CN212010902U

CN212010902U - Silicon wafer in-place detection device in muddy water

Info

Publication number: CN212010902U
Application number: CN202020519093.XU
Authority: CN
Inventors: 靳立辉; 尹擎; 杨骅; 杜晨鹏; 耿明强; 赵晓光
Original assignee: Tianjin Huanbo Science and Technology Co Ltd
Current assignee: Tianjin Huanbo Science and Technology Co Ltd
Priority date: 2020-04-10
Filing date: 2020-04-10
Publication date: 2020-11-24
Anticipated expiration: 2030-04-10

Abstract

The utility model provides a silicon wafer detection device that targets in place in muddy water, including proximity sensor, swinging boom, installation pole, fixed block, the one end of installation pole run through in the lower part of fixed block, the installation pole is close to the one end of fixed block with the swinging boom rotates to be connected, proximity sensor is fixed in the upper portion of installation piece, the orientation the swinging boom direction sets up. Muddy water in-place silicon wafer detection device improve the precision of detection, improved the machining efficiency of silicon wafer greatly.

Description

Silicon wafer in-place detection device in muddy water

Technical Field

The utility model belongs to silicon chip processing field especially relates to a detection device that targets in place for silicon chip in muddy water.

Background

With the exhaustion of traditional fossil energy, renewable energy research has received attention, and the advantages of large solar energy reserve, safety, cleanness and the like become one of the main energy sources in the future. Under the joint assistance of factors such as high-speed industrial development, good policy and technical progress, the growth of the domestic photovoltaic power generation industry is vigorous, and the industry maintains high-speed growth.

In the manufacturing process of the photovoltaic silicon wafer, the cleaning of the silicon wafer is a key link of the whole manufacturing process of the silicon wafer, and plays an important role. The stability of the silicon chip insert is also an important process for improving the cleaning efficiency of the silicon chip. During the cleaning process of the silicon wafer, the silicon wafer is inserted into the wafer basket by the inserting piece feeding technology, so that no waste products are generated from the previous process to the next process, and the working hour utilization rate is improved.

Most of the existing silicon wafer feeding detection mechanisms of the sheet inserting equipment are directly detected by sensors. The wet-type plugging is carried out in water, so impurities, silicon powder and the like are mixed in the water. In the direct detection of the sensor, the phenomena of missing detection and false detection can occur due to sewage. The card or the long-time non-loading of the card can be caused by the repeated loading of the card on the equipment, so that the production efficiency is low.

Disclosure of Invention

In view of this, the present invention provides a device for detecting the in-place of silicon wafer in muddy water, which overcomes the above-mentioned drawbacks of the prior art.

In order to achieve the above purpose, the technical scheme of the utility model is realized like this:

muddy aquatic silicon chip detection device that targets in place, including proximity sensor, swinging boom, installation pole, fixed block, the one end of installation pole run through in the lower part of fixed block, the other end is installed in the basin, the installation pole is close to the one end of fixed block with the swinging boom rotates to be connected, proximity sensor is fixed in on the installation piece, the orientation the swinging boom direction sets up.

Further, fixed block upper portion open have with proximity sensor complex screw hole, the last external screw thread that is equipped with of proximity sensor, proximity sensor pass through the screw hole with fixed block threaded connection, proximity sensor's probe set up in the fixed block with between the swinging boom, proximity sensor and PLC controller electric connection.

Furthermore, the rotating arm is provided with a through hole corresponding to the mounting rod, the mounting rod penetrates through the through hole in the rotating arm, and a stop block is fixed at one end of the mounting rod close to the rotating arm.

Furthermore, the bottom of the rotating arm extends downwards to form an installation arm, and the installation arm is perpendicular to one side of the installation rod and is connected with a rubber roller in a rotating mode.

Furthermore, a threaded hole is formed in the side face of the fixing block, and the mounting rod is fixed on the fixing block through the threaded hole in a screw insertion mode.

Further, the proximity sensor is disposed at an upper portion of the mounting rod.

Further, the proximity sensor is arranged above the water surface.

Compared with the prior art, the utility model discloses following advantage has:

(1) the proximity sensor judges the silicon chip upper piece to be confirmed through the detection of the rotating arm, and is arranged at a position above the water surface, so that the missing detection or false detection caused by the existence of impurities such as silicon powder in water is avoided;

(2) the rubber idler wheel is arranged at the lower end of the rotating arm, so that the silicon wafer is prevented from being worn due to the fact that the silicon wafer is in direct contact with the rotating arm, and the detection process is smooth.

Drawings

The accompanying drawings, which form a part hereof, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention without undue limitation. In the drawings:

fig. 1 is a schematic view of a device for detecting the in-place of silicon wafers in muddy water according to an embodiment of the present invention.

Description of reference numerals:

1-mounting a rod; 11-a stop block; 2-a proximity sensor; 3, fixing blocks; 31-a threaded hole; 4-a rotating arm; 41-mounting arms; 42-a through hole; 5-rubber roller.

Detailed Description

It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.

The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

As shown in fig. 1, the device for detecting the silicon wafer in place in muddy water comprises a proximity sensor 2, a rotating arm 4, an installation rod 1 and a fixed block 3, wherein one end of the installation rod 1 penetrates through the lower part of the fixed block 3, one end of the installation rod 1, which is close to the fixed block 3, is rotatably connected with the rotating arm 4, one end of the installation rod 1, which is far away from the rotating arm 4, is fixed on the wall of a water tank of a wafer inserting machine, and the proximity sensor 2 is fixed on the upper part of the installation block and faces the rotating arm 4. Because the silicon wafer in-place detection is actually carried out in a water tank of the wafer inserting machine, the proximity sensor 2 is arranged above the horizontal plane, and the phenomenon of shoulder exposure or false detection caused by the impurities such as silicon powder mixed in the water is prevented. The proximity sensor adopts but is not limited to an ohm dragon E2E-X2D1-M1-Z sensor.

As shown in fig. 1, the upper portion of the fixing block 3 is provided with a threaded hole 31 matched with the proximity sensor 2, the proximity sensor 2 is provided with an external thread, the proximity sensor 2 is in threaded connection with the fixing block 3 through the threaded hole 31, a probe of the proximity sensor 2 is arranged between the fixing block 3 and the rotating arm 4, and the proximity sensor 2 is electrically connected with the PLC controller. In this embodiment, but not limited to Mitsubishi FX3U series PLC controllers are used.

As shown in fig. 1, the rotating arm 4 is provided with a through hole 42 corresponding to the mounting rod 1, the mounting rod 1 penetrates through the rotating arm 4 through the through hole 42, and a stopper 11 is fixed at one end of the mounting rod 1 close to the rotating arm 4 to prevent the rotating arm 4 from being detached from the mounting rod 1.

As shown in fig. 1, the bottom of the rotating arm 4 extends downwards to form an installation arm 41, the installation arm 41 is perpendicular to one side of the installation rod 1 is rotated and connected with a rubber roller 5, a silicon wafer is driven by a conveying device to move towards the vertical direction of the installation rod 1, the rubber roller 5 is upwards rotated by the thrust of the silicon wafer, the rotating arm 4 is driven to rotate, so that the rotating arm 4 is in indirect contact with the silicon wafer, and the silicon wafer is prevented from being worn.

As shown in fig. 1, a threaded hole 31 is formed in a side surface of the fixed block 3, and the mounting rod 1 is fixed to the fixed block 3 by inserting a screw into the threaded hole 31.

The silicon chip under transfer apparatus's drive to with during the motion of 1 vertically direction of installation pole, rubber roller 5 receives the thrust of silicon chip and upwards rotates to drive swinging boom 4 and rotate, swinging boom 4 rotate can with fixed block 3 is 60 degrees left and right sides contained angle, contained angle when the biggest proximity sensor 2's probe exposes, and proximity sensor 2 can not detect swinging boom 4 this moment to send signal to the PLC controller, after the silicon chip material loading, rubber roller 5 crosses the silicon chip and gets back to initial position again, and proximity sensor 2 detects swinging boom 4, and sends signal to the PLC controller, has PLC controller control insert machine to carry out next work.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. Silicon wafer detection device that targets in place in muddy water, its characterized in that: including proximity sensor (2), swinging boom (4), installation pole (1), fixed block (3), the one end of installation pole (1) with fixed block (3) fixed mounting, the other end are installed in the basin, installation pole (1) are close to the one end of fixed block (3) with swinging boom (4) rotate to be connected, proximity sensor (2) are fixed in on fixed block (3), the orientation swinging boom (4) direction sets up.

2. The device for detecting the in-place of silicon wafers in muddy water of claim 1, wherein: open on fixed block (3) have with proximity sensor (2) complex screw hole (31), be equipped with the external screw thread on proximity sensor (2), through screw hole (31) with fixed block (3) threaded connection, the probe of proximity sensor (2) set up in fixed block (3) with between swinging boom (4), proximity sensor (2) and PLC controller electric connection.

3. The device for detecting the in-place of silicon wafers in muddy water of claim 1, wherein: the utility model discloses a fixing device for fixing the rotary arm, including the swinging boom (4), open on the swinging boom (4) have with through-hole (42) that installation pole (1) correspond, installation pole (1) pass through-hole (42) run through in swinging boom (4), installation pole (1) are close to the one end of swinging boom (4) is fixed with dog (11).

4. The device for detecting the in-place of silicon wafers in muddy water of claim 1, wherein: the bottom of the rotating arm (4) extends downwards to form an installation arm (41), and the installation arm (41) is perpendicular to one side of the installation rod (1) and is connected with a rubber roller (5) in a rotating mode.

5. The device for detecting the in-place of silicon wafers in muddy water of claim 1, wherein: the side of the fixed block (3) is provided with a threaded hole (31), and the mounting rod (1) is fixed on the fixed block (3) through the threaded hole (31) inserted by a screw.

6. The device for detecting the in-place of silicon wafers in muddy water of claim 1, wherein: the proximity sensor (2) is arranged on the upper part of the mounting rod (1).

7. The device for detecting the in-place of silicon wafers in muddy water of claim 1, wherein: the proximity sensor (2) is arranged above the water surface.