CN212011222U

CN212011222U - Microstrip surface-mounted circulator

Info

Publication number: CN212011222U
Application number: CN202020857569.0U
Authority: CN
Inventors: 尹久红; 丁敬垒; 赵春美; 闫欢; 胡艺缤; 杨勤; 高春燕
Original assignee: CETC 9 Research Institute
Current assignee: CETC 9 Research Institute
Priority date: 2020-05-21
Filing date: 2020-05-21
Publication date: 2020-11-24
Anticipated expiration: 2030-05-21

Abstract

The utility model discloses a micro-strip surface-mounted circulator, belonging to the technical field of microwave ferrite devices, comprising an iron bottom plate, a ferrite substrate, matching ceramics and a permanent magnet which are connected in sequence, and also comprising a tin ball and a metallized via hole; the utility model greatly simplifies the traditional iron bottom plate processing structure form by introducing the ball planting process, improves the processing efficiency and increases the yield; the surface-mounted circulator after ball mounting has more advantages in links such as nondestructive testing, complete equipment assembly and the like, and has the capacity of mass production.

Description

Microstrip surface-mounted circulator

Technical Field

The utility model relates to a microwave ferrite device technical field especially relates to a surface mounting device port processing method and adopt microstrip surface mounting circulator of this method preparation.

Background

The micro-strip circulator/isolator is a microwave ferrite device which is widely used on various microwave weaponry such as phased array radar and the like. At present, with the advance of various weaponry and phased array radars towards integration and miniaturization, surface-mounted microstrip devices with integrated advantages become the preferred structures of the related equipment at present.

The input/output port of the traditional microstrip circulator and the transmission circuit are on the same layer, and need to be lapped with the transmission circuit of a user through gold wires and other modes when in use. Although this connection method can realize the transmission of microwave signals, its drawbacks are two: firstly, the gold wire lapping has higher requirements on operators and needs specific equipment; secondly, the overlapping of the gold wires needs a certain bending radius, thereby invisibly increasing the installation size of the product.

Therefore, with the development of the technology, more and more semiconductor devices are mounted in a surface-mounted mounting mode, that is, the input and output ports of the product are on the same surface as the ground, so that all the semiconductor devices can be assembled through a mounting machine and completed through equipment such as reflow soldering and the like at one time, the time for assembling the whole machine is greatly shortened, all the devices can be integrated together, and the mounting size can be reduced to about 50% of the original mounting size.

At present, there are many kinds of surface-mounted devices, such as a microstrip surface-mounted circulator, and a typical structure of the surface-mounted device is as shown in fig. 1, and the surface-mounted device is composed of an iron base plate 1, a ferrite substrate 2, a matching ceramic 3, a permanent magnet 4 and other main parts. In order to realize the surface-mounted performance of the product, the transmission circuit of the ferrite substrate 2 is punched on the substrate to form a metallized through hole 6 to the back of the product, and is connected with an external signal wire through an input/output port 5, so that the function of a surface-mounted circulator is realized.

In the existing process method, the input/output port 5 is very small, generally about 0.3mm × 0.3 mm-0.6 mm × 0.6mm, very small in size, independent of an iron bottom plate, difficult to assemble, low in yield, difficult to improve the grinding level and production efficiency of the device and high in bottleneck in batch production.

The existing microstrip surface-mounted circulator has the structural form of 'an iron base plate + a ferrite substrate + matching ceramic + a permanent magnet' and also has the structural form of 'the ferrite substrate + the matching ceramic + the permanent magnet', and the two structural forms have the respective defects as follows:

the first form: iron bottom plate, ferrite substrate, matching ceramic and permanent magnet

The form is the structural form commonly used by the existing microstrip device, and the most important difference of the surface-mounted circulator and the traditional microstrip device is that a metallized through hole is arranged on a ferrite substrate, and an input/output port is arranged on a lower iron bottom plate.

In order to facilitate welding of the lower iron bottom plate and the input/output port, the traditional design scheme has two types:

the first design scheme is that an iron bottom plate 1 and an input/output port 5 are respectively processed and molded, as shown in fig. 2, after electrogilding is finished, the iron bottom plate and a ferrite substrate are welded by a welding mode, and the iron bottom plate is placed on a precise tool clamp for positioning;

the second design scheme is that the iron bottom plate and the input/output port are integrally processed, as shown in fig. 3; and after the processing is finished, the whole body is welded with the ferrite substrate, and after the welding is finished, the cutting is carried out according to the dotted line part in the figure.

Aiming at the first design scheme in the first form, the size of the input/output port 5 of the product is very small, generally about 0.3mm multiplied by 0.3 mm-0.6 mm multiplied by 0.6mm, the processing difficulty is high, the size precision of the processed product is poor, and the product is not suitable for batch production. In the assembling process, the product size is small, the positioning precision of the positioning fixture is high, the operation difficulty is extremely high, and the positioning fixture is generally rarely used in production.

The second design scheme in the first design scheme is the assembly design optimization on the basis of the first design scheme, and the machining and the assembly can be simpler by integrally machining the iron bottom plate and the input/output port; however, after the product is assembled, the extra parts need to be cut, and the defects are mainly two points:

1. the product needs to be cut after welding, because the size of the input and output port is extremely small, small iron blocks at the port of the product are extremely easy to pull off in the cutting process, and the product is directly scrapped, and the yield of the structural form is about 60-80%, so that the structure is not suitable for large-batch production;

2. the iron base plate of the product is generally subjected to gold plating treatment, the section of the cut product is bare pure iron, and the product is very easy to rust when being used in the air for a long time, so that the reliability of the product is influenced.

The second form: ferrite substrate + matching ceramic + permanent magnet

Aiming at the problem of high processing difficulty of the first-form iron base plate, the thickness of the ferrite is increased by about 0.2mm in design, and the ferrite replaces the original iron base plate in design, and as shown in figure 4, the back of the ferrite forms an input/output port through a sputtering process. These types of defects are mainly two-fold:

1. after the ferrite material is increased, the impedance of the upper circuit is greatly increased, and in order to meet the impedance requirement of the earlier designed circuit, the width of the transmission line needs to be properly increased, generally, if the thickness of the substrate is increased by 0.2mm, the line width of the product is increased by about 65-75%. After the compacting treatment, the size of the designed product is increased by about 40-60% compared with the original size of the product, the installation size of the product is greatly increased, and the technical development trend of miniaturization of the whole equipment is not met;

2. the product cancels the iron bottom plate, the uniformity of the magnetic field on the ferrite substrate is greatly reduced, the microwave performance of the product is also reduced to a certain degree, particularly for the product with the bandwidth of more than 10%, the performance deterioration of the product is serious, and the technical development requirement of the whole equipment for broadband is not met.

SUMMERY OF THE UTILITY MODEL

One of the objectives of the present invention is to provide a method for processing ports of surface-mounted devices to solve the problems of difficult assembly and low yield of the surface-mounted devices.

In order to achieve the above purpose, the utility model adopts the technical scheme that: a surface-mounted device port processing method comprises an iron bottom plate and a ferrite substrate, wherein the processed shape of the iron bottom plate is the shape of an input/output port, then the processed and formed iron bottom plate is welded with the ferrite substrate, and after welding is completed, the input/output port of the surface-mounted device is processed by adopting a ball-planting process.

The utility model provides an input/output port that foretell table pasted device pasted the circulator for example microstrip table plants the ball scheme and can make the iron bottom plate processing of product more convenient, and plant the ball efficiency fast, and the yield is high, can use in a large number in batch product.

The utility model discloses an iron bottom plate processing method includes but not limited to current wire-electrode cutting or etching to obtain getting rid of input/output port's iron bottom plate shape.

The utility model discloses a method is applicable to the port of the surface-mounted circulator/isolator that dielectric material such as ceramic, organic glass, PCB, Si, GaAs of taking ferrite function material and iron bottom plate structure constitutes and handles.

The utility model discloses a novel port processing method that proposes is applicable to the port of all ferrite table pastes devices and handles, and the port position includes but not limited to at the device border, and any position in device top, bottom all can be applicable to this method.

The second objective of the present invention is to provide a microstrip surface-mounted circulator made by the above-mentioned processing method, which comprises an iron bottom plate, a ferrite substrate, a matching ceramic and a permanent magnet, which are connected in sequence, and further comprises a solder ball and a metalized via hole, wherein a surface circuit is arranged on the ferrite substrate, and the solder ball passes through the metalized via hole and the surface circuit of the ferrite substrate are connected.

Compared with the prior art, the utility model has the advantages of:

1. the ball mounting process can ensure that the iron bottom plate has simple structure and greatly reduces the processing difficulty;

2. the ball mounting process replaces the traditional design scheme of a small iron block with a port, the working efficiency is improved by more than 50 times, and the yield can be improved to more than 99.5% from the previous 60-80%;

3. after the product is planted with the balls, the height of the balls is slightly higher than that of the iron bottom plate by about 0.1-0.15 mm, as shown in fig. 7; therefore, the later nondestructive testing is facilitated, the solder ball is soft, the tightness of the test connection can be ensured through the micro deformation of the end face of the solder ball during the testing, and the testing time can be shortened to 1/5-1/10 of the testing time of the traditional device;

4. the product port is composed of the tin balls, so that the welding quality of the connecting plate with a user can be guaranteed even if the solder at the user port is insufficient during heating, and the reliability is high.

Drawings

FIG. 1 is a schematic diagram of a typical conventional microstrip surface-mount circulator;

FIG. 2 is a schematic view of one prior art iron base plate processing scheme;

FIG. 3 is a schematic view of another prior art iron base plate processing scheme;

FIG. 4 is a schematic structural diagram of a microstrip surface-mount circulator with an iron base plate removed in the prior art;

fig. 5 is a schematic view of a processing structure of an iron bottom plate according to an embodiment of the present invention;

fig. 6 is a schematic structural view of a microstrip surface-mounted circulator according to an embodiment of the present invention;

fig. 7 is an enlarged side view of fig. 6.

In the figure: 1. an iron bottom plate; 2. a ferrite substrate; 3. matching ceramics; 4. a permanent magnet; 5. An input-output port; 6. tin balls; 7. the vias are metallized.

Detailed Description

The present invention will be further explained with reference to the accompanying drawings.

Example (b):

the embodiment takes a micro-strip surface-mounted circulator as an example for explanation, and a method for processing a port of the surface-mounted circulator is improved in that the surface-mounted circulator comprises an iron base plate, a ferrite substrate, matching ceramics and a permanent magnet, wherein the processing modes of the ferrite substrate, the matching ceramics and the permanent magnet are still traditional processing modes, the improvement is that the processing mode of the iron base plate is that the iron base plate is processed by adopting a wire cutting method, the processed iron base plate is in a shape without an input/output port, as shown in fig. 5, the processed and formed iron base plate is welded with the ferrite substrate, and after the welding is finished, the input/output port of a surface-mounted device is subjected to ball planting by adopting a conventional ball planting process (similar to a BGA ball planting process) in the field of electronic semiconductors;

the structure of the microstrip surface-mounted circulator prepared by the processing method is shown in fig. 6 and 7, and comprises an iron base plate 1, a ferrite substrate 2, matching ceramic 3 and a permanent magnet 4 which are sequentially connected, and further comprises a solder ball 6 and a metalized through hole 7, wherein a surface circuit is arranged on the ferrite substrate 2, and the solder ball 6 is connected with the surface circuit of the ferrite substrate 2 through the metalized through hole 7.

The utility model provides a novel processing method of microstrip table pastes circulator port through introducing "ball planting" technology, has carried out a large amount of simplifications with traditional iron bottom plate processing structure form, has also increased the yield when promoting machining efficiency. The surface-mounted circulator after ball mounting has more advantages in links such as nondestructive testing, complete equipment assembly and the like, and has the capacity of mass production. And a specific ball planting machine can be introduced to carry out the ball planting of the port of the micro-strip surface-mounted circulator in the later period, so that the production efficiency is more efficient, and the aim of intelligent production and manufacturing is fulfilled.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. A microstrip surface-mounted circulator is characterized in that: the surface circuit comprises an iron bottom plate, a ferrite substrate, matching ceramic and a permanent magnet which are sequentially connected, and further comprises a solder ball and a metalized through hole, wherein a surface circuit is arranged on the ferrite substrate, and the solder ball is connected with the surface circuit of the ferrite substrate through the metalized through hole.