CN211839812U

CN211839812U - Mould that heat dispersion is good

Info

Publication number: CN211839812U
Application number: CN201922067397.7U
Authority: CN
Inventors: 甘求保
Original assignee: Kunshan Norbock Precision Mould Co ltd
Current assignee: Kunshan Norbock Precision Mould Co ltd
Priority date: 2019-11-26
Filing date: 2019-11-26
Publication date: 2020-11-03
Anticipated expiration: 2029-11-26

Abstract

The utility model discloses a mould that heat dispersion is good, including lower bolster, cope match-plate pattern, connecting rod, a spacing groove, a supporting spring and a gag lever post, lower bolster top swing joint has the cope match-plate pattern, cope match-plate pattern top integrated into one piece has the connecting rod, a spacing groove has been seted up at lower bolster bottom surface both ends, a spacing inslot chamber is provided with a supporting spring. The utility model discloses the semiconductor refrigeration piece can release air conditioning, air conditioning transmits on the copper, the copper has the characteristic of quick absorption air conditioning and quick release air conditioning, can effectively promote the radiating effect to movable mould and quiet mould, can pour into copper aqueduct inner chamber with the coolant liquid in the water tank through the water pump simultaneously, the coolant liquid in copper aqueduct inner chamber takes away the heat on movable mould and quiet mould surface, thereby with further promotion to the radiating effect of movable mould and quiet mould, and the coolant liquid still flows into in the water tank, thereby can play endless effect to the coolant liquid.

Description

Mould that heat dispersion is good

Technical Field

The utility model relates to a mould equipment technical field specifically is a mould that heat dispersion is good.

Background

The industrial production of the die is used for obtaining various dies and tools of required products by methods such as injection molding, blow molding, extrusion, die casting or forging forming, smelting, stamping and the like. In short, a mold is a tool used to make a shaped article, the tool being made up of various parts, different molds being made up of different parts. The processing of the appearance of an article is realized mainly through the change of the physical state of a formed material. The element has the name of "industrial mother".

However, the existing mold has the following disadvantages in the use process:

1. when the movable die and the static die punch materials, impact force is large, abrasion between the movable die and the static die is serious, and the service life of the die can be greatly reduced.

2. When the die is used for continuous stamping, a large amount of heat energy is released by mutual friction between the movable die and the static die, and the heat dissipation effect of the conventional die is poor in the using process.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a mould that heat dispersion is good to movable mould and quiet mould are when carrying out the punching press to the material among the solution above-mentioned background art, and the impact strength is great, will the life of greatly reduced mould, and the mould is when continuous punching press, and the mutual friction will release a large amount of heat energy between movable mould and the quiet mould, and the relatively poor problem of radiating effect in the use of current mould.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a mould that heat dispersion is good, includes lower bolster, cope match-plate pattern, connecting rod, spacing groove, a supporting spring and gag lever post No. one, lower bolster top swing joint has the cope match-plate pattern, cope match-plate pattern top integrated into one piece has the connecting rod, No. one the spacing groove has been seted up at lower bolster bottom surface both ends, No. one the spacing inslot chamber is provided with a supporting spring, it has a gag lever post to peg graft at cope match-plate pattern lower surface both ends, and the gag lever post other end is located a spacing inslot chamber, No. two the gag lever posts are installed to a gag lever post one side, No. two the gag lever post one end is pegged graft and is had the movable mould, surface mounting has quiet mould on the lower bolster, No. two the spacing grooves have all been seted up at quiet mould upper surface both ends, and No. two the gag lever posts.

Preferably, the copper is all installed to movable mould and quiet mould inner chamber, copper side surface all laminates and is connected with the semiconductor refrigeration piece, and the semiconductor refrigeration piece all is provided with two sets ofly, and the semiconductor refrigeration piece can release air conditioning at the during operation, and on air conditioning transmitted the copper, the copper has the characteristic of quick absorption air conditioning and quick release air conditioning, can effectively promote the radiating effect to movable mould and quiet mould.

Preferably, copper aqueducts are inlaid on one side of each semiconductor refrigeration piece, the copper aqueducts are provided with multiple groups, the copper aqueducts are connected end to end, water is injected into the copper aqueducts, and the water can take away heat of the movable mold and the static mold when flowing, so that the heat dissipation effect can be achieved on the movable mold and the static mold.

Preferably, a connecting rod is movably mounted on one side of the second limiting rod, the top of the connecting rod is inserted into the surface of the upper die plate, the two groups of connecting rods are arranged, and the second supporting spring can be fixed through the connecting rods.

Preferably, No. two supporting springs are sleeved on the surfaces of the connecting rods, and the movable die can be supported through the No. two supporting springs, so that vibration generated when the static die and the movable die are impacted can be absorbed.

Preferably, the water tank is installed to the quiet mould bottom, and the water tank inner chamber installs the water pump, the play water end of water pump all links to each other with the end of intaking of copper aqueduct through flexible pipe, the play water end of copper aqueduct all links to each other with the water tank through flexible hose, can pour into copper aqueduct inner chamber with the coolant liquid in the water tank through the water pump, and the water in copper aqueduct inner chamber still flows into the water tank after taking away the heat to can play the effect of circulation to the coolant liquid.

Preferably, a heater is installed on one side of the water pump, a temperature regulator is embedded in the surface of one side of the lower template, the current output end of the temperature regulator is connected with the current input end of the heater, the water temperature can be heated through the heater, and the heating temperature of the heater can be regulated through the temperature regulator.

Preferably, the welding of water tank one end has the water injection pipe, and the water injection pipe is located lower bolster side surface, water tank surface mosaic has the liquid level window, can add the notes coolant liquid to the water tank through the water injection pipe to can watch the coolant liquid surplus condition in the water tank through the liquid level window, thereby be convenient for in time supply the coolant liquid.

The utility model provides a mould that heat dispersion is good possesses following beneficial effect:

(1) the utility model discloses the movable mould upper surface is provided with the connecting rod, and No. two supporting spring have been cup jointed on the connecting rod surface, when the cope match-plate pattern pushes down, support the movable mould through No. two supporting spring to but make the movable mould play the cushioning effect with a quiet mould contact in the twinkling of an eye, thereby can effectively reduce the impact force degree between movable mould and the quiet mould, will promote the life of mould greatly.

(2) The utility model discloses semiconductor refrigeration piece utilizes semiconductor material's Peltier effect at the during operation, when the galvanic couple that the direct current was established ties into through two kinds of different semiconductor material, can absorb the heat respectively and emit the heat at the both ends of galvanic couple, thereby air conditioning can be released, air conditioning transmits to the copper on, the copper has the characteristic of quick absorption air conditioning and quick release air conditioning, can effectively promote the radiating effect to movable mould and quiet mould, can pour into copper aqueduct inner chamber through the coolant liquid in the water tank through the water pump simultaneously, the water of copper aqueduct inner chamber takes away the heat on movable mould and quiet mould surface, thereby with further promotion to the radiating effect of movable mould and quiet mould, and the coolant liquid still flows into in the water tank, thereby can play the endless effect to the coolant liquid.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a schematic sectional structure of the present invention;

FIG. 3 is a schematic structural view of the upper template mechanism of the present invention;

fig. 4 is the structural schematic diagram of the lower template mechanism of the utility model.

In the figure: 1. a lower template; 101. mounting a template; 102. a connecting rod; 103. a first limit groove; 104. a first support spring; 105. a first limiting rod; 2. a second limiting rod; 201. moving the mold; 202. static molding; 3. a copper plate; 301. a semiconductor refrigeration sheet; 302. a copper aqueduct; 4. a connecting rod; 401. a second support spring; 402. a second limiting groove; 5. a water tank; 501. a water pump; 502. a heater; 503. a temperature regulator; 504. a water injection pipe; 505. a liquid level window.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

As shown in fig. 1-4, the utility model provides a technical solution: a die with good heat dissipation performance comprises a lower template 1, an upper template 101, a connecting rod 102, a first limiting groove 103, a first supporting spring 104 and a first limiting rod 105, an upper template 101 is movably connected above the lower template 1, a connecting rod 102 is integrally formed at the top of the upper template 101, a first limiting groove 103 is arranged at two ends of the bottom surface of the lower template 1, a first supporting spring 104 is arranged in the inner cavity of the first limiting groove 103, a first limiting rod 105 is inserted at two ends of the lower surface of the upper template 101, the other end of the first limiting rod 105 is positioned in the inner cavity of the first limiting groove 103, one side of the first limiting rod 105 is provided with a second limiting rod 2, one end of the second limiting rod 2 is inserted with a movable mould 201, the upper surface of the lower template 1 is provided with a static mould 202, no. two limiting grooves 402 are formed in two ends of the upper surface of the static die 202, and the No. two limiting grooves 402 are matched with the No. two limiting rods 2.

