CN113163696A - Automatic heat dissipation communication device based on 5G - Google Patents
Automatic heat dissipation communication device based on 5G Download PDFInfo
- Publication number
- CN113163696A CN113163696A CN202110521745.2A CN202110521745A CN113163696A CN 113163696 A CN113163696 A CN 113163696A CN 202110521745 A CN202110521745 A CN 202110521745A CN 113163696 A CN113163696 A CN 113163696A
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- heat dissipation
- water tank
- water
- pipe
- communication device
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20209—Thermal management, e.g. fan control
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a 5G-based automatic heat dissipation communication device which comprises a main body assembly, a main body heat dissipation assembly and an auxiliary heat dissipation assembly, wherein the main body assembly comprises a shell, a cover plate, a PLC (programmable logic controller) plate, a temperature sensor, a signal transmitter, a bottom plate and a mounting hole; the main body radiating assembly comprises a fan, a water tank, a micro water pump, a pipe body, a coil pipe and a water inlet pipe; the fan is embedded in the upper surface of the cover plate, the water tank is welded on the lower surface of the cover plate, the upper surface of the water tank is communicated with a water inlet pipe, and a micro water pump is installed on one side of the water tank; pour into the water source into through the inlet tube in to the water tank, the inside water source of water tank flows in the coil pipe, at the in-process that the water source flows, absorbs the inside heat of casing, and at this moment, the water source becomes hot, and miniature pump's water inlet passes through the body and extracts the interior water source of coil pipe, and in the reinjection water tank, the completion is to the inside electronic component's of casing circulation heat dissipation, and the radiating effect is good.
Description
Technical Field
The invention relates to the technical field of communication equipment, in particular to an automatic heat dissipation communication device based on 5G.
Background
The 5G, also called 5G technology, refers to the fifth generation mobile communication technology and the cellular mobile communication technology, and the core of 5G is that analog signals representing sound and images are digitized in a mobile phone, converted by an analog-to-digital converter and transmitted as a bit stream, and the main advantage is that the data transmission rate is high, and the transmission of large data volume such as high-definition video and virtual reality can be satisfied.
Communication devices are divided into wired communication equipment and wireless communication equipment, the 5G communication technology is rapidly developed, and the communication speed of the communication devices is faster and faster;
in the process of using the communication device, an electronic element (namely, a PLC (programmable logic controller) board) in the communication device can emit a large amount of heat, the heat dissipation function of the existing communication device is poor, the heat is accumulated in the shell in a large amount, the time is long, and the service life of the electronic element in the communication device is easy to reduce.
Therefore, an automatic heat dissipation communication device based on 5G is provided.
Disclosure of Invention
The invention aims to provide a 5G-based automatic heat dissipation communication device to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: the automatic heat dissipation communication device based on the 5G comprises a main body assembly, a main body heat dissipation assembly and an auxiliary heat dissipation assembly, wherein the main body assembly comprises a shell, a cover plate, a PLC (programmable logic controller) plate, a temperature sensor, a signal transmitter, a bottom plate and a mounting hole;
the main body radiating assembly comprises a fan, a water tank, a micro water pump, a pipe body, a coil pipe and a water inlet pipe;
the fan is installed on the upper surface of the cover plate in an embedded mode, the water tank is welded on the lower surface of the cover plate, the upper surface of the water tank is communicated with a water inlet pipe, a micro water pump is installed on one side of the water tank, a water outlet of the micro water pump is communicated with the water tank, a water inlet of the micro water pump is communicated with one end of the pipe body, the other end of the pipe body is communicated with one end of the coil pipe, and the other end of the coil pipe is communicated with the;
the auxiliary heat dissipation assemblies are arranged in four groups, the auxiliary heat dissipation assemblies are arranged in the water tank, and the top of each auxiliary heat dissipation assembly penetrates through the water tank and the cover plate.
Preferably: the cover plate is fixedly connected to the upper surface of the shell through screws, the base plate is welded to the lower surface of the shell, and the upper surface of the base plate is symmetrically provided with two mounting holes.
Preferably: PLC board and signal transmitter all install in the inside diapire of casing, the signal output part of PLC board and signal transmitter's signal input part pass through wire signal connection.
Preferably: the temperature sensor is installed in the inside diapire of casing, temperature sensor's signal output part passes through the signal input part signal connection of wire and PLC board, the electrical output part of PLC board passes through the wire and the electrical input part electric connection of fan and miniature pump.
