CN112530284B - Display panel and display device - Google Patents
Display panel and display device Download PDFInfo
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- CN112530284B CN112530284B CN202011381627.8A CN202011381627A CN112530284B CN 112530284 B CN112530284 B CN 112530284B CN 202011381627 A CN202011381627 A CN 202011381627A CN 112530284 B CN112530284 B CN 112530284B
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- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
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- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
Abstract
The embodiment of the invention relates to the technical field of display, and discloses a display panel, which comprises: a substrate; the substrate includes: a display area, the display area including at least: the first bending area is positioned on one side of the non-bending area; an organic layer and an inorganic layer which are stacked on the substrate; in the stacking direction of the organic layer and the inorganic layer, the thickness of the organic layer in the first bending region is smaller than that of the organic layer in the non-bending region, and the thickness of the inorganic layer in the first bending region is larger than that of the inorganic layer in the non-bending region. According to the display panel and the display device, stress borne by the display panel during bending is reduced, and the reliability of the display panel is improved.
Description
Technical Field
The embodiment of the invention relates to the technical field of display, in particular to a display panel and a display device.
Background
The flexible display panel plays an important role in display products due to excellent characteristics of self-luminescence, wide viewing angle, lightness, thinness, low energy consumption, flexibility and the like. The existing display panel usually adopts an organic layer and inorganic layer laminated packaging structure, but in the process of bending the display panel, because the stress borne by the bending area of the display panel is large, and perfect cooperative deformation cannot be achieved between the organic layer and the inorganic layer, the film layer is easy to crack or even break in the bending area due to the large bending stress between the film layers, so that the reliability problems of edge black spots and the like of the display panel are caused.
Disclosure of Invention
Embodiments of the present invention provide a display panel and a display device, which reduce stress applied to the display panel when the display panel is bent, and improve reliability of the display panel.
To solve the above technical problem, an embodiment of the present invention provides a display panel including: a substrate; the substrate includes: a display area, the display area including at least: the first bending area is positioned on one side of the non-bending area; an organic layer and an inorganic layer stacked on the substrate; in the direction in which the organic layer and the inorganic layer are stacked, the thickness of the organic layer in the first bending region is smaller than that of the organic layer in the non-bending region, and the thickness of the inorganic layer in the first bending region is larger than that of the inorganic layer in the non-bending region.
In addition, the inorganic layer includes: the organic light-emitting diode comprises a first inorganic layer positioned on the substrate, a second inorganic layer positioned on one side of the first inorganic layer far away from the substrate, and an organic layer positioned between the first inorganic layer and the second inorganic layer; in the direction in which the organic layer and the inorganic layer are stacked, the thickness of the second inorganic layer in the first bending region is larger than the thickness of the second inorganic layer in the non-bending region. The thickness of the second inorganic layer in the first bending area is thickened, so that the effect that the stress borne by the organic layer and the inorganic layer in the first bending area cannot be reduced due to the fact that the first inorganic layer is only thickened is avoided, and the increase of the process cost caused by the fact that the first inorganic layer and the second inorganic layer are thickened simultaneously is also avoided, and therefore the effect that the stress borne by the organic layer and the inorganic layer in the first bending area is reduced is achieved on the basis of low process cost.
In addition, the display area further includes: the second bending area is positioned on one side of the first bending area, which is far away from the non-bending area, and the bending stress of the second bending area is smaller than that of the first bending area; the organic layer is also positioned in the second bending area, and the thickness of the organic layer positioned in the second bending area is the same as that of the organic layer positioned in the non-bending area.
Preferably, a groove located in the first bending region is formed by the organic layer located in the first bending region, the organic layer located in the second bending region, and the organic layer located in the non-bending region, and the second inorganic layer fills the groove. In the scheme, the part of the organic layer, which is positioned in the first bending area, and the part of the second inorganic layer, which is positioned in the bending area, are mutually meshed, so that the situation that the organic layer and the second inorganic layer are separated when the stress ratio of the first bending area is larger is avoided.
