CN211880707U - Tin cream printing steel mesh open pore structure - Google Patents
Tin cream printing steel mesh open pore structure Download PDFInfo
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- CN211880707U CN211880707U CN202020627635.5U CN202020627635U CN211880707U CN 211880707 U CN211880707 U CN 211880707U CN 202020627635 U CN202020627635 U CN 202020627635U CN 211880707 U CN211880707 U CN 211880707U
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Abstract
The utility model relates to a tin cream printing steel mesh trompil structure is applied to and prints the tin cream for reflow soldering's electronic component on the pad of circuit board, the pad of circuit board is provided with first pad, second pad, corresponds to electronic component's positive and negative electrode respectively, and through printing the tin cream on the pad of circuit board, further with the help of reflow soldering with first pad, second pad respectively with the positive and negative electrode welding that electronic component corresponds together, its characterized in that, tin cream printing steel mesh trompil structure is provided with the first region that corresponds with first pad, the second region that corresponds with the second pad, be provided with little triangle-shaped through-hole in the first region, be provided with rectangle through-hole and big triangle-shaped through-hole in the second region, the rectangle through-hole set up in little triangle-shaped through-hole with between the big triangle-shaped through-hole.
Description
Technical Field
The utility model relates to an electron field especially relates to a tin cream printing steel mesh trompil structure.
Background
The most important welding mode is the electronic component welding during the solder paste welding. The solder paste assists in holding the electronic component during reflow soldering so that it does not shift position prior to soldering. Whether the solder paste can stably fix the electronic component or not depends on the design of the open pore structure of the solder paste printing steel mesh. The open pore structure of the solder paste printing steel mesh is poorly designed, which can cause the failure problems of electronic components, such as offset, insufficient soldering and the like.
SUMMERY OF THE UTILITY MODEL
Accordingly, there is a need for an open structure of a solder paste printing stencil with high solder yield. In order to solve the technical problem, the technical scheme of the utility model is that: the utility model provides a tin cream printing steel mesh open-cell structure, is applied to and prints tin cream for reflow soldering's electronic component on the pad of circuit board, the pad of circuit board is provided with first pad, second pad, corresponds to electronic component's positive and negative electrode respectively, through printing tin cream on the pad of circuit board, further with the help of reflow soldering with first pad, second pad respectively with the positive and negative electrode welding that corresponds together, tin cream printing steel mesh open-cell structure is provided with the first region that corresponds with first pad, the second region that corresponds with the second pad, be provided with little triangle-shaped through-hole in the first region, be provided with rectangle through-hole and big triangle-shaped through-hole in the second region, rectangle through-hole set up in little triangle-shaped through-hole with between the big triangle-shaped through-hole.
Further preferably, the first pad area is smaller than the second pad area, and accordingly, the first region area is smaller than the second region area.
Further preferably, a space is arranged between the first area and the second area, and the shortest distance between the rectangular through hole and the small triangular through hole is greater than the space.
Further preferably, the small triangular through hole is provided with a first base and a first vertex angle, the large triangular through hole is provided with a second base and a second vertex angle, the rectangular through hole is provided with a long side and a short side, and the first base and the second base are parallel to the long side.
Further preferably, the first vertex angle is far away from the rectangular through hole, the first bottom edge is close to the rectangular through hole, the second vertex angle is close to the rectangular through hole, and the second bottom edge is far away from the rectangular through hole.
Further preferably, the area of the small triangular through hole is not more than 0.45 times of the area of the first region.
Further preferably, the sum of the area of the rectangular through hole and the area of the large triangular through hole is not more than 0.25 times of the area of the second region.
Further preferably, a second interval is arranged between the second vertex angle and the rectangular through hole, and the width of the second interval is greater than that of the rectangular through hole.
Further preferably, the edge of the small triangular through hole does not intersect with the edge of the first region.
Further preferably, the edge of the rectangular through hole, the edge of the large triangular through hole and the edge of the second area do not intersect.
Compared with the prior art, the utility model discloses following beneficial effect has: the tin paste printing steel mesh opening structure ensures that the area of the tin paste is large enough, so that the tin paste has enough adhesive force on the electronic component and the electronic component is prevented from shifting; meanwhile, with the help of the asymmetric steel mesh opening structure, the solder paste is smoothly exhausted in the reflow soldering process, the tension is balanced, and the reflow soldering yield can be effectively improved.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
Fig. 1 is a schematic view of an opening structure of a solder paste printing steel mesh according to an embodiment of the present invention.
Detailed Description
To further illustrate the technical means and effects of the present invention adopted to achieve the objects of the present invention, the following detailed description of the embodiments, structures, features and effects according to the present invention will be made with reference to the accompanying drawings and preferred embodiments.
Referring to fig. 1, a solder paste printing steel mesh opening structure is applied to printing solder paste on a pad of a circuit board for an electronic component of reflow soldering, the pad of the circuit board is provided with a first pad and a second pad respectively corresponding to positive and negative electrodes of the electronic component, the first pad and the second pad are respectively welded with the corresponding positive and negative electrodes by means of reflow soldering through printing the solder paste on the pad of the circuit board, the solder paste printing steel mesh opening structure is provided with a first area 1 corresponding to the first pad and a second area 2 corresponding to the second pad, a small triangular through hole 11 is arranged in the first area 1, a rectangular through hole 21 and a large triangular through hole 22 are arranged in the second area 2, and the rectangular through hole 21 is arranged between the small triangular through hole 11 and the large triangular through hole 22.
The first pad area is smaller than the second pad area, and accordingly, the first region 1 area is smaller than the second region 2 area.
A space 3 is arranged between the first area 1 and the second area 2, and the shortest distance between the rectangular through hole 21 and the small triangular through hole 11 is larger than the width of the space 3.
The small triangular through hole 11 is provided with a first bottom edge 111 and a first top angle 112, the large triangular through hole 22 is provided with a second bottom edge 221 and a second top angle 222, the rectangular through hole 21 is provided with a long edge and a short edge, and the first bottom edge 111 and the second bottom edge 221 are parallel to the long edge.
The first vertex angle 112 is far away from the rectangular through hole 21, the first bottom edge 111 is close to the rectangular through hole 21, the second vertex angle 222 is close to the rectangular through hole 21, and the second bottom edge 221 is far away from the rectangular through hole 21.
The area of the small triangular through hole 11 is not more than 0.45 times of the area of the first region 1.
The sum of the area of the rectangular through hole 21 and the area of the large triangular through hole 22 is not more than 0.25 times of the area of the second region 2.
A second interval is arranged between the second vertex angle 222 and the rectangular through hole 21, and the width of the second interval is greater than that of the rectangular through hole 21.
The edge of the small triangular through-hole 11 does not intersect the edge of the first region 1.
The edges of the rectangular through holes 21 and the edges of the large triangular through holes 22 do not intersect with the edges of the second region 2.
The above description is only a preferred embodiment of the present invention, and the present invention is not limited to the above description, and although the present invention has been disclosed by the preferred embodiment, it is not limited to the present invention, and any person skilled in the art can make modifications or changes equivalent to the equivalent embodiments by utilizing the above disclosed technical contents without departing from the technical scope of the present invention, but all the modifications, changes and changes of the technical spirit of the present invention made to the above embodiments are also within the scope of the technical solution of the present invention.
Claims (10)
1. The utility model provides a tin cream printing steel mesh open-cell structure, is applied to and prints tin cream for reflow soldering's electronic component on the pad of circuit board, the pad of circuit board is provided with first pad, second pad, corresponds to electronic component's positive and negative electrode respectively, through printing tin cream on the pad of circuit board, further with the help of reflow soldering with first pad, second pad respectively with the positive and negative electrode welding that corresponds together, a serial communication port, tin cream printing steel mesh open-cell structure is provided with the first region that corresponds with first pad, the second region that corresponds with the second pad, be provided with little triangle-shaped through-hole in the first region, be provided with rectangle through-hole and big triangle-shaped through-hole in the second region, rectangle through-hole set up in little triangle-shaped through-hole with between the big triangle-shaped through-hole.
2. A solder paste printing steel mesh opening structure according to claim 1, wherein the first land area is smaller than the second land area, and accordingly the first area is smaller than the second area.
3. A solder paste printing steel mesh opening structure according to claim 1, wherein a space is provided between the first region and the second region, and the shortest distance between the rectangular through holes and the small triangular through holes is greater than the space.
4. The opening structure of solder paste printing steel mesh according to claim 1, wherein the small triangular through hole has a first base and a first vertex angle, the large triangular through hole has a second base and a second vertex angle, the rectangular through hole has a long side and a short side, and the first base and the second base are parallel to the long side.
5. The solder paste printing steel mesh opening structure according to claim 4, wherein the first vertex angle is far away from the rectangular through hole, the first bottom edge is near the rectangular through hole, the second vertex angle is near the rectangular through hole, and the second bottom edge is far away from the rectangular through hole.
6. A solder paste printing steel mesh opening structure according to claim 1, wherein the area of the small triangular through-hole is not more than 0.45 times the area of the first region.
7. The solder paste printing steel mesh opening structure of claim 1, wherein the sum of the rectangular through-hole area and the large triangular through-hole area is not more than 0.25 times the area of the second region.
8. The solder paste printing steel mesh opening structure according to claim 4, wherein a second interval is provided between the second top corner and the rectangular through hole, and the width of the second interval is greater than the width of the rectangular through hole.
9. The solder paste printing steel mesh opening structure according to claim 1, wherein the edge of the small triangular through hole does not intersect with the edge of the first area.
10. The solder paste printing steel mesh opening structure according to claim 1, wherein the edges of the rectangular through holes, the edges of the large triangular through holes and the edges of the second area do not intersect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020627635.5U CN211880707U (en) | 2020-04-23 | 2020-04-23 | Tin cream printing steel mesh open pore structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020627635.5U CN211880707U (en) | 2020-04-23 | 2020-04-23 | Tin cream printing steel mesh open pore structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211880707U true CN211880707U (en) | 2020-11-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020627635.5U Active CN211880707U (en) | 2020-04-23 | 2020-04-23 | Tin cream printing steel mesh open pore structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211880707U (en) |
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2020
- 2020-04-23 CN CN202020627635.5U patent/CN211880707U/en active Active
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