CN212069670U - Device cleaning device of semiconductor equipment - Google Patents
Device cleaning device of semiconductor equipment Download PDFInfo
- Publication number
- CN212069670U CN212069670U CN201922362838.6U CN201922362838U CN212069670U CN 212069670 U CN212069670 U CN 212069670U CN 201922362838 U CN201922362838 U CN 201922362838U CN 212069670 U CN212069670 U CN 212069670U
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- fixedly connected
- cleaning
- cover
- threaded rod
- semiconductor equipment
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Abstract
The utility model discloses a device cleaning device of semiconductor equipment; belonging to the technical field of equipment cleaning; its technical essential includes semiconductor equipment's device belt cleaning device, including base and washing cover, the both sides table wall of base rotates through the bearing jointly and is connected with first threaded rod, and the other end of first threaded rod extends to the outside and the fixedly connected with second belt pulley of base, and threaded connection has the thread bush on the first threaded rod, and the last wall fixedly connected with dead lever of thread bush, the utility model discloses the thread bush has realized horizontal migration through dead lever drive U type supporting seat, removes clamping device to the left side of washing cover, makes ultrasonic emitter wash the wafer to realize secondary cleaning, can effectual device to semiconductor equipment wash, the second splint can horizontal migration, can be applicable to the not wafer of equidimension.
Description
The technical field is as follows:
the utility model relates to an equipment cleaning technical field, in particular to device belt cleaning device of semiconductor equipment.
Background art:
the semiconductor refers to a material having conductivity between a conductor and an insulator at normal temperature, and the importance of the semiconductor is very great from the viewpoint of scientific and economic development. Most of electronic products such as computers, mobile phones or digital audio recorders today have a very close relationship with semiconductors, the semiconductor products are contaminated with various pollutants in the environment during the manufacturing process, and the pollutants adhered to the surface of the semiconductor products seriously affect the performance, reliability and yield of the devices, so the semiconductor products are generally cleaned after each process of manufacturing the semiconductor products, thereby ensuring the quality of the semiconductor products.
With the characteristics of miniaturization and high integration of electronic devices, the number and the diameter of residual impurity particles on a semiconductor device are smaller and smaller, and the common cleaning mode is not thorough in one-time cleaning, so that some fine particles still adhere to the surface of a wafer after cleaning is finished, the wafer is damaged or even scrapped when the wafer is installed, and the cleaning efficiency can be greatly reduced by repeated cleaning.
Therefore, it is necessary to invent a device cleaning apparatus for a semiconductor apparatus to solve the above problems.
The utility model has the following contents:
an object of the utility model is to provide a device belt cleaning device of semiconductor equipment to solve among the prior art not totally abluent and the cleaning efficiency is low not enough.
The utility model discloses by following technical scheme implement: a device cleaning device of semiconductor equipment comprises a base and a cleaning cover, wherein the surface walls on two sides of the base are connected with a first threaded rod through a bearing in a rotating mode;
the other end of the first threaded rod extends to the outside of the base and is fixedly connected with a second belt pulley, and a threaded sleeve is connected to the first threaded rod in a threaded manner;
the upper surface wall of the threaded sleeve is fixedly connected with a fixed rod, the upper surface wall of the base is provided with a strip-shaped opening corresponding to the fixed rod, the top end of the fixed rod is fixedly connected with a bottom plate, the upper surface wall of the bottom plate is fixedly connected with an electric telescopic rod, and the top of the electric telescopic rod is fixedly connected with a clamping mechanism;
and a cleaning mechanism is arranged at the top of the cleaning cover.
Preferably, fixture include with electric telescopic handle top fixed connection's U type supporting seat, two vertical portions of U type supporting seat rotate through the bearing jointly and are connected with the second threaded rod, the table wall threaded connection of second threaded rod has the second splint, the last upper wall left side fixedly connected with of U type supporting seat and the corresponding first splint of second splint, the lower table wall fixedly connected with sliding block of second splint, the spout with sliding block accordant connection is seted up to the last upper wall of U type supporting seat.
