CN212034612U - A heat dissipation component, a heat dissipation module, and an air conditioner - Google Patents

Abstract

The utility model discloses a radiator unit for give the device heat dissipation that generates heat, radiator unit includes phase change heating panel and fin assembly, be provided with the closed cavity on the phase change heating panel, it has the phase change working medium to fill in the closed cavity, the phase change heating panel includes heat absorption portion and radiating part, radiator unit includes the heat-conducting plate and connects fin on the heat-conducting plate, the heat-conducting plate is connected one side of heat absorption portion, the device that generates heat is relative the heat-conducting plate sets up the opposite side of heat absorption portion. The utility model provides a radiator unit connects the heat-conducting plate in heat absorption portion one side, and the device that generates heat sets up at the heat absorption portion opposite side, and the back is leaked to the phase transition working medium, and when the heat of heat absorption portion can not transmit the heat dissipation part heat dissipation, the fin dispels the heat to the device that generates heat, prolongs the life of the device that generates heat. The utility model also provides a heat dissipation module with this radiator unit. The utility model also provides an air conditioner with this heat dissipation module.

Description

A heat dissipation component, a heat dissipation module, and an air conditioner

technical field

The utility model relates to the technical field of heat dissipation, in particular to a heat dissipation assembly, a heat dissipation module and an air conditioner.

Background technique

With the rapid development of power electronic equipment and devices towards miniaturization, integration and high efficiency, device performance and heat dissipation continue to increase, resulting in uneven distribution of heat flux density, high local heat flux density, heat accumulation in local areas, The problem of high local temperature, such as IGBT and other power modules in the controller of the inverter air conditioner with large heat generation.

The existing heat dissipation assembly includes a phase change heat dissipation plate and fins welded on the phase change heat dissipation plate, wherein one side of the phase change heat dissipation plate is flat, and the other side is a pipeline surface with pipelines and unevenness. The phase change heat sink is filled with a phase change working medium, and the phase change heat sink includes a heat absorption part, a bending part and a heat dissipation part. However, the phase change working medium in the phase change heat sink may leak. At this time, the phase change heat sink does not have the function of phase change heat dissipation, and the heat generated by the heating device cannot be efficiently transferred to the heat sink for heat dissipation. If it is damaged by working in a high temperature environment, the service life is greatly shortened.

Utility model content

Based on this, it is necessary to provide a heat dissipation component with a long service life of the heating device;

It is also necessary to provide a heat dissipation module with the heat dissipation assembly;

It is more necessary to provide an air conditioner with the cooling module.

The technical solution adopted by the present utility model to solve the technical problem is: a heat dissipation assembly, which is used to dissipate heat to a heating device, the heat dissipation assembly includes a phase change heat dissipation plate and a fin assembly, and the phase change heat dissipation plate is provided with a closed A cavity, the closed cavity is filled with a phase change working medium, the phase change heat dissipation plate includes a heat absorption part and a heat dissipation part, the heat dissipation component includes a heat conduction plate and a fin connected to the heat conduction plate, so The heat-conducting plate is connected to one side of the heat-absorbing part, and the heating device is arranged on the other side of the heat-absorbing part relative to the heat-conducting plate.

Further, the phase change heat dissipation plate further includes a substrate, the substrate includes a first substrate and a second substrate that are covered with each other, and the closed cavity is disposed between the first substrate and the second substrate, The first substrate is formed with a pipeline surface in a direction away from the second substrate through hot rolling and inflation processes, and the surface of the second substrate away from the first substrate is a flat surface.

Further, a heat-conducting layer is disposed between the heat-conducting plate and the heat-absorbing portion.

Further, the phase-change heat dissipation plate further includes a bent portion, and the bent portion is connected between the heat absorption portion and the heat dissipation portion.

Further, the height of the heat dissipation part is higher than the height of the heat absorption part.

A heat dissipation module, the heat dissipation module includes the above-mentioned heat dissipation assembly.

Further, the heat dissipation module further includes a control box, the control box is attached to the phase change heat dissipation plate, and is connected with the phase change heat dissipation plate, and a heating device is detachably arranged in the control box. , the heating device is attached to the heat absorbing part.

Further, the control box includes a box body and an upper cover, the box body includes a bottom plate and four side plates connected to the bottom plate, and the heating device includes a circuit board, components mounted on the circuit board. In the device, a side of the circuit board away from the component is attached to the heat absorbing part.