In addition, the display area further includes: the second bending area is positioned on one side of the first bending area, which is far away from the non-bending area, and the bending stress of the second bending area is smaller than that of the first bending area; the second inorganic layer is also positioned in the second bending area, and the thickness of the second inorganic layer positioned in the second bending area is greater than that of the second inorganic layer positioned in the non-bending area. In the scheme, the second inorganic layer of the second bending area, which is positioned on one side of the first bending area, which is far away from the non-bending area, is thickened so as to further reduce the stress borne by the second bending area.
Preferably, the thickness of the second inorganic layer in the first bending region is the same as the thickness of the second inorganic layer in the second bending region. According to the scheme, the second inorganic layers positioned in the first bending area and the second bending area can be simultaneously prepared, so that the preparation process is simplified, and the preparation cost is reduced.
In addition, the thickness of the organic layer in the first bending area is 2-5 micrometers smaller than that of the organic layer in the non-bending area; the thickness of the second inorganic layer in the first bending area is 0.2-0.5 micrometer greater than that of the second inorganic layer in the non-bending area.
In addition, the organic layer includes: the organic light-emitting diode comprises a first organic layer and a second organic layer, wherein the second organic layer is positioned on one side of the first organic layer, which is far away from the substrate; the first organic layer is positioned in the display area; the second organic layer is located in the non-bending area. The scheme gives a specific structural style of the organic layer.
In addition, the display area further includes: the second bending area is positioned on one side of the first bending area, which is far away from the non-bending area, and the bending stress of the second bending area is smaller than that of the first bending area; the second organic layer is also located in the second bending region.
In addition, the display area further includes: the second bending area is positioned on one side of the first bending area, which is far away from the non-bending area, and the bending stress of the second bending area is smaller than that of the first bending area; in the direction in which the organic layer and the inorganic layer are stacked, the thickness of the organic layer in the second bending region is smaller than the thickness of the organic layer in the non-bending region. In the scheme, the organic layer of the second bending area, which is positioned on one side of the first bending area, which is far away from the non-bending area, is thinned so as to further reduce the stress borne by the second bending area.
In addition, the thickness of the organic layer in the first bending area is the same as that of the organic layer in the second bending area. According to the scheme, the organic layers in the first bending area and the second bending area can be simultaneously prepared, so that the preparation process is simplified, and the preparation cost is reduced.
The embodiment of the invention also provides a display device which comprises the display panel.
Embodiments of the present invention provide a display panel, relative to the related art, including: a substrate; the substrate includes: a display area, the display area including at least: the first bending area is positioned on one side of the non-bending area; an organic layer and an inorganic layer which are stacked on a substrate; in the direction of the lamination of the organic layer and the inorganic layer, the thickness of the organic layer in the first bending area is smaller than that of the organic layer in the non-bending area, and the thickness of the inorganic layer in the first bending area is larger than that of the inorganic layer in the non-bending area. The organic layer that will be located the first bending zone of display panel is made thin, inorganic layer is made thick mode and is improved the cooperative deformability of organic layer and inorganic layer in the first bending zone, and can reduce the stress size that first bending zone organic layer and inorganic layer received, can avoid the too big display panel rete that appears of first bending zone received stress to produce the crackle, the fracture takes place even, cause display panel to produce reliability problems such as marginal black spot, display panel's reliability has been promoted greatly.
Drawings
One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the figures in which like reference numerals refer to similar elements and which are not to scale unless otherwise specified.
Fig. 1 is a top view of a display area of a display panel according to a first embodiment of the present invention;
fig. 2 is a sectional view of a display panel according to a first embodiment of the present invention;
fig. 3 is a sectional view of a display panel according to a second embodiment of the present invention;
fig. 4 is a sectional view of a display panel according to a third embodiment of the present invention;
fig. 5 is another cross-sectional view of a display panel according to a third embodiment of the present invention;
fig. 6 is a sectional view of a display panel according to a fourth embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that numerous technical details are set forth in order to provide a better understanding of the present application in various embodiments of the present invention. However, the technical solution claimed in the present application can be implemented without these technical details and various changes and modifications based on the following embodiments.
