CN207338433U - Flexible optoelectronic part packaging protection film and the flexible optoelectronic part for including the packaging protection film - Google Patents
Flexible optoelectronic part packaging protection film and the flexible optoelectronic part for including the packaging protection film Download PDFInfo
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- CN207338433U CN207338433U CN201720796614.4U CN201720796614U CN207338433U CN 207338433 U CN207338433 U CN 207338433U CN 201720796614 U CN201720796614 U CN 201720796614U CN 207338433 U CN207338433 U CN 207338433U
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- packaging protection
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Abstract
The utility model belongs to encapsulation technology field, is related to a kind of flexible optoelectronic part packaging protection film, including several packaging film units, it is characterised in that：Each packaging film unit includes the flexible base layer of adhesive bond successively, metal layer and flexible cover sheet, and the metal layer has the wavy warp architecture of nano-grade size.The utility model not only has good iris action to steam and oxygen; can also be when device be subject to foreign impacts and vibrations; ensure that its shape and function are intact; play shock absorbing effect; so as to play the role of effective packaging protection to flexible organic opto-electronic device, available for the packaging film in flexible organic electroluminescent device.
Description
Technical field
The utility model belongs to encapsulation technology field, and the flexible optoelectronic part encapsulation of more particularly to a kind of novel structure is protected
Cuticula, the packaging film being mainly used in flexible organic electroluminescent device (OLED), while can be also suitably used for planar junction
The packaging protection film of the flexible optical element of structure.
Background technology
Organic electroluminescence device (OLED) is with a wide range of applications in terms of solid-state lighting light source and FPD.
OLED Display Techniques have the advantages that high brightness, high efficiency, wide viewing angle, high-low temperature resistant characteristic, it is considered to be after CRT, LCD
Third generation Display Technique.Flexible bending characteristic be OLED compared with other Display Techniques, particular advantages having are flexible
Display device is also a Main way of future development.In order to realize the marketing development of OLED device, OLED device is current
Application requirement is reached in terms of efficiency, but has stilled need to meet certain life conditions.For flexible OLED devices, with greater need for opening
Novel encapsulated material and packaging technology are sent out, so as to reduce production cost, improves ratio defective product and device lifetime.
Traditional OLED encapsulation technologies are packaged mainly for the device on rigid substrates, typically add a glass to device
Glass or metal cover board, and attached drier, then combined substrate and cover board by fluid sealants such as epoxy resin, so that in substrate
A cover is formed between cover board, device and air are separated, prevents water in air, oxygen to the unfavorable shadows of each functional layers of OLED
Ring.Opposite with conventional packaging method, film encapsulation method, which has, mitigates device overall weight and thickness, reduces cost, and adopt
The advantage of luminous efficiency can be improved with transparent membrane encapsulating material, hope is brought for flexible display technologies.Thin-film package skill
Art can be divided into inorganic thin film encapsulation, organic film encapsulation, inorganic/organic hybrid films encapsulation according to material.Inorganic thin film seals
Dress generally uses ceramic membrane, although there is good barrier to water, oxygen, film forming and flatness be not high, and machinery is strong
Degree is poor, is unfavorable for flexible device encapsulation.Organic film encapsulation generally uses thin polymer film, has good film-forming property, surface compact
The advantages of being not easy to form pin hole, it is often more important that, the mechanical strength of polymer is good, according to condition, can bear different degrees of
Ambient pressure, suitable for the encapsulating material of flexible device, but its barriering effect to water, oxygen is to be improved.Organic/inorganic film
Encapsulation, also referred to as Barix encapsulation technologies, it is to be initially formed one layer of organic film, and one layer of nothing is then deposited on organic film
Machine film, so as to form a Barix encapsulation unit, by the multiple encapsulation units of repeatedly stacking, improves the air-tightness of encapsulation.From
And the respective advantage of polymer encapsulated and inorganic encapsulated is combined, also overcome and polymer encapsulated or inorganic encapsulated is used alone
Shortcoming.This technology is also applied for the encapsulation of flexible device.In actual application, foreign impacts and vibrations pair inevitably occur
The influence of OLED device, such as bending, folding, stretching etc. so that device bends or deforms, or even cisco unity malfunction.
The bad mechanical strength of substrate material (such as glass) and each functional layer material of device usually used in rigidity OLED device, in the external world
Under effect (such as extruding, fold, bend, stretching), it may occur that slight crack, so that whole device loses effect.At present, increasingly
Multi-vendor increasing flexibility of research and development OLED device, application of the extension OLED device in new field.Flexible OLED devices are prepared on
In flexible substrates, it is desirable to be able to bear certain external mechanical effect.In order to overcome external mechanical effect to cause OLED device
Adverse effect, therefore be also required to that there is bending deformed packaging film device is protected.Usual organic/inorganic film
Encapsulation technology, can only meet relatively low crooked deformability, and used inorganic material (such as silica, three oxidations two
Aluminium) bad mechanical strength, easily crack, be not suitable for flexible package technology.Therefore, it is necessary to develop design novel thin film encapsulation skill
Art, especially for existing thin film encapsulation technology, proposes the technology with innovation and actual application value in moulding or structure
Method.In general, polymeric material has preferable mechanically deform ability, suitable for the substrate material of flexible device；Metal
Material has good water, oxygen blocking capability, but its mechanically deform ability is limited.
The content of the invention
In order to stop water and oxygen produce organic electroluminescence device in air adverse effect, especially to flexible organic
, it is necessary to which device can also keep normal work under larger external influence, the utility model provides a kind of soft electroluminescent device
Property optoelectronic device packaging protective film, it not only has good film forming, uniformity and surface smoothness, also has good
Water and oxygen ability are obstructed, and larger external influence can be born and protect flexible device to work normally.
Technical solution is used by the utility model solves its technical problem：A kind of flexible optoelectronic part packaging protection
Film, including several packaging film units, it is characterised in that：Each packaging film unit includes the flexible base of adhesive bond successively
Bottom, metal layer and flexible cover sheet, the metal layer have the wavy warp architecture of nano-grade size.
The wavy warp architecture is one direction arrangement.
The wavy texture is periodicity or aperiodicity.
The wavy amplitude of the wavy texture is between 50nm~500nm.
The cycle of the wavy texture is between 30nm~300nm.
The flexible base layer for dimethyl silicone polymer layer, polyethylene terephthalate layer, polyimide layer,
Polyethylene naphthalate layer, polyethersulfon layer, one or more kinds of above-mentioned materials of layer of polyurethane or block polypropylene layer
The composite layer being mixed.
The flexible cover sheet is dimethyl silicone polymer layer, polyethylene terephthalate layer, poly- naphthalenedicarboxylic acid
Ethylene glycol ester layer, polyethersulfon layer, layer of polyurethane, polyimide layer, low density polyethylene layer, high-density polyethylene layer or block gather
The composite layer that one or more kinds of above-mentioned materials of propylene layer are mixed.
The metal layer is one layer of continuous metal film.
The metal layer is layer gold, silver layer, magnesium layer, aluminium lamination, layers of copper, molybdenum layer, tungsten layer, the one or more of titanium layer, or
Include at least two alloy-layer in gold, silver, magnesium, aluminium, copper, molybdenum, tungsten, titanium.
Include the flexible optoelectronic part of above-mentioned packaging protection film.
The packaging protection film of the utility model, not only with good water and oxygen obstructing capacity, it is often more important that be conducive to
The tensility energy of flexible device is improved, mechanically deform ability greatly enhances, the external influence energy that increase flexible device can be born
Power, and then protect flexible device to be worked normally under extraneous mechanism, suitable for the packaging film of flexible OLED devices, not only
There is good iris action to steam and oxygen, additionally it is possible to device be subject to foreign impacts and vibrations when, it is ensured that its shape and
Function is intact, plays shock absorbing effect, is conducive to extend OLED application fields.
The beneficial effects of the utility model are：
1) surface of flexible base layer and metal layer and flexible cover sheet and metal layer has the wavy of nano-grade size
Warp architecture, can gradually flatten when being subject to external mechanical to act on, and plays buffering or even eliminates external influence, so as to protect flexibility
Device.
