CN212034424U

CN212034424U - High-strength tear-resistant flexible substrate

Info

Publication number: CN212034424U
Application number: CN201921844143.5U
Authority: CN
Inventors: 张义福
Original assignee: Huizhou Rongyuxin Electronic Technology Co ltd
Current assignee: Huizhou Rongyuxin Electronic Technology Co ltd
Priority date: 2019-10-30
Filing date: 2019-10-30
Publication date: 2020-11-27
Anticipated expiration: 2029-10-30

Abstract

The utility model belongs to the technical field of the PCB base plate technique and specifically relates to a flexible base plate is torn to high strength tearing, including insulating base member layer, the both sides on insulating base member layer all are equipped with the anti-stretching layer, one side on insulating base member layer all is equipped with a plurality of dovetail fixed recess, one side on anti-stretching layer is equipped with the sand grip, the both ends on insulating base member layer are equipped with the side band layer, the both sides on side band layer all are equipped with connecting groove, two cell walls on connecting groove all are equipped with the toughness baseband, connecting groove's upper portion is equipped with the packing preforming, two one side on anti-stretching layer all is equipped with outer copper foil, outer copper foil with be equipped with the adhesive linkage between one side on anti-stretching layer, through the utility model discloses an improvement has effectively improved flexible base plate's tear resistance, novel structure is practical, is fit for.

Description

High-strength tear-resistant flexible substrate

Technical Field

The utility model relates to a PCB base plate technical field especially relates to a tear flexible substrate is resisted to high strength.

Background

With the continuous development of the PCB technology, the PCB is widely used in various industries, and the application of the hard board is well established from some large-scale control devices to the current fields of LED control and the like, and the hard board is also called as a rigid PCB and adopts a rigid PCB substrate. However, with the development and progress of the society, flexible Printed Circuit Boards (PCBs) or rigid-flex boards are popular, and most of these flexible printed circuit boards are flexible substrates, such as flexible substrates made of PI polyimide substrate materials, which have good mechanical properties and excellent chemical resistance, and become the preferred materials of the existing flexible substrates and are gaining wide attention. However, the existing flexible substrates have a drawback that the material layers are bonded and fixed by adhesives such as epoxy resin adhesives, so that the tearing resistance of the flexible substrates is poor, the side edges of the flexible substrates are prone to fluffing and stabbing, the whole flexible substrates are installed in some equipment and need to be precisely protected, and once the whole flexible substrates are damaged, the results of short circuit, layer deviation, fracture and the like are caused, so that certain trouble is brought to users or developers. Therefore, the utility model provides a tear-resistant flexible substrate of high strength solves above-mentioned problem.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the problem that the tear-resistant flexible substrate is not provided in the prior art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a design a flexible base plate is torn to high strength tearing, including insulating base member layer, the both sides of insulating base member layer all are equipped with the stretch-proofing layer, insulating base member layer with one side that the stretch-proofing layer is relative all is equipped with a plurality of dovetail fixed recess, one side of stretch-proofing layer be equipped with fixed recess assorted sand grip, insulating base member layer with both ends that the stretch-proofing layer is relative all are equipped with the side band layer, the side band layer with all be equipped with connecting groove between the both sides of stretch-proofing layer, connecting groove's cell wall both sides all are equipped with the toughness baseband that a plurality of provided certain tension, connecting groove's upper portion is equipped with rather than assorted filling preforming, two stretch-proofing layer is kept away from one side of insulating base member layer all is equipped with outer copper foil, outer copper foil with be equipped with the adhesive linkage between one side of stretch-proofing layer.

Preferably, one side of each of the two layers of outer copper foils is provided with a printed circuit area, and the flexible base band and the side band layer are separated from the printed circuit areas.

Preferably, the insulating substrate layer is formed by stacking and fixing a plurality of layers of PI polyimide insulating films through hot pressing, the stretch-resistant layer is formed by gluing and fixing a plurality of layers of ultrathin glass fiber cloth, and the glue joint agent is a polyimide adhesive.

Preferably, one side of side band layer is equipped with a plurality of equidistance and equally divide the heat dissipation bump of arranging, a plurality of toughness baseband is the equidistance and equally divides the arrangement, and a plurality of fixed recess is the equidistance and equally divides the arrangement.

Preferably, the bonding layer and the connecting groove are filled with epoxy resin adhesives, and the thickness of the copper foil of the outer copper foil is selected from one of three specifications of 0.5OZ, 1OZ and 2 OZ.

The utility model provides a pair of tear-resistant flexible substrate of high strength, beneficial effect lies in: through the arrangement and the matching of the insulating base body layer and the stretch-resistant layer in the flexible substrate, the fixed groove and the convex strip are arranged between the stretch-resistant layer and the insulating base body layer for connection, so that the mounting surface of the stretch-resistant layer can bear certain tensile or compression stress when being bent, and the interlayer fracture cannot be caused; set up its both ends on insulating base member layer simultaneously and prevented to tear the layer inclined to one side phenomenon that the pulling force caused because of the side, the certain elastic force through the tension cushioning effect of toughness baseband and filled adhesive simultaneously for the base plate after being drawn the deformation resumes to original form, protect inside silk thread layer or electroplate the copper hole not influenced, because side band layer and toughness baseband all set up in non-circuit district, so do not influence or interfere the connection of circuit between the layer, overall structure is novel and practical, and is suitable for promoting.

Drawings

Fig. 1 is a schematic structural view of a high strength tear-resistant flexible substrate according to the present invention;

fig. 2 is an exploded schematic view of a high strength tear resistant flexible substrate according to the present invention;

fig. 3 is a schematic cross-sectional structure view of a high-strength tear-resistant flexible substrate according to the present invention.

In the figure: the heat dissipation base body comprises an insulation base body layer 1, an anti-stretching layer 2, a fixing groove 3, a convex strip 4, a connecting groove 5, a toughness base band 6, a printed circuit area 7, a filling pressing sheet 8, an outer copper foil 9, an adhesive layer 10, a side band layer 11 and a heat dissipation convex point 111.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1-3, a high-strength tear-resistant flexible substrate comprises an insulating substrate layer 1, wherein both sides of the insulating substrate layer 1 are provided with a stretch-resistant layer 2, one side of the insulating substrate layer 1 opposite to the stretch-resistant layer 2 is provided with a plurality of dovetail-type fixing grooves 3, one side of the stretch-resistant layer 2 is provided with raised strips 4 matched with the fixing grooves 3, the cooperation of the raised strips 4 and the fixing grooves 3 enables the internal layers to bear transverse tearing force, both ends of the insulating substrate layer 1 opposite to the stretch-resistant layer 2 are provided with side belt layers 11, the arrangement of the side belt layers 11 can effectively prevent the layer deviation phenomenon caused by interlayer tearing, so as to prevent the internal circuits from being damaged, connecting grooves 5 are arranged between both sides of the side belt layers 11 and the stretch-resistant layer 2, both sides of the groove walls of the connecting grooves 5 are provided with a plurality of toughness base belts 6 providing certain tension, the arrangement of the toughness base belts 6 can effectively buffer the tensile stress, the upper portion of coupling groove 5 is equipped with rather than assorted packing preforming 8, and one side that insulating base member layer 1 was kept away from to two stretch-proofing layers 2 all is equipped with outer copper foil 9, is equipped with adhesive linkage 10 between one side of outer copper foil 9 and stretch-proofing layer 2, and adhesive linkage 10 chooses for use epoxy adhesive that has certain elasticity.

The utility model discloses in, the one side of two-layer outer copper foil 9 all is equipped with printed wiring district 7, and toughness baseband 6, side band layer 11 all separate mutually with printed wiring district 7, prevent to cause the influence to circuit layer or layer circuit.

Insulating base member layer 1 is piled up fixedly through the hot pressing by a plurality of layers of PI polyimide insulating film and forms, stretch-proofing layer 2 is fixed by the bonding of a plurality of layers of ultra-thin glass fiber cloth, the adhesive joint adopts the polyimide adhesive, one side of side band layer 11 is equipped with a plurality of equidistance and equally divides the heat dissipation bump 111 of arranging, a plurality of toughness baseband 6 is the equidistance and equally divides the arrangement, a plurality of fixed recess 3 is the equidistance and equally divides the arrangement, keep the good mechanical properties of PI polyimide insulating film, make stretch-proofing performance obtain improving simultaneously.

The inside epoxy adhesive that all fills of adhesive linkage 10 and connecting groove 5, one of three kinds of specifications of 0.5OZ, 1OZ or 2OZ is chooseed for use to the copper foil thickness of outer copper foil 9, and chooseing for use of copper foil thickness chooses for use according to the circuit characteristic of circuit district, and overall structure is novel practical, is fit for promoting.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. The utility model provides a flexible base plate is torn to high strength tearing, includes insulating base member layer (1), its characterized in that, the both sides of insulating base member layer (1) all are equipped with stretch-proofing layer (2), insulating base member layer (1) with one side that stretch-proofing layer (2) is relative all is equipped with a plurality of dovetail fixed recess (3), one side of stretch-proofing layer (2) be equipped with fixed recess (3) assorted sand grip (4), both ends that insulating base member layer (1) and stretch-proofing layer (2) are relative all are equipped with side band layer (11), connecting groove (5) all are equipped with between the both sides of side band layer (11) and stretch-proofing layer (2), the cell wall both sides of connecting groove (5) all are equipped with a plurality of toughness base band (6) that provide certain tension, the upper portion of connecting groove (5) is equipped with rather than assorted filling preforming (8), one side of each of the two anti-stretching layers (2) far away from the insulating base body layer (1) is provided with an outer copper foil (9), and a bonding layer (10) is arranged between each of the outer copper foils (9) and one side of each of the anti-stretching layers (2).

2. A high strength tear resistant flexible substrate according to claim 1, wherein both of said outer copper foils (9) are provided with a track area (7) on one side, and said flexible base tape (6) and said side tape layer (11) are spaced from said track area (7).

3. The high-strength tear-resistant flexible substrate according to claim 1, wherein the insulating base layer (1) is formed by stacking and fixing a plurality of PI polyimide insulating films through hot pressing, the stretch-resistant layer (2) is formed by gluing and fixing a plurality of layers of ultrathin glass fiber cloth, and the glue is a polyimide adhesive.

4. A high strength tear-resistant flexible substrate according to claim 1, wherein one side of said side tape layer (11) is provided with a plurality of heat dissipating protrusions (111) arranged equidistantly and equally, a plurality of said flexible base tapes (6) are arranged equidistantly and equally, and a plurality of fixing grooves (3) are arranged equidistantly and equally.

5. The high-strength tear-resistant flexible substrate according to claim 1, wherein the bonding layer (10) and the connecting groove (5) are filled with epoxy resin adhesive, and the thickness of the outer copper foil (9) is selected from one of three specifications of 0.5OZ, 1OZ and 2 OZ.