A first embodiment of the present invention relates to a display panel, and the core of the present embodiment is a display panel including: a substrate; the substrate includes: a display area, the display area including at least: the first bending area is positioned on one side of the non-bending area; an organic layer and an inorganic layer which are stacked on a substrate; in the direction of the lamination of the organic layer and the inorganic layer, the thickness of the organic layer in the first bending area is smaller than that of the organic layer in the non-bending area, and the thickness of the inorganic layer in the first bending area is larger than that of the inorganic layer in the non-bending area.
The organic layer that will be located the first bending zone of display panel is made thin, inorganic layer is made thick mode and is improved the cooperative deformability of organic layer and inorganic layer in the first bending zone, and can reduce the stress size that first bending zone organic layer and inorganic layer received, can avoid the too big display panel rete that appears of first bending zone received stress to produce the crackle, the fracture takes place even, cause display panel to produce reliability problems such as marginal black spot, display panel's reliability has been promoted greatly.
The following description specifically describes implementation details of the display panel of the present embodiment, and the following description is provided only for the sake of understanding and is not necessary for implementing the present embodiment.
The schematic structural diagram of the display panel in this embodiment is shown in fig. 1 and 2:
the display panel includes: a substrate 1. The substrate 1 includes: a display area, the display area including at least: a non-bending region 10, and a first bending region 20 located at one side of the non-bending region 10. As shown in fig. 1, the non-bending region 10 is generally located in the middle of the display region of the display panel, the first bending region 20 is located at one side of the non-bending region 10 and near the edge of the display region, when the display panel is bent, the non-bending region 10 is subjected to the minimum stress and hardly has deformation, and the first bending region 20 located at one side of the non-bending region 10 is subjected to the larger stress and the larger deformation. It should be noted that fig. 1 shows an arrangement manner of the non-bending region 10 and the first bending region 20 in the display panel, where the first bending region 20 includes two regions and is respectively located at two opposite sides of the non-bending region 10; in practical applications, however, it is possible that the first bending region 20 is located on only one side of the non-bending region 10.
The display panel further includes: the organic layer 22 and the inorganic layer are stacked on the substrate 1. In the direction in which the organic layer 22 and the inorganic layer are stacked, the thickness of the organic layer 22 in the first bending region 20 is smaller than the thickness of the organic layer 22 in the non-bending region 10, and the thickness of the inorganic layer in the first bending region 20 is larger than the thickness of the inorganic layer in the non-bending region 10.
Specifically, the organic layer 22 and the inorganic layer stacked on the substrate 1 constitute a thin film encapsulation layer, and the display region is encapsulated. However, in the process of bending the display panel, because the bending region of the display panel is subjected to a large stress and perfect cooperative deformation cannot be achieved between the organic layer 22 and the inorganic layer, the film layer is easily cracked or even broken in the bending region due to the large bending stress between the film layers, which causes package failure of the display panel and reliability problems such as edge black spots.
In this regard, the inventors have found through stress simulation that reducing the thickness of the organic layer 22 and increasing the thickness of the inorganic layer can reduce the stress on the encapsulation film layer. Therefore, the thickness configuration of the packaging layer of the bending region is adjusted in the embodiment, that is, the organic layer 22 in the first bending region 20 of the display panel is thinned, and the inorganic layer is thickened, so that the cooperative deformability of the organic layer 22 and the inorganic layer in the first bending region 20 is improved, the stress applied to the organic layer 22 and the inorganic layer in the first bending region 20 can be reduced, the problem that the film layer of the display panel cracks or even breaks due to the overlarge stress applied to the first bending region 20, so that the display panel generates edge black spots and other reliability problems can be solved, and the reliability of the display panel is greatly improved.
The inventor finds that when the thickness of the organic layer 22 in the first bending region 20 is 2 to 5 micrometers smaller than that of the organic layer 22 in the non-bending region 10, and the thickness of the inorganic layer in the first bending region 20 is 0.2 to 0.5 micrometers larger than that of the inorganic layer in the non-bending region 10, the organic layer 22 and the inorganic layer in the first bending region 20 have better cooperative deformability, and the stress applied to the organic layer 22 and the inorganic layer in the first bending region 20 can be greatly reduced.
Further, as shown in fig. 2, the inorganic layer includes: a first inorganic layer 21 positioned on the substrate 1, a second inorganic layer 23 positioned on the side of the first inorganic layer 21 far away from the substrate 1, and an organic layer 22 positioned between the first inorganic layer 21 and the second inorganic layer 23; in the direction in which the organic layer 22 and the inorganic layer are stacked, the thickness of the second inorganic layer 23 in the first inflection region 20 is greater than the thickness of the second inorganic layer 23 in the non-inflection region 10.
Specifically, the thin film encapsulation layer formed by the organic layer 22 and the inorganic layer stacked on the substrate 1 has a three-layer structure, that is, the thin film encapsulation layer includes: the first inorganic layer 21, the organic layer 22, and the second inorganic layer 23 are stacked on the substrate 1. Based on the principle that "reducing the thickness of the organic layer 22 and increasing the thickness of the inorganic layer can reduce the stress on the encapsulation film layer", the inventors found that the first inorganic layer 21 or the second inorganic layer 23 can be made thick to achieve the desired thickness of the inorganic layer, or the first inorganic layer 21 and the second inorganic layer 23 can be made thick to achieve the desired thickness of the inorganic layer. However, the inventors have further found that, since the display panel is bent toward the side away from the substrate 1 when the display panel is bent, the stress applied to the film layer close to the substrate 1 is small, and the stress applied to the film layer away from the substrate 1 is large, so that the stress applied to the second inorganic layer 23 when the display panel is bent is the largest. Therefore, in the present embodiment, the thickness of the second inorganic layer 23 located in the first bending region 20 is made thick, so that the effect that the stress on the organic layer 22 and the inorganic layer of the first bending region 20 cannot be reduced by making the first inorganic layer 21 thick is avoided, and the increase of the process cost caused by making the first inorganic layer 21 and the second inorganic layer 23 thick is also avoided, thereby achieving the effect of reducing the stress on the organic layer 22 and the inorganic layer of the first bending region 20 on the basis of low process cost. When only the second inorganic layer 23 is made thick, the thickness of the second inorganic layer 23 in the first bending region 20 is 0.2 to 0.5 micrometers greater than the thickness of the second inorganic layer 23 in the non-bending region 10.
Further, the display area further includes: the second bending area 30 is positioned on one side of the first bending area 20, which is far away from the non-bending area 10, and the bending stress of the second bending area 30 is smaller than that of the first bending area 20; the organic layer 22 is also located in the second bending region 30, and the thickness of the organic layer 22 located in the second bending region 30 is the same as that of the organic layer 22 located in the non-bending region 30.
Specifically, the display area further includes: the second bending region 30 is located on the side of the first bending region 20 away from the non-bending region 10, and the bending stress applied to the second bending region 30 is smaller than the bending stress applied to the first bending region 20. Two first bending areas 20 are arranged and are respectively positioned at two sides of the non-bending area 10 and close to the edge of the display area; correspondingly, two second bending regions 30 are also provided, which are respectively located at the sides of the two first bending regions 20 away from the non-bending region 10. It should be noted that fig. 1 shows only one arrangement of the non-bending region 10, the first bending region 20 and the second bending region 30 in the display panel, and in practical applications, there may be only one first bending region 20 located at one side of the non-bending region 10; accordingly, only one second bending region 30 is provided and located at one side of the first bending region 20.
In this embodiment, the organic layer 22 is further located in the second bending region 30, and the thickness of the organic layer 22 located in the second bending region 30 is the same as the thickness of the organic layer 22 located in the non-bending region 30, so that only the film thickness of the region of the display panel with larger bending stress is changed, thereby improving the reliability of the display panel and saving the manufacturing cost.
Preferably, the organic layer 22 is located in the first bending region 20, the organic layer 22 is located in the second bending region 30, and the organic layer 22 is located in the non-bending region 10 to form a groove located in the first bending region 20, and the second inorganic layer 23 fills the groove.
As shown in fig. 2, the organic layer 22 of the first bending region 20 is thinned, and the thicknesses of the organic layer 22 of the second bending region 30 and the organic layer 22 of the non-bending region 10 are the same, so that the organic layer 22 forms a groove in the first bending region 20, the groove is filled with the second inorganic layer 23, and the portion of the organic layer 22 located in the first bending region 20 and the portion of the second inorganic layer 23 located in the first bending region 20 are engaged with each other, thereby preventing the film separation of the organic layer 22 and the second inorganic layer 23 when the stress ratio of the first bending region 20 is large, and further improving the reliability of the display panel during bending.
It should be noted that, as shown in fig. 2, since the reduced thickness (2 micrometers to 5 micrometers) of the organic layer 22 is much greater than the increased thickness (0.2 micrometers to 0.5 micrometers) of the second inorganic layer 23, after the organic layer 22 of the first bending region 20 is thinned and the second inorganic layer 23 is thickened, the thickness of the whole film encapsulation layer of the first bending region 20 is smaller than that of the whole film encapsulation layer of the non-bending region 10.
Compared with the related art, the embodiment of the invention provides a display panel, the cooperative deformation capability of the organic layer 22 and the inorganic layer in the first bending area 20 of the display panel is improved by adjusting the thickness configuration of the packaging layer of the bending area, that is, the organic layer 22 and the inorganic layer in the first bending area 20 of the display panel are thinned and the inorganic layer is thickened, the stress on the organic layer 22 and the inorganic layer in the first bending area 20 can be reduced, the problem that the film layer of the display panel is cracked or even cracked due to the overlarge stress on the first bending area 20, the problem of the reliability of the display panel such as edge black spots is solved, and the reliability of the display panel is greatly improved.
The second embodiment of the present invention relates to a display panel, which is an improvement of the first embodiment, and the main improvement is that in this scheme, a second inorganic layer of a second bending region located on a side of a first bending region far away from a non-bending region is made thick, so as to further reduce stress applied to the second bending region.
As shown in fig. 1 of the first embodiment, the display area further includes: the second bending region 30 is located on the side of the first bending region 20 away from the non-bending region 10, and the bending stress applied to the second bending region 30 is smaller than the bending stress applied to the first bending region 20. Two first bending regions 20 are arranged and are respectively positioned at two sides of the non-bending region 10 and near the edge of the display region; correspondingly, two second bending regions 30 are also provided, which are respectively located at the sides of the two first bending regions 20 away from the non-bending region 10. It should be noted that fig. 1 shows only one arrangement of the non-bending region 10, the first bending region 20 and the second bending region 30 in the display panel, and in practical applications, there may be only one first bending region 20 located at one side of the non-bending region 10; accordingly, only one second bending region 30 is provided and located at one side of the first bending region 20.
As shown in fig. 3, the second inorganic layer 23 is also located in the second bending region 30, and the thickness of the second inorganic layer 23 located in the second bending region 30 is greater than the thickness of the second inorganic layer 23 located in the non-bending region 10. In this embodiment, the thickness of the second inorganic layer 23 located in the second bending region 30 is made thicker, so that the stress applied to the second bending region 30 is further reduced, and the film of the second inorganic layer 23 located in the second bending region 30 is prevented from cracking.
Preferably, the thickness of the second inorganic layer 23 in the first bending region 20 is the same as the thickness of the second inorganic layer 23 in the second bending region 30. Thus, the second inorganic layer 23 located in the first bending region 20 and the second bending region 30 can be simultaneously prepared, thereby simplifying the preparation process and reducing the preparation cost. When the second inorganic layer 23 located in the second bending region 30 is made thick, the thickness of the second inorganic layer 23 located in the second bending region 30 is 0.2 to 0.5 micrometers greater than the thickness of the second inorganic layer 23 located in the non-bending region 10.
Compared with the related art, the embodiment of the invention provides a display panel, by making the thickness of the second inorganic layer 23 of the second bending region 30 located at the side of the first bending region 20 far away from the non-bending region 10, the stress applied to the second bending region 30 is further reduced, and the film cracking of the second inorganic layer 23 located at the second bending region 30 is avoided.
