CN212034612U - Heat dissipation assembly, heat dissipation module and air conditioner - Google Patents
Heat dissipation assembly, heat dissipation module and air conditioner Download PDFInfo
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- CN212034612U CN212034612U CN202020472075.0U CN202020472075U CN212034612U CN 212034612 U CN212034612 U CN 212034612U CN 202020472075 U CN202020472075 U CN 202020472075U CN 212034612 U CN212034612 U CN 212034612U
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 99
- 238000010521 absorption reaction Methods 0.000 claims abstract description 41
- 230000008859 change Effects 0.000 claims abstract description 39
- 238000010438 heat treatment Methods 0.000 claims abstract description 27
- 238000005452 bending Methods 0.000 claims description 8
- 230000005855 radiation Effects 0.000 claims description 4
- 238000005098 hot rolling Methods 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 claims description 2
- 230000007704 transition Effects 0.000 abstract description 9
- 239000012071 phase Substances 0.000 description 33
- 239000000758 substrate Substances 0.000 description 17
- 239000007792 gaseous phase Substances 0.000 description 4
- 239000007791 liquid phase Substances 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical group CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a radiator unit for give the device heat dissipation that generates heat, radiator unit includes phase change heating panel and fin assembly, be provided with the closed cavity on the phase change heating panel, it has the phase change working medium to fill in the closed cavity, the phase change heating panel includes heat absorption portion and radiating part, radiator unit includes the heat-conducting plate and connects fin on the heat-conducting plate, the heat-conducting plate is connected one side of heat absorption portion, the device that generates heat is relative the heat-conducting plate sets up the opposite side of heat absorption portion. The utility model provides a radiator unit connects the heat-conducting plate in heat absorption portion one side, and the device that generates heat sets up at the heat absorption portion opposite side, and the back is leaked to the phase transition working medium, and when the heat of heat absorption portion can not transmit the heat dissipation part heat dissipation, the fin dispels the heat to the device that generates heat, prolongs the life of the device that generates heat. The utility model also provides a heat dissipation module with this radiator unit. The utility model also provides an air conditioner with this heat dissipation module.
Description
Technical Field
The utility model relates to a heat dissipation technical field especially, relates to a radiator unit and heat dissipation module, air conditioner.
Background
With the rapid development of miniaturization, integration and high efficiency of power electronic equipment and devices, the performance and heat dissipation capacity of the devices are continuously increased, and the problems of uneven heat flow density distribution, extremely high local heat flow density, heat accumulation in local areas and overhigh local temperature are brought, for example, power modules such as Insulated Gate Bipolar Transistor (IGBT) and the like in a controller of a variable frequency air conditioner with large heat productivity.
The existing heat dissipation assembly comprises a phase change heat dissipation plate and fins welded on the phase change heat dissipation plate, wherein one side of the phase change heat dissipation plate is a plane, and the other side of the phase change heat dissipation plate is a pipe surface with a pipeline and unevenness. The phase-change heat dissipation plate is filled with a phase-change working medium and comprises a heat absorption part, a bending part and a heat dissipation part, the plane of the heat absorption part is attached to the heating device, and the heat dissipation part is connected with the fins. However, the phase-change working medium in the phase-change heat dissipation plate may leak, and at this moment, the phase-change heat dissipation plate does not have a phase-change heat dissipation function, and heat generated by the heating device cannot be efficiently transferred to the heat dissipation part for heat dissipation, so that the heating device is damaged due to long-term working in a high-heat environment, and the service life of the heating device is greatly shortened.
SUMMERY OF THE UTILITY MODEL
Therefore, it is necessary to provide a heat dissipation assembly with a long service life of the heat generating device;
it is also necessary to provide a heat dissipation module with the heat dissipation assembly;
it is further desirable to provide an air conditioner with the heat dissipation module.
The utility model provides a technical scheme that its technical problem adopted is: the heat dissipation assembly is used for dissipating heat of a heating device and comprises a phase change heat dissipation plate and a fin assembly, wherein a closed cavity is formed in the phase change heat dissipation plate, a phase change working medium is filled in the closed cavity, the phase change heat dissipation plate comprises a heat absorption portion and a heat dissipation portion, the heat dissipation assembly comprises a heat conduction plate and fins connected to the heat conduction plate, the heat conduction plate is connected to one side of the heat absorption portion, and the heating device is opposite to the heat conduction plate arranged on the other side of the heat absorption portion.
Further, the phase change heating panel still includes the base plate, the base plate includes first base plate and the second base plate that closes each other, closed cavity sets up first base plate with between the second base plate, first base plate is towards keeping away from the direction of second base plate is formed with the pipeline face through hot rolling, inflation technology, the surface that the second base plate kept away from first base plate is for leveling the surface.
Further, a heat conduction layer is arranged between the heat conduction plate and the heat absorption part.
Furthermore, the phase change heat dissipation plate further comprises a bending part, and the bending part is connected between the heat absorption part and the heat dissipation part.
Further, the height of the heat dissipation part is higher than the height of the heat absorption part.
A heat radiation module comprises the heat radiation component.
Further, the heat dissipation module still includes the control box, the control box with the phase transition radiator is laminated mutually, and with the phase transition radiator is connected, detachably is provided with the device that generates heat in the control box, the device that generates heat with the heat absorption portion is laminated mutually.
Further, the control box includes box and upper cover, the box include the bottom plate and with four curb plates that the bottom plate is connected, the device that generates heat includes the circuit board, installs components and parts on the circuit board, one side that the circuit board kept away from components and parts with the heat absorption portion laminating mutually.
Furthermore, a through groove is formed in the bottom plate and communicated with the inner cavity of the control box, and one side, far away from the component, of the circuit board penetrates through the through groove and then is attached to the heat absorbing part.
An air conditioner, the air conditioner includes above-mentioned heat dissipation module.
The utility model has the advantages that: the utility model provides a radiator unit or heat dissipation module, air conditioner connects the heat-conducting plate in one side of heat absorption portion, and the relative heat-conducting plate of device that generates heat sets up the opposite side at the heat absorption portion, consequently, the back takes place to leak in the phase transition working medium of phase transition heating panel, and when the heat of heat absorption portion can not transmit the radiating part and dispel the heat, the fin can dispel the heat to the device that generates heat to the life of extension device that generates heat.
Drawings
The present invention will be further explained with reference to the drawings and examples.
Fig. 1 is a schematic structural diagram of an air conditioner according to a first embodiment of the present invention;
FIG. 2 is an exploded view of the air conditioner shown in FIG. 1;
FIG. 3 is a top plan view of the air conditioner of FIG. 1;
FIG. 4 is a sectional view taken along A-A of the air conditioner shown in FIG. 3;
FIG. 5 is an enlarged view of a portion of the air conditioner shown in FIG. 4 at B;
fig. 6 is a schematic structural view of an air conditioner according to a second embodiment of the present invention;
FIG. 7 is an exploded view of the air conditioner shown in FIG. 6;
FIG. 8 is a top view of the air conditioner shown in FIG. 6;
FIG. 9 is a sectional view taken along C-C of the air conditioner shown in FIG. 8;
fig. 10 is a partially enlarged view of the air conditioner shown in fig. 9 at D.
The names and the numbers of the parts in the figure are respectively as follows:
control box 1, box 11 and upper cover 12
Heat sink 21, bent 22 and heat sink 23
Heat conduction layer 6 component 42 circuit board 43
Detailed Description
The present invention will now be described in detail with reference to the accompanying drawings. This figure is a simplified schematic diagram, and merely illustrates the basic structure of the present invention in a schematic manner, and therefore it shows only the constitution related to the present invention.
Referring to fig. 1 to 5, the present invention provides a heat dissipation assembly for dissipating heat of a heating device, which includes a phase change heat dissipation plate 2 and a fin assembly 3, wherein the fin assembly 3 is connected to the phase change heat dissipation plate 2.
The phase change heat dissipation plate 2 comprises a substrate, the substrate comprises a first substrate 210 and a second substrate 220 which are mutually covered, the first substrate 210 and the second substrate 220 are both Z-shaped plate structures, a closed cavity is formed between the first substrate 210 and the second substrate 220, a phase change working medium is filled in the closed cavity, pipelines (not shown) are formed in the first substrate 210 in the direction away from the second substrate 220 through hot rolling and blowing processes, so that a pipeline surface 211 with grooves and protrusions is formed on the surface of the first substrate 210 away from the second substrate 220, and the surface of the second substrate 220 away from the first substrate 210 is a flat surface 221.
In this embodiment, the phase change working medium is ethanol. In other embodiments, not shown, the phase change working fluid may also be one of water or propanol.
Furthermore, the substrate is formed with a heat absorbing portion 21, a bending portion 22 and a heat dissipating portion 23, the bending portion 22 is connected between the heat absorbing portion 21 and the heat dissipating portion 23, and the included angles between the heat absorbing portion 21 and the heat dissipating portion 23 and the bending portion 22 are all 90 °. In practical applications, the height of the heat dissipating part 23 is higher than the height of the heat absorbing part 21. In the present embodiment, the flat surface 221 corresponding to the heat absorbing portion 21 is bonded to the heat generating device.
