CN212084997U - Frequency conversion rectifier module - Google Patents
Frequency conversion rectifier module Download PDFInfo
- Publication number
- CN212084997U CN212084997U CN202021096197.0U CN202021096197U CN212084997U CN 212084997 U CN212084997 U CN 212084997U CN 202021096197 U CN202021096197 U CN 202021096197U CN 212084997 U CN212084997 U CN 212084997U
- Authority
- CN
- China
- Prior art keywords
- copper sheet
- red copper
- chip
- ceramic substrate
- circular hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000006243 chemical reaction Methods 0.000 title claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 61
- 229910052802 copper Inorganic materials 0.000 claims abstract description 61
- 239000010949 copper Substances 0.000 claims abstract description 61
- 239000000919 ceramic Substances 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 239000002184 metal Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 238000009413 insulation Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000003466 welding Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- Rectifiers (AREA)
Abstract
The utility model discloses a frequency conversion rectifier module, including being the flat ceramic substrate of rectangle and last insulating cover, circular hole has been seted up to ceramic substrate upper surface center department, the outside that the ceramic substrate upper surface is located circular hole bonds all around has first red copper sheet, second red copper sheet, third red copper sheet, fourth red copper sheet and fifth red copper sheet. The utility model discloses in, this frequency conversion rectifier module, six chips are three and just weld and three back welding, through the bridge mode, weld on five different figure coplanar red copper sheets, weld three AC input end and two DC output end on five copper sheets for the product manufacturing yield is high, and rated current is big, and stability is good.
Description
Technical Field
The utility model relates to a rectifier bridge technical field especially relates to frequency conversion rectifier module.
Background
The three-phase rectifier bridge is used for various power supplies such as frequency conversion and the like, is limited by the external dimension, has the product external dimension of 26mmX26mm, requires the rated voltage between 35A and 50A to be more than 1600V, has high practical environment temperature, adopts the common rectification wafer process in the traditional rectifier bridge, and has six diode chips which are all in direct welding, thereby bringing great difficulty to the manufacture and having unstable product quality.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing a variable frequency rectifier module.
In order to achieve the above purpose, the utility model adopts the following technical scheme: the frequency conversion rectifier module comprises a rectangular flat-plate-shaped ceramic substrate and an upper insulating cover, wherein a circular hole is formed in the center of the upper surface of the ceramic substrate, a first red copper sheet, a second red copper sheet, a third red copper sheet, a fourth red copper sheet and a fifth red copper sheet are bonded on the periphery of the outer side of the circular hole in the upper surface of the ceramic substrate, a first chip, a second chip and a third chip are welded on the first red copper sheet in a positive mode, a fourth chip, a fifth chip and a sixth chip are welded on the third red copper sheet in a reverse mode, an input terminal is welded on each of the first red copper sheet, the second red copper sheet and the third red copper sheet, and an output terminal is welded on each of the fourth red copper sheet and the fifth red copper sheet.
Preferably, the third chip and the sixth chip are respectively welded and fixed with the second red copper sheet through metal bridges, the second chip and the fifth chip are respectively welded and fixed with the fourth red copper sheet through metal bridges, and the first chip and the fourth chip are respectively welded and fixed with the fifth red copper sheet through metal bridges.
Preferably, the upper surface of the ceramic substrate is clamped with an upper insulating cover, and an internal thread pipe matched with the circular hole for use is arranged at the center of the upper surface of the upper insulating cover.
Preferably, the upper surface of the upper insulating cover is provided with a terminal groove used for matching with the output terminal and the input terminal.
Preferably, the outer diameter of the internal thread pipe is matched with the inner diameter of the circular hole.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses in, this frequency conversion rectifier module, six chips are three and just weld and three back welding, through the bridge mode, weld on five different figure coplanar red copper sheets, weld three AC input end and two DC output end on five copper sheets for the product manufacturing yield is high, and rated current is big, and stability is good.
2. The utility model discloses in, this frequency conversion rectifier module, when the installation is fixed, with the upper insulation cover joint on ceramic substrate, make the internal thread pipe that sets up on the upper insulation cover peg graft in the circular hole that sets up on ceramic substrate, cooperation fixing bolt screw carries out the bolt fastening to the upper insulation cover, just accomplished ceramic substrate's fixing, such fixed mode, when making the components and parts that set up on the ceramic substrate need overhaul, the fixing bolt who sets up on the upper insulation cover is dismantled down, alright dismantle with insulating cover and ceramic substrate in the completion, the convenience of its maintenance of very big improvement.
Drawings
Fig. 1 is a schematic structural diagram of a variable frequency rectifier module provided by the present invention;
fig. 2 is a schematic structural diagram of a first red copper sheet of the frequency conversion rectifier module according to the present invention;
fig. 3 is a schematic structural diagram of a third red copper sheet of the frequency conversion rectifier module according to the present invention;
fig. 4 is a schematic cross-sectional view of an upper insulating cover of the variable frequency rectifier module according to the present invention.
Illustration of the drawings:
1. a ceramic substrate; 2. a circular hole; 3. a first copper sheet; 31. a first chip; 32. a second chip; 33. a third chip; 4. a second copper sheet; 5. a third copper sheet; 51. a fourth chip; 52. a fifth chip; 53. a sixth chip; 6. a fourth copper sheet; 7. a fifth copper sheet; 8. an output terminal; 9. an input terminal; 10. an upper insulating cover; 11. a terminal groove; 12. an internally threaded tube.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-4, the frequency conversion rectifier module comprises a ceramic substrate 1 in a rectangular flat plate shape and an upper insulating cover 10, a circular hole 2 is formed in the center of the upper surface of the ceramic substrate 1, a first red copper sheet 3, a second red copper sheet 4, a third red copper sheet 5, a fourth red copper sheet 6 and a fifth red copper sheet 7 are bonded around the outer side of the circular hole 2 on the upper surface of the ceramic substrate 1, a first chip 31, a second chip 32 and a third chip 33 are welded on the first red copper sheet 3, a fourth chip 51, a fifth chip 52 and a sixth chip 53 are inversely welded on the third red copper sheet 5, an input terminal 9 is welded on each of the first red copper sheet 3, the second red copper sheet 4 and the third red copper sheet 5, and an output terminal 8 is welded on each of the fourth red copper sheet 6 and the fifth red copper sheet 7.
The third chip 33 and the sixth chip 53 are respectively welded and fixed with the second red copper sheet 4 through a metal bridge, the second chip 32 and the fifth chip 52 are respectively welded and fixed with the fourth red copper sheet 6 through a metal bridge, and the first chip 31 and the fourth chip 51 are respectively welded and fixed with the fifth red copper sheet 7 through a metal bridge.
An upper insulating cover 10 is clamped on the upper surface of the ceramic substrate 1, and an internal threaded pipe 12 matched with the circular hole 2 is arranged in the center of the upper surface of the upper insulating cover 10.
The upper surface of the upper insulating cover 10 is provided with a terminal groove 11 used in cooperation with the output terminal 8 and the input terminal 9.
The external diameter of the internal thread pipe 12 is matched with the internal diameter of the round hole 2.
The working principle is as follows: this frequency conversion rectifier module, when the installation is fixed, will go up insulating cover 10 joint on ceramic substrate 1, make the internal thread pipe 12 that sets up on insulating cover 10 peg graft in ceramic substrate 1 goes up the circular hole 2 that sets up, cooperation fixing bolt carries out the bolt fastening to last insulating cover 10, just accomplished ceramic substrate 1's fixing, such fixed mode, when making the components and parts that set up on ceramic substrate 1 need overhaul, the fixing bolt on the insulating cover 10 is gone up in the dismantlement, alright dismantle with insulating cover 10 and ceramic substrate 1 in the completion, the convenience of its maintenance of improvement of maximization.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (5)
1. The frequency conversion rectification module comprises a rectangular flat-plate-shaped ceramic substrate (1) and an upper insulation cover (10), and is characterized in that a circular hole (2) is formed in the center of the upper surface of the ceramic substrate (1), a first red copper sheet (3), a second red copper sheet (4), a third red copper sheet (5), a fourth red copper sheet (6) and a fifth red copper sheet (7) are bonded on the periphery of the outer side of the circular hole (2) on the upper surface of the ceramic substrate (1), a first chip (31), a second chip (32) and a third chip (33) are positively welded on the first red copper sheet (3), a fourth chip (51), a fifth chip (52) and a sixth chip (53) are reversely welded on the third red copper sheet (5), an input terminal (9) is welded on each of the first red copper sheet (3), the second red copper sheet (4) and the third red copper sheet (5), and the fourth red copper sheet (6) and the fifth red copper sheet (7) are respectively welded with an output terminal (8).
2. The frequency conversion rectifier module according to claim 1, wherein the third chip (33) and the sixth chip (53) are respectively fixed to the second red copper sheet (4) by a metal bridge, the second chip (32) and the fifth chip (52) are respectively fixed to the fourth red copper sheet (6) by a metal bridge, and the first chip (31) and the fourth chip (51) are respectively fixed to the fifth red copper sheet (7) by a metal bridge.
3. The variable-frequency rectification module according to claim 1, wherein an upper insulating cover (10) is clamped on the upper surface of the ceramic substrate (1), and an internal threaded pipe (12) matched with the circular hole (2) is arranged at the center of the upper surface of the upper insulating cover (10).
4. The variable frequency rectifier module according to claim 1, wherein the upper surface of the upper insulating cover (10) is provided with a terminal groove (11) for matching with the output terminal (8) and the input terminal (9).
5. The variable frequency rectifier module according to claim 3, characterized in that the external diameter of said internally threaded tube (12) is adapted to the internal diameter of the circular hole (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021096197.0U CN212084997U (en) | 2020-06-12 | 2020-06-12 | Frequency conversion rectifier module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021096197.0U CN212084997U (en) | 2020-06-12 | 2020-06-12 | Frequency conversion rectifier module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212084997U true CN212084997U (en) | 2020-12-04 |
Family
ID=73557635
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021096197.0U Expired - Fee Related CN212084997U (en) | 2020-06-12 | 2020-06-12 | Frequency conversion rectifier module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212084997U (en) |
-
2020
- 2020-06-12 CN CN202021096197.0U patent/CN212084997U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201204 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |