CN211858688U - Optical device packaging structure and optical device - Google Patents
Optical device packaging structure and optical device Download PDFInfo
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- CN211858688U CN211858688U CN201922293611.0U CN201922293611U CN211858688U CN 211858688 U CN211858688 U CN 211858688U CN 201922293611 U CN201922293611 U CN 201922293611U CN 211858688 U CN211858688 U CN 211858688U
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Abstract
The utility model relates to an optical device packaging structure and an optical device, which comprises a glass substrate and an independent sealing unit, wherein the sealing unit comprises an organic material sealing layer; the organic material sealing layer is arranged on the glass substrate, the light emitting layer is coated on the organic material sealing layer, the packaging layer is coated on the light emitting layer, the cover plate glass layer is coated on the packaging layer through the bonding layer, and the two sides of the cover plate glass layer are both provided with bonding edges bonded with the glass substrate. The utility model utilizes the mask technology, namely the upper layer completely covers the edge of the lower layer to form an independent sealing unit, which is lighter and thinner and has more excellent sealing effect; a layer of film sealing layer is deposited by using a mask plate, and the deposited layer is automatically replaced in the vacuum cavity by a mechanical arm. The single product cut in this way does not expose the section of the packaging film to the atmosphere; the glass cover plate is adopted to replace the metal cover plate for double-side sealing, the glue area is clear and visible after sealing, and the problem that visual inspection cannot be carried out by adopting metal cover plate sealing is solved.
Description
Technical Field
The utility model relates to a technical field of optical communication technique especially relates to an optical device packaging structure and optical device.
Background
Optical devices (Optical devices) are divided into active devices and passive devices, the active devices are optoelectronic devices which need external energy to drive and work in an Optical communication system and can convert electrical signals into Optical signals or Optical signals into electrical signals, and the optoelectronic devices are hearts of an Optical transmission system. The optical passive device is an optoelectronic device which does not need an external energy source to drive operation. With the rapid development of 5G communication and the increasing demand of data centers, the market demand for multiplexing optical modules of 100G, 400G and the like is increasing.
However, most of the optical modules applied to the data center adopt a non-airtight packaging structure, that is, an optical chip and an optical component are fixed on a metal shell which is machined or formed by opening a die, and then are sealed by glue, so that the optical module has large mass on one hand, poor sealing performance on the other hand, the deterioration or failure of the characteristics of the optical module is easily caused by the existence of moisture or oxygen, whether the sealed area is covered completely cannot be detected by a visual inspection mode, and no other effective modes can be used for detecting. On the basis of meeting the requirements of performance and reliability, the scheme which is lighter, thinner, lower in cost and good in sealing performance can be the first place in intense competition.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an optical device packaging structure, solved the quality of the optical device structure that exists among the prior art great, the relatively poor technical problem of leakproofness.
The utility model provides a scheme as follows of above-mentioned technical problem: an optical device packaging structure comprises a glass substrate and a plurality of independent sealing units, wherein each sealing unit comprises an organic material sealing layer, a light emitting layer, a packaging layer, an adhesive layer and a cover plate glass layer which are sequentially stacked and arranged; the light emitting layer is coated on the organic material sealing layer, the packaging layer is coated on the light emitting layer, the cover plate glass layer is coated on the packaging layer through the bonding layer, and the two sides of the cover plate glass layer are provided with bonding edges bonded with the glass substrate.
Further, each sealing unit further comprises an inorganic material sealing layer, and the inorganic material sealing layer is arranged between the packaging layer and the bonding layer.
Further, the packaging layer comprises an inorganic oxide layer and a buffer layer, the buffer layer is coated on the light emitting layer, and the inorganic oxide layer is coated on the buffer layer.
Further, the inorganic oxide layer is formed by alternately adopting a plurality of layers of metal oxides, and the metal oxides comprise at least one of Al2O3, MgO, TiO2 and ZrO 2; the thickness of the inorganic oxide layer is 10nm-100 nm; the refractive index of the inorganic oxide layer is 0.6-1.1; the inorganic oxide layer is deposited in an ALD mode, and the process temperature is 80-100 ℃; the buffer layer is polysiloxane.
Further, the buffer layer grows in a spin coating mode, the thickness of the buffer layer is 100nm-250nm, and the process temperature is 50-70 ℃.
Further, the upper surface at laminating border is equipped with and presses the groove, it is oval to press the groove.
Further, the thickness of the light emitting layer is 2-8 nm; the refractive index of the light emitting layer ranges from 1.2 to 1.50.
Further, the light emitting layer is made of at least one of SiN, SiO2 and SiNO and is grown by adopting an electron beam evaporation or thermal evaporation mode; the organic material sealing layer is made of C-type Parylene material; the adhesive layer is polysiloxane, epoxy resin or acrylic acid.
Further, the deposition thickness of the cover glass layer is 60nm-100nm, and the thickness of the organic material sealing layer is 30nm-40 nm.
Furthermore, the adhesive layer is formed by adopting a surface coating mode, and the thickness is 2-8 μm.
The utility model has the advantages that: the utility model provides an optical device packaging structure has following advantage:
1. the sealing unit is designed into an organic material sealing layer, a light emitting layer, a packaging layer, a bonding layer and a cover plate glass layer which are sequentially stacked and arranged, the scheme that a metal shell is adopted in the prior art is replaced by the non-metal materials, a mask technology is utilized in the process of depositing a film, namely, the upper layer is required to completely cover the edge of the lower layer to form independent sealing units, and the sealing unit is lighter and thinner and has more excellent sealing effect, so that the technical problems of larger quality and poorer sealing performance of an optical device structure in the prior art are solved;
2. one layer of film sealing layer uses a mask plate, and after one layer is deposited, the mask plate used by the next layer of film is automatically replaced in the vacuum cavity by a mechanical arm. Cutting the splinters after the packaging is finished, wherein the cutting seams are positioned among the plurality of independent sealing units, and only the glass substrate is damaged during cutting without damaging the thin film layers on the sealing units, so that the sections of the packaging films cannot be exposed to the atmosphere by the cut single product;
3. the glass cover plate is adopted to replace the metal cover plate for double-side sealing, and a glue area is clearly visible after sealing, so that the problem that visual inspection cannot be carried out by adopting metal cover plate sealing is well solved, and the reliability of a product is ensured;
4. when light is transmitted between different media, reflection loss occurs at the medium contact surface due to the difference in refractive index. The larger the difference in refractive index, the larger the reflection loss and the more the transmitted light is consumed. When light of the OLED is emitted through the cathode, the packaging layer and the cover plate glass, strong reflection loss can occur due to large refractive index difference between the cathode and the packaging layer. And a light emitting layer is added between the cathode and the packaging layer, so that the optical reflection loss is reduced.
A second object of the present invention is to provide an optical device, which includes an optical device package structure and an optical device, wherein the optical device is disposed in the cavity.
The above description is only an overview of the technical solution of the present invention, and in order to make the technical means of the present invention clearer and can be implemented according to the content of the description, the following detailed description is made with reference to the preferred embodiments of the present invention and accompanying drawings. The detailed description of the present invention is given by the following examples and the accompanying drawings.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without undue limitation of the invention. In the drawings:
fig. 1 is a schematic structural diagram of an optical device package structure according to an embodiment of the present invention;
fig. 2 is an enlarged view of a portion a of the optical device package structure provided in fig. 1.
In the drawings, the components represented by the respective reference numerals are listed below:
100. a packaging structure; 10. a glass substrate; 20. an organic material sealing layer; 30. a light emitting layer; 40. a packaging layer; 41. an inorganic oxide layer; 42. a buffer layer; 50. an inorganic material sealing layer; 60. an adhesive layer; 70. a cover glass layer; 71. fitting edges; 711. pressing the groove; 200. an optical device.
Detailed Description
The principles and features of the present invention are described below in conjunction with the accompanying fig. 1-2, the examples given are intended to illustrate the present invention and are not intended to limit the scope of the invention. The invention is described in more detail in the following paragraphs by way of example with reference to the accompanying drawings. The advantages and features of the present invention will become more fully apparent from the following description and appended claims. It should be noted that the drawings are in simplified form and are not to precise scale, and are provided for convenience and clarity in order to facilitate the description of the embodiments of the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
As shown in fig. 1-2, the present invention provides an optical device package structure, the package structure 100 includes a glass substrate 10 and a plurality of individual sealing units, each of which includes an organic material sealing layer 20, a light-emitting layer 30, a packaging layer 40, an adhesive layer 60 and a cover glass layer 70 stacked and arranged in sequence; the organic material sealing layer 20 is arranged on the glass substrate 10, a cavity for placing the optical device 200 is arranged between the organic material sealing layer 20 and the glass substrate 10, the light emitting layer 30 is coated on the organic material sealing layer 20, the packaging layer 40 is coated on the light emitting layer 30, the cover glass layer 70 is coated on the packaging layer 40 through the bonding layer 60, and the two sides of the cover glass layer 70 are provided with bonding edges 71 bonded with the glass substrate 10.
In the above embodiment, the sealing units are designed as the organic material sealing layer 20, the light emitting layer 30, the encapsulation layer 40, the bonding layer 60 and the cover glass layer 70 which are sequentially stacked and arranged, the scheme that a metal shell is adopted in the prior art is replaced by the non-metal materials, and a mask technology is utilized in the process of depositing the film, namely, the upper layer needs to completely cover the edge of the lower layer to form independent sealing units, so that the sealing units are lighter and thinner and have a better sealing effect, and the technical problems of larger quality and poorer sealing performance of an optical device structure in the prior art are solved; one layer of film sealing layer uses a mask plate, and after one layer is deposited, the mask plate used by the next layer of film is automatically replaced in the vacuum cavity by a mechanical arm. Cutting the splinters after the packaging is finished, wherein the cutting seams are positioned among a plurality of independent sealing units, and only the glass substrate 10 is damaged during cutting without damaging the thin film layers on the sealing units, so that the sections of the packaging films cannot be exposed to the atmosphere by the cut single product; the glass cover plate is adopted to replace the metal cover plate for double-side sealing, and a glue area is clearly visible after sealing, so that the problem that visual inspection cannot be carried out by adopting metal cover plate sealing is well solved, and the reliability of a product is ensured; when light is transmitted between different media, reflection loss occurs at the medium contact surface due to the difference in refractive index.
It is understood that the refractive index c of the light exit layer 30 can be designed to be greater than the refractive index b of the encapsulation layer and less than the refractive index a of the cathode of the optical device 200. The optical device 200 includes a cathode, an organic compound layer, and an anode in this order from top to bottom. The larger the difference in refractive index, the larger the reflection loss and the more the transmitted light is consumed. When light of the optical device 200 is emitted through the cathode, the encapsulation layer, and the cover glass, a strong reflection loss occurs due to a large refractive index difference between the cathode refractive index a and the encapsulation layer refractive index b. The addition of the light extraction layer 30 (refractive index c, a > c > b) between the cathode and the encapsulation layer helps to reduce optical reflection losses.
Preferably, each sealing unit further includes an inorganic material sealing layer 50, and the inorganic material sealing layer 50 is disposed between the encapsulation layer 40 and the adhesive layer 60 to further enhance the sealing effect. Therefore, the pollution caused by the glass substrate 10 in the conveying process can be avoided, the inorganic sealing layer is preferably deposited by ion beam sputtering, and the inorganic sealing material is preferably one or two of SiN, SiO2 and SiNO.
Preferably, the encapsulation layer 40 includes an inorganic oxide layer 41 and a buffer layer 42, the buffer layer 42 is coated on the light emitting layer 30, and the inorganic oxide layer 41 is coated on the buffer layer 42.
By designing the encapsulation layer 40 as the inorganic oxide layer 41 and the buffer layer 42, the effects of impact resistance, oxidation resistance, and moisture reduction can be further improved.
Preferably, the inorganic oxide layer is formed by alternately using a plurality of layers of metal oxides, and the metal oxides comprise at least one of Al2O3, MgO, TiO2 and ZrO 2; the thickness of the inorganic oxide layer is 10nm-100 nm; the refractive index of the inorganic oxide layer is 0.6-1.1; the inorganic oxide layer is deposited in an ALD mode, and the process temperature is 80-100 ℃; the buffer layer is polysiloxane.
Preferably, the buffer layer grows in a spin coating mode, the thickness of the buffer layer is 100nm-250nm, and the process temperature is 50-70 ℃.
