CN108448010B

CN108448010B - Display panel and display terminal

Info

Publication number: CN108448010B
Application number: CN201810450411.9A
Authority: CN
Inventors: 黄莹; 李雪原; 朱平; 刘胜芳
Original assignee: Yungu Guan Technology Co Ltd
Current assignee: Yungu Guan Technology Co Ltd
Priority date: 2018-05-11
Filing date: 2018-05-11
Publication date: 2021-04-23
Anticipated expiration: 2038-05-11
Also published as: CN108448010A

Abstract

The invention discloses a display panel and a display terminal. The bonding region comprises a planarization layer and a film packaging layer which are sequentially stacked and directly contacted, wherein the film packaging layer covers the planarization layer. According to the invention, the flattening layer is arranged in the binding region firstly, then the thin film packaging layer is arranged, the inorganic packaging layer in the formed thin film packaging layer is flat, the flattening layer can buffer the stress of the inorganic packaging layer, the flexibility of the display panel is improved, the circuit of the binding region is not damaged, and the problem that the thin film packaging layer corresponding to the binding region provided with the multilayer wiring is easy to crack is effectively avoided, so that the packaging reliability is improved, and the service life of the display panel is further prolonged.

Description

Display panel and display terminal

Technical Field

The invention relates to the technical field of display, in particular to a display panel and a display terminal.

Background

In the display technology field, the organic light emitting material of the display panel is very sensitive to oxygen and water vapor, and therefore, it is necessary to provide a highly reliable thin film encapsulation layer to avoid the problem of failure caused by water and oxygen intrusion. In addition, a plurality of layers of wires, such as data lines, power lines, etc., are required to be disposed at IC (integrated circuit) bonding positions of the display panel, and then thin film packaging is performed also at the bonding regions. The inventor finds that the corresponding thin film packaging layer at the binding region is easy to crack in actual production, so that a channel for water and oxygen permeation is formed, and the reliability of the package is reduced.

Disclosure of Invention

Accordingly, there is a need for a display panel and a display terminal capable of improving the reliability of packaging.

A display panel comprises a binding region, wherein the binding region comprises a planarization layer and a film packaging layer which are sequentially stacked and arranged in a direct contact mode, and the film packaging layer covers the planarization layer.

According to the invention, the flattening layer is arranged in the binding region for arranging the multilayer wiring, then the thin film packaging layer is arranged, the inorganic packaging layer in the formed thin film packaging layer is flat, the flattening layer can buffer the stress of the inorganic packaging layer, the flexibility of the display panel is improved, the circuit of the binding region is not damaged, and the problem that the thin film packaging layer corresponding to the binding region provided with the multilayer wiring is easy to crack is effectively avoided, so that the packaging reliability is improved, and the service life of the display panel is prolonged.

In one embodiment, the bonding region includes a wiring layer composed of a plurality of wires, and the planarization layer is embedded in the wiring layer.

In one embodiment, the bonding region includes a wiring layer composed of a plurality of wires, and the planarization layer covers the wiring layer.

In one embodiment, the display panel includes a plurality of display modules, and the upper surface of the planarization layer is not higher than the upper surfaces of the display modules.

In one embodiment, the display panel further comprises a display area provided with a plurality of display modules, and the planarization layer is arranged outside the display area.

In one embodiment, the thickness of the planarization layer is 1.2 times the maximum thickness of the wiring layer.

In one embodiment, the planarization layer is an organic layer with water and oxygen barrier capability.

In one embodiment, the material of the planarization layer is epoxy or acrylic.

In one embodiment, the material of the planarization layer is an isocyanate modified epoxy resin.

A display terminal comprises the display panel.

Drawings

FIG. 1 is a schematic diagram of a front structure of a display panel according to an embodiment;

fig. 2 is a schematic cross-sectional view of the area a of the display panel shown in fig. 1.

Detailed Description

To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1 and 2, a display panel 10 according to an embodiment of the invention includes a bonding region 101. The bonding region 101 includes a planarization layer 110 and a thin film encapsulation layer 130 sequentially stacked in direct contact. The thin film encapsulation layer 130 covers the planarization layer 110.

Referring to fig. 2, the thin film encapsulation layer 130 includes a first inorganic encapsulation layer 131, an organic encapsulation layer 132, and a second inorganic encapsulation layer 133 sequentially stacked from bottom to top.