Further, a through slot is formed on the bottom plate, the through slot is communicated with the inner cavity of the control box, and the side of the circuit board away from the component passes through the through slot and communicates with the suction unit. The hot part fits together.

An air conditioner comprising the above-mentioned cooling module.

The beneficial effects of the present invention are as follows: the heat-dissipating assembly or the heat-dissipating module and the air conditioner provided by the present invention connect the heat-conducting plate on one side of the heat-absorbing part, and the heating device is arranged on the other side of the heat-absorbing part relative to the heat-conducting plate, Therefore, after the phase-change working medium in the phase-change heat sink leaks, when the heat of the heat-absorbing part cannot be transferred to the heat-dissipating part for heat dissipation, the fins can dissipate heat from the heat-generating device, thereby prolonging the service life of the heat-generating device.

Description of drawings

The utility model will be further described below in conjunction with the accompanying drawings and embodiments.

1 is a schematic structural diagram of an air conditioner according to Embodiment 1 of the present invention;

Fig. 2 is an exploded view of the air conditioner shown in Fig. 1;

Fig. 3 is the top view of the air conditioner shown in Fig. 1;

Fig. 4 is the sectional view taken along A-A in the air conditioner shown in Fig. 3;

Fig. 5 is the partial enlarged view of B in the air conditioner shown in Fig. 4;

6 is a schematic structural diagram of the air conditioner according to the second embodiment of the present invention;

Figure 7 is an exploded view of the air conditioner shown in Figure 6;

Figure 8 is a top view of the air conditioner shown in Figure 6;

Fig. 9 is the sectional view taken along C-C in the air conditioner shown in Fig. 8;

FIG. 10 is a partial enlarged view of D in the air conditioner shown in FIG. 9 .

The names and numbers of the parts in the figure are:

Control Box 1 Box 11 Top Cover 12

Through slot 110 Phase change heat sink 2 First substrate 210

Second substrate 220 Pipe surface 211 Flat surface 221

Heat absorbing part 21 Bending part 22 Radiating part 23

Bottom plate 111 Side plate 112 Fin assembly 3

Thermal plate 31 Fin 32 Heating device 4

Thermal conductive layer 6 Components 42 Circuit board 43

bracket 5

Detailed ways

The present utility model will now be described in detail in conjunction with the accompanying drawings. This figure is a simplified schematic diagram, and only illustrates the basic structure of the present invention in a schematic way, so it only shows the structure related to the present invention.

Referring to FIGS. 1 to 5 , the present invention provides a heat dissipation assembly for dissipating heat to a heating device, which includes a phase change heat dissipation plate 2 and a fin assembly 3 , and the fin assembly 3 is connected to the phase change heat dissipation plate 2 .

The phase-change heat dissipation plate 2 includes a substrate, and the substrate includes a first substrate 210 and a second substrate 220 that are covered with each other. The first substrate 210 and the second substrate 220 are both Z-shaped plate structures. The first substrate 210 and the second substrate 220 A closed cavity is formed between the substrates 220, the closed cavity is filled with a phase change working medium, and a pipeline is formed on the first substrate 210 through hot rolling and inflation in the direction away from the second substrate 220 (not shown in the figure). out), so that a pipeline surface 211 with grooves and protrusions is formed on the surface of the first substrate 210 away from the second substrate 220, and the surface of the second substrate 220 away from the first substrate 210 is a flat surface 221. In this embodiment, the flat surface The surface 221 is used to fit with the heating element 4 , and the pipeline surface 211 is used to be welded with the fin assembly 3 .

In this embodiment, the phase change working medium is ethanol. In other not shown embodiments, the phase change working medium may also be one of water or propanol.

Further, the substrate is formed with a heat absorption part 21, a bending part 22 and a heat dissipation part 23, the bending part 22 is connected between the heat absorption part 21 and the heat dissipation part 23, and the heat absorption part 21 and the heat dissipation part 23 are connected with the bending part 21. The included angles between the parts 22 are all 90°. In practical applications, the height of the heat dissipation part 23 is higher than the height of the heat absorption part 21 . In this embodiment, the flat surface 221 corresponding to the heat absorbing portion 21 is attached to the heating device.

