CN211879335U - Wafer surface cleaning device - Google Patents
Wafer surface cleaning device Download PDFInfo
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- CN211879335U CN211879335U CN202020003244.6U CN202020003244U CN211879335U CN 211879335 U CN211879335 U CN 211879335U CN 202020003244 U CN202020003244 U CN 202020003244U CN 211879335 U CN211879335 U CN 211879335U
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- wafer
- backup pad
- cleaning
- frame
- threaded rod
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Abstract
The utility model discloses a wafer surface cleaning device relates to semiconductor production technical field. The cleaning device comprises a supporting plate, the top of backup pad is provided with vibrations case, the inside of vibrations case is provided with the ultrasonic vibrator, the top of vibrations case is provided with the washing case, the top both sides of backup pad are provided with backup pad one and backup pad two respectively, the upper portion of backup pad one and backup pad two is provided with circular through-hole, be provided with the threaded rod in the circular through-hole, the one end of threaded rod is provided with the motor. Has the advantages that: the tiny bubbles generated by vibration are used for taking away the dirt particles on the surface of the wafer, so that the cleanness degree of the surface of the wafer is ensured. And spraying the fine wafer by using a spraying device, and completely removing the stains on the surface of the wafer by spraying the stains on the surface of the wafer to prevent the stains from being left on the surface of the fine wafer.
Description
Technical Field
The utility model relates to a semiconductor production technical field particularly, relates to a wafer surface cleaning device.
Background
The wafer cleaning process is very important for the electronic industry, especially the semiconductor industry, almost every process involves cleaning in the manufacturing process of semiconductor devices and integrated circuits, wafer cleaning mainly removes various impurity ions such as particles, organic matters, inorganic metal ions and the like adsorbed on the surface of a wafer, so that the surface cleanliness of the wafer reaches certain process requirements, and along with the development of the semiconductor wafer process, in order to meet the requirements of the electrical characteristics of the wafer, the requirements on the cleanliness of the cleaned wafer are higher and higher.
The existing wafer cleaning equipment utilizes clear water to carry out spraying treatment on a wafer, the cleaning equipment is difficult to remove impurities or dirt on the surface of the wafer, so that the surface of the wafer is not clean enough, and the existing cleaning equipment has a cleaning function, but does not have a flushing device after cleaning, so that the dirt attached to the surface cannot be cleaned.
An effective solution to the problems in the related art has not been proposed yet.
SUMMERY OF THE UTILITY MODEL
To the problem among the correlation technique, the utility model provides a wafer surface cleaning device to overcome the above-mentioned technical problem that current correlation technique exists.
The technical scheme of the utility model is realized like this:
the utility model provides a wafer surface cleaning device, includes the backup pad, the top of backup pad is provided with the vibrations case, the inside of vibrations case is provided with the ultrasonic vibrator, the top of vibrations case is provided with washs the case, the top both sides of backup pad are provided with backup pad one and backup pad two respectively, the upper portion of backup pad one and backup pad two is provided with circular through-hole, be provided with the threaded rod in the circular through-hole, the one end of threaded rod is provided with the motor, the surface of threaded rod is provided with the movable block, the movable block with threaded rod screw-thread fit, the bottom of movable block is provided with the telescopic link, the bottom of telescopic link is provided.
Furthermore, the clamping device comprises a clamping frame, a first spring and a second spring are arranged on two sides of the inside of the clamping frame respectively, a first annular clamping block is arranged at the other end of the first spring, a second annular clamping block is arranged at the other end of the second spring, and a wafer is arranged between the first annular clamping block and the second annular clamping block.
Furthermore, one side, close to the support plate II, of the top end of the support plate is provided with a cleaning frame, one side of the cleaning frame is provided with a first spray head, one side, corresponding to the first spray head, is provided with a second spray head, the side face of the first spray head is provided with a first water inlet pipe, and the side face of the second spray head is provided with a second water inlet pipe.
Furthermore, the side of the cleaning frame is provided with an opening, and the size of the opening is equal to that of the clamping frame.
The utility model has the advantages that: placing a wafer between a first annular clamping block and a second annular clamping block, injecting clear water into the cleaning box, starting an ultrasonic vibrator, generating vibration waves by the ultrasonic vibrator, transmitting the vibration waves to impurities on the surface of the wafer through medium water, removing the impurities from the surface of the wafer by utilizing tiny bubbles, starting a motor after cleaning, driving a threaded rod to rotate by the motor, driving a moving block to move by the threaded rod, transferring the wafer to the inside of a cleaning frame, spraying and cleaning the wafer by a first spraying head and a second spraying head, wherein the clamping device comprises a clamping frame, two sides of the inside of the clamping frame are respectively provided with a first spring and a second spring, the other end of the first spring is provided with a first annular clamping block, the other end of the second spring is provided with a second annular clamping block, and the wafer is arranged between the first annular clamping block and the second annular clamping block, so that the wafer can be clamped, with the firm centre gripping of wafer between annular grip block one and annular grip block two, start the telescopic link and place the inside of wasing the case with the wafer, be favorable to the washing of wafer, one side that the top of backup pad is close to backup pad two is provided with the washing frame, one side of wasing the frame is provided with shower head one, one corresponding one side of shower head is provided with shower head two, the side of shower head one is provided with inlet tube one, the side of shower head two is provided with inlet tube two to utilize shower head one and shower head two pairs of wafers to spray and wash, get rid of the spot on wafer surface, utilize ultrasonic wave generating device to shake earlier and wash the filth on wafer surface and clear away with the filth granule on wafer surface, utilize the small bubble that vibrations produced to take away the filth granule on wafer surface, guaranteed the clean degree on wafer surface. And spraying the fine wafer by using a spraying device, and completely removing the stains on the surface of the wafer by spraying the stains on the surface of the wafer to prevent the stains from being left on the surface of the fine wafer.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic perspective view of an embodiment of the present invention;
fig. 2 is a front view of an apparatus according to an embodiment of the present invention;
fig. 3 is a partial enlarged view of fig. 2A according to an embodiment of the present invention;
fig. 4 is a top view according to an embodiment of the invention.
In the figure:
1. a support plate; 2. a first support plate; 3. a motor; 4. a circular through hole; 5. a moving block; 6. a threaded rod; 7. a second support plate; 8. cleaning the frame; 9. a telescopic rod; 10. a first annular clamping block; 11. a first spring; 12. a clamping frame; 13. a second annular clamping block; 14. a second spring; 15. a wafer; 16. a first spray header; 17. a first water inlet pipe; 18. a second spray header; 19. a water inlet pipe II; 20. a cleaning tank; 21. an ultrasonic vibrator; 22. a vibration box.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art all belong to the protection scope of the present invention.
According to the utility model discloses an embodiment provides a wafer surface cleaning device.
As shown in fig. 1-4, according to the utility model discloses wafer surface cleaning device, including backup pad 1, the top of backup pad 1 is provided with and is provided with vibrations case 22, the inside of vibrations case 22 is provided with ultrasonic vibrator 21, the top of vibrations case 22 is provided with washs case 20, the top both sides of backup pad 1 are provided with backup pad one 2 and backup pad two 7 respectively, the upper portion of backup pad one 2 and backup pad two 7 is provided with circular through-hole 4, be provided with threaded rod 6 in the circular through-hole 4, the one end of threaded rod 6 is provided with motor 3, the surface of threaded rod 6 is provided with movable block 5, movable block 5 with threaded rod 6 screw-thread fit, the bottom of movable block 5 is provided with telescopic link 9, the bottom of telescopic link 9 is provided with clamping device.
In one embodiment, for the above clamping device, the clamping device includes a clamping frame 12, a first spring 11 and a second spring 14 are respectively disposed on two sides of the interior of the clamping frame 12, a first annular clamping block 10 is disposed at the other end of the first spring 11, a second annular clamping block 13 is disposed at the other end of the second spring 14, and a wafer 15 is disposed between the first annular clamping block 10 and the second annular clamping block 13, so as to facilitate clamping of the wafer, firmly clamp the wafer 15 between the first annular clamping block 10 and the second annular clamping block 13, and activate the telescopic rod 9 to place the wafer 15 inside the cleaning box 20, which facilitates cleaning of the wafer.
In one embodiment, for the support plate 1, a cleaning frame 8 is arranged on one side of the top end of the support plate 1 close to the support plate two 7, a first spray header 16 is arranged on one side of the cleaning frame 8, a second spray header 18 is arranged on one side corresponding to the first spray header 16, a first water inlet pipe 17 is arranged on the side surface of the first spray header 16, and a second water inlet pipe 19 is arranged on the side surface of the second spray header 18, so that the wafer 15 is subjected to spray cleaning by using the first spray header 16 and the second spray header 18 to remove stains on the surface of the wafer.
In an embodiment, for the cleaning frame 8, an opening is formed in a side surface of the cleaning frame 8, the size of the opening is equal to that of the clamping frame 12, and the telescopic rod 9 drives the clamping frame 8 to move so as to move the clamping frame 12 into the cleaning frame 8.