In practical production, the invention finds that, because the thickness of the wires at each position of the bonding region 101 is different and the wires are overlapped with each other, the surface of the inorganic encapsulation layer of the film encapsulation layer 130 is not flat due to the traditional structure of directly arranging the film encapsulation layer 130 on the circuit 150 on the bonding region 101, for example, the film layer of the inorganic encapsulation layer at the power line wire position is protruded and not flat, thereby causing the inorganic encapsulation layer of the film encapsulation layer 130 to be not flat. When the display panel 10 is bent or aged, the inorganic sealing layer is deformed and stressed differently at different positions, and the inorganic sealing layer is likely to wrinkle, crack or even break at a position with a large stress, thereby forming a channel through which water and oxygen permeate, and reducing the reliability of the sealing.

Based on this, in the invention, the planarization layer 110 is firstly arranged on the binding region 101 provided with the multilayer wiring, and then the thin film packaging layer 130 is arranged, so that the inorganic packaging layer in the formed thin film packaging layer 130 is flat, and the planarization layer 110 can buffer the stress of the inorganic packaging layer, thereby improving the flexibility of the display panel 10, not damaging the circuit 150 of the binding region 101, and effectively avoiding the problem that the thin film packaging layer 130 corresponding to the binding region 101 provided with the multilayer wiring is easy to crack, thereby improving the packaging reliability, and further prolonging the service life of the display panel 10.

In one embodiment, the bonding area 101 is populated with wires 150, and the bonding area 101 includes a wiring layer composed of a number of wires. A planarization layer 110 is embedded within the wiring layer. Thus, the planarization layer 110 fills the trace gap on the bonding region 101 and covers the wire 150. The planarization layer 110 can not only planarize the bonding region 101, but also fix the traces.

Further, the planarization layer 110 covers the wiring layer, so that the problem of package failure caused by contact between the thin film packaging layer 130 and the wiring layer is further avoided, and the packaging reliability is improved.

Further, the planarization layer 110 is an organic planarization layer. Further, the planarization layer 110 is an organic layer having a water and oxygen blocking property. Specifically, the material of the planarization layer 110 is aliphatic polyester, aliphatic polyurethane, aromatic polyurethane, epoxy resin, or acrylic resin, preferably epoxy resin or acrylic resin. It is understood that the material of the planarization layer 110 is not limited thereto.

Further, the acrylic resin is PMMA (polymethyl methacrylate) or silicone acrylate. It is understood that the material of the planarization layer 110 is not limited thereto, and may include other organic materials suitable for the planarization layer 110.

The material of the planarization layer 110 is preferably an epoxy resin with superior water and oxygen barrier properties to further improve the overall package reliability. Compared with PMMA material, the epoxy resin has less degassing and less water content in the material when forming the planarization layer 110, so that the formation of the planarization layer 110 which is compact and does not contain water vapor is facilitated, and the packaging performance is further ensured.

Furthermore, the epoxy resin is preferably an epoxy resin with a molecular weight of 300-700. Further, an epoxy resin having a molecular weight of 506 is preferable.

More preferably, the material of the planarization layer 110 is an isocyanate modified epoxy resin to further reduce the moisture permeability of the planarization layer 110 and increase the water and oxygen barrier properties of the planarization layer 110.

It is understood that the planarization layer 110 is formed after the pixels are deposited in the display area 102 of the display panel 10, and before the conventional thin film encapsulation steps are performed. Specifically, the planarization layer 110 is deposited by an inkjet printing technique.

Specifically, the patterned planarization layer 110 can be obtained by directly performing patterned deposition on the bonding region 101 by inkjet printing. The patterning deposition is carried out by adopting an ink-jet printing mode, the deposition is carried out only in the area needing to be printed, and the mask and the etching are not needed, so that the deposition of the planarization layer can be directly carried out on the binding area. Or the bonding region 101 is first coated with an organic adhesive on the whole surface, and then patterned by photolithography, and the region not requiring an organic layer is etched away to obtain the patterned planarization layer 110. Preferably, the process of directly performing inkjet printing to obtain the patterned planarization layer 110 is simple, fast and effective. The planarization layer 110 with a smaller thickness can be deposited by a process of first coating an organic layer on the whole surface and then performing photolithography, but the material utilization rate is low and the process is complicated.

In one embodiment, the display panel 10 further includes a plurality of display modules. The display module mainly comprises an anode layer, an organic light emitting layer and a cathode layer. The upper surface of the planarization layer 110 is not higher than the upper surface of the display module. Therefore, the planarization layer 110 can not only cover the wiring layer well, but also prevent the adverse effect of the moisture contained in the planarization layer 110 on the pixels of the display module due to the fact that the planarization layer 110 is higher than the display module, thereby further improving the reliability of the package.

