CN212116030U

CN212116030U - Picture transmission transmitting device

Info

Publication number: CN212116030U
Application number: CN202020843187.2U
Authority: CN
Inventors: 卢致辉; 卢光宋; 陈金颖; 陈钦; 谭龙
Original assignee: Shenzhen Micromulticopter Aero Technology Co Ltd
Current assignee: Zhejiang Cobit Innovation Technology Co ltd
Priority date: 2020-05-19
Filing date: 2020-05-19
Publication date: 2020-12-08
Anticipated expiration: 2030-05-19

Abstract

The utility model belongs to the technical field of unmanned aerial vehicle, more specifically say, relate to a picture biography emitter. The heat dissipation fan comprises a shell with an installation cavity, a circuit board installed in the installation cavity and a fan assembly used for dissipating heat, wherein the fan assembly comprises a heat dissipation fan electrically connected with the circuit board, the position, opposite to the circuit board, of the top surface of the shell, deviating from the circuit board, is provided with an embedded groove, the heat dissipation fan is installed in the embedded groove, and an air outlet of the heat dissipation fan is communicated with external air. During the use, open radiator fan, radiator fan carries out the forced air cooling heat dissipation to the casing, and the heat that will conduct to the casing in time looses, and so, the heat that electronic component on the circuit board produced in the use can be fast timely give off to reduce the heat and accumulate in the casing again, effectively avoid the picture to pass emitter the overheated condition to appear, the whole heat dispersion of device improves, provides good guarantee for the normal use of device.

Description

Picture transmission transmitting device

Technical Field

The utility model belongs to the technical field of unmanned aerial vehicle, more specifically say, relate to a picture biography emitter.

Background

After unmanned aerial vehicle flies and keeps away from people's eye sight, can only pass the image observation place ahead scene that emitter returned through camera and picture, the operator makes corresponding control according to the picture of passback, if keep away the barrier, slow down, turn to and operation such as go up and down, so camera and picture pass emitter be the essential subassembly of unmanned aerial vehicle.

Generally, a circuit board is installed in a map transmission device, and various electronic components are installed on the circuit board and used for realizing signal conversion and transmission of various information such as image information. The existing graph transmission transmitting device generally radiates by arranging the radiating holes on the shell, the radiating effect is poor, the heat cannot be timely radiated, the temperature of the device is easily overhigh, the overall performance of the graph transmission transmitting device is influenced, and when the weather is hot, the overheating phenomenon is more obvious, and even the device can be burnt.

SUMMERY OF THE UTILITY MODEL

An object of the embodiment of the utility model is to provide a transmitting device is passed to picture to solve the not good, the heat of transmitting device radiating effect of picture biography that exists among the prior art technical problem that can not in time effluvium.

In order to achieve the above object, the utility model adopts the following technical scheme: the utility model provides a picture passes emitter, including the casing that has the installation cavity, install in circuit board in the installation cavity, and install in on the casing and be used for radiating fan assembly, fan assembly include with circuit board electric connection's radiator fan, the casing deviates from the top surface of circuit board is just right the position department of circuit board is provided with the inlay groove, radiator fan install in the inlay groove, just radiator fan's air outlet is linked together with the outside air.

Furthermore, a plurality of strip-shaped long holes which are arranged side by side are formed in the bottom of the embedding groove, and each strip-shaped long hole is positioned right above the electronic element on the circuit board.

Furthermore, the fan assembly further comprises a heat dissipation cover which is used for being matched with the sealing cover and covering the embedded groove, and a plurality of heat dissipation holes communicated with the air outlet are formed in the position, facing the air outlet, of the heat dissipation cover.

Furthermore, the cooling fan comprises a fan shell installed in the embedding groove and a fan main body contained in the fan shell, the fan main body is rotatably installed in the fan shell, a plurality of air inlet holes are formed in the bottom surface of the fan shell, and the air outlet is formed in the top surface of the fan shell.

Further, the heat dissipation opening is located right above the air outlet.

Furthermore, the side of fan housing still is provided with the lateral part uncovered, the uncovered edge of lateral part the width direction of casing sets up, the casing top surface dodges and opens the position department of inlaying the dress groove still follows the length direction interval of casing is provided with a plurality of fin, and adjacent two be formed with just right between the fin the open air current clearance of lateral part.

Furthermore, the bottom of the heat dissipation cover is vertically and convexly provided with a plurality of connecting studs, connecting holes for fasteners to be matched and penetrated are formed in the bottoms of the embedding grooves corresponding to the connecting studs, and the fasteners penetrate through the connecting holes and are fixedly connected with the connecting studs so as to fixedly connect the heat dissipation cover to the top of the embedding grooves.

Furthermore, each side wall of the radiating fin is provided with at least one support column in a protruding mode, the end portion, close to the embedded groove, of the radiating fin is provided with a step portion, the top of each support column and the top of the step portion are arranged in the same height mode, the height of each support column and the height of the top of the step portion are higher than the height of the top face of the fan shell, and the bottom face of the radiating cover abuts against the top faces of the support columns and the step portions.

Furthermore, the top heights of the supporting columns and the step parts are lower than the height of the side wall of the embedded groove, the radiating cover is embedded in the embedded groove, and the top surface of the radiating cover is flush with the top of the radiating fin.

Further, the casing is including upper casing and the inferior valve of dismantling the connection, the upper casing with the inferior valve encloses jointly to establish form the installation cavity, inlay the dress groove set up in the upper casing deviates from the top surface of inferior valve, fan unit mount in on the upper casing.

The utility model provides an above-mentioned one or more technical scheme in the picture biography emitter have one of following technological effect at least: through installing fan unit on the casing, during the use, the radiator fan who will set up in the inlay inslot of casing is opened, radiator fan starts and carries out the forced air cooling heat dissipation to the casing, thereby in time the effluvium of heat that will conduct to the casing, so, the heat that electronic component on the circuit board produced in the use can be fast timely give off, thereby reduce heat and in the casing accumulation again, effectively avoid picture to pass emitter the overheated condition to appear, the whole heat dispersion of device improves, provide good guarantee for the normal use of device.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive labor.

Fig. 1 is a schematic structural diagram of a map transmission transmitting device according to an embodiment of the present invention;

FIG. 2 is an exploded view of the schematic diagram transmission device shown in FIG. 1;

FIG. 3 is a sectional view taken along line A-A of FIG. 1;

FIG. 4 is a schematic structural diagram of an upper housing of the schematic transmission device shown in FIG. 1;

FIG. 5 is a schematic structural diagram of a heat dissipation fan of the schematic transmission device shown in FIG. 1;

fig. 6 is a schematic structural diagram of a heat dissipation cover of the schematic emission device shown in fig. 1.

Wherein, in the figures, the respective reference numerals:

10-housing 11-installation cavity 12-upper shell

13-lower case 20-circuit board 21-electronic component

30-fan assembly 31-radiating fan 32-radiating cover

121-embedding groove 122-strip-shaped long hole 123-radiating fin

124-airflow gap 125-connecting hole 126-supporting column

131-radiating long hole 311-fan main body 312-fan shell

321-heat dissipation hole 322-connecting stud 1231-step part

3121 an air outlet 3122 and an opening at the side.

Detailed Description

In order to make the technical problem, technical scheme and beneficial effect that the utility model will solve more clearly understand, it is right to combine figure 1 ~ 6 and embodiment below the utility model discloses further detailed description proceeds. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

As shown in fig. 1-6, an embodiment of the present invention provides a graph transmission device, which can be a wired or wireless graph transmission device. Specifically, as shown in fig. 1 to 3, the image transmitting device includes a housing 10 having a mounting cavity 11, a circuit board 20 mounted in the mounting cavity 11, and a fan assembly 30 mounted on the housing 10 for dissipating heat. Wherein, the casing 10 is made of metal, and has good heat conduction capability, so as to be able to conduct and dissipate heat in the installation cavity 11, preferably, in this embodiment, the casing 10 is made of aluminum alloy material, and the whole weight of the casing 10 is light, and has excellent heat conduction and heat dissipation capability; the circuit board 20 is a core component of the image transmission transmitting device of the embodiment for realizing the image transmission function, and is provided with various electronic components 21, such as a power supply component, a signal initial transmitting component, a signal processing component, an interface component, and the like; the fan assembly 30 includes a heat dissipation fan 31 electrically connected to the circuit board 20, a position of the top surface of the casing 10 away from the circuit board 20 and facing the circuit board 20 is provided with an embedded groove 121, the heat dissipation fan 31 is installed in the embedded groove 121, and an air outlet (shown in the drawing) of the heat dissipation fan 31 is communicated with the outside air to dissipate heat.

The utility model discloses emitter is passed to picture, through installation fan subassembly 30 on casing 10, in use, radiator fan 31 that will set up in casing 10's inlay inslot 121 is opened, radiator fan 31 starts and carries out the forced air cooling heat dissipation to casing 10, thereby in time the effluvium of heat that will conduct to casing 10, thus, the heat that electronic component 21 on circuit board 20 produced in the use, can be fast timely give off, can reduce heat and accumulate in casing 10 again, thereby effectively avoid the picture of this embodiment to pass emitter and appear overheated condition, the whole heat dispersion of device improves, the normal use that emitter is passed to the picture of this embodiment provides good guarantee.

In another embodiment of the present invention, as shown in fig. 2 and 4, a plurality of bar-shaped long holes 122 are formed at the bottom of the embedding groove 121 and arranged side by side, and each bar-shaped long hole 122 is located right above the electronic component 21 on the circuit board 20. Specifically, the elongated hole 122 may be a blind hole, so that heat generated by the circuit board 20 can be conducted and dissipated via the bottom of the embedded groove 121 and the wall of the elongated hole 122, the elongated hole 122 provides more space for air to flow, and the contact heat dissipation area between the air and the housing 10 is increased, thereby improving the heat dissipation capability of the image transmission transmitting device of the embodiment; of course, in other embodiments, the elongated hole 122 may be a through hole, so that the embedded groove 121 is directly in air communication with the installation cavity 11, which is more beneficial to dissipating heat in the installation cavity 11.

In another embodiment of the present invention, as shown in fig. 1 and fig. 2, the fan assembly 30 further includes a heat dissipation cover 32 for adapting to the cover-embedding groove 121, and the heat dissipation cover 32 is disposed at a position opposite to the air outlet 3121 of the heat dissipation fan 31 and has a plurality of heat dissipation holes 321 communicated with the air outlet 3121 for air circulation and heat dissipation. The heat dissipation cover 32 is arranged to cover the embedded groove 121, that is, the heat dissipation fan 31 is accommodated in the embedded groove 121, so that external impurities and the like are prevented from falling into the embedded groove 121 and affecting the normal rotation work of the heat dissipation fan 31, meanwhile, the heat dissipation hole 321 is formed in the heat dissipation cover 32, and the heat is conveyed to the heat dissipation hole 321 by the heat dissipation fan 31 through air flow and is dissipated out in time.

In the present embodiment, as shown in fig. 2, the heat dissipating cover 32 is provided with a plurality of heat dissipating holes 321, each heat dissipating hole 321 is disposed at a position of the heat dissipating cover 32 facing the air outlet 3121 of the heat dissipating fan 31 in a ring shape, so as to ensure that heat taken out from the air outlet 3121 by the heat dissipating fan 31 can be directly dissipated through the heat dissipating hole 321, thereby improving the heat dissipating efficiency.

Preferably, in the present embodiment, the heat dissipation cover 32 is preferably made of a metal material, which is helpful for heat conduction and heat dissipation.

In another embodiment of the present invention, as shown in fig. 2, fig. 3 and fig. 5, the heat dissipation fan 31 includes a fan housing 312 installed in the embedded groove 121 and a fan main body 311 accommodated in the fan housing 312, the fan housing 312 is fastened in the embedded groove 121 through screws and the like, the fan housing 312 is used for protecting the fan main body 311, the fan main body 311 is rotatably installed in the fan housing 312, a plurality of air inlets (not shown) are opened on the bottom surface of the fan housing 312 facing the bottom of the embedded groove 121, and the air outlet 3121 is disposed on the top surface of the fan housing 312 away from the bottom of the embedded groove 121.