The third embodiment of the present invention relates to a display panel, which is an improvement of the first embodiment, and the main improvement is that in the present invention, an organic layer of a second bending region located on a side of a first bending region far from a non-bending region is thinned to further reduce stress applied to the second bending region.
As shown in fig. 1 of the first embodiment, the display area further includes: the second bending region 30 is located at a side of the first bending region 20 away from the non-bending region 10, and the bending stress applied to the second bending region 30 is smaller than the bending stress applied to the first bending region 20. Two first bending areas 20 are arranged and are respectively positioned at two sides of the non-bending area 10 and close to the edge of the display area; correspondingly, two second bending regions 30 are also provided, which are respectively located at the sides of the two first bending regions 20 away from the non-bending region 10. It should be noted that fig. 1 only shows an arrangement manner of the non-bending region 10, the first bending region 20 and the second bending region 30 in the display panel, and in practical applications, there may be only one first bending region 20 disposed on one side of the non-bending region 10; accordingly, only one second bending region 30 is provided and located at one side of the first bending region 20.
As shown in fig. 4, in the direction in which the organic layer 22 and the inorganic layer are stacked, the thickness of the organic layer 22 at the second inflection region 30 is smaller than the thickness of the organic layer 22 at the non-inflection region 10. In this embodiment, the organic layer 22 located in the second bending region 30 is made thinner, so as to further reduce the stress applied to the second bending region 30.
Preferably, the thickness of the organic layer 22 in the first bending region 20 is the same as the thickness of the organic layer 22 in the second bending region 30. Thus, the organic layer 22 located in the first bending region 20 and the organic layer located in the second bending region 30 can be simultaneously prepared, thereby simplifying the preparation process and reducing the preparation cost. When the organic layer 22 located in the second bending region 30 is made thin, the thickness of the organic layer 22 located in the second bending region 30 is 2 to 5 micrometers smaller than the thickness of the organic layer 22 located in the non-bending region 10.
Preferably, as shown in fig. 5, the third embodiment may also be combined with the second embodiment, that is, the second inorganic layer 23 is also located in the second bending region 30, and the thickness of the second inorganic layer 23 located in the second bending region 30 is greater than that of the second inorganic layer 23 located in the non-bending region 10; and the thickness of the organic layer 22 in the second bending region 30 is smaller than the thickness of the organic layer 22 in the non-bending region 10. That is to say, the portion of the organic layer 22 located in the second bending region 30 is thinned, and the portion of the second inorganic layer 23 located in the second bending region 30 is thickened, so that the cooperative deformability of the organic layer 22 and the inorganic layer in the second bending region 30 is improved, the stress applied to the organic layer 22 and the inorganic layer in the second bending region 30 can be reduced, the problem that the film layer of the display panel is cracked or even broken due to the overlarge stress applied to the second bending region 30, and the reliability of the display panel is damaged due to the edge black spots and the like can be solved, and the reliability of the display panel is further improved.
As shown in table 1 below, simulation data of the stress on the organic layer 22 and the inorganic layer when only the second inorganic layer 23 of the first bending region 20 and the second bending region 30 is made thick are shown:
as shown in table 2 below, simulation data of the stress applied to the organic layer 22 and the inorganic layer when only the organic layer 22 of the first bending region 20 and the second bending region 30 is thinned are shown:
as shown in table 3 below, simulation data of the stress applied to the organic layer 22 and the inorganic layer when the organic layer 22 of the first bending region 20 and the second bending region 30 is made thin and the second inorganic layer 23 is made thick are shown:
it is clear from the above simulation data that, compared to the way the organic layer 22 is made thin alone, or the inorganic layer is made thick alone: meanwhile, the organic layer 22 of the first bending region 20 and the second bending region 30 is made thin, and the inorganic layer is made thick, so that the stress on the organic layer 22 and the inorganic layer can be reduced to the greatest extent.
