CN211982174U - Temperature measurement feedback electromagnetic induction heating body based on thick film technology - Google Patents
Temperature measurement feedback electromagnetic induction heating body based on thick film technology Download PDFInfo
- Publication number
- CN211982174U CN211982174U CN202020855686.3U CN202020855686U CN211982174U CN 211982174 U CN211982174 U CN 211982174U CN 202020855686 U CN202020855686 U CN 202020855686U CN 211982174 U CN211982174 U CN 211982174U
- Authority
- CN
- China
- Prior art keywords
- layer
- heating body
- temperature
- thermistor
- eddy current
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The utility model discloses a temperature measurement feedback electromagnetic induction heating element based on thick film technology, which comprises an eddy current heating element substrate, wherein the eddy current heating element substrate generates heat through the changed current in an electromagnetic coil; the surface of the eddy current heating body substrate is provided with an insulating coupling material layer, the surface of the insulating coupling material layer is provided with a thermistor wire layer, and the thermistor wire layer and the eddy current heating body substrate are relatively insulated and isolated by the insulating coupling material layer, so that a better adhesion effect is generated; the thermistor line layer is positioned on a loop of the sensor circuit, the resistance value of the thermistor line layer changes along with the temperature, and the sensor circuit detects the temperature according to the resistance value change of the thermistor line layer; because the thermistor line layer directly detects the temperature of the eddy current heating element substrate, the temperature can be accurately detected in real time, and the detection is more direct compared with the detection of the temperature of a heating object.
Description
Technical Field
The utility model relates to an electromagnetic induction heating technical field further relates to a temperature measurement feedback electromagnetic induction heat-generating body based on thick film technique.
Background
The electromagnetic induction heating device in the market at present comprises an electromagnetic coil and an eddy current heating body, wherein the eddy current heating body of a columnar coil is arranged in the middle of the coil, and the eddy current heating body of a planar coil is arranged on the upper part or the lower part of the coil. Alternating current generated by the induction heating power supply passes through the electromagnetic coil) to generate an alternating magnetic field, the eddy current heating body is arranged in the magnetic field range to cut alternating magnetic lines, and alternating current (namely eddy current) is generated in the eddy current heating body to heat the object contacted with the eddy current heating body.
In the heating process, the temperature of the heated object needs to be monitored, and the temperature is controlled by adjusting the magnetic field intensity or output time of the electromagnetic coil through a signal fed back by a thermocouple installed in the heated object, as shown in fig. 1, which is a schematic view of a conventional thermocouple temperature measurement structure, the current change of the coil 01 causes the eddy current heating body 02 to generate heat, the eddy current heating body 02 heats an object placed inside, the thermocouple 03 is inserted into the heated object to measure the temperature, and the current feedback adjustment of the coil 01 is performed through a detection signal of the thermocouple 03.
The temperature control mode belongs to indirect measurement, has the problems of long reaction time and large measurement error, and is difficult to accurately realize temperature feedback; meanwhile, the thermocouple is generally made of metal materials, is easily influenced by the magnetic field of the electromagnetic coil, and is low in reliability, and the phenomenon of uneven temperature distribution cannot be effectively identified due to the fact that the temperature measurement mode is single-point temperature measurement.
For those skilled in the art, how to measure temperature accurately in real time is a technical problem to be solved at present.
SUMMERY OF THE UTILITY MODEL
The utility model provides a temperature measurement feedback electromagnetic induction heat-generating body based on thick film technique, the temperature of direct measurement vortex heat-generating body substrate can realize real-time accurate temperature measurement, and the concrete scheme is as follows:
a temperature measurement feedback electromagnetic induction heating element based on thick film technology comprises an eddy current heating element substrate, wherein the eddy current heating element substrate generates heat through an electromagnetic coil;
the surface of the eddy current heating body substrate is provided with an insulating coupling material layer, the surface of the insulating coupling material layer is provided with a thermistor wire layer, and the thermistor wire layer is positioned on a loop of a sensor circuit; the resistance value of the thermistor line layer changes with the temperature.
Optionally, a covering protection layer is arranged on the surface of the insulating coupling material layer, and the thermistor wire layer is wrapped in the covering protection layer; the electromagnetic coil is attached to the surface of the covering protective layer;
the thermistor wire layer is connected with a pad circuit, and the pad circuit extends to the edge of the covering protective layer and is connected with a lead.
Optionally, the thickness of the insulating coupling material layer is 10 to 200 micrometers, the thickness of the thermistor line layer is 5 to 20 micrometers, the thickness of the pad circuit is 5 to 20 micrometers, and the thickness of the protective cover layer is 10 to 100 micrometers.
Optionally, the insulating coupling material layer, the thermistor wire layer, the pad circuit, and the protective cover layer are processed by screen printing.
Optionally, the thermistor wire layer is embodied as a negative temperature coefficient sensor, or a positive temperature coefficient sensor, or a platinum resistance sensor.
Optionally, the insulating coupling material layer is microcrystalline glass.
The utility model provides a temperature measurement feedback electromagnetic induction heating element based on thick film technology, which comprises an eddy current heating element substrate, wherein the eddy current heating element substrate generates heat through the changed current in an electromagnetic coil; the surface of the eddy current heating body substrate is provided with an insulating coupling material layer, the surface of the insulating coupling material layer is provided with a thermistor wire layer, and the thermistor wire layer and the eddy current heating body substrate are relatively insulated and isolated by the insulating coupling material layer, so that a better adhesion effect is generated; the thermistor line layer is positioned on a loop of the sensor circuit, the resistance value of the thermistor line layer changes along with the temperature, and the sensor circuit detects the temperature according to the resistance value change of the thermistor line layer; because the thermistor line layer directly detects the temperature of the eddy current heating element substrate, the temperature can be accurately detected in real time, and the detection is more direct compared with the detection of the temperature of a heating object.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic diagram of a conventional thermocouple temperature measurement structure;
fig. 2 is the utility model provides a temperature measurement feedback electromagnetic induction heat-generating body's a specific embodiment structure chart based on thick film technology.
The figure includes:
the eddy current heating element comprises an eddy current heating element substrate 1, an insulating coupling material layer 2, a thermistor wire layer 3, a pad circuit 4, a covering protective layer 5, an electromagnetic coil 6 and a lead 7.
Detailed Description
The core of the utility model lies in providing a temperature measurement feedback electromagnetic induction heat-generating body based on thick film technique, the temperature of direct measurement vortex heat-generating body substrate can realize real-time accurate temperature measurement.
In order to make those skilled in the art better understand the technical solution of the present invention, the following will describe the temperature measurement feedback electromagnetic induction heating unit based on thick film technology in detail with reference to the accompanying drawings and specific embodiments.
As shown in fig. 2, for the utility model provides a temperature measurement feedback electromagnetic induction heat-generating body's a concrete embodiment structure picture based on thick film technology, including vortex heat-generating body substrate 1, insulating coupling material layer 2, thermistor line layer 3, solenoid 6 isotructure, vortex heat-generating body substrate 1 produces the heat through solenoid 6, solenoid 6 and induction heating power link to each other, the heating during operation, the power provides alternating current for the coil, the alternating current who flows through the coil produces an alternating magnetic field through the work piece, vortex heat-generating body substrate 1 cuts the alternating magnetic line, thereby produce the electric current of alternation in inside, the vortex makes the high-speed irregular motion of the inside atom of object, the atom collides mutually, the friction produces heat energy, thereby heat article, promptly through turning into magnetic energy to the electric energy, make by heating member induction magnetic energy and generate heat.
The eddy current heating body substrate 1 can adopt a barrel shape or a flat plate shape, and the thermistor wire layer 3 can be made into different shapes according to different heating objects; thermistor line layer 3 can be as required in the different shapes of surperficial bending type one-tenth, realizes the design of large tracts of land face on vortex heat-generating body substrate 1, and thermistor line layer 3 covers bigger area, realizes temperature measurement on a large scale.
An insulating coupling material layer 2 is arranged on the surface of the eddy current heating body substrate 1, and a thermistor wire layer 3 is arranged on the surface of the insulating coupling material layer 2; the insulating coupling material layer 2 relatively insulates the eddy current heating element substrate 1 and the thermistor wire layer 3, and meanwhile, the insulating coupling material layer 2 has good adhesion capability, so that the eddy current heating element substrate 1 and the thermistor wire layer 3 can be combined more tightly; meanwhile, the insulating coupling material layer 2 has a good heat conduction effect, so that the heat of the eddy current heating element substrate 1 is rapidly transferred to the thermistor wire layer 3.
The thermistor line layer 3 is located on a loop of the sensor circuit, the resistance of the thermistor line layer 3 changes with the temperature, and the sensor circuit detects the resistance change of the thermistor line layer 3 and correspondingly obtains the corresponding temperature according to the resistance change.
The utility model discloses temperature measurement feedback electromagnetic induction heat-generating body based on thick film technique is based on the thick film circuit design, and thick film circuit is an integrated circuit, with resistance, inductance, electric capacity, semiconductor element and interconnection wire isotructure, the circuit unit who has certain function of making on the base plate. The thick film circuit referred to herein mainly refers to the thermistor wire layer 3 of the temperature sensor circuit provided on the insulating coupling material layer 2.