Preferably: the auxiliary radiating assembly comprises a sealing pipe body, a condensate layer, a heat absorption pipe section, a radiating pipe section and radiating fins;
the bottom of the sealing pipe body penetrates through the inside of the water tank, and the top of the sealing pipe body penetrates through the top of the water tank.
Preferably: and a condensed liquid layer is arranged inside the sealing pipe body.
Preferably: the heat absorption pipe section and the heat dissipation pipe section are arranged inside the sealing pipe body, and the heat dissipation pipe section is located above the heat dissipation pipe section.
Preferably: and the top of the outer side of the heat dissipation pipe section is sleeved with a heat dissipation fin.
Compared with the prior art, the invention has the beneficial effects that:
the temperature sensor is used for detecting the temperature inside the shell, detection information is sent to the PLC board, when the temperature is too high, the PLC board controls the fan and the micro water pump to be started to dissipate heat of electronic elements inside the shell, when the temperature inside the shell is normal, the fan and the micro water pump are turned off, heat dissipation work is automatically completed, the fan and the micro water pump do not need to be started all the time, and electric energy is saved;
injecting a water source into the water tank through the water inlet pipe, wherein the water source in the water tank flows in the coil pipe, absorbing heat in the shell in the flowing process of the water source, at the moment, the water source becomes hot, the water source in the coil pipe is extracted from the water inlet of the micro water pump through the pipe body and then injected into the water tank, so that circulating heat dissipation of electronic elements in the shell is completed, and the heat dissipation effect is good;
three, the water source becomes the hot back, the inside condensate layer of sealed body is arrived in heat transfer, the inside condensate layer of sealed body turns into vapour state by liquid, and upward movement, the condensate layer of vapour state rises to cooling tube section department from heat absorption tube section department, radiating fin improves the radiating effect of cooling tube section, the heat gives off to external back, the condensate layer of vapour state turns into liquid, the bottom of sealed body flows down, absorb the heat of the inside water of water tank again, make the temperature at the inside water source of water tank be in lower state all the time, improve the radiating effect to the inside electronic component of casing.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the interior of the housing of the present invention;
FIG. 3 is a schematic view of the interior of the sealing tube according to the present invention;
fig. 4 is a bottom view of the present invention.
In the figure: 10. a body assembly; 11. a housing; 12. a cover plate; 13. a PLC board; 14. a temperature sensor; 15. a signal transmitter; 16. a base plate; 17. mounting holes; 20. a main body heat dissipation assembly; 21. a fan; 22. a water tank; 23. a micro water pump; 24. a pipe body; 25. a coil pipe; 26. a water inlet pipe; 30. an auxiliary heat dissipation assembly; 31. sealing the tube body; 32. condensing the liquid layer; 33. a heat absorption pipe section; 34. a heat dissipation pipe section; 35. and (4) radiating fins.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Examples
Referring to fig. 1-4, the present invention provides a technical solution: A5G-based automatic heat dissipation communication device comprises a main body assembly 10, a main body heat dissipation assembly 20 and an auxiliary heat dissipation assembly 30, wherein the main body assembly 10 comprises a shell 11, a cover plate 12, a PLC (programmable logic controller) plate 13, a temperature sensor 14, a signal transmitter 15, a bottom plate 16 and a mounting hole 17;
the main body heat radiation component 20 comprises a fan 21, a water tank 22, a micro water pump 23, a pipe body 24, a coil pipe 25 and a water inlet pipe 26;
the fan 21 is embedded in the upper surface of the cover plate 12, the water tank 22 is welded on the lower surface of the cover plate 12, the upper surface of the water tank 22 is communicated with a water inlet pipe 26, a micro water pump 23 is installed on one side of the water tank 22, the water outlet of the micro water pump 23 is communicated with the water tank 22, the water inlet of the micro water pump 23 is communicated with one end of a pipe body 24, the other end of the pipe body 24 is communicated with one end of a coil pipe 25, and the other end of the coil pipe 25 is communicated with the water tank 22;
the auxiliary heat dissipating assemblies 30 are arranged in four groups, the auxiliary heat dissipating assemblies 30 are installed inside the water tank 22, and the top of the auxiliary heat dissipating assemblies 30 penetrates through the water tank 22 and the cover plate 12.
In this embodiment, specifically: the cover plate 12 is fixedly connected to the upper surface of the shell 11 through screws, the bottom plate 16 is welded to the lower surface of the shell 11, and two mounting holes 17 are symmetrically formed in the upper surface of the bottom plate 16; fix bottom plate 16 through two mounting holes 17 to with this device fixed, when overhauing this device, through the screw of dismantling apron 12, take off apron 12, can take off main part radiator unit 20, overhaul this device.