2) flexible base layer and flexible cover sheet, using with good film-forming property, that uniformity is good and surface smoothness is high is poly-
Compound material, has good mechanical strength, can bear larger flexural deformation, play a very good protection to device.
3) packaging film that flexible base layer, metal layer and flexible cover sheet are alternatively formed, has very steam and oxygen
Good iris action.
4) preparation method is simple, easy to process, of low cost, material can recycle.
Brief description of the drawings
The utility model is further illustrated with reference to the accompanying drawings and examples.
Fig. 1 is the vertical section structure schematic diagram for the packaging protection film (periodicity wavy texture) that the utility model is related to, its
In, periodically wavy structure distribution connecing in contact surface of the flexible base layer with metal layer and flexible cover sheet and metal layer
Surface is touched, periodically wavy structure distribution is in one direction；
Fig. 2 is the vertical section structure schematic diagram for the packaging protection film (aperiodicity wavy texture) that the utility model is related to,
Wherein, aperiodicity wavy texture is distributed in contact surface and flexible cover sheet and metal layer of the flexible base layer with metal layer
Contact surface, periodically wavy structure distribution is in one direction.
Wherein, 3, flexible base layer 1, the metal layer 2 with the wavy warp architecture of nanoscale, flexible cover sheet encapsulation
Film unit 4 (N is the number of packaging film unit), flexible substrate 5 and flexible organic electroluminescent device 6.
Embodiment
The utility model is：A kind of flexible optoelectronic part packaging protection film, including N number of packaging film unit 4, Mei Gefeng
Dress film unit 4 includes adhering to the flexible base layer 1 combined closely, metal layer 5 and flexible cover sheet 3 successively, can pass through steaming
The modes such as plating, deposition, spraying make.
Metal layer 2 has the wavy warp architecture of nano-grade size.Preferably, the wavy warp architecture is one direction
Arrangement.Wavy texture can be periodicity or aperiodicity.Preferably, the wavy amplitude of the wavy texture is in 50nm
Between~500nm.Preferably, the cycle of the wavy texture is between 30nm~300nm.Metal layer 2 is one layer of continuous gold
Belong to film, be preferably layer gold, silver layer, magnesium layer, aluminium lamination, layers of copper, molybdenum layer, tungsten layer, the one or more of titanium layer, or comprising gold, silver,
At least two alloy-layer in magnesium, aluminium, copper, molybdenum, tungsten, titanium.
Preferably, flexible base layer 1 is dimethyl silicone polymer layer, polyethylene terephthalate layer, polyimides
One or more kinds of above-mentioned materials of layer, polyethylene naphthalate layer, polyethersulfon layer, layer of polyurethane or block polypropylene layer
Expect the composite layer being mixed.
Preferably, flexible cover sheet 3 is dimethyl silicone polymer layer, polyethylene terephthalate layer, poly- naphthalene diformazan
Sour ethylene glycol ester layer, polyethersulfon layer, layer of polyurethane, polyimide layer, low density polyethylene layer, high-density polyethylene layer or block
The composite layer that one or more kinds of above-mentioned materials of polypropylene layer are mixed.
The utility model prepares flexible base layer 1 using wet processing and is stretched, then in the flexible substrates of stretching
Metal layer 2 is prepared on layer 1, then discharges the drawing force on 1/ metal layer 2 of flexible base layer so that 2 flexural deformation of metal layer, i.e.,
The wavy warp architecture with nano-grade size is formed, a flexible cover sheet 3 is finally deposited on metal layer 2, is so formed
One packaging film unit 4.By repeating, according to actual needs, it is possible to achieve the envelope that different number packaging film units 4 form
Fill protective film.
The flexible optoelectronic part of above-mentioned packaging protection film is included, such as flexible organic electroluminescent device
(OLED)) packaging film in or as packaging protection film in the flexible optical element with planar structure etc..As schemed
Show, flexible organic electroluminescent device 6 is located at the top of flexible substrate 5, encapsulates tool again above flexible organic electroluminescent device 6
There is the packaging protection film of N number of packaging film unit 4.