In summary, with the aid of the technical solution of the present invention, the wafer 15 is placed between the first annular clamping block 10 and the second annular clamping block 13, clear water is injected into the cleaning box 22, the ultrasonic vibrator 21 is started, the ultrasonic vibrator 21 generates vibration waves to transmit the vibration waves to impurities on the surface of the wafer through medium water, the impurities are removed from the surface of the wafer 15 by tiny bubbles, the motor 3 is started after cleaning, the motor 3 drives the threaded rod 6 to rotate, the threaded rod 6 drives the moving block 5 to move, the wafer 15 is transferred to the cleaning frame 8, the first spray head 16 and the second spray head 18 spray and clean the wafer 15, the clamping device includes the clamping frame 12, the first spring 11 and the second spring 14 are respectively disposed on two sides of the clamping frame 12, the first annular clamping block 10 is disposed on the other end of the first spring 11, the second annular clamping block 13 is disposed on the other end of the second spring 14, a wafer 15 is arranged between the first annular clamping block 10 and the second annular clamping block 13, so that the wafer is clamped, the wafer 15 is firmly clamped between the first annular clamping block 10 and the second annular clamping block 13, the telescopic rod 9 is started to place the wafer 15 into the cleaning box 20, the wafer is cleaned, the cleaning frame 8 is arranged on one side, close to the second supporting plate 7, of the top end of the supporting plate 1, the first spray header 16 is arranged on one side of the cleaning frame 8, the second spray header 18 is arranged on one side, corresponding to the first spray header 16, of the first spray header 16, a first water inlet pipe 17 is arranged on the side surface of the first spray header 16, a second water inlet pipe 19 is arranged on the side surface of the second spray header 18, so that the first spray header 16 and the second spray header 18 are used for spray cleaning of the wafer 15, and stains on the surface of the wafer are removed,
has the advantages that: 1. the ultrasonic wave generating equipment is used for firstly vibrating and cleaning the wafer to remove the dirt on the surface of the wafer, and the tiny bubbles generated by vibration are used for taking away the dirt particles on the surface of the wafer, so that the cleanness degree of the surface of the wafer is ensured.
2. And spraying the fine wafer by using a spraying device, and completely removing the stains on the surface of the wafer by spraying the stains on the surface of the wafer to prevent the stains from being left on the surface of the fine wafer.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (4)
1. A wafer surface cleaning apparatus comprising: the supporting plate (1) is characterized in that the top end of the supporting plate (1) is provided with a vibration box (22), an ultrasonic vibrator (21) is arranged in the vibration box (22), a cleaning box (20) is arranged at the top end of the vibration box (22), a first supporting plate (2) and a second supporting plate (7) are respectively arranged at two sides of the top end of the supporting plate (1), the upper parts of the first supporting plate (2) and the second supporting plate (7) are provided with circular through holes (4), a threaded rod (6) is arranged in the circular through hole (4), one end of the threaded rod (6) is provided with a motor (3), a moving block (5) is arranged on the surface of the threaded rod (6), the moving block (5) is in threaded fit with the threaded rod (6), the bottom end of the moving block (5) is provided with a telescopic rod (9), and the bottom end of the telescopic rod (9) is provided with a clamping device.
2. The wafer surface cleaning device as recited in claim 1, wherein the clamping device comprises a clamping frame (12), a first spring (11) and a second spring (14) are respectively arranged on two sides of the interior of the clamping frame (12), a first annular clamping block (10) is arranged at the other end of the first spring (11), a second annular clamping block (13) is arranged at the other end of the second spring (14), and a wafer (15) is arranged between the first annular clamping block (10) and the second annular clamping block (13).
3. The wafer surface cleaning device as recited in claim 2, wherein a cleaning frame (8) is arranged on one side of the top end of the support plate (1) close to the support plate II (7), a first spray head (16) is arranged on one side of the cleaning frame (8), a second spray head (18) is arranged on the corresponding side of the first spray head (16), a first water inlet pipe (17) is arranged on the side surface of the first spray head (16), and a second water inlet pipe (19) is arranged on the side surface of the second spray head (18).
4. Wafer surface cleaning device as claimed in claim 3, characterized in that the side of the cleaning frame (8) is provided with an opening, the size of which is equal to the clamping frame (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020003244.6U CN211879335U (en) | 2020-01-02 | 2020-01-02 | Wafer surface cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020003244.6U CN211879335U (en) | 2020-01-02 | 2020-01-02 | Wafer surface cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211879335U true CN211879335U (en) | 2020-11-06 |
Family
ID=73259911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020003244.6U Expired - Fee Related CN211879335U (en) | 2020-01-02 | 2020-01-02 | Wafer surface cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211879335U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113020059A (en) * | 2021-02-10 | 2021-06-25 | 江苏亚电科技有限公司 | A belt cleaning device for monolithic formula wafer |
-
2020
- 2020-01-02 CN CN202020003244.6U patent/CN211879335U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113020059A (en) * | 2021-02-10 | 2021-06-25 | 江苏亚电科技有限公司 | A belt cleaning device for monolithic formula wafer |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201106 Termination date: 20220102 |
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| CF01 | Termination of patent right due to non-payment of annual fee |