The fin assembly 3 includes a heat-conducting plate 31 and fins 32 connected to the heat-conducting plate 31, and the heat-conducting plate 31 is made of a heat-conducting metal material. In this embodiment, the metal material is aluminum. Further, the positions of the heat conducting plate 31 and the pipe surface 211 corresponding to the heat absorbing portion 21 are connected by brazing.

Further, a capillary structure is provided in the closed cavity.

During operation, after the phase change heat sink 2 absorbs heat, the liquid phase change working medium in the closed cavity is vaporized in the heat absorption part 21, and the gaseous phase change working medium rapidly expands and then fills the entire closed cavity. After the phase change working medium moves to the heat dissipation part 23 and is cooled and liquefied, the liquid phase change working medium flows back to the heat absorption part 21 again under the action of the capillary structure, and the circulation absorbs heat and evaporates to play the role of heat dissipation. At the same time, it is transferred to the phase change Part of the heat on the heat dissipation plate 2 is also transferred to the heat conduction plate 31 and the fins 32 for heat dissipation.

When the phase change working medium in the phase change heat dissipation plate 2 leaks, at this time, when the heat of the heat absorption part 21 cannot be transferred to the heat dissipation part 23 for heat dissipation, the fins 32 can dissipate heat from the heat generating device, thereby extending the the service life of the heating device.

Please refer to FIG. 1 to FIG. 5 , the present invention also provides a heat dissipation module with the above heat dissipation assembly, the heat dissipation module includes the above heat dissipation assembly, and a control box 1 is attached and installed on the heat dissipation assembly, and the control box 1 is provided with a heating device 4 , and the control box 1 is attached to the heat absorbing part 21 of the phase change heat sink 2 and is fixedly connected to the phase change heat sink 2 .

The control box 1 is a square box structure. The control box 1 includes a box body 11 and an upper cover 12. The box body 11 includes a bottom plate 111 and four side plates 112 connected to the bottom plate 111. The bottom plate 111 is provided with a through slot 110. , the through groove 110 is communicated with the inner cavity of the control box 1 .

The heating device 4 includes a circuit board 43 and a component 42 mounted on the circuit board 43 . The side of the circuit board 43 away from the component 42 passes through the through slot 110 and is attached to the flat surface 221 corresponding to the heat absorbing portion 21 . The circuit board 43 is in contact with the flat surface 221 of the heat absorbing portion 21 to improve the heat conduction efficiency.

During operation, the heat generated by the components 42 is transferred to the circuit board 43, and then transferred to the phase-change heat sink 2. The liquid phase-change working medium in the closed cavity is vaporized after absorbing heat in the heat-absorbing part 21, and the gaseous phase-change The working medium expands rapidly and then fills the entire closed cavity. When the gaseous phase change working medium moves to the heat dissipation part 23 and then cools and liquefies, the liquid phase change working medium flows back to the heat absorption part 21 again under the action of the capillary structure, and the cyclic absorption The heat evaporation further plays the role of heat dissipation, and at the same time, a small part of the heat transferred to the phase change heat dissipation plate 2 will be transferred to the heat conduction plate 31 and the fins 32 for heat dissipation.

Please refer to FIG. 1 to FIG. 5 again, the present invention also provides an air conditioner with the above-mentioned heat dissipation module, the air conditioner includes the above-mentioned heat dissipation module, and a bracket 5 is connected to the heat dissipation module, and the bracket 5 is connected with the above-mentioned heat dissipation module. The pipeline surfaces 211 corresponding to the heat dissipation portion 23 are fixedly connected. In this embodiment, the bracket 5 is used for fixing the fan.

In the heat dissipation assembly or the heat dissipation module and the air conditioner provided in the first embodiment of the present invention, the heat-conducting plate 31 is connected to one side of the heat-absorbing part 21 , and the heat-generating device is arranged on the other side of the heat-absorbing part 21 relative to the heat-conducting plate 31 . Therefore, after the phase-change working medium in the phase-change heat dissipation plate 2 leaks, when the heat of the heat-absorbing part 21 cannot be transferred to the heat-dissipating part 23 for heat dissipation, the fins 32 can dissipate heat to the heating element 4, thereby extending the heating element 4 service life.

Embodiment 2

Referring to FIGS. 6 to 10 , the difference between the heat dissipation assembly provided in the second embodiment of the present invention and the heat dissipation assembly in the first embodiment is that in this embodiment, a layer of heat conduction layer 6 is applied on the pipeline surface 211 corresponding to the heat absorption part 21 . , so that the plane where the pipeline surface 211 is located has a planar structure. The heat-conducting plate 31 and the pipeline surface 211 corresponding to the heat-absorbing portion 21 are fixedly connected by fasteners (eg, screws, bolts, etc.).

In this embodiment, the thermally conductive layer 6 is made of a thermally conductive material. The thermally conductive material is thermally conductive silicone grease or thermally conductive gel, wherein both thermally conductive silicone grease or thermally conductive gel belong to the slurry type. In other not-shown embodiments, the thermally conductive material may also be thermally conductive paste.

In the heat dissipation assembly or the heat dissipation module and the air conditioner provided in the second embodiment of the present invention, a layer of heat conduction layer 6 is applied on the pipeline surface 211 corresponding to the heat absorption part 21 , and the heat conduction plate 31 is fixed to the pipeline surface 211 corresponding to the heat absorption part 21 . If the phase change working medium in the phase change heat dissipation plate 2 leaks, the heat of the heat absorption part 21 cannot be transferred to the heat dissipation part 23 for heat dissipation, the fins 32 can dissipate heat to the components 42, thereby prolonging the heat generation The service life of the device 4, and at the same time, the thermal conductive layer 6 has a good heat transfer effect, and the plane where the pipe surface 211 corresponding to the heat absorbing part 21 is located is a planar structure, which increases the heat transfer area and further improves the heat transfer efficiency. .

Taking the above ideal embodiments according to the present invention as inspiration, through the above description, the relevant staff can make various changes and modifications without departing from the scope of the present invention. The technical scope of the present invention is not limited to the content in the description, and its technical scope must be determined according to the scope of the claims.

Claims (10)

1. The utility model provides a heat radiation component for give the device heat dissipation that generates heat which characterized in that: the heat dissipation assembly comprises a phase-change heat dissipation plate and a fin assembly, a closed cavity is arranged on the phase-change heat dissipation plate, a phase-change working medium is filled in the closed cavity, the phase-change heat dissipation plate comprises a heat absorption portion and a heat dissipation portion, the heat dissipation assembly comprises a heat conduction plate and fins connected to the heat conduction plate, the heat conduction plate is connected to one side of the heat absorption portion, and the heating device is arranged on the other side of the heat absorption portion relative to the heat conduction plate.

2. The heat dissipation assembly of claim 1, wherein: the phase change heating panel still includes the base plate, the base plate includes first base plate and the second base plate that closes each other, closed cavity sets up first base plate with between the second base plate, first base plate is towards keeping away from the direction of second base plate is formed with the pipeline face through hot rolling, inflation technology, the second base plate is kept away from the surface of first base plate is for leveling the surface.

3. The heat removal assembly of claim 2, wherein: and a heat conduction layer is arranged between the heat conduction plate and the heat absorption part.

4. The heat dissipation assembly of claim 1, wherein: the phase change heat dissipation plate further comprises a bending portion, and the bending portion is connected between the heat absorption portion and the heat dissipation portion.

5. The heat dissipation assembly of claim 1, wherein: the height of the heat dissipation part is higher than that of the heat absorption part.

6. A heat dissipation module is characterized in that: the heat dissipation module comprises the heat dissipation assembly as recited in any one of claims 1-5.

7. The heat dissipation module of claim 6, wherein: the heat dissipation module further comprises a control box, the control box is attached to the phase-change heat dissipation plate and connected with the phase-change heat dissipation plate, a heating device is arranged in the control box, and the heating device is attached to the heat absorption part.

8. The heat dissipation module of claim 7, wherein: the control box comprises a box body and an upper cover, the box body comprises a bottom plate and four side plates connected with the bottom plate, the heating device comprises a circuit board and components mounted on the circuit board, and one side of the circuit board, which is far away from the components, is attached to the heat absorbing part.

9. The heat dissipation module of claim 8, wherein: the bottom plate is provided with a through groove, the through groove is communicated with the inner cavity of the control box, and one side of the circuit board, which is far away from the component, passes through the through groove and then is attached to the heat absorbing part.

10. An air conditioner, characterized in that: the air conditioner comprises the heat dissipation module according to any one of claims 6 to 9.

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