Compared with the related art, the embodiment of the invention provides a display panel, wherein the organic layer 22 of the second bending region 30 located at the side of the first bending region 20 far away from the non-bending region 10 is thinned to further reduce the stress applied to the second bending region 30; preferably, the organic layer 22 of the first bending region 20 and the organic layer 22 of the second bending region 30 are made thin and the inorganic layer is made thick at the same time, so that the stress applied to the organic layer 22 and the inorganic layer can be reduced to the greatest extent.
A fourth embodiment of the present invention relates to a display panel, which is an improvement of the first embodiment, and is mainly improved in that an organic layer includes: the first organic layer and the second organic layer give a specific structural style of the organic layer.
As shown in fig. 6, the organic layer 22 includes: a first organic layer 221, and a second organic layer 222 located on a side of the first organic layer 221 away from the substrate 1; the first organic layer 221 is located in the display region; the second organic layer 222 is located in the non-bending region 10.
In the present embodiment, the organic layer 22 can be prepared by a two-step process, in which first, a first organic layer 221 is formed on the substrate 1; and secondly, forming a second organic layer 222 in the non-bending area 10 by adjusting the ink outlet position of the nozzle and adjusting the viscosity of the ink, so that the film thickness of the organic layer 22 in the display area outside the non-bending area 10 is smaller than that of the organic layer 22 in the non-bending area 10. It is realized that in the actual manufacturing process, the organic layer 22 with the same thickness may be directly formed in the whole display region, and then the thickness of the organic layer 22 in the display region outside the non-bending region 10 is made thin.
The display area further includes: the second bending area 30 is positioned at one side of the first bending area 20 far away from the non-bending area 10, and the bending stress of the second bending area 30 is smaller than that of the first bending area 20; the second organic layer 222 is also located in the second bending region 30. In this embodiment, the second organic layer 222 is also located in the second bending region 30, that is, the film thickness of the organic layer 22 in the second bending region 30 is the same as the film thickness of the organic layer 22 in the non-bending region 10. It is realized that in the actual manufacturing process, the organic layer 22 with the same thickness may be directly formed in the whole display region, and then, only the thickness of the organic layer 22 of the first bending region 20 is made thin.
Accordingly, the second inorganic layer 23 is thickened in the first to third embodiments as follows: the first inorganic layer may be prepared first, and then the second inorganic layer may be prepared only in the display region where the thickness needs to be increased. It is also possible to prepare an inorganic layer with a relatively large thickness over the entire display area, and then thin the inorganic layer in the other areas except the display area with the increased thickness.
It should be noted that the thickness of the organic layer 22 in the related art is 10 micrometers to 15 micrometers, while the thickness of the first organic layer 221 in this embodiment is 8 micrometers to 10 micrometers, and the thickness of the second organic layer 222 is 2 micrometers to 5 micrometers. The thickness of the second inorganic layer 23 in the related art is 1.0 to 1.5 micrometers, whereas the thickness of the first inorganic layer in the present embodiment is 0.8 to 1 micrometer, and the thickness of the second inorganic layer is 0.2 to 0.5 micrometer.
A fifth embodiment of the present invention relates to a display device including: in any of the above embodiments, the display device may be a mobile phone, a tablet, a computer, a VR or AR display device.
It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples for carrying out the invention, and that various changes in form and details may be made therein without departing from the spirit and scope of the invention in practice.
Claims (11)
1. A display panel, comprising:
a substrate; the substrate includes: a display area, the display area including at least: the bending device comprises a non-bending area and a first bending area positioned on one side of the non-bending area;
an organic layer and an inorganic layer which are stacked on the substrate;
in the direction of stacking the organic layer and the inorganic layer, the thickness of the organic layer in the first bending region is smaller than that of the organic layer in the non-bending region, and the thickness of the inorganic layer in the first bending region is larger than that of the inorganic layer in the non-bending region;
wherein the inorganic layer comprises: the organic light-emitting diode comprises a first inorganic layer positioned on the substrate, a second inorganic layer positioned on one side of the first inorganic layer far away from the substrate, and an organic layer positioned between the first inorganic layer and the second inorganic layer;
in the direction in which the organic layer and the inorganic layer are stacked, the thickness of the second inorganic layer in the first bending region is larger than the thickness of the second inorganic layer in the non-bending region.