Specifically, the surface of the planarization layer 110 facing the first inorganic sealing layer 131 is not higher than the surface of the display region 102 facing the first inorganic sealing layer 131, so as to prevent the planarization layer 110 protruding from the display region 102 and causing the moisture contained in the planarization layer 110 to adversely affect the pixels of the display region 102.

Further, the display panel 100 further includes a display area 102 having a plurality of display modules, and the planarization layer 110 is disposed outside the display area 102.

Specifically, the thickness of the planarization layer 110 is preferably 1.2 times the maximum thickness of the wiring layer of the bonding region 101, which can well coat the wires 150 of the bonding region 101. It is understood that the organic encapsulation layer 132 is encapsulated between the first inorganic encapsulation layer 131 and the second inorganic encapsulation layer 133.

The first inorganic encapsulation layer 131 and the second inorganic encapsulation layer 133 may be formed by a chemical vapor deposition method. The organic encapsulation layer 132 may be formed using inkjet printing. Specifically, the first inorganic encapsulation layer 131 and the second inorganic encapsulation layer 133 are silicon nitride films. The organic encapsulation layer 132 is an acrylate film. It is understood that the materials of the first inorganic encapsulation layer 131, the organic encapsulation layer 132, and the second inorganic encapsulation layer 133 are not limited thereto.

Preferably, the upper surface of the planarization layer 110 is flush with the upper surface of the display region 102 on the basis that the planarization layer 110 covers the wiring layer. That is, the surface of the planarization layer 110 facing the first inorganic encapsulation layer 131 is flush with the surface of the display region 102 facing the first inorganic encapsulation layer 131. Therefore, the formed inorganic packaging layer is flat, and the problem of packaging failure caused by cracking of the inorganic packaging layer is further reduced.

Further, the binding region 101 is disposed around the outer edge of the display region 102. The planarization layer 110 is disposed on the binding region 101, i.e., the planarization layer 110 is disposed around the outer edge of the display region 102.

In one embodiment, the display panel 10 further includes a package boundary 103 disposed at an outer edge of the bonding region 101, and the first inorganic packaging layer 131 is formed in the package boundary 103 and covers the planarization layer 110 on the bonding region 101 and the display module of the display region 102. The first inorganic encapsulation layer 131 with better compactness and water-oxygen barrier property is adopted to coat the planarization layer 110 and the display module, so that the planarization layer 110 can be prevented from being invaded by water and oxygen to form a water-oxygen permeation channel, and the encapsulation reliability of the pixel is further improved.

The present invention also provides a display terminal including the display panel 10. The display terminal comprises a mobile phone, a television, a tablet computer and other equipment.

The display terminal adopts the display panel, effectively solves the problem that a thin film packaging layer corresponding to a binding area provided with a plurality of layers of wiring is easy to crack, improves the packaging reliability, and further prolongs the service life of the display panel.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. The display panel is characterized by comprising a binding region, wherein the binding region comprises a planarization layer and a film packaging layer which are sequentially stacked and directly contacted, and the film packaging layer covers the planarization layer; the bonding region further comprises a wiring layer formed by a plurality of wirings, the planarization layer is embedded in the wiring layer and covers the wiring layer, and the film packaging layer comprises a first inorganic packaging layer, an organic packaging layer and a second inorganic packaging layer which are sequentially stacked from bottom to top; the planarization layer is an organic layer with water and oxygen barrier capability, and the material of the planarization layer is aliphatic polyester, aliphatic polyurethane, aromatic polyurethane, epoxy resin or acrylic resin;

the display panel comprises a plurality of display modules, and the upper surface of the planarization layer is not higher than the upper surfaces of the display modules;

the display panel also comprises a display area provided with a plurality of display modules, and the planarization layer is arranged on the outer side of the display area; the thickness of the planarization layer is 1.2 times the maximum thickness of the wiring layer;

the display panel further comprises a packaging boundary arranged at the outer edge of the binding region, and the first inorganic packaging layer is formed in the packaging boundary and coats the planarization layer on the binding region and the display module of the display region.

2. The display panel of claim 1, wherein a surface of the planarization layer facing the first inorganic encapsulation layer is not higher than a surface of the display area facing the first inorganic encapsulation layer.

3. The display panel of claim 1, wherein the acrylic resin is a PMMA material or a silicone acrylate.

4. The display panel according to claim 1, wherein the epoxy resin is an epoxy resin having a molecular weight of 300 to 700.

5. The display panel according to claim 1, wherein a material of the planarization layer is an isocyanate-modified epoxy resin.

6. A display terminal comprising the display panel according to any one of claims 1 to 5.