Preferably, the left end of the second threaded rod extends to the outside of the U-shaped supporting seat and is fixedly connected with a rotary table.
Preferably, a plurality of spacing grooves are formed in the upper surface walls of the first clamping plate and the second clamping plate.
Preferably, the top of the liquid storage tank is fixedly communicated with a liquid inlet pipe, and the top end of the liquid inlet pipe is in threaded connection with the second tank cover.
Preferably, the cleaning mechanism comprises a first box cover corresponding to the cleaning cover, the right side of the upper surface of the cleaning cover is provided with an opening, the left side of the opening is rotationally connected with the side wall of the first box cover through a rotating shaft, a spray pipe is fixedly connected inside the first box cover, the bottom of the spray pipe is fixedly communicated with a plurality of spray heads, the left side of the upper surface wall of the cleaning cover is fixedly connected with a liquid storage tank, the middle part of the upper surface wall of the cleaning cover is fixedly connected with a water pump, both ends of the water pump are fixedly communicated with a water pipe, one of the water pipes is communicated with the liquid storage tank, the other water pipe penetrates into the inner cavity of the first tank cover and is fixedly communicated with the top of the water spray pipe, the ultrasonic cleaning device is characterized in that the inner wall of the top of the cleaning cover and the inner wall of the left side of the cleaning cover are fixedly connected with ultrasonic transmitters, the lower surface wall of the base is fixedly communicated with a sewage discharge pipe, and the sewage discharge pipe is fixedly communicated with a valve.
Preferably, the four feet of the lower surface wall of the base are fixedly connected with symmetrically distributed supporting legs.
The utility model has the advantages that:
1. through increasing the liquid reserve tank, a water pump, water pipe and shower nozzle, the washing liquid suction spray pipe in the water pump will liquid reserve tank, and through the shower nozzle blowout, wash the wafer, the epaxial first belt pulley of motor output drives first threaded rod through the belt and rotates, first threaded rod rotates and drives the thread bush removal, the thread bush passes through the dead lever and drives U type supporting seat and realized horizontal migration, remove clamping device to the left side of wasing the cover, make ultrasonic transmitter wash the wafer, thereby realize the secondary and wash, can be effectual wash semiconductor equipment's device.
2. Through setting up second threaded rod, splint and carousel, it drives the second threaded rod and rotates to rotate the carousel, because second splint and second threaded rod make threaded connection, so the rotation of second threaded rod makes second splint horizontal migration for second splint are tight with first splint clamp, makes the wafer can insert in the spacing groove of first splint and second splint, and second splint can horizontal migration, can be applicable to the not wafer of equidimension.
Description of the drawings:
in order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a sectional view of the base of the present invention.
Fig. 3 is a schematic view of the side structure of the U-shaped supporting seat of the present invention.
Figure 4 is the front structural section of the U-shaped supporting seat of the utility model.
In the figure: 1. a base; 2. cleaning the cover; 3. a first threaded rod; 4. a threaded sleeve; 5. fixing the rod; 6. a base plate; 7. an electric telescopic rod; 8. a U-shaped supporting seat; 9. a liquid storage tank; 10. a water pump; 11. a water pipe; 12. a first cover; 13. a water spray pipe; 14. a spray head; 15. an ultrasonic transmitter; 16. a second pulley; 17. a first pulley; 18. a belt; 19. a motor; 20. A protective box; 21. a blow-off pipe; 22. a valve; 23. supporting legs; 24. a liquid inlet pipe; 25. a strip-shaped opening; 27. a first splint; 28. a second threaded rod; 29. a second splint; 30. a second cover; 31. a turntable.
The specific implementation mode is as follows:
the technical solution of the present invention is described in further detail below with reference to the accompanying drawings, but the scope of the present invention is not limited to the following description. Any feature disclosed in this specification (including any accompanying claims-abstract and drawings) may be replaced by alternative features serving equivalent or similar purposes, unless expressly stated otherwise. That is, unless expressly stated otherwise, each feature is only an example of a generic series of equivalent or similar features.