The fin assembly 3 includes a heat conductive plate 31 and fins 32 attached to the heat conductive plate 31, the heat conductive plate 31 being made of a heat conductive metal material. In the present embodiment, the metal material is aluminum. Further, the heat transfer plate 31 and the heat absorbing portion 21 are connected by brazing at positions corresponding to the pipe surface 211.
Furthermore, a capillary structure is arranged in the closed cavity.
During operation, after the phase change heat dissipation plate 2 absorbs heat, the liquid phase change working medium in the closed cavity is vaporized in the heat absorption part 21, the gaseous phase change working medium expands rapidly and then fills the whole closed cavity, after the gaseous phase change working medium moves to the heat dissipation part 23 and is cooled and liquefied, the liquid phase change working medium flows back to the heat absorption part 21 again under the effect of the capillary structure, circulation heat absorption evaporation further plays a role in heat dissipation, and meanwhile, part of heat transferred to the phase change heat dissipation plate 2 can also be transferred to the heat conduction plate 31 and the fins 32 for heat dissipation.
When the phase change working medium in the phase change heat dissipation plate 2 leaks, and the heat of the heat absorption part 21 cannot be transferred to the heat dissipation part 23 for heat dissipation, the fins 32 can dissipate the heat of the heating device, so that the service life of the heating device is prolonged.
Please refer to fig. 1 to 5, the present invention further provides a heat dissipation module with the above heat dissipation assembly, the heat dissipation module includes the above heat dissipation assembly, the control box 1 is installed on the heat dissipation assembly, the heating device 4 is provided in the control box 1, the control box 1 is attached to the heat absorption portion 21 of the phase change heat dissipation plate 2, and is fixedly connected to the phase change heat dissipation plate 2.
The control box 1 is a square box structure, the control box 1 includes a box body 11 and an upper cover 12, the box body 11 includes a bottom plate 111 and four side plates 112 connected with the bottom plate 111, a through groove 110 is provided on the bottom plate 111, and the through groove 110 is communicated with an inner cavity of the control box 1.
The heat generating device 4 comprises a circuit board 43 and a component 42 mounted on the circuit board 43, wherein one side of the circuit board 43 away from the component 42 passes through the through groove 110 and is attached to the flat surface 221 corresponding to the heat absorbing part 21. The circuit board 43 is attached to the flat surface 221 of the heat absorbing part 21, thereby improving heat conduction efficiency.
During operation, heat generated by the component 42 is transferred to the circuit board 43 and then transferred to the phase change heat dissipation plate 2, the liquid phase change working medium in the closed cavity is vaporized after the heat absorption part 21 absorbs the heat, the gaseous phase change working medium rapidly expands to fill the whole closed cavity, after the gaseous phase change working medium moves to the heat dissipation part 23 and is cooled and liquefied, the liquid phase change working medium flows back to the heat absorption part 21 again under the action of the capillary structure, circulation heat absorption evaporation further plays a role in heat dissipation, and meanwhile, at least part of the heat transferred to the phase change heat dissipation plate 2 can be transferred to the heat conduction plate 31 and the fins 32 for heat dissipation.
Referring to fig. 1 to 5 again, the present invention further provides an air conditioner with the heat dissipation module, the air conditioner includes the heat dissipation module, the heat dissipation module is connected with a bracket 5, and the bracket 5 is fixedly connected to the pipeline surface 211 corresponding to the heat dissipation portion 23. In the present embodiment, the bracket 5 is used to fix the fan.
The embodiment of the utility model provides a radiator unit or heat dissipation module, air conditioner connects heat-conducting plate 31 in one side of heat absorption portion 21, the relative heat-conducting plate 31 of heating device sets up the opposite side at heat absorption portion 21, consequently, the phase transition working medium in the phase transition heating panel 2 takes place to leak the back, and when the heat of heat absorption portion 21 can not transmit the heat dissipation portion 23 and dispel the heat, fin 32 can dispel the heat to heating device 4 to the life of extension heating device 4.
Example two
Referring to fig. 6 to 10, a heat dissipation assembly according to a second embodiment of the present invention is different from the heat dissipation assembly according to the first embodiment in that: in this embodiment, a heat conductive layer 6 is coated on the pipeline surface 211 corresponding to the heat absorbing part 21, so that the plane where the pipeline surface 211 is located is a planar structure. The heat conducting plate 31 is fixedly connected to the corresponding pipe surface 211 of the heat absorbing part 21 by a fastening member (e.g., a screw, a bolt, etc.).
In the present embodiment, the heat conductive layer 6 is made of a heat conductive material. The heat conduction material is heat conduction silicone grease or heat conduction gel, wherein the heat conduction silicone grease or the heat conduction gel belong to slurry substances. In other embodiments, not shown, the thermally conductive material may also be a thermally conductive paste.
The embodiment of the utility model provides a second heat radiation assembly or heat dissipation module, the air conditioner, scribble one deck heat-conducting layer 6 on the pipeline face 211 that the heat absorption portion 21 corresponds, the pipeline face 211 fixed connection that heat-conducting plate 31 and heat absorption portion 21 correspond, can realize equally that the phase transition working medium in the phase transition heating panel 2 takes place to leak the back, when heat absorption portion 21's heat can not transmit heat dissipation part 23 and dispel the heat, fin 32 can dispel the heat to components and parts 42, thereby prolong the life of heating element 4, and simultaneously, heat-conducting layer 6 has fine heat transfer effect, and the plane that makes the pipeline face 211 that the heat absorption portion 21 corresponds place is planar structure, increase heat transfer area, and then further improved heat transfer efficiency.
In light of the foregoing, it will be apparent to those skilled in the art from this disclosure that various changes and modifications can be made without departing from the scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (10)
1. The utility model provides a heat radiation component for give the device heat dissipation that generates heat which characterized in that: the heat dissipation assembly comprises a phase-change heat dissipation plate and a fin assembly, a closed cavity is arranged on the phase-change heat dissipation plate, a phase-change working medium is filled in the closed cavity, the phase-change heat dissipation plate comprises a heat absorption portion and a heat dissipation portion, the heat dissipation assembly comprises a heat conduction plate and fins connected to the heat conduction plate, the heat conduction plate is connected to one side of the heat absorption portion, and the heating device is arranged on the other side of the heat absorption portion relative to the heat conduction plate.
2. The heat dissipation assembly of claim 1, wherein: the phase change heating panel still includes the base plate, the base plate includes first base plate and the second base plate that closes each other, closed cavity sets up first base plate with between the second base plate, first base plate is towards keeping away from the direction of second base plate is formed with the pipeline face through hot rolling, inflation technology, the second base plate is kept away from the surface of first base plate is for leveling the surface.
3. The heat removal assembly of claim 2, wherein: and a heat conduction layer is arranged between the heat conduction plate and the heat absorption part.
4. The heat dissipation assembly of claim 1, wherein: the phase change heat dissipation plate further comprises a bending portion, and the bending portion is connected between the heat absorption portion and the heat dissipation portion.
5. The heat dissipation assembly of claim 1, wherein: the height of the heat dissipation part is higher than that of the heat absorption part.
6. A heat dissipation module is characterized in that: the heat dissipation module comprises the heat dissipation assembly as recited in any one of claims 1-5.
7. The heat dissipation module of claim 6, wherein: the heat dissipation module further comprises a control box, the control box is attached to the phase-change heat dissipation plate and connected with the phase-change heat dissipation plate, a heating device is arranged in the control box, and the heating device is attached to the heat absorption part.
8. The heat dissipation module of claim 7, wherein: the control box comprises a box body and an upper cover, the box body comprises a bottom plate and four side plates connected with the bottom plate, the heating device comprises a circuit board and components mounted on the circuit board, and one side of the circuit board, which is far away from the components, is attached to the heat absorbing part.
9. The heat dissipation module of claim 8, wherein: the bottom plate is provided with a through groove, the through groove is communicated with the inner cavity of the control box, and one side of the circuit board, which is far away from the component, passes through the through groove and then is attached to the heat absorbing part.
10. An air conditioner, characterized in that: the air conditioner comprises the heat dissipation module according to any one of claims 6 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020472075.0U CN212034612U (en) | 2020-04-02 | 2020-04-02 | Heat dissipation assembly, heat dissipation module and air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020472075.0U CN212034612U (en) | 2020-04-02 | 2020-04-02 | Heat dissipation assembly, heat dissipation module and air conditioner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212034612U true CN212034612U (en) | 2020-11-27 |
Family
ID=73489671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020472075.0U Active CN212034612U (en) | 2020-04-02 | 2020-04-02 | Heat dissipation assembly, heat dissipation module and air conditioner |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212034612U (en) |
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2020
- 2020-04-02 CN CN202020472075.0U patent/CN212034612U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 213176 No.20, Jiandong Road, Lijia Town, Wujin District, Changzhou City, Jiangsu Province Patentee after: Changzhou Hengchuang Thermal Management System Co.,Ltd. Country or region after: China Address before: 213000 No.20, Jiandong Road, Lijia Town, Wujin District, Changzhou City, Jiangsu Province Patentee before: CHANGZHOU HENGCHUANG HEAT MANAGEMENT Co.,Ltd. Country or region before: China |