In this embodiment, specifically: the PLC board 13 and the signal emitter 15 are both arranged on the inner bottom wall of the shell 11, and the signal output end of the PLC board 13 is connected with the signal input end of the signal emitter 15 through a lead signal; the signals are converted by the PLC board 13, and the signals are transmitted by the signal transmitter 15 by utilizing the 5G technology, so that data communication is completed.
In this embodiment, specifically: the temperature sensor 14 is mounted on the inner bottom wall of the shell 11, the signal output end of the temperature sensor 14 is in signal connection with the signal input end of the PLC board 13 through a lead, and the electrical output end of the PLC board 13 is electrically connected with the electrical input ends of the fan 21 and the micro-water pump 23 through leads; detect the inside temperature of casing 11 through temperature sensor 14 to detect information and send PLC board 13 for, when the high temperature, PLC board 13 control fan 21 and miniature pump 23 start, dispel the heat to the inside electronic component of casing 11, and when the inside temperature of casing 11 is normal, close fan 21 and miniature pump 23, accomplish the work of dispelling the heat automatically, need not to start fan 21 and miniature pump 23 all the time, save the electric energy.
In this embodiment, specifically: the auxiliary radiating assembly 30 includes a sealing pipe body 31, a condensate layer 32, a heat absorbing pipe section 33, a radiating pipe section 34 and a radiating fin 35;
the bottom of the sealing tube 31 penetrates through the inside of the water tank 22, and the top of the sealing tube 31 penetrates through the top of the water tank 22; the bottom of the sealing tube body 31 performs heat transfer with the water inside the water tank 22.
In this embodiment, specifically: a condensed liquid layer 32 is arranged inside the sealing pipe body 31; after the water inside the water tank 22 transfers heat to the sealing tube 31, the condensed liquid layer 32 inside the sealing tube 31 is converted from a liquid state to a vapor state and moves upward.
In this embodiment, specifically: the sealing tube body 31 is internally provided with a heat absorption tube section 33 and a heat dissipation tube section 34, and the heat dissipation tube section 34 is positioned above the heat dissipation tube section 34; the condensed liquid layer 32 in the vapor state rises from the heat absorbing pipe section 33 to the heat radiating pipe section 34, and the heat is radiated to the outside.
In this embodiment, specifically: the top of the outer side of the heat dissipation pipe section 34 is sleeved with a heat dissipation fin 35; the heat dissipating fins 35 enhance the heat dissipating effect of the heat dissipating pipe section 34, and the vapor-state condensate layer 32 is converted into a liquid state, flows down the bottom of the sealing pipe body 31, and re-absorbs the heat of the water inside the water tank 22.
In this embodiment: the signal of the PLC board 13 is ZG043, and the model number of the temperature sensor 14 is WZP-N. The signal emitter 15 is in the model of TLG-G531F4E-20SC, the fan 21 is in the model of FS12038, and the micro water pump 23 is in the model of AQB-6V.
Working principle or structural principle, during the use, pour into the water source into the water tank 22 through the inlet tube 26, install the valve on the inlet tube 26, be used for opening or closing the inlet tube 26, temperature sensor 14 detects the inside temperature of casing 11, and send detected information to PLC board 13, when the temperature is too high, PLC board 13 control fan 21 and miniature pump 23 start, the inside water source of water tank 22 flows in coil pipe 25, in the process that the water source flows, absorb the inside heat of casing 11, at this moment, the water source becomes hot, the water source in miniature pump 23's water inlet draws the coil pipe 25 through body 24, pour into the water tank 22 again, accomplish the circulation heat dissipation to the inside electronic component of casing 11, the radiating effect is good, simultaneously, after the water source becomes hot, heat transfer to the inside condensate liquid layer 32 of sealed body 31, the inside condensate layer 32 of sealed body 31 turns into vapour state from liquid, and move upward, the vaporous condensate layer 32 rises from the heat absorbing pipe section 33 to the heat dissipating pipe section 34, the heat dissipating fins 35 improve the heat dissipating effect of the heat dissipating pipe section 34, after the heat is dissipated to the outside, the vaporous condensate layer 32 is converted into a liquid state, flows down the bottom of the sealing pipe body 31, and re-absorbs the heat of the water in the water tank 22, so that the temperature of the water source in the water tank 22 is always in a lower state, the heat dissipating effect on the electronic components in the shell 11 is improved, when the temperature in the shell 11 is normal, the fan 21 and the micro water pump 23 are turned off, the heat dissipating work is automatically completed, the fan 21 and the micro water pump 23 do not need to be started all the time, the electric energy is saved, meanwhile, the fan 21 accelerates the exchange speed of the air in the shell 11 and the outside air, and the heat dissipating effect on the electronic components in the shell 11 is improved again.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. An automatic heat dissipation communication device based on 5G comprises a main body component (10), a main body heat dissipation component (20) and an auxiliary heat dissipation component (30), and is characterized in that: the main body assembly (10) comprises a shell (11), a cover plate (12), a PLC (programmable logic controller) plate (13), a temperature sensor (14), a signal emitter (15), a bottom plate (16) and a mounting hole (17);
the main body heat dissipation assembly (20) comprises a fan (21), a water tank (22), a micro water pump (23), a pipe body (24), a coil pipe (25) and a water inlet pipe (26);
the fan (21) is installed on the upper surface of the cover plate (12) in an embedded mode, the water tank (22) is welded to the lower surface of the cover plate (12), the upper surface of the water tank (22) is communicated with a water inlet pipe (26), a micro water pump (23) is installed on one side of the water tank (22), a water outlet of the micro water pump (23) is communicated with the water tank (22), a water inlet of the micro water pump (23) is communicated with one end of a pipe body (24), the other end of the pipe body (24) is communicated with one end of the coil pipe (25), and the other end of the coil pipe (25) is communicated with the water tank (22);
the auxiliary heat dissipation assemblies (30) are arranged in four groups, the auxiliary heat dissipation assemblies (30) are arranged in the water tank (22), and the top of each auxiliary heat dissipation assembly (30) penetrates through the water tank (22) and the cover plate (12).
2. The 5G-based automated thermal communication device of claim 1, wherein: the cover plate (12) is fixedly connected to the upper surface of the shell (11) through screws, the bottom plate (16) is welded to the lower surface of the shell (11), and two mounting holes (17) are symmetrically formed in the upper surface of the bottom plate (16).
3. The 5G-based automated thermal communication device of claim 1, wherein: PLC board (13) and signal transmitter (15) all install in the inside diapire of casing (11), the signal input part of the signal output part of PLC board (13) and signal transmitter (15) passes through wire signal connection.
4. The 5G-based automated thermal communication device of claim 1, wherein: temperature sensor (14) are installed in the inside diapire of casing (11), the signal output part of temperature sensor (14) passes through the wire and is connected with the signal input part signal of PLC board (13), the electrical output part of PLC board (13) passes through the wire and the electrical input part electrical connection of fan (21) and miniature pump (23).
5. The 5G-based automated thermal communication device of claim 1, wherein: the auxiliary heat dissipation assembly (30) comprises a sealing pipe body (31), a condensate layer (32), a heat absorption pipe section (33), a heat dissipation pipe section (34) and heat dissipation fins (35);
the bottom of the sealing pipe body (31) penetrates through the inside of the water tank (22), and the top of the sealing pipe body (31) penetrates through the top of the water tank (22).
6. The 5G-based automated heat dissipation communication device of claim 5, wherein: and a condensed liquid layer (32) is arranged in the sealing pipe body (31).
7. The 5G-based automated heat dissipation communication device of claim 5, wherein: the heat dissipation pipe is characterized in that a heat absorption pipe section (33) and a heat dissipation pipe section (34) are arranged inside the sealing pipe body (31), and the heat dissipation pipe section (34) is located above the heat dissipation pipe section (34).
8. The 5G-based automated heat dissipation communication device of claim 5, wherein: and the top of the outer side of the heat dissipation pipe section (34) is sleeved with a heat dissipation fin (35).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202110521745.2A CN113163696A (en) | 2021-05-13 | 2021-05-13 | Automatic heat dissipation communication device based on 5G |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110521745.2A CN113163696A (en) | 2021-05-13 | 2021-05-13 | Automatic heat dissipation communication device based on 5G |
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| CN113163696A true CN113163696A (en) | 2021-07-23 |
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| CN202110521745.2A Pending CN113163696A (en) | 2021-05-13 | 2021-05-13 | Automatic heat dissipation communication device based on 5G |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114810616A (en) * | 2022-04-20 | 2022-07-29 | 安徽南方化工泵业有限公司 | Stainless steel magnetic drive pump with from cooling mechanism |
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| CN212850847U (en) * | 2020-10-23 | 2021-03-30 | 深圳市浩湖网络技术有限公司 | High-efficient heat sink is used to switch |
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Application publication date: 20210723 |
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