Embodiment 1
Referring to Fig. 1, PDMS flexible base layers 1 are prepared using solution spin coating method, PDMS is stretched to original in one direction
Carry out length 1.2 times, and one layer of gold thin film is prepared by vacuum thermal evaporation method on the PDMS of stretching.Then, release is coated with
Drawing force on the PDMS of gold, so as to form periodic wave sigmoid structure in gold thin film layer, the amplitude of wavy texture is 50nm,
The cycle 300nm of wavy texture.Finally, one layer of PDMS is formed by spraying method in the gold thin film layer with wavy warp architecture
Flexible cover sheet 3.In this way, form a packaging film unit 4.By iterative process, realization has 10 packaging film units 4
The packaging protection film of composition.
Embodiment 2
Referring to Fig. 1, PDMS flexible base layers 1 are prepared using solution spin coating method, PDMS is stretched to original in one direction
Carry out length 2 times, and one layer of gold thin film is prepared by vacuum thermal evaporation method on the PDMS of stretching.Then, release is coated with gold
PDMS on drawing force so that gold thin film layer formed periodic wave sigmoid structure, the amplitude of wavy texture is 500nm,
The cycle 30nm of wavy texture.Finally, one layer of PDMS is formed by spraying method in the gold thin film layer with wavy warp architecture
Flexible cover sheet 3.In this way, form a packaging film unit 4.By iterative process, realization has 5 packaging film units 4
The packaging protection film of composition.
Embodiment 3
Referring to Fig. 1, PDMS flexible base layers 1 are prepared using solution spin coating method, PDMS is stretched to original in one direction
Carry out length 1.6 times, and one layer of gold thin film is prepared by vacuum thermal evaporation method on the PDMS of stretching.Then, release is coated with
Drawing force on the PDMS of gold, so as to form periodic wave sigmoid structure in gold thin film layer, the amplitude of wavy texture is
200nm, the cycle 70nm of wavy texture.Finally, in the gold thin film layer with wavy warp architecture one is formed by spraying method
Layer PDMS flexible cover sheets 3.In this way, form a packaging film unit 4.By iterative process, realization has 6 packaging films
The packaging protection film that unit 4 forms.
Embodiment 4
Referring to Fig. 2, PDMS flexible base layers 1 are prepared using solution spin coating method, PDMS is stretched to original in one direction
Carry out length 1.3 times, and one layer of gold thin film is prepared by vacuum thermal evaporation method on the PDMS of stretching.Then, release is coated with
Drawing force on the PDMS of gold, so as to form the wavy warp architecture of aperiodicity in gold thin film layer, the amplitude of wavy texture is 50
~150nm, the cycle of wavy texture is 80~200nm.Finally, spraying side is passed through in the gold thin film layer with wavy warp architecture
Method forms one layer of PDMS flexible cover sheet 3.In this way, form a packaging film unit 4.By iterative process, realizing has 8
The packaging film that packaging film unit 4 forms.
Embodiment 5
Referring to Fig. 2, PDMS flexible base layers 1 are prepared using solution spin coating method, PDMS is stretched to original in one direction
Carry out length 1.5 times, and one layer of gold thin film is prepared by vacuum thermal evaporation method on the PDMS of stretching.Then, release is coated with
Drawing force on the PDMS of gold, so as to form the wavy warp architecture of aperiodicity in gold thin film layer, the amplitude of wavy texture is
100nm~200nm, the cycle of wavy texture is 50~150nm.Finally, pass through in the gold thin film layer with wavy warp architecture
Spraying method forms one layer of PDMS flexible cover sheet 3.In this way, form a packaging film unit 4.By iterative process, realize
The packaging protection film formed with 6 packaging film units 4.
Embodiment 6
Referring to Fig. 2, PDMS flexible base layers 1 are prepared using solution spin coating method, PDMS is stretched to original in one direction
Carry out length 1.8 times, and one layer of gold thin film is prepared by vacuum thermal evaporation method on the PDMS of stretching.Then, release is coated with
Drawing force on the PDMS of gold, so as to form the wavy warp architecture of aperiodicity in gold thin film layer, the amplitude of wavy texture is
300nm~500nm, the cycle of wavy texture is 30~90nm.Finally, spray is passed through in the gold thin film layer with wavy warp architecture
Coating method forms one layer of PDMS flexible cover sheet 3.In this way, form a packaging film unit 4.By iterative process, tool is realized
The packaging protection film being made of 4 packaging film units 4.
The above is only the preferred embodiment of the utility model, it is noted that for the common skill of the art
For art personnel, on the premise of the utility model technical principle is not departed from, some improvements and modifications can also be made, these change
The scope of protection of the utility model is also should be regarded as into retouching.
Claims (10)
1. a kind of flexible optoelectronic part packaging protection film, including several packaging film units, it is characterised in that：Each encapsulation
Film unit includes the flexible base layer of adhesive bond successively, and metal layer and flexible cover sheet, the metal layer have nanometer
The wavy warp architecture of level size.
2. flexible optoelectronic part packaging protection film according to claim 1, it is characterised in that：The wavy bending knot
Structure is one direction arrangement.
3. flexible optoelectronic part packaging protection film according to claim 1, it is characterised in that：The wavy bending knot
Structure is periodicity or aperiodicity.
4. flexible optoelectronic part packaging protection film according to claim 1, it is characterised in that：The wavy bending knot
The wavy amplitude of structure is between 50nm~500nm.
5. flexible optoelectronic part packaging protection film according to claim 1, it is characterised in that：The wavy bending knot
The cycle of structure is between 30nm~300nm.
6. flexible optoelectronic part packaging protection film according to claim 1, it is characterised in that：The flexible base layer
For dimethyl silicone polymer layer, polyethylene terephthalate layer, polyimide layer, polyethylene naphthalate layer, poly-
The composite layer that one or more kinds of above-mentioned materials of ether sulfone layer, layer of polyurethane or block polypropylene layer are mixed.
7. flexible optoelectronic part packaging protection film according to claim 1, it is characterised in that：The flexible cover sheet
For dimethyl silicone polymer layer, polyethylene terephthalate layer, polyethylene naphthalate layer, polyethersulfon layer, poly- ammonia
Ester layer, polyimide layer, low density polyethylene layer, high-density polyethylene layer or block polypropylene layer one or more on
State the composite layer that material is mixed.
8. flexible optoelectronic part packaging protection film according to claim 1, it is characterised in that：The metal layer is one
Layer continuous metal film.
9. flexible optoelectronic part packaging protection film according to claim 1, it is characterised in that：The metal layer is gold
Layer, silver layer, magnesium layer, aluminium lamination, layers of copper, molybdenum layer, tungsten layer, the one or more of titanium layer, or comprising gold, silver, magnesium, aluminium, copper, molybdenum, tungsten,
At least two alloy-layer in titanium.
A kind of 10. flexible optoelectronic part, it is characterised in that：Protected comprising being encapsulated described in any claim in claim 1-9
Cuticula.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720796614.4U CN207338433U (en) | 2017-07-03 | 2017-07-03 | Flexible optoelectronic part packaging protection film and the flexible optoelectronic part for including the packaging protection film |
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|---|---|---|---|
| CN201720796614.4U CN207338433U (en) | 2017-07-03 | 2017-07-03 | Flexible optoelectronic part packaging protection film and the flexible optoelectronic part for including the packaging protection film |
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| CN207338433U true CN207338433U (en) | 2018-05-08 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110497659A (en) * | 2019-07-18 | 2019-11-26 | 尼尔金属(苏州)有限公司 | A kind of composite material and preparation method and the electronic product using it |
-
2017
- 2017-07-03 CN CN201720796614.4U patent/CN207338433U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110497659A (en) * | 2019-07-18 | 2019-11-26 | 尼尔金属(苏州)有限公司 | A kind of composite material and preparation method and the electronic product using it |
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