat dissipation effect of the heat sink 4 on the chip 2 is improved, the long-term stable use of the semiconductor laser is facilitated, when the dust cleaning maintenance needs to be performed to the inside of the housing of the, can be with phase separation between micro fan 3 and the laser instrument 1, heat sink 4 moves with micro fan 3 through the transmission of connecting rod together this moment, can be with card ball 503 and draw-in groove 502 phase separation at this moment to can dismantle heat sink 4, the inclined hole 40 in heat sink 4 is cleared up with the inside remaining a small amount of dust of through-hole 403 together to the in-process of the inside deashing operation of laser instrument 1 shell, then resetting each part, so that keep the radiating effect of each part in laser instrument 1.

In the description of the present invention, it is to be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "other end", "upper", "one side", "top", "inner", "front", "center", "both ends", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "disposed," "connected," "fixed," "screwed" and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate medium, and may be connected through the inside of two elements or in an interaction relationship between two elements, unless otherwise specifically defined, and the specific meaning of the above terms in the present invention will be understood by those skilled in the art according to specific situations.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a semiconductor laser heat sink, includes laser instrument (1), chip (2) and miniature fan (3), chip (2) are installed to the inside bottom of laser instrument (1), the last surface mounting of laser instrument (1) has miniature fan (3), its characterized in that: the upper surface of the chip (2) is provided with a heat sink (4);

the heat sink (4) comprises a graphite plate (401), a silica gel heat conduction sleeve (402), a through hole (403), a rubber ring (404), a support rod (405) and an inclined hole (406);

the graphite plate (401) is positioned above the chip (2), the outer wall of the graphite plate (401) is sleeved with a silica gel heat conduction sleeve (402), the lower surface of the silica gel heat conduction sleeve (402) is attached to the upper surface of the chip (2), the front surface of the silica gel heat-conducting sleeve (402) is provided with a plurality of through holes (403) from left to right in turn, the through holes (403) sequentially penetrate through the silica gel heat conduction sleeve (402) and the graphite plate (401), two rubber rings (404) are arranged in the through hole (403), the two rubber rings (404) are fixedly connected through a support rod (405), the outer wall of the rubber ring (404) on the outer side is in interference fit with the inner wall of the through hole (403), the upper surface of the silica gel heat conduction sleeve (402) is provided with a plurality of inclined holes (406), the inclined hole (406) penetrates through the silica gel heat conduction sleeve (402) and a part of the graphite plate (401) in sequence and is communicated with the through hole (403).

2. A semiconductor laser heatsink as claimed in claim 1, wherein: the graphite plate (401) is positioned right below the micro fan (3).

3. A semiconductor laser heatsink as claimed in claim 1, wherein: the ratio of the upper end to the lower end of the inner diameter of the inclined hole (406) is 3: 1.

4. A semiconductor laser heatsink as claimed in claim 1, wherein: the heat sink (4) is connected with the micro fan (3) through a connecting rod (5);

the connecting rod (5) comprises a support plate (501), a clamping groove (502), a clamping ball (503), a short rod (504), a circular groove (505), an inserting rod (506), an upright rod (507) and a butterfly rubber sleeve (508);

the two support plates (501) are respectively positioned at the left side and the right side of the silica gel heat conduction sleeve (402), one part of each support plate (501) penetrates through the silica gel heat conduction sleeve (402) to be fixedly connected with the graphite plate (401), a clamping groove (502) is formed in the upper surface of each support plate (501), a clamping ball (503) is clamped in the clamping groove (502), a short rod (504) is fixedly connected to the top end of the clamping ball (503), a circular groove (505) is formed in the center of the top end of the short rod (504), an inserting rod (506) is inserted into the circular groove (505), the outer wall of the inserting rod (506) is in clearance fit with the inner wall of the circular groove (505), a vertical rod (507) is fixedly connected to the top end of the inserting rod (506), the top ends of the two vertical rods (507) are fixedly connected to the left side and the right side of the bottom end of the micro fan (3) respectively, and butterfly rubber sleeves (508) are fixedly, the bottom end of the butterfly rubber sleeve (508) is fixedly connected with the short rod (504).

5. A semiconductor laser heatsink as claimed in claim 4, wherein: the distance between the inner wall of the butterfly rubber sleeve (508) and the outer wall of the inserted rod (506) is 0.5-1 mm.

6. A semiconductor laser heatsink as claimed in claim 4, wherein: the clamping ball (503) and the clamping groove (502) form a clamping structure.