CN211947280U - Electroplating liquid purification device - Google Patents
Electroplating liquid purification device Download PDFInfo
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- CN211947280U CN211947280U CN201921610826.4U CN201921610826U CN211947280U CN 211947280 U CN211947280 U CN 211947280U CN 201921610826 U CN201921610826 U CN 201921610826U CN 211947280 U CN211947280 U CN 211947280U
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- electroplating
- electroplating solution
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Abstract
The utility model discloses an electroplating solution purification device, which comprises an electroplating bath for containing electroplating solution, wherein the bottom of the electroplating bath is provided with a liquid outlet; the filtering assembly is communicated with the liquid outlet and is used for filtering the electroplating solution which is discharged from the liquid outlet and is provided with impurities and discharging the filtered electroplating solution into the top opening of the electroplating bath; a flocculant releasing assembly for adding a flocculant to the plating liquid discharged from the liquid discharge port; wherein the flocculant does not adsorb metal ions. The utility model discloses an electroplating solution purifier, through flocculating agent release subassembly, discharge into the flocculating agent that does not adsorb metal ion in the electroplating solution before getting into filter assembly in the electroplating solution, the flocculating agent is condensed into coarser granule with the slight impurity in the electroplating solution, makes the impurity in the electroplating solution more easily filtered by filter assembly.
Description
Technical Field
The utility model relates to an electroplating treatment technical field especially relates to an electroplate liquid purifier.
Background
The existing electroplating bath is a rectangular bath body made of plastics, an outlet is not arranged at the bottom of the rectangular bath body, and solid impurities settled from the electroplating bath are accumulated on a bottom plate for a long time, so that the electroplating bath can be cleaned after equipment is shut down frequently, and the working efficiency is reduced.
In order to solve the problems, people set a filtering device to circularly filter the electroplating solution in the electroplating bath so as to reduce the downtime of equipment; however, since the filterability of the plating solution is not high, the filtering effect is not good, and a large amount of impurities are still deposited at the bottom of the plating tank after the plating solution is used for a period of time.
Therefore, it is desired to develop a plating liquid purification apparatus capable of improving the filtration effect.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing an electroplating solution purification device, this electroplating solution purification device can solve the problem that prior art exists.
In order to realize the purpose, the technical scheme of the utility model is that:
an electroplating solution purification apparatus, comprising:
the bottom of the electroplating bath is provided with a liquid outlet;
the filtering assembly is communicated with the liquid outlet and is used for filtering the electroplating solution which is discharged from the liquid outlet and is provided with impurities and discharging the filtered electroplating solution into the top opening of the electroplating bath;
a flocculant releasing assembly for adding a flocculant to the plating liquid discharged from the liquid discharge port;
wherein the flocculant does not adsorb metal ions.
The utility model discloses an electroplating solution purification device, through being equipped with the leakage fluid dram in the bottom of plating bath, make the electroplating solution that has impurity filter assembly after discharging from the leakage fluid dram, and then flow back in the plating bath to through flocculating agent release assembly, discharge into the flocculating agent that does not adsorb metal ion in the electroplating solution before getting into filter assembly, the flocculating agent is condensed the fine impurity in the electroplating solution into coarser granule, make the impurity in the electroplating solution more easily filtered by filter assembly; in addition, a flocculating agent which does not adsorb metal ions is added, so that the metal ions required by electroplating can not be adsorbed.
As a specific embodiment, a first drainage pipe is connected between the drainage port and the filter assembly.
Further, a first stop valve is arranged on the first liquid discharge pipe and used for controlling the flow of the electroplating solution in the first liquid discharge pipe.
The utility model discloses an electroplating solution purifier is through being connected first drain pipe between leakage fluid dram and filter component to and then set up first stop valve on first drain pipe, control the flow of the electroplating solution that flows from the leakage fluid dram through first stop valve, thereby control the electroplating solution liquid level height in the plating bath, avoid the electroplating solution too much to discharge and influence and equip the function.
Furthermore, be equipped with on the flocculating agent release subassembly with the second fluid-discharge tube that first fluid-discharge tube is connected, just be equipped with the second stop valve on the second fluid-discharge tube, the second stop valve is used for controlling the emission of flocculating agent.
The utility model discloses an electroplating solution purifier, through being connected the second fluid-discharge tube between flocculating agent release subassembly and first drain pipe, flocculating agent release subassembly exhaust flocculating agent sneaks into the electroplating solution in to the electroplating solution filterability that makes filter assembly flow through is higher, and sneaks into the proportion of electroplating solution through second cut-off valve control flocculating agent, keeps flocculating agent concentration in the electroplating solution to keep unanimous, avoids flocculating agent concentration low or too high, influences the filterability of electroplating solution.
As a specific embodiment, the flocculant is cationic polyacrylamide.
As a specific embodiment, the filter assembly comprises a settling tank communicated with the liquid outlet, and granular filter materials are placed in the settling tank.
Furthermore, the filter assembly also comprises a filter with a filter element arranged inside;
the liquid inlet of the filter is communicated with the settling tank, and the liquid outlet of the filter is communicated with the top opening of the electroplating tank.
Furthermore, the bottom of the electroplating bath is arranged in a conical shape, and the liquid outlet is arranged at the top of the conical shape.
The utility model discloses an electroplating solution purifier is the toper setting through the bottom that makes the plating bath to set up the leakage fluid dram conical top, thereby through the effect of gravity, make the impurity that the inslot subsides tend to concentrate on the leakage fluid dram, convenient in time discharge.
Furthermore, a plurality of horizontally placed pipe bodies are further arranged in the electroplating bath, and the pipe bodies form a placing frame for placing a heater, a stirrer and an anti-falling net.
Furthermore, the electroplating bath comprises a main electroplating cavity and a buffer cavity, and a third liquid discharge pipe connected with the first liquid discharge pipe is arranged on the buffer cavity;
and an overflow weir is arranged between the main electroplating cavity and the buffer cavity, and when the liquid level of the electroplating solution in the main electroplating cavity is higher than the overflow weir, the electroplating solution flows into the buffer cavity and flows out of the third liquid discharge pipe.
For a better understanding and an implementation, the present invention is described in detail below with reference to the accompanying drawings.
Drawings
FIG. 1 is a schematic view showing the structure of a plating liquid purification apparatus according to an embodiment of the present invention;
fig. 2 is an enlarged view at a in fig. 1.
Detailed Description
In order to better illustrate the present invention, the following detailed description of the present invention is made with reference to the accompanying drawings.
As shown in fig. 1, a plating liquid purifying apparatus includes:
the plating bath 10 is used for containing electroplating solution, and the bottom of the plating bath is provided with a liquid outlet 101;
a filter assembly communicating with the liquid discharge port 101, for filtering the plating solution discharged from the liquid discharge port 101 and containing impurities, and discharging the filtered plating solution into the top opening of the plating tank 10;
a flocculant discharge unit 30 for adding a flocculant to the plating liquid discharged from the liquid discharge port 101;
wherein the flocculant does not adsorb metal ions.
According to the electroplating solution purification device, the liquid outlet is formed in the bottom of the electroplating bath, so that electroplating solution with impurities is discharged from the liquid outlet and then filtered by the filtering assembly, and then flows back to the electroplating bath, the flocculating agent which does not adsorb metal ions is discharged into the electroplating solution by the flocculating agent releasing assembly before the electroplating solution enters the filtering assembly, fine impurities in the electroplating solution are coagulated into coarse particles by the flocculating agent, and the impurities in the electroplating solution are filtered by the filtering assembly more easily; in addition, a flocculating agent which does not adsorb metal ions is added, so that the metal ions required by electroplating can not be adsorbed.
Preferably, the bottom of the plating tank 10 is provided with a taper, and the liquid outlet 101 is provided at the top of the taper.
It should be noted that, in the present embodiment, the bottom of the electroplating tank 10 is provided with a plurality of cones, and the top of each cone is provided with a liquid outlet 101; under the condition that the electroplating bath has a certain length, the inclination of the bottom of the electroplating bath can be larger by arranging a plurality of cones, and the effect of preventing impurities from settling is better.
The plating solution purifier of this embodiment is the toper setting through the bottom that makes the plating bath to with the leakage fluid dram setting the top of toper, thereby through the effect of gravity, make the impurity that the inslot subsides tend to concentrate on the leakage fluid dram, convenient in time discharge.
Specifically, a first drainage pipe 201 is connected between the drainage port 101 and the filter assembly.
Preferably, a first stop valve 202 is provided in the first drain pipe 201, and the first stop valve 202 is used to control the flow rate of the plating liquid in the first drain pipe 201.
The plating solution purifier of this embodiment is through connecting first drain pipe between leakage fluid dram and filter assembly to and then set up first stop valve on first drain pipe, through the flow of the plating solution of first stop valve control follow leakage fluid dram play, thereby control the plating solution liquid level height in the plating bath, avoid the plating solution too much and influence and equip the function.
Preferably, a second liquid discharge pipe 301 connected to the first liquid discharge pipe 201 is disposed on the flocculant releasing assembly 30, and a second stop valve 302 is disposed on the second liquid discharge pipe 301, where the second stop valve 302 is used for controlling the discharge amount of the flocculant.
In this embodiment, since the bottom of the plating tank is provided with three liquid discharge ports, the first liquid discharge pipe forms three branch pipes, and each of the three branch pipes is provided with a first stop valve; wherein, a first stop valve is arranged on the main pipe of the first liquid discharge pipe and close to the connection part of the second liquid discharge pipe and is used for controlling the total flow of the electroplating liquid flowing into the filter assembly.
Specifically, the flocculant is cationic polyacrylamide.
In the practical use process, the first stop valve and the second stop valve are matched with each other, so that the concentration range of the flocculating agent in the electroplating solution is stabilized to be 0.01-10 g/m 3; in this concentration range, the effect of aggregating fine impurities in the plating liquid into coarser particles is most effective.
Specifically, as shown in fig. 1, the filter assembly includes a settling tank 203 communicating with the liquid discharge port 101, and a granular filter material 204 is placed in the settling tank 203.
It should be noted that, in this embodiment, the inlet end of the settling tank is disposed at the bottom or near the bottom, and the outlet end of the settling tank is disposed at the top or near the top, compared to the inlet end disposed at the top or near the top and the outlet end disposed at the bottom or near the bottom, after the electroplating solution enters, the electroplating solution will not pass through the granular filter material quickly due to gravity, but will stay at the bottom where the granular filter material is deposited due to gravity, and will move upward slowly under the condition that the amount of the electroplating solution entering is increased, so as to increase the contact time with the granular filter material, and greatly improve the filtering effect.
The first drain pipe 201 is also provided with a water pump 40, and the plating liquid is sent from the bottom up to the settling tank 203 by the water pump 40.
Preferably, the filter assembly further comprises a filter 205 having a filter element disposed therein;
the liquid inlet of the filter 205 is communicated with the settling tank 203, and the liquid outlet of the filter 205 is communicated with the top opening of the plating tank 10.
Without affecting the understanding, the internal structure of the filter 205 is not shown in the drawings.
The plating solution purifier of this embodiment filters and the filterable dual filtration of filter element formula through setting up the subside formula, further improves the filter effect of plating solution, makes the impurity that subsides in the plating bath still less.
Preferably, a plurality of horizontally placed pipe bodies 102 are further arranged in the electroplating bath 10, and the pipe bodies form a placing frame for placing a heater, a stirrer and an anti-falling net.