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Before describing the embodiments, some necessary terms need to be explained. For example:
if the use of the terms first, second, etc. appear in this application to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. Thus, a "first" element discussed below could also be termed a "second" element without departing from the teachings of the present invention. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly connected" or "directly coupled" to another element, there are no intervening elements present.
The various terms appearing in this application are used for the purpose of describing particular embodiments only and are not intended as limitations on the invention, except where the context clearly dictates otherwise, the singular is intended to include the plural as well.
When the terms "comprises" and/or "comprising" are used in this specification, these terms specify the presence of stated features-integers-steps-operations-elements and/or components, but do not preclude the presence and/or addition of one or more other features-integers-steps-operations-elements-components and/or groups thereof.
The utility model provides a device cleaning device of semiconductor equipment, which is shown in figures 1-3 and comprises a base 1 and a cleaning cover 2, wherein the two side surface walls of the base 1 are connected with a first threaded rod 3 through a bearing in a rotating way;
the other end of the first threaded rod 3 extends to the outside of the base 1 and is fixedly connected with a second belt pulley 16, and a threaded sleeve 4 is connected to the first threaded rod 3 in a threaded manner;
last wall fixedly connected with dead lever 5 of thread bush 4, the last wall of base 1 is seted up with the corresponding bar opening 25 of dead lever 5, the top fixedly connected with bottom plate 6 of dead lever 5, the last wall fixedly connected with electric telescopic handle 7 of bottom plate 6, the top fixedly connected with fixture of electric telescopic handle 7, the top of wasing cover 2 is provided with wiper mechanism, thereby use the operation that electric slide rail probably leads to the short circuit to influence whole device because first threaded rod 3 is with water contact.
Fixture include with 7 top fixed connection's of electric telescopic handle U type supporting seat 8, two vertical portions of U type supporting seat 8 rotate through the bearing jointly and are connected with second threaded rod 28, the table wall threaded connection of second threaded rod 28 has second splint 29, the last upper wall left side fixedly connected with of U type supporting seat 8 and the corresponding first splint 27 of second splint 29, the lower table wall fixedly connected with sliding block of second splint 29, the spout with sliding block accordant connection is seted up to the last upper wall of U type supporting seat 8, the convenient sliding block that can be more slides.
The left end of second threaded rod 28 extends to the outside of U type supporting seat 8 and fixedly connected with carousel 31, and the edge of carousel 31 is provided with anti-skidding line, can conveniently adjust second splint 29.
A plurality of spacing grooves have all been seted up to the upper surface wall of first splint 27 and second splint 29, and the fixed intercommunication in top of liquid reserve tank 9 has feed liquor pipe 24, and the top threaded connection second case lid 30 of feed liquor pipe 24, can conveniently turn round second case lid 30 open.
The cleaning mechanism comprises a first box cover 12 corresponding to the cleaning cover 2, an opening is arranged on the right side of the upper surface of the cleaning cover 2, the left side of the opening is rotationally connected with the side wall of the first box cover 12 through a rotating shaft, a spray pipe 13 is fixedly connected inside the first box cover 12, the bottom of the spray pipe 13 is fixedly communicated with a plurality of spray heads 14, the left side of the upper surface wall of the cleaning cover 2 is fixedly connected with a liquid storage box 9, the middle part of the upper surface wall of the cleaning cover 2 is fixedly connected with a water pump 10, the two ends of the water pump 10 are fixedly communicated with water pipes 11, one water pipe 11 is communicated with the liquid storage tank 9, the other water pipe 11 penetrates through the inner cavity of the first tank cover 12 and is fixedly communicated with the top of the water spraying pipe 13, the inner wall of the top and the inner wall of the left side of the cleaning cover 2 are fixedly connected with ultrasonic transmitters 15, the lower surface wall of the base 1 is fixedly communicated with a sewage discharge pipe 21, and the sewage discharge pipe 21 is fixedly communicated with a valve 22; the four feet of the lower surface wall of the base 1 are fixedly connected with symmetrically distributed supporting legs 23. The water pipe 11 penetrating the first cover 12 is a hose, and opening the first cover 12 has no influence on the water pipe 11.
