CN212113663U - Anti-static chip vacuum adsorption template - Google Patents
Anti-static chip vacuum adsorption template Download PDFInfo
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- CN212113663U CN212113663U CN202020881879.6U CN202020881879U CN212113663U CN 212113663 U CN212113663 U CN 212113663U CN 202020881879 U CN202020881879 U CN 202020881879U CN 212113663 U CN212113663 U CN 212113663U
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- chip
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- rubber pad
- mould
- vacuum adsorption
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Abstract
The utility model discloses an anti-static chip vacuum adsorption template, including first mould, second mould and chip, the upper surface of first mould is pressed and is connected with the second mould, and the inside adhesion of first mould is connected with first anti-static rubber pad, and the upper surface adhesion of first anti-static rubber pad is connected with chip placement piece, and first anti-static rubber pad and the inside of chip placement piece all seted up communicating absorption hole, the chip embedding is connected in the inside of chip placement piece, the inside adhesion of second mould is connected with second anti-static rubber pad, the utility model relates to a chip production facility technical field; this prevent static chip vacuum adsorption template adopts the component of rubber material to place the chip, and the chip can reduce the clearance between chip and the device when being adsorbed to fastness when can improving the absorption, the rubber material is soft simultaneously, can prevent to cause the damage to the chip, and the rubber pad in this device can derive static.
Description
Technical Field
The utility model relates to a chip production facility technical field specifically is an prevent static chip vacuum adsorption template.
Background
Chips, also known as microcircuits, microchips, and chips, are a way to miniaturize circuits in electronics, and are often fabricated on the surface of a semiconductor wafer. The chip is an integrated circuit which manufactures a circuit on the surface of a semiconductor chip and is also called a thin film integrated circuit, another thick film integrated circuit is a miniaturized circuit which is formed by integrating independent semiconductor equipment and a passive component into a substrate or a circuit board, a plurality of kinds of equipment are required to be used in the production process of the chip, and a metal template is one of common equipment and is commonly used for adsorbing and fixing the chip so as to be convenient for processing the chip.
The adsorption chip capacity of the existing metal mold is poor, uneven particles are arranged on the surface of the chip, so that a gap between the chip and the metal mold is large, the metal mold is hard in material, the chip is easily damaged in the processing process, and meanwhile, the metal mold and the chip easily generate static electricity, so that the chip is easily damaged.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to prior art's weak point, provide an prevent static chip vacuum adsorption template, it is relatively poor to have solved current metal mold's adsorption chip ability, and the surface of chip is provided with the unsmooth granule of unevenness, and the clearance that leads to between chip and the metal mold is great to metal mold's material is hard, leads to the chip to cause the damage easily at the in-process of processing, and metal mold and chip produce static easily simultaneously, lead to causing the problem of damage to the chip easily.
For solving the technical problem, the utility model provides a pair of prevent static chip vacuum adsorption template, including first mould, second mould and chip, the upper surface of first mould is pressed down and is connected with the second mould, the inside adhesion of first mould is connected with first antistatic rubber pad, the upper surface adhesion of first antistatic rubber pad is connected with the chip and places the piece, and the first antistatic rubber pad all offers communicating absorption hole with the inside that the piece was placed to the chip, the inside of piece is placed at the chip in the chip embedding connection, the inside adhesion of second mould is connected with the second and prevents static rubber pad, the upside at the chip is hugged closely to the second antistatic rubber pad.
Preferably, including first mould, second mould and chip, the upper surface of first mould is pressed and is connected with the second mould, the inside adhesion of first mould is connected with first antistatic rubber pad, the upper surface adhesion of first antistatic rubber pad is connected with the chip and places the piece, and communicating absorption hole has all been seted up to the inside that the piece was placed to first antistatic rubber pad and chip, the inside that the piece was placed to the chip is connected in the chip embedding, the inside adhesion of second mould is connected with second antistatic rubber pad, the upside at the chip is hugged closely to second antistatic rubber pad.
Preferably, the first anti-static rubber pad, the chip placement block and the second anti-static rubber pad all comprise substrate layers, conductive wire layers are attached to the upper surfaces of the substrate layers, and static transfer layers are attached to the upper surfaces of the conductive wire layers.
Preferably, the thickness of the electrostatic transfer layer is the same as that of the substrate layer, and the thickness of the conductive wire layer is 0.2 mm.
Preferably, the chip placing blocks are provided with 4 rows, and corners of the chip placing blocks are fixedly connected with corners of adjacent chip placing blocks.
Preferably, the size of the recess in the chip placing block is the same as the size of the chip, and the air inlet of the adsorption hole is tightly attached to one side of the chip.
Compared with the prior art, the utility model provides a pair of prevent static chip vacuum adsorption template has following beneficial effect: the anti-static chip vacuum adsorption template is connected with a second mould through the upper surface of a first mould in a pressing way, a first anti-static rubber pad is adhered and connected inside the first mould, a chip placing block is adhered and connected on the upper surface of the first anti-static rubber pad, and the first anti-static rubber pad and the chip placing block are both provided with communicated adsorption holes, the chip is embedded and connected in the chip placing block, the second anti-static rubber pad is adhered and connected in the second mould, and the second anti-static rubber pad is tightly attached to the upper side of the chip, the device adopts a rubber component to place the chip, and the clearance between the chip and the device can be reduced when the chip is adsorbed, thereby improving the firmness during adsorption, simultaneously preventing the chip from being damaged due to soft rubber material, and the rubber pad in this device can lead static out to can prevent that static from causing the damage to the inside of chip.
Drawings
Fig. 1 is a schematic structural view of a preferred embodiment of an anti-static chip vacuum adsorption template provided by the present invention;
fig. 2 is a top view of a first mold of the present invention;
FIG. 3 is a front view of the chip of the present invention;
fig. 4 is a local material diagram of the first antistatic rubber pad of the present invention.
Reference numbers in the figures: 1. a first mold; 2. a second mold; 3. a first antistatic rubber pad; 4. a chip placement block; 5. an adsorption hole; 6. a chip; 7. a second antistatic rubber pad; 31. a substrate layer; 32. an electrostatic transfer layer; 33. a layer of conductive filaments.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and embodiments.
Please refer to fig. 1, fig. 2, fig. 3 and fig. 4, wherein fig. 1 is a schematic structural diagram of a preferred embodiment of an anti-static chip vacuum adsorption template according to the present invention; fig. 2 is a top view of a first mold of the present invention; FIG. 3 is a front view of the chip of the present invention; fig. 4 is a local material diagram of the first antistatic rubber pad of the present invention. An anti-static chip vacuum adsorption template comprises a first mold 1, a second mold 2 and a chip 6, wherein the upper surface of the first mold 1 is connected with the second mold 2 in a pressing manner, the inner part of the first mold 1 is connected with a first anti-static rubber pad 3 in an adhesion manner, the upper surface of the first anti-static rubber pad 3 is connected with a chip placing block 4 in an adhesion manner, 4 rows of chip placing blocks 4 are arranged, the corners of the chip placing block 4 are fixedly connected with the corners of the adjacent chip placing block 4, the inner parts of the first anti-static rubber pad 3 and the chip placing block 4 are respectively provided with a communicated adsorption hole 5, the adsorption holes 5 are communicated with an external adsorption device, the chip 6 is embedded and connected in the chip placing block 4, the size of the inner concave part of the chip placing block 4 is the same as that of the chip 6, the air inlet of the adsorption hole 5 is tightly attached to one side of the chip 6, the inner part of the second mold 2 is, the second anti-static rubber pad 7 is tightly attached to the upper side of the chip 6, the first anti-static rubber pad 3, the chip placing block 4 and the second anti-static rubber pad 7 are made of the same material, the first antistatic rubber pad 3, the chip placing block 4 and the second antistatic rubber pad 7 are all members made of white rubber, the first antistatic rubber pad 3, the chip placing block 4 and the second antistatic rubber pad 7 all comprise a substrate layer 31, the upper surface of the substrate layer 31 is adhered and connected with a conductive wire layer 33, the upper surface of the conductive wire layer 33 is adhered and connected with a static transfer layer 32, the thickness of the static transfer layer 32 is the same as that of the substrate layer 31, the substrate layer 31 and the static transfer layer 32 are both nitrile rubber, and the static electricity transfer layer 32 is mixed with silver-plated particles of glass and silver-plated particles of aluminum, the thickness of the conductive wire layer 33 is 0.2mm, and the conductive wire layer 33 is connected with the ground through a conductive wire, and those not described in detail in this specification are well within the skill of those in the art.
The utility model provides a pair of prevent static chip vacuum adsorption template's theory of operation as follows:
during operation, place chip 6 earlier and place the piece 4 in the chip, start outside adsorption equipment afterwards, place piece 4 intercommunication with chip 6 and chip through adsorbing hole 5, later with second mould 2 and 1 pressfitting of first mould, the second of 2 insides of second mould is prevented static rubber pad 7 and can be laminated at the upside of chip 6, two sets of static chips of preventing all shift layer 32 and conducting wire layer 33 through the static of self, can discharge static to can prevent that static from causing the damage to chip 6.
Compared with the prior art, the utility model provides a pair of prevent static chip vacuum adsorption template has following beneficial effect:
adopt the component of rubber material to place chip 6 in this device, chip 6 can reduce the clearance between chip 6 and the device when being adsorbed to fastness when can improving the absorption, the rubber material is soft simultaneously, can prevent to cause the damage to chip 6, and the rubber pad in this device can derive static, thereby can prevent that static from causing the damage to chip 6's inside.
The above only is the embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent processes made by the contents of the specification and the drawings are utilized, or directly or indirectly applied to other related technical fields, and the patent protection of the present invention is included in the same way.
Claims (6)
1. The utility model provides an prevent static chip vacuum adsorption template, includes first mould, second mould and chip, the upper surface of first mould is pressed and is connected with the second mould, a serial communication port, the inside adhesion of first mould is connected with first anti-static rubber pad, the upper surface adhesion of first anti-static rubber pad is connected with the chip and places the piece, and first anti-static rubber pad all offers communicating absorption hole with the inside that the piece was placed to the chip, the chip embedding is connected in the inside that the piece was placed to the chip, the inside adhesion of second mould is connected with the second and prevents static rubber pad, the upside at the chip is hugged closely to the second anti-static rubber pad.
2. The anti-static chip vacuum adsorption template of claim 1, wherein: the first anti-static rubber pad, the chip placing block and the second anti-static rubber pad are made of the same material, and the first anti-static rubber pad, the chip placing block and the second anti-static rubber pad are all members made of white rubber.
3. The anti-static chip vacuum adsorption template of claim 2, wherein: the first anti-static rubber pad, the chip placing block and the second anti-static rubber pad all comprise a substrate layer, the upper surface of the substrate layer is connected with a conductive wire layer in an adhesion mode, and the upper surface of the conductive wire layer is connected with a static transfer layer in an adhesion mode.
4. The anti-static chip vacuum adsorption template of claim 3, wherein: the thickness of the static transfer layer is the same as that of the substrate layer, and the thickness of the conductive wire layer is 0.2 mm.
5. The anti-static chip vacuum adsorption template of claim 4, wherein: the chip placing blocks are provided with 4 rows, and corners of the chip placing blocks are fixedly connected with corners of adjacent chip placing blocks.
6. The anti-static chip vacuum adsorption template of claim 5, wherein: the size of the inner recess of the chip placing block is the same as that of the chip, and the air inlet of the adsorption hole is tightly attached to one side of the chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020881879.6U CN212113663U (en) | 2020-05-24 | 2020-05-24 | Anti-static chip vacuum adsorption template |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020881879.6U CN212113663U (en) | 2020-05-24 | 2020-05-24 | Anti-static chip vacuum adsorption template |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212113663U true CN212113663U (en) | 2020-12-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020881879.6U Active CN212113663U (en) | 2020-05-24 | 2020-05-24 | Anti-static chip vacuum adsorption template |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212113663U (en) |
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2020
- 2020-05-24 CN CN202020881879.6U patent/CN212113663U/en active Active
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Effective date of registration: 20230912 Address after: 226000 The first floor of the factory building (II) of Zhiruida Park, No. 123, Chixing Road, Nantong Economic and Technological Development Zone, Nantong, Jiangsu Province Patentee after: Dongyi Semiconductor Technology (Jiangsu) Co.,Ltd. Address before: No.30-8, Lusheng Road, Luzhi Town, Wuzhong District, Suzhou City, Jiangsu Province Patentee before: Suzhou fanen Machinery Technology Co.,Ltd. |