Preferably, as shown in fig. 2, the plating tank 10 includes a main plating chamber 103 and a buffer chamber, and a third drain pipe 105 connected to the first drain pipe 201 is disposed on the buffer chamber 103;
an overflow weir 106 is arranged between the main plating chamber 103 and the buffer chamber, and when the liquid level of the plating liquid in the main plating chamber 103 is higher than the overflow weir 106, the plating liquid flows into the buffer chamber and flows out from the third liquid discharge pipe.
The plating solution purifier of this embodiment is equipped with the overflow weir through setting up the cushion chamber in the plating bath between main plating chamber and cushion chamber to set up third fluid-discharge tube intercommunication cushion chamber and first drain pipe, make unnecessary plating solution flow into the cushion chamber through the overflow weir, and flow to first drain pipe through third drain pipe, second drain pipe, all the time at this purifier inner loop.
Various embodiments or examples and features of various embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
In the description of the present invention, it should be understood that the terms "vertical", "horizontal", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the scope of the present invention.
If the terms "first," "second," etc. are used herein to define parts, those skilled in the art will recognize that: the use of "first" and "second" is merely for convenience in describing the invention and to simplify the description, and the words are not intended to have a special meaning unless otherwise stated.
The present invention is not limited to the above embodiment, and if various modifications or variations of the present invention do not depart from the spirit and scope of the present invention, the present invention is intended to cover such modifications and variations if they fall within the scope of the claims and the equivalent technology of the present invention.
Claims (7)
1. An electroplating solution purification apparatus, comprising:
the bottom of the electroplating bath is provided with a liquid outlet;
the filter assembly is communicated with the liquid outlet, the filter assembly comprises a settling tank communicated with the liquid outlet and a filter provided with a filter element inside, a liquid inlet of the filter is communicated with the settling tank, a liquid outlet of the filter is communicated with the top opening of the electroplating bath, a first liquid discharge pipe is connected between the liquid outlet and the filter assembly, and the filter assembly is used for filtering electroplating solution which is discharged from the liquid outlet and contains impurities and discharging the filtered electroplating solution into the top opening of the electroplating bath;
the electroplating solution purification device also comprises a flocculant release assembly, the flocculant release assembly is provided with a second liquid discharge pipe connected with the first liquid discharge pipe, and a flocculant is added into the electroplating solution discharged from the liquid discharge port through the second liquid discharge pipe;
wherein the flocculant does not adsorb metal ions.
2. The plating liquid purification apparatus as recited in claim 1, wherein:
the first liquid discharge pipe is provided with a first stop valve which is used for controlling the flow of the electroplating liquid in the first liquid discharge pipe.
3. The plating liquid purification apparatus as recited in claim 1, wherein:
and a second stop valve is arranged on the second liquid discharge pipe and is used for controlling the discharge amount of the flocculating agent.
4. The plating liquid purification apparatus as recited in claim 1, wherein:
the flocculant is cationic polyacrylamide.
5. The plating liquid purification apparatus as recited in claim 1, wherein:
granular filter materials are placed in the settling tank.
6. The plating liquid purification apparatus as recited in claim 1, wherein:
the bottom of the electroplating bath is arranged in a conical shape, and the liquid outlet is arranged at the top of the conical shape.
7. The plating liquid purification apparatus as recited in claim 1, wherein:
and a plurality of horizontally placed pipe bodies are further arranged in the electroplating bath, and the pipe bodies form a placing frame for placing a heater, a stirrer and an anti-falling net.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921610826.4U CN211947280U (en) | 2019-09-25 | 2019-09-25 | Electroplating liquid purification device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921610826.4U CN211947280U (en) | 2019-09-25 | 2019-09-25 | Electroplating liquid purification device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211947280U true CN211947280U (en) | 2020-11-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921610826.4U Active CN211947280U (en) | 2019-09-25 | 2019-09-25 | Electroplating liquid purification device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211947280U (en) |
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2019
- 2019-09-25 CN CN201921610826.4U patent/CN211947280U/en active Active
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