The specific using method of the device cleaning device of the semiconductor equipment comprises the following steps:
firstly, filling cleaning solution into a liquid storage tank 9, opening a first tank cover 12 at the top of a cleaning cover 2, placing a wafer to be cleaned on a U-shaped supporting seat 8, rotating a turntable 31 at one side of the U-shaped supporting seat 8, driving a second threaded rod 28 in the U-shaped supporting seat 8 to rotate by the turntable 31, and rotating the second threaded rod 28 to move a second clamping plate 29 due to the fact that the second clamping plate 29 is in threaded connection with the second threaded rod 28 so as to achieve the purpose of clamping;
then, the water pump 10 is started, the water pump 10 pumps the cleaning liquid in the liquid storage tank 9 into the water spraying pipe 13 through the communicated water pipe 11, and then the cleaning liquid is sprayed out by the spray head 14 to clean the wafer for the first time;
finally, motor 19 is opened, motor 19 drives first belt pulley 17, first belt pulley 17 drives second belt pulley 16 through belt 18 and rotates, second belt pulley 16 drives first threaded rod 3 and rotates, first threaded rod 3 drives bottom plate 6 through threaded connection's thread bush 4 and slides, bottom plate 6 drives U type supporting seat 8 through electric telescopic handle 7 and slides, U type supporting seat 8 slides and removes the device the left side with the wafer, ultrasonic emitter 15 awakens the secondary through the transmission ultrasonic wave to the wafer and washs, can be effectual to the wafer sanitization.
In other technical features in this embodiment, those skilled in the art can flexibly select the technical features according to actual situations to meet different specific actual requirements. However, it will be apparent to one of ordinary skill in the art that: it is not necessary to employ these specific details to practice the invention. In other instances, well-known components, structures or parts are not described in detail in order to avoid obscuring the present invention, and the technical scope of the present invention is defined by the claims.
In the description of the present invention, unless otherwise explicitly specified or limited, the terms "disposed" - "mounted" - "connected" are used in a broad sense and should be understood broadly by those skilled in the art. For example, the components may be fixedly connected, movably connected, integrally connected, or partially connected, mechanically connected, electrically connected, directly connected, indirectly connected through an intermediate medium, or connected inside two elements, and the like, and for those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations, that is, the expression of the language and the implementation of the actual technology can flexibly correspond, and the expression of the language (including the drawings) of the specification of the present invention does not constitute any single restrictive interpretation of the claims.
Modifications and variations may be made by those skilled in the art without departing from the spirit and scope of the invention, which should be limited only by the claims appended hereto. In the previous description, numerous specific details were set forth in order to provide a thorough understanding of the present invention. However, it will be apparent to one of ordinary skill in the art that: it is not necessary to employ these specific details to practice the invention. In other instances, well-known techniques, such as specific construction details, operating conditions, and other technical conditions, have not been described in detail in order to avoid obscuring the present invention.
Claims (7)
1. A device cleaning device of semiconductor equipment comprises a base (1) and a cleaning cover (2), and is characterized in that the surface walls on two sides of the base (1) are rotatably connected with a first threaded rod (3) through a bearing;
the other end of the first threaded rod (3) extends to the outside of the base (1) and is fixedly connected with a second belt pulley (16), and a threaded sleeve (4) is connected to the first threaded rod (3) in a threaded manner;
a fixing rod (5) is fixedly connected to the upper surface wall of the threaded sleeve (4), a strip-shaped opening (25) corresponding to the fixing rod (5) is formed in the upper surface wall of the base (1), a bottom plate (6) is fixedly connected to the top end of the fixing rod (5), an electric telescopic rod (7) is fixedly connected to the upper surface wall of the bottom plate (6), and a clamping mechanism is fixedly connected to the top of the electric telescopic rod (7);
and a cleaning mechanism is arranged at the top of the cleaning cover (2).
2. The device cleaning device for the semiconductor equipment, according to claim 1, characterized in that the clamping mechanism comprises a U-shaped supporting seat (8) fixedly connected with the top of the electric telescopic rod (7), two vertical parts of the U-shaped supporting seat (8) are jointly and rotatably connected with a second threaded rod (28) through a bearing, a second clamping plate (29) is in threaded connection with the surface wall of the second threaded rod (28), a first clamping plate (27) corresponding to the second clamping plate (29) is fixedly connected to the left side of the upper surface wall of the U-shaped supporting seat (8), a sliding block is fixedly connected to the lower surface wall of the second clamping plate (29), and a sliding groove matched and connected with the sliding block is formed in the upper surface wall of the U-shaped supporting seat (8).
3. The device cleaning apparatus for semiconductor equipment as claimed in claim 2, wherein the left end of the second threaded rod (28) extends to the outside of the U-shaped support base (8) and is fixedly connected with a rotary plate (31).
4. The device cleaning apparatus of the semiconductor equipment as claimed in claim 2, wherein the upper surface walls of the first clamping plate (27) and the second clamping plate (29) are provided with a plurality of limiting grooves.
5. The device cleaning device of the semiconductor equipment according to claim 1, wherein the cleaning mechanism comprises a first box cover (12) corresponding to the cleaning cover (2), the right side of the upper surface of the cleaning cover (2) is opened, the left side of the opening is rotatably connected with the side wall of the first box cover (12) through a rotating shaft, a spray pipe (13) is fixedly connected inside the first box cover (12), the bottom of the spray pipe (13) is fixedly communicated with a plurality of spray heads (14), the left side of the upper surface wall of the cleaning cover (2) is fixedly connected with a liquid storage box (9), a water pump (10) is fixedly connected in the middle of the upper surface wall of the cleaning cover (2), water pipes (11) are fixedly communicated with both ends of the water pump (10), one of the water pipes (11) is communicated with the liquid storage box (9), and the other water pipe (11) penetrates through the inner cavity of the first box cover (12) and is fixedly communicated with the top of the spray pipe (13), the ultrasonic cleaning device is characterized in that the ultrasonic emitter (15) is fixedly connected to the inner wall of the top of the cleaning cover (2) and the inner wall of the left side, the lower surface wall of the base (1) is fixedly communicated with a sewage discharge pipe (21), and the sewage discharge pipe (21) is fixedly communicated with a valve (22).
6. The device cleaning apparatus of the semiconductor equipment as claimed in claim 5, wherein the top of the liquid storage tank (9) is fixedly communicated with a liquid inlet pipe (24), and the top end of the liquid inlet pipe (24) is connected with the second tank cover (30) in a threaded manner.
7. The device cleaning apparatus of the semiconductor equipment as claimed in claim 1, wherein the four feet of the lower surface wall of the base (1) are fixedly connected with symmetrically distributed support legs (23).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922362838.6U CN212069670U (en) | 2019-12-25 | 2019-12-25 | Device cleaning device of semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922362838.6U CN212069670U (en) | 2019-12-25 | 2019-12-25 | Device cleaning device of semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212069670U true CN212069670U (en) | 2020-12-04 |
Family
ID=73566978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922362838.6U Expired - Fee Related CN212069670U (en) | 2019-12-25 | 2019-12-25 | Device cleaning device of semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212069670U (en) |
-
2019
- 2019-12-25 CN CN201922362838.6U patent/CN212069670U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201204 Termination date: 20211225 |
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| CF01 | Termination of patent right due to non-payment of annual fee |