Preferably, as shown in fig. 1, the heat dissipation hole 321 is located right above the air outlet 3121, that is, the heat dissipation hole 321 faces the air outlet 3121, so that the high-temperature air can be dissipated in the shortest distance, the heat dissipation time is shorter, and the heat dissipation effect is more obvious.

Further, in this embodiment, as shown in fig. 2, 3 and 5, a side opening 3122 is further disposed on a side of the fan housing 312, the side opening 3122 is disposed along a width direction of the casing 10, a plurality of fins 123 are further disposed at a position where the top surface of the casing 10 avoids the embedded groove 121 along a length direction of the casing 10 at intervals, an airflow gap 124 facing the side opening 3122 is formed between two adjacent fins 123, and when the heat dissipation fan 31 starts to dissipate heat, external air can enter the fan housing 312 through the airflow gap 124 and then enter the embedded groove 121 to perform contact heat exchange. Meanwhile, the arrangement of the heat radiating fins 123 also increases the heat conducting and heat radiating area of the shell 10, the contact area of the shell 10 and the air is increased, and the heat radiating capacity is better.

In the present embodiment, the heat sink 123 is a metal sheet with good heat conduction and dissipation capability, and is preferably made of the same material as the housing 10, so as to simplify the manufacturing process.

In another embodiment of the present invention, as shown in fig. 2 and fig. 6, the bottom of the heat dissipation cover 32 is vertically provided with a plurality of connecting studs 322, the bottom of the embedded groove 121 is provided with a connecting hole 125 for the fastener to be fitted and installed, the fastener passes through the connecting hole 125 and is fastened and connected to the connecting stud 322, so as to fasten and connect the heat dissipation cover 32 to the top of the embedded groove 121, i.e. the heat dissipation cover 32 is connected to the housing 10 through a bolt or a screw, etc., which is simple in assembly and disassembly operation and more flexible and convenient in use.

Preferably, in this embodiment, as shown in fig. 2, 4 and 6, the embedding groove 121 is a square groove, the heat dissipation cover 32 is a square cover adapted to the square groove, and the four corners of the heat dissipation cover 32 are respectively provided with one connection stud 322, so that the assembly connection between the heat dissipation cover 32 and the housing 10 is more stable and reliable.

In another embodiment of the present invention, as shown in fig. 2, fig. 4 and fig. 6, each sidewall of the embedded groove 121 avoiding the heat sink 123 is provided with at least one supporting column 126, the end of the heat sink 123 close to the embedded groove 121 is provided with a step portion 1231, the top of the supporting column 126 and the top of the step portion 1231 are arranged at the same height, and the height of the supporting column 126 and the step portion 1231 is higher than the top surface height of the fan housing 312, the bottom surface of the heat sink cover 32 offsets with the top surfaces of the supporting column 126 and the step portion 1231, so as to ensure that the heat sink cover 32 covers the heat sink fan 31, and the supporting column 126 and the step portion 1231 are arranged to support the heat sink cover 32, thereby avoiding the heat sink cover 32 from being.

Further, in the present embodiment, as shown in fig. 3, 4 and 6, the heights of the top portions of the supporting column 126 and the step portion 1231 are lower than the height of the sidewall of the embedded groove 121, the heat dissipation cover 32 is embedded in the embedded groove 121, and the top surface of the heat dissipation cover 32 is flush with the top portion of the heat dissipation fin 123, so that the appearance is more compact and neat.

In another embodiment of the present invention, as shown in fig. 1, fig. 2 and fig. 3, the casing 10 includes an upper casing 12 and a lower casing 13 which can be detachably connected, specifically, the upper casing 12 is screwed or fastened with the lower casing 13, the upper casing 12 and the lower casing 13 jointly enclose the installation cavity 11, the circuit board 20 is installed in the installation cavity 11, and is fixed to the upper casing 12 or the lower casing 13, so as to avoid the circuit board 20 from shaking in the installation cavity 11, the embedded groove 121 is disposed on the top surface of the upper casing 12 deviating from the lower casing 13, and the fan assembly 30 is installed on the upper casing 12.

Further, in this embodiment, as shown in fig. 3, a heat dissipation long hole 131 is further disposed on a bottom surface of the lower casing 13 away from the upper casing 12, the heat dissipation long hole 131 is a blind hole, so as to prevent external impurities from entering the installation cavity 11 through the heat dissipation long hole 131, and the arrangement of the heat dissipation long hole 131 increases a contact area between the lower casing 13 and air, thereby facilitating heat conduction and heat dissipation of the lower casing 13, and further improving a heat dissipation effect of the image transmission device of this embodiment.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. The utility model provides a picture passes emitter which characterized in that, including the casing that has the installation cavity, install in circuit board in the installation cavity, and install in on the casing and be used for radiating fan assembly, fan assembly include with circuit board electric connection's radiator fan, the top surface that the casing deviates from the circuit board is just to the position department of circuit board is provided with the inlay groove, radiator fan install in the inlay groove, just radiator fan's air outlet is linked together with the outside air.

2. The image transmission apparatus according to claim 1, wherein: and a plurality of strip-shaped long holes which are arranged side by side are formed at the bottom of the embedding groove, and each strip-shaped long hole is positioned right above the electronic element on the circuit board.

3. The image transmission apparatus according to claim 1, wherein: the fan component further comprises a heat dissipation cover which is used for being matched with the sealing cover and covering the embedded groove, and a plurality of heat dissipation holes communicated with the air outlet are formed in the position, right facing the air outlet, of the heat dissipation cover.

4. The image transmission apparatus according to claim 3, wherein: the cooling fan comprises a fan shell arranged in the embedding groove and a fan main body contained in the fan shell, the fan main body is rotatably arranged in the fan shell, a plurality of air inlet holes are formed in the bottom surface of the fan shell, and the air outlet is formed in the top surface of the fan shell.

5. The image transmission apparatus according to claim 4, wherein: the heat dissipation holes are located right above the air outlet.

6. The image transmission apparatus according to claim 4, wherein: the side of fan housing still is provided with the lateral part uncovered, the uncovered edge of lateral part the width direction of casing sets up, the casing top surface dodges and opens the position department of inlay the dress groove still follows the length direction interval of casing is provided with a plurality of fin, and adjacent two be formed with just right between the fin the open air flow gap of lateral part.

7. The image transmission apparatus according to claim 6, wherein: the bottom of the heat dissipation cover is vertically and convexly provided with a plurality of connecting studs, connecting holes for fasteners to be matched and penetrated are formed in the bottoms of the embedded grooves corresponding to the connecting studs, and the fasteners penetrate through the connecting holes and are fixedly connected with the connecting studs so as to fixedly connect the heat dissipation cover to the top of the embedded grooves.

8. The image transmission apparatus according to claim 7, wherein: the side walls of the radiating fins are provided with at least one supporting column in a protruding mode, the end portions, close to the embedded grooves, of the radiating fins are provided with step portions, the tops of the supporting columns and the top of the step portions are arranged in the same height mode, the heights of the tops of the supporting columns and the tops of the step portions are higher than the height of the top face of the fan shell, and the bottom face of the radiating cover abuts against the supporting columns and the top face of the step portions.

9. The image transmission apparatus according to claim 8, wherein: the top height of the support column and the top height of the step part are both lower than the height of the side wall of the embedded groove, the radiating cover is embedded in the embedded groove, and the top surface of the radiating cover is flush with the top of the radiating fin.

10. The map-transmission transmitting device according to any one of claims 1 to 8, wherein: the casing is including dismantling the epitheca and the inferior valve of connection, the epitheca with the inferior valve encloses jointly and establishes formation the installation cavity, inlay the dress groove set up in the epitheca deviates from the top surface of inferior valve, fan unit install in on the epitheca.