CN211879341U

CN211879341U - Fine wire bonding riving knife

Info

Publication number: CN211879341U
Application number: CN202020458746.8U
Authority: CN
Inventors: 刘星宇; 谭和平
Original assignee: Chengdu Yeheng Electronic Co ltd
Current assignee: Chengdu Yeheng Electronic Co ltd
Priority date: 2020-04-01
Filing date: 2020-04-01
Publication date: 2020-11-06
Anticipated expiration: 2030-04-01

Abstract

The utility model discloses a thin wire bonding cleaver, which relates to the technical field of semiconductor packaging and comprises a knife handle and a knife head, wherein the knife handle and the knife head are integrally formed and are integrally processed; a wire inlet hole groove is formed in the side face of the cutter head, and a lead through hole is obliquely formed in the front end of the cutter head; the end face of the front end of the tool bit consists of a bonding face and a non-bonding face, the included angle between the bonding face and the lead through hole is 20-75 degrees, the non-bonding face is processed into an inclined straight face, a wire outlet groove is transversely processed in the non-bonding face, and the wire outlet groove is close to the lead through hole and is communicated with the lead through hole. The utility model discloses the wire hole groove processing is in the non-bonded face, and the cleaver is introduced through going into the wire hole groove to the fine rule, again through the lead wire through-hole, the wire hole groove gets into the bonding region, therefore the fine rule is enclosded at the wire hole inslot, has avoided the problem that the fine rule rocked at the bonding in-process and fine rule surface by the fish tail or draw disconnected situation.

Description

Fine wire bonding riving knife

Technical Field

The utility model relates to a semiconductor package technical field, concretely relates to fine rule bonding riving knife.

Background

The connection between the chip and the external pins inside the semiconductor package plays an important role in establishing the electrical connection between the chip and the outside and ensuring the smooth input/output between the chip and the outside, and is a key in the whole subsequent packaging process. Wire bonding is predominantly used in connection methods with simple process implementation, low cost, and applicability to a variety of packaging formats. Wire bonding is one of the primary interconnect technologies in a package. Other technologies include flip chip, wafer level packaging, and through silicon via technologies. The wire bonding uses a thin metal wire, and uses heat, pressure and ultrasonic energy to tightly weld the metal wire and a substrate bonding pad, so as to realize the electrical interconnection between the chips and the substrate and the information intercommunication between the chips. Under ideal control conditions, electron sharing or atomic interdiffusion can occur between the lead and the substrate, so that atomic-scale bonding between the two metals is realized.

The cleaver is an important tool in the wire bonding process, and the structure and the performance of the cleaver determine the flexibility, the reliability and the economical efficiency of bonding. However, in the bonding process of the existing cleaver, since the lead hole and the horizontal plane form a certain angle, in order to ensure the smoothness of bonding, a certain extension is made along the direction of the lead hole during the bonding.

The existing cleaver consists of a hilt and a tool bit welded together through a special process, wherein a lead hole is formed in the tool bit. First, although the existing cleaver can perform bonding with a thin wire diameter, when the bonding track is complicated or the ultrasonic vibration frequency is high, the following defects will occur: 1. the method comprises the steps of (1) generating a bonding wire material, wherein the bonding wire material is soft, fine wires can deflect to cause poor consistency of wire arcs, 2, two adjacent wire arcs are adhered together, 3, the surfaces of the fine wires are scratched or broken by outer edges of cleavers, 4, the cleavers are formed by multi-section welding, unstable ultrasonic transmission can occur if welding is poor, and 5, the cleaver lead hole filler is not wear-resistant. Secondly, the existing cleaver is formed by welding a knife handle and a knife head through a special process, and is difficult to batch.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical defect, an object of the utility model is to provide an easily realize industrial production and can avoid the fine rule surface by the fish tail or draw disconnected fine rule bonding riving knife.

In order to achieve the above object, the utility model provides a following technical scheme:

a thin wire bonding cleaver comprises a knife handle and a knife head, and is characterized in that the knife handle and the knife head are integrally formed and are integrally processed; a wire inlet hole groove is formed in the side face of the cutter head, and a lead through hole is obliquely formed in the front end of the cutter head; the end face of the front end of the tool bit is composed of a bonding face and a non-bonding face, an included angle is formed between the non-bonding face and the bonding face and ranges from 5 degrees to 30 degrees, the included angle between the bonding face and the lead through hole ranges from 20 degrees to 75 degrees, the non-bonding face is processed into an inclined straight face, a lead hole groove is transversely processed in the non-bonding face, and the lead hole groove is close to the lead through hole and communicated with the lead through hole.

The utility model discloses in, go into the downward processing of line hole groove along tool bit side slope and form.

In the present invention, the cross-sectional shape of the wire-insertion groove is circular or rectangular.

The utility model discloses in, handle of a knife and tool bit material are one of carbide, titanium alloy, pottery.

Compared with the prior art, the beneficial effects of the utility model are that:

firstly, the wire outlet hole groove is processed in a non-bonding surface, the thin wire is led into the riving knife through the wire inlet hole groove and then enters the bonding area through the lead through hole and the wire outlet hole groove, so that the thin wire is surrounded in the wire outlet hole groove, and the problems that the thin wire shakes in the bonding process and the surface of the thin wire is scratched or broken are avoided.

And secondly, the knife handle and the knife head are integrally formed and are integrally processed, so that the industrial production is easier to realize.

Drawings

FIG. 1 is a schematic structural view of a conventional riving knife;

fig. 2 is a cross-sectional view of the present invention;

FIG. 3 is an enlarged view of the cutter head;

FIG. 4 is a diagram illustrating the usage of the present invention;

the reference signs are: 1 is a tool handle, 2 is a tool bit, 3 is a lead through hole, 4 is a wire inlet groove, 5 is a wire outlet groove, 6 is a bonding surface, and 7 is a non-bonding surface.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

A thin wire bonding cleaver comprises a knife handle and a knife head, wherein the knife handle 1 and the knife head 2 are integrally formed and are processed by a whole piece of hard alloy; a wire inlet hole groove is formed in the side face of the cutter head, the wire inlet hole groove is wide outside and narrow inside, and a lead through hole is obliquely formed in the front end of the cutter head; the end face of the front end of the tool bit is composed of a bonding surface and a non-bonding surface, the non-bonding surface and the bonding surface form an included angle, the included angle is 20 degrees, the included angle between the bonding surface and the lead through hole is 30 degrees, the non-bonding surface is processed into an inclined straight surface, the wire outlet groove is formed in the non-bonding surface in a transverse processing mode, the wire outlet groove surrounds a thin wire, and the wire outlet groove is tightly close to the lead through hole and communicated with the lead through hole. The thin wire is led into the riving knife through the wire inlet hole groove and then enters the bonding area through the lead through hole and the wire outlet hole groove, so that the thin wire is surrounded in the wire outlet hole groove, and the problems that the thin wire shakes in the bonding process and the surface of the thin wire is scratched or broken are avoided.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A thin wire bonding riving knife comprises a knife handle and a knife head, and is characterized in that the knife handle (1) and the knife head (2) are integrally formed and are integrally processed; a wire inlet groove (4) is formed in the side face of the tool bit, and a lead through hole (3) is obliquely formed in the front end of the tool bit; the end face of the front end of the tool bit consists of a bonding face (6) and a non-bonding face (7), the non-bonding face and the bonding face form an included angle, the included angle is 5-30 degrees, the included angle between the bonding face and the lead through hole is 20-75 degrees, and the non-bonding face is processed into an oblique straight face; and a wire outlet groove (5) is transversely processed in the non-bonding surface, is close to the lead through hole and is communicated with the lead through hole.

2. The thin wire bonding riving knife of claim 1 wherein the wire entry hole slot is machined obliquely downward along the side of the bit.

3. The thin wire bonding riving knife of claim 1 wherein the cross-sectional shape of the wire through hole is circular or rectangular.

4. The thin wire bonding riving knife of claim 1 wherein the shank and bit are one of cemented carbide, titanium alloy, and ceramic.