Preferentially, copper 3 is all installed to movable mould 201 and quiet mould 202 inner chamber, 3 side surfaces of copper all laminate and are connected with semiconductor refrigeration piece 301, and semiconductor refrigeration piece 301 all is provided with two sets ofly, and semiconductor refrigeration piece 301 can release air conditioning at the during operation, and on air conditioning transmits copper 3, copper 3 has the characteristic of quick absorption air conditioning and quick release air conditioning, can effectively promote the radiating effect to movable mould 201 and quiet mould 202.

Preferably, copper water guiding pipes 302 are embedded on one sides of the semiconductor refrigeration sheets 301, the copper water guiding pipes 302 are provided with multiple groups, the copper water guiding pipes 302 are connected end to end, water is injected into the copper water guiding pipes 302, and the water can take away heat of the movable mold 201 and the static mold 202 when flowing, so that a heat dissipation effect can be achieved on the movable mold 201 and the static mold 202.

Preferably, No. two gag lever post 2 one side movable mounting have connecting rod 4, and the grafting is on cope match-plate pattern 101 surface at connecting rod 4 top, connecting rod 4 is provided with two sets ofly altogether, can fix No. two supporting spring 401 through connecting rod 4.

Preferably, the surface of the connecting rod 4 is sleeved with a second supporting spring 401, and the movable mold 201 can be supported by the second supporting spring 401, so that the vibration generated by the stationary mold 202 and the movable mold 201 during the impact can be absorbed.

Preferably, the water tank 5 is installed to quiet mould 202 bottom, and the water pump 501 is installed to 5 inner chambers of water tank, the play water end of water pump 501 all links to each other with the end of intaking of copper aqueduct 302 through flexible pipe, the play water end of copper aqueduct 302 all links to each other with water tank 5 through flexible hose, can pour into copper aqueduct 302 inner chamber with the coolant liquid in the water tank 5 through water pump 501, and the water of copper aqueduct 302 inner chamber still flows into water tank 5 after taking away the heat to can play the endless effect to the coolant liquid.

Preferably, a heater 502 is installed on one side of the water pump 501, a temperature regulator 503 is embedded on the surface of one side of the lower template 1, a current output end of the temperature regulator 503 is connected with a current input end of the heater 502, the water temperature can be heated by the heater 502, and the heating temperature of the heater 502 can be regulated by the temperature regulator 503.

Preferably, 5 one end welding of water tank has water injection pipe 504, and water injection pipe 504 is located 1 side surface of lower bolster, 5 surface mosaic of water tank have liquid level window 505, can add notes coolant liquid in to water tank 5 through water injection pipe 504 to can watch the coolant liquid surplus condition in the water tank 5 through liquid level window 505, thereby be convenient for in time supply the coolant liquid.

It should be noted that, when the die with good heat dissipation performance works, a cooling liquid can be injected into the water inlet tank 5 through the water injection pipe 504, the top of the upper die plate 101 is connected with a punch press through the connecting rod 102, a material to be punched is placed on the surface of the stationary die 202, the upper die plate 101 is driven to press down through the punch press, so that the movable die 201 can be pressed on the surface of the stationary die 202, and thus the material is punched, wherein the first limiting groove 103 is formed in both ends of the upper surface of the upper die plate 101, the bottom of the upper die plate 101 is connected with the first limiting groove 103 through the first limiting rod 105, the first limiting rod 105 and the first limiting groove 103 are matched with each other, so as to guide the pressing direction of the upper die plate 101, and when the upper die plate 101 is pressed down, the second limiting rod 2 is inserted into the second limiting groove 402, so that the pressing precision of the upper die plate 101 can be effectively improved, and further the die assembly precision of the stationary die, the stamping quality of materials is improved, the connecting rod 4 is arranged on the upper surface of the movable mold 201, the second supporting spring 401 is sleeved on the surface of the connecting rod 4, when the upper mold plate 101 is pressed down, the movable mold 201 is supported through the second supporting spring 401, so that the movable mold 201 and the static mold 202 are in contact to play a role in buffering at one moment, the impact force between the movable mold 201 and the static mold 202 can be effectively reduced, the semiconductor refrigeration sheet 301 utilizes the Peltier effect of semiconductor materials during working, when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the couple respectively, so that cold air can be released, the cold air is transmitted to the copper plate 3, the copper plate 3 has the characteristics of quickly absorbing and releasing the cold air, the heat dissipation effect on the movable mold 201 and the static mold 202 can be effectively improved, and meanwhile, the cooling liquid in the water tank 5 can be injected into the inner cavity of the copper water guide pipe, the water of copper aqueduct 302 inner chamber takes away the heat on movable mould 201 and quiet mould 202 surface, thereby with further promotion to the radiating effect of movable mould 201 and quiet mould 202, and the coolant liquid still flows into in the water tank 5, thereby can play the effect of circulation to the coolant liquid, can heat the temperature through heater 502, and can adjust the heating temperature of heater 502 through temperature regulator 503, circulate through copper aqueduct 302, thereby can make movable mould 201 and quiet mould 202 carry out the punching press to the material under specific temperature, and then can effectively promote the punching press quality to specific stamping workpiece, can annotate the coolant liquid in the water tank 5 through water injection pipe 504, and can watch the remaining condition of coolant liquid in the water tank 5 through liquid level window 505, thereby be convenient for in time supply the coolant liquid.

A semiconductor refrigeration chip 301 of TEC1-12706 model, a water pump 501 of 15G0.5-8 model, a heater 502 of AQMI-01 model and a temperature regulator 503 of C25TR0UA2200 model

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a mould that heat dispersion is good, includes lower bolster (1), cope match-plate pattern (101), connecting rod (102), spacing groove (103), supporting spring (104) and gag lever post (105), lower bolster (1) top swing joint has cope match-plate pattern (101), cope match-plate pattern (101) top integrated into one piece has connecting rod (102), spacing groove (103) have been seted up at lower bolster (1) bottom surface both ends, spacing groove (103) inner chamber is provided with supporting spring (104) No. one, peg graft at cope match-plate pattern (101) lower surface both ends and have gag lever post (105), and gag lever post (105) other end is located spacing groove (103) inner chamber No. one, its characterized in that: no. two gag lever posts (2) are installed to a gag lever post (105) one side, No. two gag lever posts (2) one end is pegged graft and is had movable mould (201), surface mounting has quiet mould (202) on lower bolster (1), No. two spacing grooves (402) have all been seted up at quiet mould (202) upper surface both ends, and No. two spacing grooves (402) and No. two gag lever posts (2) mutually support.

2. The mold with good heat dissipation performance according to claim 1, wherein: copper (3) are all installed to movable mould (201) and quiet mould (202) inner chamber, copper (3) one side surface all the laminating be connected with semiconductor refrigeration piece (301), and semiconductor refrigeration piece (301) all are provided with two sets ofly.

3. The mold with good heat dissipation performance according to claim 2, wherein: semiconductor refrigeration piece (301) one side all inlays and has copper aqueduct (302), copper aqueduct (302) are provided with the multiunit, and connect end to end between copper aqueduct (302).

4. The mold with good heat dissipation performance according to claim 1, wherein: no. two gag lever post (2) one side movable mounting have connecting rod (4), and peg graft on cope match-plate pattern (101) surface connecting rod (4) top, connecting rod (4) are provided with two sets altogether.

5. The mold with good heat dissipation performance according to claim 4, wherein: and the surface of the connecting rod (4) is sleeved with a second supporting spring (401).

6. The mold with good heat dissipation performance according to claim 1, wherein: the water tank (5) is installed to quiet mould (202) bottom, and water pump (501) are installed to water tank (5) inner chamber, the play water end of water pump (501) all links to each other with the end of intaking of copper aqueduct (302) through flexible pipe, the play water end of copper aqueduct (302) all links to each other with water tank (5) through flexible hose.

7. The mold with good heat dissipation performance according to claim 6, wherein: a heater (502) is installed on one side of the water pump (501), a temperature regulator (503) is embedded in the surface of one side of the lower template (1), and the current output end of the temperature regulator (503) is connected with the current input end of the heater (502).

8. The mold with good heat dissipation performance according to claim 6, wherein: water injection pipe (504) are welded to water tank (5) one end, and water injection pipe (504) are located lower bolster (1) side surface, water tank (5) surface mosaic has liquid level window (505).