2. The display panel according to claim 1, wherein the display region further comprises: the second bending area is positioned on one side of the first bending area, which is far away from the non-bending area, and the bending stress of the second bending area is smaller than that of the first bending area;
the organic layer is also positioned in the second bending area, and the thickness of the organic layer positioned in the second bending area is the same as that of the organic layer positioned in the non-bending area.
3. The display panel according to claim 2, wherein a portion of the organic layer located in the first bending region, a portion of the organic layer located in the second bending region, and a portion of the organic layer located in the non-bending region form a groove located in the first bending region, and the second inorganic layer fills the groove.
4. The display panel according to claim 1, wherein the display area further comprises: the second bending area is positioned on one side of the first bending area, which is far away from the non-bending area, and the bending stress of the second bending area is smaller than that of the first bending area;
the second inorganic layer is also positioned in the second bending area, and the thickness of the second inorganic layer positioned in the second bending area is larger than that of the second inorganic layer positioned in the non-bending area.
5. The display panel according to claim 4, wherein the second inorganic layer has the same thickness in the first bending region as the second inorganic layer in the second bending region.
6. The display panel according to any one of claims 1 to 5, wherein the thickness of the organic layer in the first bending region is 2 to 5 μm smaller than the thickness of the organic layer in the non-bending region; the thickness of the second inorganic layer in the first bending area is 0.2-0.5 micrometer greater than that of the second inorganic layer in the non-bending area.
7. The display panel according to claim 1, wherein the organic layer comprises: the organic light-emitting diode comprises a first organic layer and a second organic layer, wherein the second organic layer is positioned on one side of the first organic layer, which is far away from the substrate;
the first organic layer is positioned in the display area;
the second organic layer is located in the non-bending area.
8. The display panel according to claim 7, wherein the display area further comprises: the second bending area is positioned on one side of the first bending area, which is far away from the non-bending area, and the bending stress of the second bending area is smaller than that of the first bending area;
the second organic layer is also located in the second bending region.
9. The display panel according to claim 1, wherein the display area further comprises: the second bending area is positioned on one side of the first bending area, which is far away from the non-bending area, and the bending stress of the second bending area is smaller than that of the first bending area;
in the direction in which the organic layer and the inorganic layer are stacked, the thickness of the organic layer in the second bending region is smaller than the thickness of the organic layer in the non-bending region.
10. The display panel according to claim 9, wherein the organic layer has the same thickness in the first bending region as the organic layer in the second bending region.
11. A display device, comprising: the display panel of any one of claims 1 to 10.
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| CN113555394B (en) * | 2021-07-05 | 2023-02-03 | 武汉华星光电半导体显示技术有限公司 | Display panel |
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| CN110148684A (en) * | 2019-06-27 | 2019-08-20 | 云谷（固安）科技有限公司 | A kind of display panel and display device |
| CN111540838A (en) * | 2020-04-23 | 2020-08-14 | 昆山国显光电有限公司 | Display panel, manufacturing method thereof and display device |
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| KR20180068382A (en) * | 2016-12-13 | 2018-06-22 | 삼성디스플레이 주식회사 | Display device and manufacturing method thereof |
| CN108400138B (en) * | 2016-12-28 | 2020-11-03 | 上海天马有机发光显示技术有限公司 | Flexible display panel, display device and manufacturing method of flexible display panel |
| CN207834361U (en) * | 2017-11-09 | 2018-09-07 | 深圳市柔宇科技有限公司 | Fexible film encapsulating structure |
| CN108054292B (en) * | 2017-12-29 | 2019-09-03 | 云谷（固安）科技有限公司 | Encapsulating structure and flexible display apparatus including encapsulating structure |
| CN108448010B (en) * | 2018-05-11 | 2021-04-23 | 云谷（固安）科技有限公司 | Display panel and display terminal |
| KR20200037889A (en) * | 2018-10-01 | 2020-04-10 | 삼성디스플레이 주식회사 | Display module |
| CN110718639A (en) * | 2019-09-25 | 2020-01-21 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
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