The utility model discloses temperature measurement feedback electromagnetic induction heat-generating body based on thick film technique uses the magnetic conductivity substrate as vortex heat-generating body substrate 1 to the thermistor line layer 3 of preparing the temperature sensor circuit on its surface, thermistor line layer 3 realizes good thermal coupling through insulating coupling material layer 2 and 1 zonulae occludens of vortex heat-generating body substrate. The heat that the during operation vortex heat-generating body produced thereby realizes accurate direct temperature measurement through insulating coupling material direct transfer to the temperature sensor circuit of zonulae occludens with it, and thick film circuit is nonmagnetic material simultaneously, can not influenced by solenoid's magnetic field. Due to the high integration characteristic of the thick film circuit, the thickness of the thick film functional layer of the heater is only dozens to hundreds of microns, so the whole component is light, thin and small, and is easy to be combined with other components to realize the high integration, light weight and portability of the assembly equipment and reduce the energy consumption.
On the basis of the scheme, the surface of the insulating coupling material layer 2 is provided with the covering and protecting layer 5, the covering and protecting layer 5 is coupled with the insulating coupling material layer 2, and the thermistor wire layer 3 is wrapped in the covering and protecting layer 5 to protect the thermistor wire layer 3.
The electromagnetic coil 6 is attached to the surface of the covering protective layer 5; the thermistor wire layer 3 is connected to the pad circuit 4, and the pad circuit 4 extends to the edge of the cover protective layer 5. The width of the pad circuit 4 is larger than that of the thermistor wire layer 3, one part of the pad circuit 4 is covered by the covering protective layer 5 and the other part is exposed at the edge of the covering protective layer 5, and the exposed part of the pad circuit 4 is connected with the lead 7 and is connected with the other part of the temperature sensor circuit through the lead 7.
Preferably, the thickness of the insulating coupling material layer 2 of the present invention is 10 to 200 micrometers, the thickness of the thermistor wire layer 3 is 5 to 20 micrometers, the thickness of the pad circuit 4 is 5 to 20 micrometers, and the thickness of the protective cover layer 5 is 10 to 100 micrometers, and the appropriate thickness is selected according to different use voltages and power levels.
The insulating coupling material layer 2, the thermistor wire layer 3, the pad circuit 4, and the cover coat layer are processed by screen printing. The specific process comprises the following steps: insulating coupling paste → screen printing → drying → high temperature sintering → sensor circuit paste → screen printing → drying → high temperature sintering → pad conductor paste → screen printing → drying → high temperature sintering → covering protection paste → screen printing → drying → high temperature sintering → lead welding → finished product.
Preferably, the thermistor wire layer 3 in the present invention is one of a negative temperature coefficient sensor, a positive temperature coefficient sensor, or a platinum resistance sensor. The negative temperature coefficient temperature sensor is one of thermistors, and the resistance value rapidly decreases along with the temperature rise; it is usually composed of two or three kinds of metal oxides, and is calcined in a high temperature furnace to form dense sintered ceramics, and the actual size is very flexible. The ptc sensor is a kind of thermistor, and the resistance value of the ptc sensor shows a stepwise increase with the rise of temperature, and the higher the temperature is, the larger the resistance value is. The platinum resistance sensor is formed by adding metal platinum into a resistor, the resistance value of the resistor is different due to temperature change, and the physical or chemical change caused by high and low temperature is avoided due to the stable property of the platinum.
The utility model provides an insulating coupling material layer 2 preferably adopts the microcrystalline glass processing to make, has good insulating nature and heat conduction effect, simultaneously with vortex heat-generating body substrate 1, thermistor line layer 3, pad circuit 4 can good coupling.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (6)
1. A temperature measurement feedback electromagnetic induction heating body based on a thick film technology is characterized by comprising an eddy current heating body base material (1), wherein the eddy current heating body base material (1) generates heat through an electromagnetic coil (6);
an insulating coupling material layer (2) is arranged on the surface of the eddy current heating body substrate (1), a thermistor wire layer (3) is arranged on the surface of the insulating coupling material layer (2), and the thermistor wire layer (3) is positioned on a loop of a sensor circuit; the resistance value of the thermistor line layer (3) changes along with the temperature.
2. A thermometric feedback electromagnetic induction heating body based on thick film technology according to claim 1, characterized in that the surface of the insulating coupling material layer (2) is provided with a covering protective layer (5), and the thermistor wire layer (3) is wrapped in the covering protective layer (5); the electromagnetic coil (6) is attached to the surface of the covering protective layer (5);
the thermistor wire layer (3) is connected with a pad circuit (4), and the pad circuit (4) extends to the edge of the covering protective layer (5) and is connected with a lead (7).
3. A thermometric feedback electromagnetic induction heating body based on thick film technology according to claim 2, characterized in that the thickness of said insulating coupling material layer (2) is 10-200 microns, the thickness of said thermistor wire layer (3) is 5-20 microns, the thickness of said pad circuit (4) is 5-20 microns, and the thickness of said covering protective layer (5) is 10-100 microns.
4. The thermometric feedback electromagnetic induction heating body based on the thick film technology according to claim 3, characterized in that the insulating coupling material layer (2), the thermistor wire layer (3), the pad circuit (4), the covering protective layer are processed by screen printing.
5. A thermometric feedback electromagnetic induction heating body based on thick film technology according to claim 3, characterized in that said thermistor wire layer (3) is specifically a negative temperature coefficient sensor, or a positive temperature coefficient sensor, or a platinum resistance sensor.
6. A thermometric feedback electromagnetic induction heating body based on thick film technology according to claim 3, characterized in that said insulating coupling material layer (2) is microcrystalline glass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020855686.3U CN211982174U (en) | 2020-05-20 | 2020-05-20 | Temperature measurement feedback electromagnetic induction heating body based on thick film technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020855686.3U CN211982174U (en) | 2020-05-20 | 2020-05-20 | Temperature measurement feedback electromagnetic induction heating body based on thick film technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211982174U true CN211982174U (en) | 2020-11-20 |
Family
ID=73371751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020855686.3U Active CN211982174U (en) | 2020-05-20 | 2020-05-20 | Temperature measurement feedback electromagnetic induction heating body based on thick film technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211982174U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111465131A (en) * | 2020-05-20 | 2020-07-28 | 株洲利德英可电子科技有限公司 | Temperature measurement feedback electromagnetic induction heating body based on thick film technology |
| CN113933685A (en) * | 2021-09-29 | 2022-01-14 | 广东汇芯半导体有限公司 | Method, apparatus, device and storage medium for detecting overheat of semiconductor circuit |
-
2020
- 2020-05-20 CN CN202020855686.3U patent/CN211982174U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111465131A (en) * | 2020-05-20 | 2020-07-28 | 株洲利德英可电子科技有限公司 | Temperature measurement feedback electromagnetic induction heating body based on thick film technology |
| CN113933685A (en) * | 2021-09-29 | 2022-01-14 | 广东汇芯半导体有限公司 | Method, apparatus, device and storage medium for detecting overheat of semiconductor circuit |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111465131A (en) | Temperature measurement feedback electromagnetic induction heating body based on thick film technology | |
| CN211982174U (en) | Temperature measurement feedback electromagnetic induction heating body based on thick film technology | |
| CN102345886B (en) | Temperature sensor and there is the induction cooking device of described temperature sensor | |
| CN111134374A (en) | Metal substrate heating element | |
| CN110381613A (en) | A kind of nanometer of planar resistive film metal electric heating device | |
| CN106322457B (en) | A kind of electromagnetic stove | |
| JP6315642B2 (en) | Thick film element with high thermal conductivity in coating layer | |
| CN205919373U (en) | Electromagnetic oven | |
| KR101662713B1 (en) | Thermal properties measurement sensors for thermoelectric thin film in cross-plane direction | |
| JP6315643B1 (en) | Thick film element with high thermal conductivity on coated substrate | |
| CN207751600U (en) | Heater with temperature sensor | |
| CN211932580U (en) | Metal substrate heating element | |
| CN211656413U (en) | Electric heating plate capable of generating heat uniformly and thick film heating element | |
| CN108508263A (en) | Power sensor | |
| KR200399623Y1 (en) | Non-magnetic field heating wire used in bedding | |
| JPS6143823B2 (en) | ||
| CN210053598U (en) | Signal enhancement temperature control system | |
| CN107871574A (en) | A kind of manufacture method of negative temperature coefficient ceramics thermistor | |
| CN108508264B (en) | Power sensor | |
| CN109640407A (en) | A kind of plate thick film heater and manufacturing process | |
| CN206113038U (en) | Electromagnetic stove | |
| CN109561525A (en) | A kind of electric water-heating cup plate thick film heater and preparation method thereof | |
| CN207382601U (en) | A kind of fever tablet with resistance wire | |
| CN205921772U (en) | 3D printer extrusion device and heating device thereof | |
| CN206697302U (en) | A kind of thermistor of high-fire resistance |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |