CN211888017U - Feeding machine for detecting, shunting and turning main and auxiliary surfaces of semiconductor wafer - Google Patents
Feeding machine for detecting, shunting and turning main and auxiliary surfaces of semiconductor wafer Download PDFInfo
- Publication number
- CN211888017U CN211888017U CN202020366687.1U CN202020366687U CN211888017U CN 211888017 U CN211888017 U CN 211888017U CN 202020366687 U CN202020366687 U CN 202020366687U CN 211888017 U CN211888017 U CN 211888017U
- Authority
- CN
- China
- Prior art keywords
- guide rail
- semiconductor wafer
- linear conveying
- channel
- diverter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Jigging Conveyors (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The utility model discloses a feeding machine for detecting, shunting and turning over the main surface and the auxiliary surface of a semiconductor wafer, which comprises a vibration disc and a direct vibration feeder; the vibration disc is connected with the direct vibration feeder; and is provided with automatic sensor detection equipment; the automatic sensor detection equipment is used for detecting the front and the back surfaces of the semiconductor wafer conveyed on the direct vibration feeder, and a shunt is arranged at the position corresponding to the automatic sensor detection equipment; the flow divider is used for communicating the direct vibration feeder with the first linear conveying guide rail or the second linear conveying guide rail; a turnover device is arranged on the second linear conveying guide rail; the turnover device comprises an input guide rail, an output guide rail and a baffle; the input guide rail is positioned above the output guide rail; the baffle is arranged at the tail end of the input guide rail, and is separated from the tail end of the input guide rail by a distance N, wherein N is smaller than the length and the width of the semiconductor wafer. The automatic detection, the shunting and the turnover of the semiconductor wafer are realized.
Description
Technical Field
The utility model belongs to the technical field of semiconductor wafer processing and specifically relates to a material machine that is used for semiconductor wafer major-minor face to detect reposition of redundant personnel turn-over is related to.
Background
In automatic assembly or automatic processing machines, vibratory trays or linear vibrators are commonly used to orderly arrange the various products or components. In the existing vibrating disk and linear vibrator, after the materials are arranged and screened out, the materials at the forefront end are taken out from the flow channel. In the field of feeding of semiconductor wafer vibration discs in the prior art, the front and the back surfaces of a semiconductor wafer need to be detected in the feeding process of the semiconductor wafer, and after the detection, the surfaces which do not meet the requirements of a production line need to be removed, so that the surfaces enter the vibration discs again, and the feeding is carried out in the vibration discs again. The front side and the secondary side of the semiconductor wafer entering the direct vibration feeder (linear vibration guide rail) from the vibration disk are random, and the probability of each semiconductor wafer is half, so that the feeding efficiency of the semiconductor wafer is greatly limited.
For example, in the prior art, a material conveying device 201721004266.9 realizes the sorting of materials by a vibrating disk and a direct vibration feeder, and the prior art designs a design that materials flow back to the vibrating disk for accumulating the backflow of materials. And in order to promote production efficiency, have very high requirement to vibration dish pan feeding efficiency in the semiconductor wafer field, consequently this design has done the reposition of redundant personnel design to semiconductor wafer after positive minor face detects to carry out the turn-over to the semiconductor wafer that does not conform to the requirement, make it need not repeated entering vibration dish, can directly send into production and processing equipment, thereby very big improvement production efficiency.
Disclosure of Invention
The utility model aims to solve the problem that to the shortcoming among the above-mentioned prior art, put forward improvement scheme or alternative, especially an improvement or alternative with semiconductor wafer automated inspection reposition of redundant personnel and turn-over function.
In order to solve the above problem, the utility model discloses a scheme as follows: a material feeding machine for detecting, shunting and turning over main and auxiliary surfaces of a semiconductor wafer comprises a vibration disc and a direct vibration feeder; the vibration disc is connected with the direct vibration feeder; a sensor automatic detection device is arranged above the direct vibration feeder; the automatic sensor detection equipment is used for detecting the front and the back surfaces of the semiconductor wafer conveyed on the direct vibration feeder, and is characterized in that a shunt is arranged at the position, corresponding to the automatic sensor detection equipment, on the direct vibration feeder; the flow divider is connected with a first linear conveying guide rail and a second linear conveying guide rail; the flow divider is used for communicating the direct vibration feeder with the first linear conveying guide rail or the second linear conveying guide rail; the automatic detection device comprises a diverter, a sensor automatic detection device, a controller and a controller, wherein the diverter and the sensor automatic detection device are both connected to the controller, and the controller is used for receiving an electric signal of the sensor automatic detection device and controlling the diverter to open or close the communication state between the first linear conveying guide rail and the second linear conveying guide rail according to the electric signal; a turnover device is arranged on the second linear conveying guide rail; the turnover device comprises an input guide rail, an output guide rail and a baffle; the input guide rail is positioned above the output guide rail; the baffle is arranged at the tail end of the input guide rail, and is separated from the tail end of the input guide rail by a distance N, wherein N is smaller than the length and the width of the semiconductor wafer.