Preferably, the upper surface of the attaching edge 71 is provided with a pressing groove 711, the pressing groove 711 is oval, the contact area is larger when pressing, and the bonding effect is increased when glue is used.
Preferably, the thickness of the light emitting layer 30 is 2-8 nm; the refractive index of the light emitting layer 30 ranges from 1.2 to 1.50.
Preferably, the light emitting layer 30 is made of at least one of SiN, SiO2, and SiNO, and is grown by electron beam evaporation or thermal evaporation; the organic material sealing layer 20 is made of C-type Parylene material; the adhesive layer is polysiloxane, epoxy resin or acrylic acid. The process for depositing the C-type Parylene organic film sealing layer is that solid C-type Parylene is sublimated at the temperature of 120-150 ℃ in the first step; secondly, cracking 2 side chain carbon-carbon bonds at 650-680 ℃ to generate a stable active monomer; finally, the single polymer enters a deposition cabin at room temperature, and is instantly polymerized, condensed and adsorbed on the glass substrate and the inorganic thin film sealing layer to form a uniform and compact organic thin film sealing layer.
Preferably, the cover glass layer 70 is deposited to a thickness of 60nm to 100nm, and the organic material sealing layer 20 is deposited to a thickness of 30nm to 40 nm.
Preferably, the adhesive layer 60 is formed by a surface coating method and has a thickness of 2 to 8 μm.
The utility model also provides an optical device, including optical device packaging structure and optical device 200, optical device 200 place in the cavity.
The utility model provides a manufacturing method of optical device packaging structure:
first, the optical device 200 is formed on the glass substrate 10;
secondly, the optical device 200 is filled with an organic material sealing layer 20;
thirdly, preparing the optical layer 30 by thermal evaporation;
fourthly, a buffer layer 42 is manufactured on the light-emitting layer 30;
fifth, an inorganic oxide layer 41 is formed on the buffer layer;
sixthly, the optical layer 30 and the organic material sealing layer 20 are sequentially formed on the inorganic oxide layer 41;
seventh, an inorganic material sealing layer 50 is formed on the outer surface of the inorganic oxide layer 41;
eighth, an adhesive layer 60 is produced;
and finally, pressing the cover glass layer 70 by using a high-pressure chip mounter, wherein the bonding pressure is 400N, and packaging the cover glass 70.
Example 1
First, the optical device 200 is formed on the glass substrate 10;
secondly, an organic material sealing layer 20 is filled on the optical device 200, the thickness of the organic material sealing layer 20 is 35nm, and the organic material sealing layer 20 is made of a C-type Parylene material;
thirdly, the optical layer 30 is prepared by thermal evaporation, the thickness of the optical layer 30 is 4nm, the refractive index is 1.4, and the material is SiO2；
Fourthly, manufacturing a buffer layer 42 on the light emergent layer 30, wherein the thickness of the buffer layer 42 is 250nm, and the heating temperature is 70 ℃;
fifthly, an inorganic oxide layer 41 is formed on the buffer layer 42, and the thickness of the inorganic oxide layer 41 is 100 nm;
sixthly, the optical layer 30 and the organic material sealing layer 20 are sequentially formed on the inorganic oxide layer 41, and the thickness of the organic material sealing layer 20 is 30 nm;
seventh, an inorganic material sealing layer 50 is formed on the outer surface of the inorganic oxide layer 41;
eighthly, manufacturing an adhesive layer 60, wherein the thickness of the adhesive layer 60 is 6 microns, and the adhesive layer 60 is polysiloxane;
and finally, pressing the cover glass layer 70 by using a high-pressure chip mounter, wherein the bonding pressure is 400N, and packaging the cover glass 70.
Example 2
First, the optical device 200 is formed on the glass substrate 10;
secondly, an organic material sealing layer 20 is filled on the optical device 200, the thickness of the organic material sealing layer 20 is 30nm, and the organic material sealing layer 20 is made of a C-type Parylene material;
thirdly, the optical layer 30 is prepared by thermal evaporation, and the thickness of the optical layer 30 is 2
nm, the refractive index is 1.3, and the material is SiN;
fourthly, manufacturing a buffer layer 42 on the light emitting layer 30, wherein the thickness of the buffer layer 42 is 200nm, and the heating temperature is 60 ℃;
fifthly, an inorganic oxide layer 41 is formed on the buffer layer 42, and the thickness of the inorganic oxide layer 41 is 80 nm;
sixthly, the optical layer 30 and the organic material sealing layer 20 are sequentially formed on the inorganic oxide layer 41, and the thickness of the organic material sealing layer 20 is 32 nm;
seventh, an inorganic material sealing layer 50 is formed on the outer surface of the inorganic oxide layer 41;
eighthly, manufacturing an adhesive layer 60, wherein the thickness of the adhesive layer 60 is 2 microns, and the adhesive layer is made of epoxy resin;
finally, the cover glass 70 was encapsulated, and the cover glass 70 was deposited to a thickness of 100 mm.
Example 3
First, the optical device 200 is formed on the glass substrate 10;
secondly, an organic material sealing layer 20 is filled on the optical device 200, the thickness of the organic material sealing layer 20 is 38nm, and the organic material sealing layer 20 is made of a C-type Parylene material;
thirdly, preparing the light emitting layer 30 by thermal evaporation, wherein the thickness of the light emitting layer 30 is 6nm, the refractive index is 1.2, and the material is SiN 0;
fourthly, manufacturing a buffer layer 42 on the light emitting layer 30, wherein the thickness of the buffer layer 42 is 150nm, and the heating temperature is 64 ℃;
fifthly, an inorganic oxide layer 41 is formed on the buffer layer 42, wherein the thickness of the inorganic oxide layer 41 is 40 nm;
sixthly, the optical layer 30 and the organic material sealing layer 20 are sequentially formed on the inorganic oxide layer 41, and the thickness of the organic material sealing layer 20 is 36 nm;
seventh, an inorganic material sealing layer 50 is formed on the outer surface of the inorganic oxide layer 41;
eighthly, manufacturing an adhesive layer 60, wherein the thickness of the adhesive layer 60 is 4 microns, and the adhesive layer is acrylic acid;
finally, the cover glass 70 was encapsulated, and the cover glass 70 was deposited to a thickness of 70 mm.
Example 4
First, the optical device 200 is formed on the glass substrate 10;
secondly, an organic material sealing layer 20 is filled on the optical device 200, the thickness of the organic material sealing layer 20 is 40nm, and the organic material sealing layer 20 is made of a C-type Parylene material;
thirdly, preparing the light layer 30 by thermal evaporation, wherein the thickness of the light emitting layer is 8nm, the refractive index is 1.5, and the material is SiN 0;
fourthly, manufacturing a buffer layer 42 on the light emergent layer 30, wherein the thickness of the buffer layer 42 is 100nm, and the heating temperature is 50 ℃;
fifthly, an inorganic oxide layer 41 is formed on the buffer layer 42, wherein the thickness of the inorganic oxide layer 41 is 40 nm;
sixthly, the optical layer 30 and the organic material sealing layer 20 are sequentially formed on the inorganic oxide layer 41, and the thickness of the organic material sealing layer 20 is 36 nm;
seventh, an inorganic material sealing layer 50 is formed on the outer surface of the inorganic oxide layer 41;
eighthly, manufacturing an adhesive layer 60, wherein the thickness of the adhesive layer 60 is 2 microns, and the adhesive layer is acrylic acid;
finally, the cover glass 70 was encapsulated, and the cover glass 70 was deposited to a thickness of 60 mm.
