CN212116024U - Photoelectric sensor's enclosed construction - Google Patents
Photoelectric sensor's enclosed construction Download PDFInfo
- Publication number
- CN212116024U CN212116024U CN202020778414.8U CN202020778414U CN212116024U CN 212116024 U CN212116024 U CN 212116024U CN 202020778414 U CN202020778414 U CN 202020778414U CN 212116024 U CN212116024 U CN 212116024U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- photoelectric sensor
- casing
- heat
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000010276 construction Methods 0.000 title abstract description 9
- 230000017525 heat dissipation Effects 0.000 claims abstract description 84
- 238000009434 installation Methods 0.000 claims abstract description 4
- 238000010438 heat treatment Methods 0.000 claims abstract description 3
- 238000010030 laminating Methods 0.000 claims abstract description 3
- 238000007789 sealing Methods 0.000 claims description 35
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 16
- 239000000741 silica gel Substances 0.000 claims description 7
- 229910002027 silica gel Inorganic materials 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 5
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 claims description 4
- 239000002041 carbon nanotube Substances 0.000 claims description 4
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 12
- 239000007789 gas Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- KJLPSBMDOIVXSN-UHFFFAOYSA-N 4-[4-[2-[4-(3,4-dicarboxyphenoxy)phenyl]propan-2-yl]phenoxy]phthalic acid Chemical compound C=1C=C(OC=2C=C(C(C(O)=O)=CC=2)C(O)=O)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=C(C(O)=O)C(C(O)=O)=C1 KJLPSBMDOIVXSN-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- DOTMOQHOJINYBL-UHFFFAOYSA-N molecular nitrogen;molecular oxygen Chemical compound N#N.O=O DOTMOQHOJINYBL-UHFFFAOYSA-N 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
The utility model discloses a photoelectric sensor's enclosed construction, including last casing and the lower casing of mutual lock complete box body, be equipped with installation photoelectric sensor's collar in the upper casing, the inboard of collar is equipped with heat abstractor, heat abstractor includes the heat dissipation person in charge and connects the heat dissipation branch pipe on the heat dissipation person in charge with photoelectric sensor's bottom laminating, keeping away from of heat dissipation branch pipe the one end that the heat dissipation person in charge extends to go up the outside of casing, go up be equipped with on the lateral wall of casing with heat dissipation branch union's heating panel. The utility model discloses a photoelectric sensor's enclosed construction has that the radiating effect is good, small, convenient to use's advantage.
Description
Technical Field
The utility model relates to a sensor encapsulation field especially relates to a photoelectric sensor's enclosed construction.
Background
The photoelectric sensor can generate heat during working, the working temperature is high, electronic thermal noise is generated, and the detection sensitivity of the sensor is influenced. Traditional sensor packaging structure generally adopts hydrologic cycle heat dissipation or air-cooled heat dissipation, so set up, can lead to packaging structure's volume grow, influences the use.
SUMMERY OF THE UTILITY MODEL
To the above problem, the utility model provides a photoelectric sensor's enclosed construction has that the radiating effect is good, small, convenient to use's advantage.
The technical scheme of the utility model is that:
the utility model provides a photoelectric sensor's enclosed construction, includes last casing and the lower casing that each other lock becomes complete box body, be equipped with the collar of installation photoelectric sensor in the upper casing, the inboard of collar is equipped with heat abstractor, heat abstractor includes the heat dissipation person in charge and the heat dissipation branch pipe of being connected on the heat dissipation person in charge of with photoelectric sensor's bottom laminating, keeping away from of heat dissipation branch pipe the lateral wall that the one end that the heat dissipation was responsible for passed collar and last casing in proper order extends to go up the outside of casing, go up be equipped with on the lateral wall of casing with the heat dissipation branch union coupling be hollow structure's heating panel.