After entering a direct vibration feeder through a vibration disc, a semiconductor wafer needs to be detected through a front side and a back side of automatic detection equipment of a sensor, then flows down through a shunt, and when front side processing equipment of the semiconductor wafer works, the front side of the semiconductor wafer upwards enters a first linear conveying guide rail and then directly enters the front side processing equipment of the semiconductor wafer; the secondary surface upwards enters a second linear conveying guide rail, the semiconductor wafer entering the second linear conveying guide rail is turned over through a turning device, and then enters the semiconductor wafer front processing equipment. The turn-over device realizes the turn-over of the semiconductor wafer through the two input guide rails and the output guide rails which run in opposite directions and the upper baffle plate. Furthermore, automatic sensor detection equipment and a removing device are arranged on the output guide rail and used for removing the semiconductor wafer with failed turnover and enabling the semiconductor wafer to enter the vibration disc again. Alternatively, the output guide is further connected to a direct vibration feeder, and the semiconductor wafer is passed through the automatic sensor inspection device again.
Further, according to the above design scheme, the feeder for detecting, shunting and turning over the major and minor surfaces of the semiconductor wafer is characterized in that the diverter comprises a shell, a diverter plate and a power device; the flow distribution plate is arranged in the shell and divides the shell into a first channel and a second channel; the first channel is positioned above the second channel; the first channel is communicated with the direct vibration feeder and the first linear conveying guide rail; the second channel is communicated with the second linear conveying guide rail; the power device is connected with the flow distribution plate and used for driving the flow distribution plate to turn up and down so as to enable the first channel and the second channel to be communicated or isolated.
The power device is controlled by the controller, and the controller judges the rotating position of the flow distribution plate according to the received electric signals, namely the flow distribution plate is positioned at the position communicated with the first channel, the direct vibration feeder and the first linear conveying guide rail or at the position communicated with the direct vibration feeder, the first channel, the second channel and the second linear conveying guide rail.
When the flow distribution plate is positioned at the position of the communicated direct vibration feeder, the first channel, the second channel and the second linear conveying guide rail, the second channel is positioned below the first channel, and the semiconductor wafer directly enters the second channel downwards and then enters the second linear conveying guide rail when entering the first channel from the direct vibration feeder.
Further, according to the above design scheme, the feeder for detecting, shunting and turning over the main surface and the secondary surface of the semiconductor wafer is characterized in that the input guide rail and the output guide rail are both inclined downwards along the conveying direction; the tail end of the input guide rail is of an arc-shaped structure, and the arc-shaped structure is an elastic smooth curved surface.
Further, according to the feed machine for detecting, shunting and turning over the main surface and the auxiliary surface of the semiconductor wafer in the design scheme, a fan is arranged below the baffle; and linear vibrators are arranged on the input guide rail and the output guide rail.
Further, the feeder for detecting, shunting and turning over the main surface and the auxiliary surface of the semiconductor wafer according to the design scheme is characterized in that the diverter further comprises an arc-shaped slide rail; the arc-shaped sliding rail is arranged in the second channel, and the lower end of the arc-shaped sliding rail is connected with the second linear conveying guide rail; the flow distribution plate is arranged above the arc-shaped slide rail.
Further, according to the above design scheme, the feeder for detecting, shunting and turning over the main surface and the auxiliary surface of the semiconductor wafer is characterized in that the shunting plate is connected with the shell through a bearing; the bearing is installed at the connecting position of the shell and the direct vibration feeder.
Further, according to the above design scheme, the feeder for detecting, shunting and turning over the main surface and the secondary surface of the semiconductor wafer is characterized in that the shunt is connected with the shell through a bearing; the bearing is installed at the joint of the shell and the first linear conveying guide rail.
The technical effects of the utility model are as follows: the application discloses a pan feeding machine for semiconductor wafer major-minor face detects reposition of redundant personnel has set up the shunt on the straight feeder that shakes behind the vibration dish for semiconductor wafer is after sensor automated inspection equipment, and the ascending semiconductor wafer of positive ascending semiconductor wafer and the ascending semiconductor wafer reposition of redundant personnel of minor face get into first linear transport guide rail and second linear transport guide rail respectively, then supply with different processing equipment respectively, carry out the processing of positive minor face simultaneously. In the process of realizing semiconductor wafer shunting, the controller judges whether to rotate the shunting plate or not after receiving an electric signal sent by the automatic sensor detection equipment mainly by means of matching with the shunt and the automatic sensor detection equipment.
The design makes a shunt design for the semiconductor wafer after the front and the back surfaces are detected, and turns over the semiconductor wafer which does not meet the requirement, so that the semiconductor wafer does not need to repeatedly enter the vibration disc, can be directly sent into production and processing equipment, saves the process of rejecting the semiconductor wafer which does not meet the requirement, and greatly improves the production efficiency.
Drawings
Fig. 1 is a schematic structural diagram of a material feeding machine.
Fig. 2 is a schematic view of the diverter configuration (unpowered).
Fig. 3 is a schematic structural diagram of the turnover device.
Wherein, 1 is a vibrating disk, 2 is a direct vibration feeder, 3 is a sensor automatic detection device, 4 is a flow divider, 5 is a first linear conveying guide rail, 6 is a second linear conveying guide rail, 7 is a linear vibrator, 8 is a turn-over device, 41 is a flow dividing plate, 42 is an arc slide rail, 43 is a shell, 44 is a first channel, 45 is a second channel, 81 is an input guide rail, 82 is an output guide rail, 83 is a baffle, 84 is a smooth curved surface, and 85 is a fan.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The meaning of the above terms in the present invention can be understood in specific cases by those skilled in the art.
Example (b): a material feeding machine for detecting, shunting and turning over main and auxiliary surfaces of a semiconductor wafer comprises a vibration disc and a direct vibration feeder; the vibration disc is connected with the direct vibration feeder; a sensor automatic detection device is arranged above the direct vibration feeder; the automatic sensor detection equipment is used for detecting the front and the back surfaces of the semiconductor wafer conveyed on the direct vibration feeder, and a shunt is arranged on the direct vibration feeder at a position corresponding to the automatic sensor detection equipment; the flow divider is connected with a first linear conveying guide rail and a second linear conveying guide rail; the flow divider is used for communicating the direct vibration feeder with the first linear conveying guide rail or the second linear conveying guide rail; the automatic detection device comprises a diverter, a sensor automatic detection device, a controller and a controller, wherein the diverter and the sensor automatic detection device are both connected to the controller, and the controller is used for receiving an electric signal of the sensor automatic detection device and controlling the diverter to open or close the communication state between the first linear conveying guide rail and the second linear conveying guide rail according to the electric signal; a turnover device is arranged on the second linear conveying guide rail; the turnover device comprises an input guide rail, an output guide rail and a baffle; the input guide rail is positioned above the output guide rail; the baffle is arranged at the tail end of the input guide rail, and is separated from the tail end of the input guide rail by a distance N, wherein N is smaller than the length and the width of the semiconductor wafer; the flow divider comprises a shell, a flow dividing plate and a power device; the flow distribution plate is arranged in the shell and divides the shell into a first channel and a second channel; the first channel is positioned above the second channel; the first channel is communicated with the direct vibration feeder and the first linear conveying guide rail; the second channel is communicated with the second linear conveying guide rail; the power device is connected with the flow distribution plate and used for driving the flow distribution plate to turn up and down so as to enable the first channel and the second channel to be communicated or isolated; the input guide rail and the output guide rail are both inclined downwards along the conveying direction; the tail end of the input guide rail is of an arc-shaped structure, and the arc-shaped structure is an elastic smooth curved surface; a fan is arranged below the baffle; the input guide rail and the output guide rail are both provided with linear vibrators; the flow divider further comprises an arc-shaped sliding rail; the arc-shaped sliding rail is arranged in the second channel, and the lower end of the arc-shaped sliding rail is connected with the second linear conveying guide rail; the flow distribution plate is arranged above the arc-shaped slide rail; the flow distribution plate is connected with the shell through a bearing; the bearing is arranged at the joint of the shell and the direct vibration feeder; the shunt is connected with the shell through a bearing; the bearing is installed at the joint of the shell and the first linear conveying guide rail.
After entering a direct vibration feeder through a vibration disc, a semiconductor wafer needs to be detected through a front side and a back side of automatic detection equipment of a sensor, then flows down through a shunt, and when front side processing equipment of the semiconductor wafer works, the front side of the semiconductor wafer upwards enters a first linear conveying guide rail and then directly enters the front side processing equipment of the semiconductor wafer; the secondary surface upwards enters a second linear conveying guide rail, the semiconductor wafer entering the second linear conveying guide rail is turned over through a turning device, and then enters the semiconductor wafer front processing equipment. The turn-over device realizes the turn-over of the semiconductor wafer through the two input guide rails and the output guide rails which run in opposite directions and the upper baffle plate. Furthermore, automatic sensor detection equipment and a removing device are arranged on the output guide rail and used for removing the semiconductor wafer with failed turnover and enabling the semiconductor wafer to enter the vibration disc again. Alternatively, the output guide is further connected to a direct vibration feeder, and the semiconductor wafer is passed through the automatic sensor inspection device again.
The power device is controlled by the controller, and the controller judges the rotating position of the flow distribution plate according to the received electric signals, namely the flow distribution plate is positioned at the position communicated with the first channel, the direct vibration feeder and the first linear conveying guide rail or at the position communicated with the direct vibration feeder, the first channel, the second channel and the second linear conveying guide rail.
When the flow distribution plate is positioned at the position of the communicated direct vibration feeder, the first channel, the second channel and the second linear conveying guide rail, the second channel is positioned below the first channel, and the semiconductor wafer directly enters the second channel downwards and then enters the second linear conveying guide rail when entering the first channel from the direct vibration feeder.
Claims (7)
1. A material feeding machine for detecting, shunting and turning over main and auxiliary surfaces of a semiconductor wafer comprises a vibration disc and a direct vibration feeder; the vibration disc is connected with the direct vibration feeder; a sensor automatic detection device is arranged above the direct vibration feeder; the automatic sensor detection equipment is used for detecting the front and the back surfaces of the semiconductor wafer conveyed on the direct vibration feeder, and is characterized in that a shunt is arranged at the position, corresponding to the automatic sensor detection equipment, on the direct vibration feeder; the flow divider is connected with a first linear conveying guide rail and a second linear conveying guide rail; the flow divider is used for communicating the direct vibration feeder with the first linear conveying guide rail or the second linear conveying guide rail; the automatic detection device comprises a diverter, a sensor automatic detection device, a controller and a controller, wherein the diverter and the sensor automatic detection device are both connected to the controller, and the controller is used for receiving an electric signal of the sensor automatic detection device and controlling the diverter to open or close the communication state between the first linear conveying guide rail and the second linear conveying guide rail according to the electric signal; a turnover device is arranged on the second linear conveying guide rail; the turnover device comprises an input guide rail, an output guide rail and a baffle; the input guide rail is positioned above the output guide rail; the baffle is arranged at the tail end of the input guide rail, and is separated from the tail end of the input guide rail by a distance N, wherein N is smaller than the length and the width of the semiconductor wafer.
2. The loader for semiconductor wafer major and minor face inspection diverter flipping according to claim 1, wherein said diverter comprises a housing, a diverter plate and a power device; the flow distribution plate is arranged in the shell and divides the shell into a first channel and a second channel; the first channel is positioned above the second channel; the first channel is communicated with the direct vibration feeder and the first linear conveying guide rail; the second channel is communicated with the second linear conveying guide rail; the power device is connected with the flow distribution plate and used for driving the flow distribution plate to turn up and down so as to enable the first channel and the second channel to be communicated or isolated.
3. The loader for semiconductor wafer major and minor face inspection diverter flips as defined in claim 1 wherein said input and output rails are both inclined downwardly in their direction of conveyance; the tail end of the input guide rail is of an arc-shaped structure, and the arc-shaped structure is an elastic smooth curved surface.
4. The loading machine for detecting, shunting and turning the main surface and the secondary surface of a semiconductor wafer as claimed in claim 1, wherein a fan is arranged below the baffle; and linear vibrators are arranged on the input guide rail and the output guide rail.
5. The loader for semiconductor wafer major and minor face inspection diverter flipping according to claim 2, wherein said diverter further comprises an arcuate slide; the arc-shaped sliding rail is arranged in the second channel, and the lower end of the arc-shaped sliding rail is connected with the second linear conveying guide rail; the flow distribution plate is arranged above the arc-shaped slide rail.
6. The feeder for detecting and shunting turnover of main and secondary surfaces of semiconductor wafers as set forth in claim 2, wherein the shunting plate is connected to the housing through a bearing; the bearing is installed at the connecting position of the shell and the direct vibration feeder.
7. The feed machine for detecting the diverter flip-over of the major and minor surfaces of a semiconductor wafer as claimed in claim 2, wherein the diverter is connected to the housing through a bearing; the bearing is installed at the joint of the shell and the first linear conveying guide rail.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020366687.1U CN211888017U (en) | 2020-03-22 | 2020-03-22 | Feeding machine for detecting, shunting and turning main and auxiliary surfaces of semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020366687.1U CN211888017U (en) | 2020-03-22 | 2020-03-22 | Feeding machine for detecting, shunting and turning main and auxiliary surfaces of semiconductor wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211888017U true CN211888017U (en) | 2020-11-10 |
Family
ID=73269775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020366687.1U Active CN211888017U (en) | 2020-03-22 | 2020-03-22 | Feeding machine for detecting, shunting and turning main and auxiliary surfaces of semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211888017U (en) |
-
2020
- 2020-03-22 CN CN202020366687.1U patent/CN211888017U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN208499639U (en) | A kind of equidistant feed device of pole part | |
| US5887698A (en) | Method and apparatus for sorting articles received from vertically spaced platforms of a moving transport device | |
| CN107640543A (en) | A kind of battery core paired device | |
| CN103129998A (en) | Sheet conveyer | |
| JP2013037538A (en) | Conveyance type counting device | |
| CN211888017U (en) | Feeding machine for detecting, shunting and turning main and auxiliary surfaces of semiconductor wafer | |
| CN110434083A (en) | A kind of plastic bottle automatic detecting machine | |
| CN211865883U (en) | Feeding machine for detecting and shunting main and auxiliary surfaces of semiconductor wafer | |
| CN219917105U (en) | Silicon wafer feeding device and silicon wafer detection equipment | |
| CN109850248A (en) | Wafer separator, separating system and clip loading system | |
| CN208516356U (en) | Using air as the sortation conveyor for preventing tiny spring wrap of power | |
| CN214651344U (en) | Feeding vibration disc and machining device | |
| CN217575779U (en) | Track closing device | |
| JP3409491B2 (en) | Discharge device for workpieces | |
| CN209834111U (en) | Wafer separator, wafer separation system and boxing system | |
| CN210557614U (en) | Sorting and outputting device for vehicle-mounted camera | |
| CN207563296U (en) | Sliding rail tooth plate hardness determination and screening installation | |
| CN202018441U (en) | Metal detecting and sorting device | |
| CN213566677U (en) | Combined packaging production line | |
| CN214269149U (en) | Efficient discharging device for sorting spiral spring loads | |
| CN209160793U (en) | A kind of cigarette base right-angled bend conveying device | |
| CN214526437U (en) | Magnetic core loading attachment | |
| US20050072654A1 (en) | Conveyor assembly | |
| CN209866706U (en) | Automatic film-coating material receiving machine for vehicle-mounted laminated glass | |
| CN204727130U (en) | A kind of belt feeder is from the device of detection cleaning bulk foreign matter |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210413 Address after: 2 / F, building 6, No. 8, Xinzhong Road, Haining Economic Development Zone, Haining City, Jiaxing City, Zhejiang Province Patentee after: Zhejiang Qingxin Technology Co.,Ltd. Address before: 212300 science and Technology Innovation Park, No.19 Qiliang Road, Danyang City, Zhenjiang City, Jiangsu Province Patentee before: Jiangsu Tongzhen Intelligent Technology Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A shunting and turnover feeder for detecting main and auxiliary surfaces of semiconductor wafer Effective date of registration: 20211214 Granted publication date: 20201110 Pledgee: Hangzhou United Rural Commercial Bank Co.,Ltd. Haining sub branch Pledgor: Zhejiang Qingxin Technology Co.,Ltd. Registration number: Y2021330002525 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220714 Granted publication date: 20201110 Pledgee: Hangzhou United Rural Commercial Bank Co.,Ltd. Haining sub branch Pledgor: Zhejiang Qingxin Technology Co.,Ltd. Registration number: Y2021330002525 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |