CN211942600U

CN211942600U - Thermal printing head

Info

Publication number: CN211942600U
Application number: CN201922411296.7U
Authority: CN
Inventors: 陈龙翰; 程双阳; 赵艳秋
Original assignee: Xiamen Core Ceramics Technology Co ltd
Current assignee: Xiamen Core Ceramics Technology Co ltd
Priority date: 2019-12-28
Filing date: 2019-12-28
Publication date: 2020-11-17
Anticipated expiration: 2029-12-28

Abstract

The utility model discloses a thermal printing head, including base plate, heat accumulation layer, printing portion and drive division, the heat accumulation layer attaches on the substrate surface. The printing part is arranged on one side above the heat storage layer and comprises a plurality of electrode belts, a resistor body arranged on the electrode belts and a protective layer covering the electrode belts and the resistor body. The resistor body comprises a plurality of heating parts which are conducted with the electrode belts. The drive division is established on heat accumulation layer and is located the side of printing the portion, and the drive division includes can form a plurality of conducting strips of alloy, attaches the solder mask on the conducting strip, the drive IC and the cladding at the outside inoxidizing coating of drive IC of back welding on the conducting strip with soldering tin. The utility model discloses a can replace the partial gold circuit among the current thermal printer head with the busbar that the metal of soldering tin formation alloy was made, greatly reduced manufacturing cost, drive IC adopts flip-chip bonding to replace current gold wire welding, and welding speed is fast, has improved production efficiency greatly.

Description

Thermal printing head

Technical Field

The utility model relates to a thermal printing device technical field, in particular to thermal printing head.

Background

The thermal head is a main component of a thermal printer, which selectively heats a thermal paper at a certain position, thereby generating a pattern. Heating is provided by a small electric heater on the printhead that is in contact with the heat sensitive material. The form of the heater schedule dots or bars is logically controlled by the printer and, when activated, produces a pattern on the thermal paper corresponding to the heating elements. The same logic that controls the heating elements also controls the feeding of the paper, thus enabling the printing of a pattern on the entire label or sheet.

The utility model discloses a patent number is CN 1114613A's utility model discloses a thermal printer head, including beating the printer head substrate, form a conductor distribution figure on the printer head substrate, beat and be equipped with one row of heating point that keeps the electricity to be connected with the conductor distribution figure on the printer head substrate, install on the printer head substrate and arrange the integrated circuit drive array that separates each other in space with the heating point, integrated circuit drive array outside has and is used for sealed resin shell, the outside of printed circuit and heating point row is equipped with the inoxidizing coating. In the scheme of the patent, all circuit materials are made of gold, and the integrated circuit and the substrate are packaged by gold wires, so that the manufacturing cost of the whole thermosensitive printing head is high due to high manufacturing cost of gold; meanwhile, the integrated circuit and the substrate are packaged by gold wires, the gold wires need to be welded one by one, the welding speed is low, and the production efficiency is low.

Disclosure of Invention

To the above problem, an object of the present invention is to provide a thermal print head, which solves the technical problems of the prior thermal print head proposed in the background art that the gold wire is adopted as the circuit material and the packaging material, the cost is high and the IC welding speed is slow.

In order to realize the purpose, the utility model discloses a technical scheme as follows:

a thermal print head comprising:

a substrate.

And the heat storage layer is attached to the surface of the substrate.

The printing part is arranged on one side above the heat storage layer and comprises a plurality of electrode belts attached to the heat storage layer and arranged at intervals along the length direction of the substrate, a resistor body arranged above the electrode belts and a protective layer covering the plurality of electrode belts and the outside of the resistor body. The resistor body comprises a plurality of heating parts which are arranged at intervals along the length direction of the substrate, and the heating parts are in one-to-one correspondence conduction connection with the electrode belts.

The drive division is established heat accumulation layer top is located the side of printing the portion, the drive division including establishing heat accumulation layer top and can form a plurality of conducting bars of alloy, attach with soldering tin solder mask on the conducting bar, lay and the back-weld along base plate length direction drive IC and the cladding on the conducting bar are in drive IC outside inoxidizing coating. The conductive strips are arranged at intervals along the length direction of the substrate and are in one-to-one corresponding conduction connection with the electrode belts.

Furthermore, the electrode belt is made of gold and has a thickness of 1.5 nm-2.5 um.

In one embodiment, the conductive strip has a single-layer structure, a thickness of 0.1nm to 30um, and is made of one of nickel, nickel alloy, aluminum and aluminum alloy.

In another embodiment, the conductive strip has a double-layer structure, and includes a connection layer and a welding layer attached to the connection layer.

Wherein, the thickness of the welding layer is 0.1 nm-30 um, and the material is one of copper, tin, copper alloy and tin alloy.

The thickness of the connecting layer is 0.1 nm-20 um, and the connecting layer is made of one of titanium, nickel, chromium, aluminum, titanium alloy, nickel alloy, chromium alloy and aluminum alloy.

Further, the electrode belt surpasses in the base plate width direction the protective layer has a joint portion, the length of joint portion is 0.1nm ~ 4mm, and the width is 0.1nm ~ 200 um.

Further, the material of heat accumulation layer and protective layer is glass glaze, the thickness on heat accumulation layer is 10um ~ 500um, the thickness of protective layer is 1um ~ 25 um.

Furthermore, the resistor body is a semi-cylinder with the radius of 0.1 um-12 um, and the material of the resistor body is ruthenium or a ruthenium compound.

Further, the base plate be ceramic substrate, the material of solder mask is green oil, the material of inoxidizing coating is epoxy.

The utility model discloses following beneficial effect has: the thermal printing head structure is characterized in that two or more than two metals are spliced to serve as a conductor, a noble metal serves as a heating body to connect the conductor, and a conductive strip made of copper, nickel, tin or alloys of the copper, the nickel and the tin which can form alloys with soldering tin is adopted to replace part of gold circuits in the existing thermal printing head, so that the production cost is greatly reduced; the drive IC adopts flip-chip bonding to replace the existing gold wire bonding, the bonding speed is high, and the production efficiency is greatly improved.

Drawings

Fig. 1 is a plan view of a thermal print head according to a first embodiment.

Fig. 2 is a schematic cross-sectional view taken along the direction I-I in fig. 1.

Fig. 3 is a partially enlarged schematic view of a portion a in fig. 2.

Fig. 4 is a partially enlarged view of a portion B in fig. 2.

Fig. 5 is a partially enlarged schematic view of a portion C in fig. 2.

Fig. 6 is a plan view of the joint portion.

FIG. 7 is a schematic cross-sectional view of a thermal print head according to a second embodiment.

Fig. 8 is a partially enlarged view of portion D of fig. 7.

Fig. 9 is a partially enlarged schematic view of a portion E in fig. 7.

Description of the main component symbols: 1. a ceramic substrate; 2. a heat storage layer; 31. an electrode belt; 310. a joint portion; 32. a resistor body; 33. a protective layer; 41. a conductive strip; 411. a connecting layer; 412. welding the layers; 42. a solder resist layer; 43. a driver IC; 44. a protective layer; l, joint length; w, joint width; in the X direction: a length direction of the ceramic substrate; y: the width direction of the ceramic substrate.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and the following detailed description.

Example one

As shown in fig. 1 to 5, a thermal head includes a ceramic substrate 1, a heat storage layer 2, a printing section 3, and a driving section 4. The heat storage layer 2 is attached to the surface of the substrate, the thickness of the heat storage layer is 10-500 um, and the heat storage layer is made of glass glaze. The longitudinal direction of the ceramic substrate 1 is the X direction in the figure, and the width direction is the Y direction in the figure.

The printing part is arranged on one side above the heat storage layer 2, and comprises a plurality of electrode belts 31 plated on the heat storage layer 2 and arranged at intervals along the length direction of the ceramic substrate 1, a resistor body 32 arranged above the electrode belts 31, and a protective layer 33 covering the plurality of electrode belts 31 and the resistor body 32. The electrode belt 31 is made of gold and has a thickness of 1.5 nm-2.5 um. The resistor 32 is made of ruthenium or a ruthenium compound, the resistor 32 is a semi-cylinder with a radius of 0.1um to 12um, the resistor 32 includes a plurality of heating parts arranged at intervals along the length direction of the ceramic substrate 1, and the heating parts are in one-to-one correspondence conduction connection with the electrode strips 31. The protective layer 33 is a glass glaze layer with a thickness of 1um to 25 um.

The driving part is arranged above the heat storage layer 2 and located on the side of the printing part, and comprises a plurality of conductive strips 41 plated on the heat storage layer 2, a solder mask 42 attached on the conductive strips 41, a driving IC 43 arranged along the length direction of the ceramic substrate 1 and inversely welded on the conductive strips 41, and a protective layer 44 coated outside the driving IC 43. The conductive strips 41 are of a single-layer structure, the conductive strips 41 are made of one of nickel, nickel alloy, aluminum and aluminum alloy, the thickness of the conductive strips is 0.1 nm-30 um, and the conductive strips 41 are arranged at intervals along the length direction of the ceramic substrate 1. The solder resist layer 42 is made of green oil, and the protective layer 44 is made of epoxy resin.

As shown in fig. 6, the electrode strips 31 exceed the protective layer 33 in the width direction of the ceramic substrate 1 and have a joint portion 310, the length L of the joint portion 310 is 0.1nm to 4mm, the width W is 0.1nm to 200um, and the conductive strips 41 are in one-to-one corresponding conductive connection with the electrode strips 31 through the joint portion 310.

The manufacturing method of the thermal printing head comprises the following steps:

firstly, coating glass glaze on a ceramic substrate 1 and sintering for 2 hours at 1100 ℃, so as to form a gloss glaze layer with the thickness of 10-500 um.

And secondly, firing a 2-micron thick gold layer on the glass glaze at 700 ℃ and etching the gold layer into a comb-shaped circuit to form a plurality of electrode strips 31 distributed at intervals along the length direction of the ceramic substrate 1.

And thirdly, firing a semi-cylindrical resistor 32 with the radius of 10um on the electrode strips 31 at 600 ℃, wherein the resistor 32 is arranged along the length direction of the ceramic substrate 1.

And fourthly, firing a glass glaze layer with the thickness of 20um at 560 ℃ on the outer sides of the electrode strips 31 and the resistor body 32, reserving a joint part 310 connected with the conductive strip 41 at the edge of the glass glaze layer, wherein the length of the joint part 310 is 0.1 nm-4 mm, and the width of the joint part 310 is 0.1 nm-200 um.

Fifthly, plating a conductive layer with the thickness of 0.1 nm-30 um on the heat storage layer 2 by adopting a PVD (physical vapor deposition) process at the air pressure of 0.1 Pa and the temperature of 300 ℃, wherein the conductive layer is made of one of nickel, nickel alloy, aluminum and aluminum alloy, and a plurality of conductive strips 41 which are in one-to-one corresponding conduction with the joint parts 310 are etched on the conductive layer by a dry method or a wet method.

And sixthly, coating green oil on the surface of the conductive strip 41, reserving a welding station of the drive IC 43, inversely welding a drive IC 43 arranged along the length direction of the ceramic substrate 1 at the reserved welding station and encapsulating epoxy resin.

In this embodiment, one of nickel, nickel alloy, aluminum and aluminum alloy is used as the material of the conductive strip 41, and since the nickel, nickel alloy, aluminum and aluminum alloy can be easily plated on the surface of the glass glaze, the bonding force thereof does not need to be strengthened by the connecting layer.

Example two

As shown in fig. 7-9, the present embodiment differs from the first embodiment only in that: the conductive strip 41 has a double-layer structure, the conductive strip 41 includes a connection layer 411 and a soldering layer 412 attached to the connection layer 411, the connection layer 411 is made of one of titanium, nickel, chromium, aluminum, titanium alloy, nickel alloy, chromium alloy and aluminum alloy, and the soldering layer 412 is made of one of copper, tin, copper alloy and tin alloy. The rest of the structure of the present embodiment is the same as that of the first embodiment.

The manufacturing method of the present embodiment is different from the first embodiment only in that: a connecting layer 411 with the thickness of 0.1 nm-20 um is plated on the heat storage layer 2, a welding layer 412 with the thickness of 0.1 nm-30 um is plated on the surface of the connecting layer 411, and then the welding layer 412 and the connecting layer 411 are etched respectively to form a plurality of conductive strips 41. The remaining steps of the manufacturing method of this embodiment are the same as those of the first embodiment.

In this embodiment, one of copper, tin, copper alloy and tin alloy is used as the material of the solder layer 412, and since the adhesion of the material on the surface of the glass glaze is not strong, the connection layer 411 is added to strengthen the metal bonding force of the solder layer 412.

While the invention has been particularly shown and described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. A thermal print head, comprising:

a substrate;

the heat storage layer is attached to the surface of the substrate;

the printing part is arranged on one side above the heat storage layer and comprises a plurality of electrode belts which are attached to the heat storage layer and are arranged at intervals along the length direction of the substrate, a resistor body arranged above the electrode belts and a protective layer covering the plurality of electrode belts and the resistor body, the resistor body comprises a plurality of heating parts which are arranged at intervals along the length direction of the substrate, and the heating parts are in one-to-one corresponding conduction connection with the electrode belts;

the drive division is established heat accumulation layer top is located the side of printing the portion, the drive division including establishing heat accumulation layer top and can form a plurality of busbar of alloy with soldering tin, attach solder mask on the busbar, lay and the back-weld along base plate length direction drive IC and the cladding on the busbar are in the outside inoxidizing coating of drive IC, a plurality of busbar are laid along base plate length direction interval, the busbar with the electrode zone one-to-one conducting connection.

2. A thermal printhead according to claim 1, wherein: the electrode belt is made of gold and has a thickness of 1.5 nm-2.5 um.

3. A thermal printhead according to claim 1, wherein: the conducting bar is of a single-layer structure, the thickness of the conducting bar ranges from 0.1nm to 30um, and the conducting bar is made of one of nickel, nickel alloy, aluminum and aluminum alloy.

4. A thermal printhead according to claim 1, wherein: the conducting bar is of a multilayer structure and comprises a connecting layer and a welding layer attached to the connecting layer.

5. A thermal printhead according to claim 4, wherein: the thickness of the welding layer is 0.1 nm-30 um, and the material is one of copper, tin, copper alloy and tin alloy.

6. A thermal printhead according to claim 4, wherein: the thickness of the connecting layer is 0.1 nm-20 um, and the material is one of titanium, nickel, chromium, aluminum, titanium alloy, nickel alloy, chromium alloy and aluminum alloy.

7. A thermal printhead according to claim 1, wherein: the electrode belt surpasses in the base plate width direction the protective layer has a joint portion, the length of joint portion is 0.1nm ~ 4mm, the width is 0.1nm ~ 200 um.

8. A thermal printhead according to claim 1, wherein: the material of heat accumulation layer and protective layer is glass glaze, the thickness on heat accumulation layer is 10um ~ 500um, the thickness of protective layer is 1um ~ 25 um.

9. A thermal printhead according to claim 1, wherein: the resistance body is the semicircle column that the radius is 0.1um ~ 12um, and the material of resistance body is ruthenium or ruthenium compound.

10. A thermal printhead according to claim 1, wherein: the base plate be ceramic substrate, the material of solder mask is green oil, the material of inoxidizing coating is epoxy.