The working principle of the technical scheme is as follows:
the heat generated by the photoelectric sensor in the working process is absorbed by the heat dissipation main pipe attached to the bottom of the photoelectric sensor, the heat dissipation main pipe, the heat dissipation branch pipe and the heat dissipation plate have higher heat conductivity, after the heat dissipation main pipe absorbs the heat, the heat can be rapidly transmitted to the heat dissipation plate outside the structure, the heat dissipation area of the heat on the heat dissipation plate is increased, the heat can be rapidly exchanged with the outside air and transmitted to the outside, the working environment of the photoelectric sensor is cooled through the rapid heat transmission (the higher the temperature is, the faster the heat transmission speed is), so that the environmental temperature of the photoelectric sensor is always kept below the safe temperature, the normal work of the photoelectric sensor is ensured, compared with the traditional water circulation heat dissipation or air cooling heat dissipation, the utility model has the advantages of simple structure, small occupied volume, more convenient use and replacing the traditional heat dissipation mode of arranging an air outlet, the sealing performance in the structure is ensured.
In a further technical scheme, the bottom that the heat dissipation was responsible for is connected with the pillar, correspond on the casing down the pillar is equipped with the constant head tank, works as go up the casing with when casing lock down, the bottom of pillar holds in the constant head tank, strengthen the location of being responsible for the heat dissipation, solved the heat dissipation and be responsible for and appear removing in last casing, lead to the unstable technical problem of device inner structure.
In a further technical scheme, the bottom of pillar with fixed first magnet and the second magnet of being equipped with respectively in the constant head tank, work as go up the casing with during the casing lock, first magnet and the mutual actuation of second magnet, through the mutual actuation effect of first magnet and second magnet, can strengthen the stability of being connected between casing and the lower casing, solved in the use, go up the casing and the unable technical problem who stabilizes the connection that carries on of casing down, in addition, still can set up the blind hole on last casing, set up the through-hole that corresponds with the blind hole on the casing down, pass through-hole and blind hole through the dead lever and go up the casing and carry out further positioning connection with the lower casing.
In a further technical scheme, be equipped with the sealed arch of round on the bottom terminal surface of going up the casing, correspond on the casing down sealed arch embedding is equipped with round silica gel sealing washer, the top of silica gel sealing washer be equipped with sealed protruding complex seal groove, when last casing and casing lock down, through the inseparable cooperation of sealed arch and seal groove, can play good sealed effect, guarantee the inside leakproofness of enclosed construction, solved that external gas easily enters into the structure inside and corrode electrical components, cause the technical problem that the life of equipment shortens.
In a further technical scheme, the heat dissipation main pipe is a clip pipe, so that heat generated by the photoelectric sensor in the working process is conveniently transferred to the bottom of the closed structure, meanwhile, the heat transfer area of the heat dissipation device is indirectly increased, and the heat transfer effect is improved.
In a further technical scheme, the main radiating pipe, the branch radiating pipes and the radiating plate are made of copper-aluminum alloy materials which are doped with carbon nanotubes and have thermal conductivity of 400W/(m.K) -700W/(m.K), so that the heat conductivity coefficient is high, the heat transfer effect is good, and heat inside the closed structure can be conveniently and quickly transferred to the outside of the structure.
The utility model has the advantages that:
1. the utility model discloses an alloy board that thermal conductivity is high carries out heat conduction heat dissipation, has replaced the traditional radiating mode that sets up the air outlet, and simple structure occupies smallly, and it is more convenient to use, has guaranteed the inside leakproofness of structure.
2. The setting of pillar has strengthened the location of being responsible for the heat dissipation, prevents that the heat dissipation from being responsible for and appear removing in last casing, guarantees the stability of the inner structure of device.
3. Through the tight fit of sealed arch and seal groove, can play good sealed effect, guarantee the inside leakproofness of enclosed construction, prevent that external gas from getting into the inside electric elements that corrode of structure, prolonged the life of equipment.
4. The heat dissipation main pipe is a clip pipe, so that heat generated by the photoelectric sensor in the working process is conveniently transferred to the bottom of the closed structure, meanwhile, the heat transfer area of the heat dissipation device is indirectly increased, and the heat transfer effect is improved.
5. The heat dissipation device is made of copper-aluminum alloy materials doped with carbon nanotubes and having the thermal conductivity of 400W/(m.K) -700W/(m.K), has large thermal conductivity and good heat transfer effect, and is convenient for quickly transferring heat inside the closed structure to the outside of the structure.
Drawings
Fig. 1 is a first schematic structural diagram of a closed structure of a photoelectric sensor according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram ii of a closed structure of a photoelectric sensor according to an embodiment of the present invention;
FIG. 3 is a state diagram of the use of FIG. 2;
FIG. 4 is an enlarged view at A in FIG. 2;
fig. 5 is a schematic structural diagram of the heat dissipation main pipe according to the embodiment of the present invention.
Description of reference numerals:
100. an upper housing; 110. a light-transmitting window; 120. sealing the protrusion; 200. a lower housing; 210. a second magnet; 220. a silica gel seal ring; 221. a sealing groove; 300. a photosensor; 400. a light-transmitting quartz glass; 500. a cavity; 600. positioning the sealing ring; 700. a heat sink; 710. a heat dissipation main pipe; 720. a heat radiation branch pipe; 730. a heat dissipation plate; 740. a pillar; 741. a first magnet; 800. and (7) installing a ring.
Detailed Description
The embodiments of the present invention will be further explained with reference to the drawings.
Example (b):
as shown in fig. 1, a closed structure of a photoelectric sensor includes an upper casing 100 and a lower casing 200 that are fastened to each other to form a complete box, a photoelectric sensor 300, a mounting ring 800 and a positioning sealing ring 600 are disposed in the upper casing 100, a light-transmitting window 110 is disposed at the top of the upper casing 100 for receiving a light source, a light-transmitting quartz glass 400 is disposed at the light-transmitting window 110, the positioning sealing ring 600 is disposed at the inner top of the upper casing 100 for fixing the light-transmitting quartz glass 400, a first mounting groove and a second mounting groove are disposed at the top of the mounting ring 800, the positioning sealing ring 600 is disposed in the first mounting groove, the photoelectric sensor 300 is disposed in the second mounting groove, the light source is received by a photosensitive component of the photoelectric sensor 300 through the light-transmitting quartz glass 400, the photoelectric sensor 300 converts an optical signal into an electrical signal, a plurality of lead holes are disposed on a side wall, a needle-shaped electric signal plug kit is arranged in the lead hole, and an electric signal generated by the photoelectric sensor 300 is led out of the closed structure through the lead hole by an electric pin of the electric signal through the needle-shaped electric signal plug kit; a cavity 500 is arranged between the light-transmitting quartz glass 400 and the photosensitive component of the photoelectric sensor 300, and the cavity 500 is filled with anhydrous nitrogen-oxygen mixed protective gas, so that the fogging of the photosensitive component of the photoelectric sensor 300 and the light-transmitting quartz glass 400 can be prevented; the inboard of collar 800 is equipped with heat abstractor 700, heat abstractor 700 includes the heat dissipation that is close to with photoelectric sensor 300's bottom and is responsible for 710 and the heat dissipation branch pipe 720 of being connected on the heat dissipation is responsible for 710, keeping away from of heat dissipation branch pipe 720 the lateral wall that collar 800 and last casing 100 were passed in proper order to the one end of heat dissipation be responsible for 710 extends to go up the outside of casing 100, be equipped with on the lateral wall of going up casing 100 with the heat dissipation plate 730 that is hollow structure that heat dissipation branch pipe 720 is connected.
The working principle of the technical scheme is as follows:
the heat generated by the photoelectric sensor 300 during the working process is absorbed by the heat dissipation main pipe 710 attached to the bottom of the photoelectric sensor, the heat dissipation main pipe 710, the heat dissipation branch pipe 720 and the heat dissipation plate 730 have higher thermal conductivity, after the heat is absorbed by the heat dissipation main pipe 710, the heat can be rapidly transferred to the heat dissipation plate 730 outside the structure, the heat dissipation area of the heat on the heat dissipation plate 730 is increased, the heat can be rapidly exchanged with the outside air and transferred to the outside, and the heat can be rapidly transferred to the outside through such rapid heat transfer (the higher the temperature is, the faster the heat transfer speed is), so that the working environment of the photoelectric sensor 300 is cooled, the environmental temperature of the photoelectric sensor 300 is always kept below the safe temperature, the normal work of the photoelectric sensor 300 is ensured, and compared with the traditional water circulation heat dissipation or air cooling heat dissipation, the utility model has the advantages of simple structure, small occupied volume and more, the sealing performance in the structure is ensured.
When the utility model is installed, firstly, the transparent quartz glass 400, the positioning sealing ring 600, the photoelectric sensor 300 and the mounting ring 800 are installed correspondingly, and the inner ring cavity 500 of the positioning sealing ring 600 is filled with the anhydrous nitrogen-oxygen mixed protective gas, wherein the transparent quartz glass 400, the photoelectric sensor 300 and the positioning sealing ring 600 are all sealed and bonded, the installed part is put into the upper shell 100, and the mounting ring 800 is fixed, so that the transparent quartz glass 400, the positioning sealing ring 600, the photoelectric sensor 300 and the mounting ring 800 are fixed in the upper shell 100, then the heat dissipation main pipe 710 is placed at the corresponding position below the photoelectric sensor 300, the heat dissipation branch pipe 720 and the heat dissipation plate 730 are fixed in a welding or bonding mode, then the heat dissipation branch pipe 720 is inserted from the hole position reserved on the upper shell 100 and the mounting ring 800, and the heat dissipation branch pipe 720 is inserted into the heat dissipation main pipe 710 for a certain distance, so that the lap joint between the heat dissipation branch pipe 720 and the heat dissipation main pipe 710 is completed, and finally the sealant is adopted to seal the gap between the heat dissipation branch pipe 720 and the heat dissipation main pipe 710, so that the photoelectric sensor 300 is convenient to disassemble and maintain or replace, and finally the upper shell 100 and the lower shell 200 are buckled, thereby completing the installation.
In another embodiment, as shown in fig. 2 and 3, a support column 740 is connected to the bottom of the heat dissipation main pipe 710, and a positioning groove is formed in the lower housing 200 corresponding to the support column 740, so that when the upper housing 100 is fastened to the lower housing 200, the bottom of the support column 740 is accommodated in the positioning groove, thereby enhancing the positioning of the heat dissipation main pipe 710, and solving the technical problem that the internal structure of the device is unstable due to the movement of the heat dissipation main pipe 710 in the upper housing 100.
In another embodiment, as shown in fig. 2 and 3, a first magnet 741 and a second magnet 210 are respectively fixedly disposed at the bottom of the supporting column 740 and in the positioning groove, when the upper casing 100 is fastened to the lower casing 200, the first magnet 741 and the second magnet 210 attract each other, and the first magnet 741 and the second magnet 210 attract each other, so as to enhance the connection stability between the upper casing 100 and the lower casing 200, and solve the technical problem that the upper casing 100 and the lower casing 200 cannot be stably connected during use.
In another embodiment, as shown in fig. 2-4, a circle of sealing protrusion 120 is disposed on the bottom end surface of the upper casing 100, a circle of silica gel sealing ring 220 is disposed on the lower casing 200 corresponding to the sealing protrusion 120, a sealing groove 221 cooperating with the sealing protrusion 120 is disposed on the top of the silica gel sealing ring 220, when the upper casing 100 is fastened to the lower casing 200, a good sealing effect can be achieved by the close cooperation between the sealing protrusion 120 and the sealing groove 221, the sealing performance inside the sealing structure is ensured, and the technical problem that the service life of the device is shortened due to the fact that external gas easily enters the structure to corrode electrical components is solved.
In another embodiment, as shown in fig. 5, the heat dissipation main tube 710 is a rectangular tube, so that heat generated by the photoelectric sensor 300 during operation can be transferred to the bottom of the closed structure, and the heat transfer area of the heat dissipation device 700 is indirectly increased, thereby improving the heat transfer effect.
In another embodiment, the main heat dissipation pipe 710, the branch heat dissipation pipes 720 and the heat dissipation plate 730 are made of copper-aluminum alloy material doped with carbon nanotubes and having a thermal conductivity of 400W/(m · K) -700W/(m · K), so that the heat conductivity is high, the heat transfer effect is good, and the heat inside the closed structure can be conveniently and rapidly transferred to the outside of the structure.
The above-mentioned embodiments only express the specific embodiments of the present invention, and the description thereof is specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention.
Claims (6)
1. The utility model provides a closed structure of photoelectric sensor, its characterized in that includes last casing and the lower casing that buckles into complete box body each other, be equipped with the collar of installation photoelectric sensor in the upper casing, the inboard of collar is equipped with heat abstractor, heat abstractor includes the heat dissipation person in charge and the heat dissipation branch pipe of connection on the heat dissipation person in charge of with photoelectric sensor's bottom laminating, keeping away from of heat dissipation branch pipe the one end that the heat dissipation was responsible for extends to go up the outside of casing, be equipped with on the lateral wall of last casing with the heating panel that the heat dissipation branch pipe is connected.
2. The sealing structure of a photoelectric sensor according to claim 1, wherein a support is connected to a bottom of the heat sink main tube, a positioning groove is provided on the lower housing corresponding to the support, and when the upper housing is engaged with the lower housing, the bottom of the support is received in the positioning groove.
3. The sealing structure of a photoelectric sensor as claimed in claim 2, wherein a first magnet and a second magnet are respectively disposed at the bottom of the pillar and in the positioning groove, and the first magnet and the second magnet attract each other when the upper housing is engaged with the lower housing.
4. The sealing structure of a photoelectric sensor according to claim 1 or 3, wherein a circle of sealing protrusion is disposed on a bottom end surface of the upper housing, a circle of silica gel sealing ring is disposed on the lower housing corresponding to the sealing protrusion, and a sealing groove engaged with the sealing protrusion is disposed on a top of the silica gel sealing ring.
5. The sealing structure for a photoelectric sensor according to claim 4, wherein the heat dissipation main tube is a loop tube.
6. The closed structure of a photoelectric sensor as claimed in claim 5, wherein the main heat dissipation pipe, the branch heat dissipation pipe and the heat dissipation plate are all copper-aluminum alloy materials doped with carbon nanotubes and having a thermal conductivity of 400W/(m-K) -700W/(m-K).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020778414.8U CN212116024U (en) | 2020-05-12 | 2020-05-12 | Photoelectric sensor's enclosed construction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020778414.8U CN212116024U (en) | 2020-05-12 | 2020-05-12 | Photoelectric sensor's enclosed construction |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212116024U true CN212116024U (en) | 2020-12-08 |
Family
ID=73617156
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020778414.8U Expired - Fee Related CN212116024U (en) | 2020-05-12 | 2020-05-12 | Photoelectric sensor's enclosed construction |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212116024U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112859492A (en) * | 2020-12-31 | 2021-05-28 | 安徽东冶地质勘查技术有限公司 | Optical sensor assembly |
-
2020
- 2020-05-12 CN CN202020778414.8U patent/CN212116024U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112859492A (en) * | 2020-12-31 | 2021-05-28 | 安徽东冶地质勘查技术有限公司 | Optical sensor assembly |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN212116024U (en) | Photoelectric sensor's enclosed construction | |
| CN107816670A (en) | A kind of modularity waterproof high-power LED light power supply assembly | |
| CN204806077U (en) | High -power LED projecting lamp | |
| CN208754387U (en) | A kind of camera | |
| CN216357793U (en) | Waterproof power adapter | |
| CN113163696A (en) | Automatic heat dissipation communication device based on 5G | |
| CN217273714U (en) | Tile nail lamp with heat dissipation device | |
| CN106907611A (en) | A kind of light-operated LED light compensating lamp | |
| CN201934973U (en) | Tunnel electrodeless lamp | |
| CN205592745U (en) | Light -operated LED light filling lamp | |
| CN208074663U (en) | A kind of modularity waterproof high-power LED light power supply assembly | |
| CN213522912U (en) | Temperature control frequency converter for tobacco flue-curing house | |
| CN216158877U (en) | Soft light strip lamp without dark space | |
| CN212510550U (en) | LED light source module with good waterproof effect | |
| CN221225780U (en) | LED display module assembly with waterproof function | |
| CN219228263U (en) | Battery management control panel | |
| CN219283285U (en) | Waterproof type LED lamp pole screen | |
| CN210325850U (en) | Diode packaging structure | |
| CN215722786U (en) | Novel LED street lamp | |
| CN219832104U (en) | LED array display substrate | |
| CN216649374U (en) | Energy-saving heat dissipation type new forms of energy motor with breather valve | |
| CN217635530U (en) | Wall washer lamp convenient for heat dissipation | |
| CN221197333U (en) | LED lamp with heat dissipation base | |
| CN220856576U (en) | Image sensor packaging structure | |
| CN209084556U (en) | A kind of LED anti-explosion lamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201208 |