In embodiments 1 to 4, the sealing units are designed as the organic material sealing layer 20, the light-emitting layer 30, the encapsulation layer 40, the adhesive layer 60, and the cover glass layer 70, which are sequentially stacked and arranged, and the non-metallic materials are adopted to replace the scheme of using a metal shell in the prior art, and a mask technology is used in the process of depositing a thin film, that is, the upper layer needs to completely cover the edge of the lower layer to form independent sealing units, and the final thickness is hundreds of nanometers, the transmittance is good, the optical reflection loss is small, and the sealing units are lighter and thinner and have a better sealing effect, so that the technical problems of the prior art that the structure of an optical device has a higher quality and a poorer sealing performance are solved; because the refractive index between the cathode (refractive index a) and the encapsulation layer (refractive index b) of the optical device 200 of the present invention is close, the transmittance is good and the optical reflection loss is small. One layer of film sealing layer uses a mask plate, and after one layer is deposited, the mask plate used by the next layer of film is automatically replaced in the vacuum cavity by a mechanical arm. Cutting the splinters after the packaging is finished, wherein the cutting seams are positioned among a plurality of independent sealing units, and only the glass substrate 10 is damaged during cutting without damaging the thin film layers on the sealing units, so that the sections of the packaging films cannot be exposed to the atmosphere by the cut single product; the glass cover plate is adopted to replace the metal cover plate for double-side sealing, and a glue area is clearly visible after sealing, so that the problem that visual inspection cannot be carried out by adopting metal cover plate sealing is well solved, and the reliability of a product is ensured; when light is transmitted between different media, reflection loss occurs at the medium contact surface due to the difference in refractive index.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way; the present invention can be smoothly implemented by those skilled in the art according to the drawings and the above description; however, those skilled in the art should understand that changes, modifications and variations made by the above-described technology can be made without departing from the scope of the present invention, and all such changes, modifications and variations are equivalent embodiments of the present invention; meanwhile, any changes, modifications, evolutions, etc. of the above embodiments, which are equivalent to the actual techniques of the present invention, still belong to the protection scope of the technical solution of the present invention.
Claims (9)
1. The optical device packaging structure is characterized in that the packaging structure (100) comprises a glass substrate (10) and a plurality of independent sealing units, wherein each sealing unit comprises an organic material sealing layer (20), a light emergent layer (30), a packaging layer (40), an adhesive layer (60) and a cover plate glass layer (70) which are sequentially stacked and arranged;
the light emitting diode is characterized in that the organic material sealing layer (20) is arranged on the glass substrate (10), a cavity for placing an optical device (200) is formed between the organic material sealing layer (20) and the glass substrate (10), the light emitting layer (30) is coated on the organic material sealing layer (20), the packaging layer (40) is coated on the light emitting layer (30), the cover plate glass layer (70) is coated on the packaging layer (40) through the bonding layer (60), and bonding edges (71) bonded with the glass substrate (10) are arranged on two sides of the cover plate glass layer (70).
2. A light device package structure according to claim 1, wherein each sealing unit further comprises a sealing layer (50) of inorganic material, the sealing layer (50) of inorganic material being arranged between the encapsulation layer (40) and the adhesive layer (60).
3. The optical device package structure of claim 1, wherein the package layer (40) comprises an inorganic oxide layer (41) and a buffer layer (42), the buffer layer (42) is coated on the light emitting layer (30), and the inorganic oxide layer (41) is coated on the buffer layer (42).
4. The optical device package structure of claim 3, wherein the inorganic oxide layers are formed by alternately forming a plurality of metal oxides; the thickness of the inorganic oxide layer is 10nm-100 nm; the refractive index of the inorganic oxide layer is 0.6-1.1; the inorganic oxide layer is deposited by ALD; the buffer layer is polysiloxane.
5. The optical device package structure of claim 3, wherein the buffer layer is grown by spin coating, and the thickness of the buffer layer is 100nm to 250 nm.
6. The optical device packaging structure according to claim 1, wherein a pressing groove (711) is formed in an upper surface of the attaching edge (71), and the pressing groove (711) is oval.
7. A light device package structure according to claim 4, wherein the light emitting layer (30) has a thickness of 2-8 nm; the refractive index of the light emitting layer (30) ranges from 1.2 to 1.50.
8. The optical device packaging structure according to claim 7, wherein the cover glass layer (70) is deposited to a thickness of 60nm to 100nm, and the organic material sealing layer (20) is deposited to a thickness of 30nm to 40 nm; the adhesive layer is formed by adopting a surface coating mode, and the thickness is 2-8 mu m.
9. An optical device arrangement, comprising the optical device package structure of any one of claims 1-8 and an optical device (200), wherein the optical device (200) is disposed in the cavity.
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| CN201922293611.0U CN211858688U (en) | 2019-12-19 | 2019-12-19 | Optical device packaging structure and optical device |
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| CN201922293611.0U CN211858688U (en) | 2019-12-19 | 2019-12-19 | Optical device packaging structure and optical device |
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