CN210940231U

CN210940231U - Plastic mold for vibration diaphragm

Info

Publication number: CN210940231U
Application number: CN201921437588.1U
Authority: CN
Inventors: 王华根
Original assignee: Suzhou Huashang Mould Co ltd
Current assignee: Suzhou Huashang Mould Co ltd
Priority date: 2019-08-30
Filing date: 2019-08-30
Publication date: 2020-07-07
Anticipated expiration: 2029-08-30

Abstract

The utility model discloses a plastic mould for vibrations diaphragm relates to plastic mould technical field, and is slow for solving current plastic mould cooling, reduces the problem of the production efficiency of vibrations diaphragm easily. The utility model discloses a take out heat dissipation structure, including base, bed die, mounting bracket, heat conduction fan, protection network, the internally mounted of base top has the bed die, the mould is installed to the top of bed die, be provided with into the die cavity between bed die and the last mould, the inside of base is provided with the cavity, the both sides of cavity are provided with the mounting groove, the internally mounted of mounting groove has heat dissipation mechanism, heat dissipation mechanism includes semiconductor refrigeration piece, mounting bracket, heat extraction fan, heat conduction fan and protection network, the mounting bracket is all installed to the both sides of semiconductor refrigeration piece, both sides the heat extraction fan and heat conduction fan are installed respectively to the inside of mounting bracket, heat extraction fan is located the inside of cavity, heat conduction fan is located the outside of base, the protection network.

Description

Plastic mold for vibration diaphragm

Technical Field

The utility model relates to a plastic mould technical field specifically is a plastic mould for vibrations diaphragm.

Background

Various tools and products used in daily production and life are large as a base and a machine body shell of a machine tool and small as a shell of a head screw, a button and various household appliances, and have no close relation with a die. In recent years, with the rapid development of the plastic industry and the continuous improvement of general-purpose and engineering plastics in the aspects of strength, precision and the like, the application range of plastic products is also continuously expanded. The trend of plastification of industrial products and daily-use products is rising continuously, and plastic molds are rapidly developed. The plastic mold is a short name for a combined mold used for compression molding, extrusion molding, injection, blow molding and low-foaming molding. The coordination change of the male die, the female die and the auxiliary forming system of the die can process a series of plastic parts with different shapes and sizes. The vibrating diaphragm is one of important components in articles such as a loudspeaker, an earphone, topics and the like, the diaphragm is vibrated by electric energy through an electromagnetic effect, and the vibrating diaphragm resonates with surrounding air to emit sound, so that different sounds are presented to people.

However, the existing plastic mold is slow in cooling and easy to reduce the production efficiency of the vibrating diaphragm, so that the existing requirements are not met, and the plastic mold for the vibrating diaphragm is provided.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a plastic mould for vibrations diaphragm to the plastic mould cooling that proposes in solving above-mentioned background art is slow, reduces the production efficiency's of vibrations diaphragm problem easily.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a plastic mould for vibrations diaphragm, includes the base, the internally mounted of base top has the bed die, the mould is installed to the top of bed die, be provided with into the die cavity between bed die and the last mould, the inside of base is provided with the cavity, the both sides of cavity are provided with the mounting groove, the internally mounted of mounting groove has heat dissipation mechanism, heat dissipation mechanism includes semiconductor refrigeration piece, mounting bracket, heat extraction fan, heat conduction fan and protection network, the mounting bracket is all installed to the both sides of semiconductor refrigeration piece, both sides heat extraction fan and heat conduction fan are installed respectively to the inside of mounting bracket, heat extraction fan is located the inside of cavity, heat conduction fan is located the outside of base, the protection network is installed to the inside one side of mounting bracket, heat dissipation frame is installed to the below of bed die.

Preferably, the inside of going up the mould is provided with the groove of moulding plastics, the bottom in the groove of moulding plastics is provided with the hole of moulding plastics, the both sides in the groove of moulding plastics all are provided with first holding tank, second holding tank and third holding tank, the below of first holding tank is provided with the second holding tank, the below of second holding tank is provided with the third holding tank.

Preferably, the internally mounted of first holding tank has the screw rod, the screw rod passes through threaded connection with first holding tank, first reset spring is installed to the below of screw rod, the internally mounted of second holding tank and third holding tank has the thimble, the thimble includes limiting plate and thimble main part, and the limiting plate is located the top of thimble main part, the limiting plate is located the inside of second holding tank, the thimble main part is located the inside of third holding tank.

Preferably, the second return springs are installed below the limiting plate, two second return springs are installed below the limiting plate, and the two second return springs are located on two sides of the ejector pin main body respectively.

Preferably, a compression molding block is installed above the injection molding groove, and the lower end of the compression molding block extends to the inside of the injection molding groove.

Preferably, the limiting plate and the thimble main body are of an integrated structure.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses an inside at the base sets up the cavity, and at cavity internally mounted heat dissipation frame, the heat dissipation frame adopts aluminium system material, good heat conductivity has, the frame that dispels the heat simultaneously contacts with the bed die, can conduct the heat on the bed die, the heat dissipation mechanism of rethread heat dissipation frame both sides installation is to thermal consumption, semiconductor refrigeration piece reliability requirement is high among the heat dissipation mechanism, and good refrigeration radiating effect has, thereby can accelerate the decline of temperature in the shaping chamber, accelerate the shaping of vibrations diaphragm, improve the production efficiency of vibrations diaphragm, strengthen the practicality of plastic mould.

2. The utility model discloses an internally mounted thimble at last mould is convenient for demold fashioned vibrations diaphragm from last mould, can improve drawing of patterns speed to improve the practicality of plastic mould, and reducible injury to the finished product model, reduction in production cost.

3. The utility model discloses a threaded connection of screw rod and first holding tank, through the adjustable thimble of equidirectional rotation stretch out length, the top of the limiting plate of thimble sets up first reset spring simultaneously, sets up second reset spring below the limiting plate, utilizes the elasticity that the spring is good and the ability of recovering the deformation, is convenient for resume the normal position with the thimble of shift position, and the regulation mode is simple and convenient, the operation of being convenient for.

Drawings

Fig. 1 is a sectional view of a plastic mold for a vibrating diaphragm according to the present invention;

FIG. 2 is a partial enlarged view of region A of the present invention;

fig. 3 is a partial enlarged view of the region B of the present invention.

In the figure: 1. a base; 11. a cavity; 12. mounting grooves; 2. a lower die; 3. an upper die; 31. injection molding a groove; 32. injection molding holes; 33. a first accommodating groove; 34. a second accommodating groove; 35. a third accommodating groove; 4. pressing the plastic block; 5. a molding cavity; 6. a heat dissipation mechanism; 61. a semiconductor refrigeration sheet; 62. a mounting frame; 63. a heat-extracting fan; 64. a heat-conducting fan; 65. a protective net; 7. a heat dissipation frame; 8. a screw; 9. a first return spring; 91. a second return spring; 10. a thimble; 101. a limiting plate; 102. the thimble main part.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1-3, the present invention provides an embodiment: a plastic mold for a vibrating diaphragm comprises a base 1, a lower mold 2 is arranged inside the upper portion of the base 1, an upper mold 3 is arranged above the lower mold 2, a molding cavity 5 is arranged between the lower mold 2 and the upper mold 3, a cavity 11 is arranged inside the base 1, mounting grooves 12 are arranged on two sides of the cavity 11, a heat dissipation mechanism 6 is arranged inside the mounting grooves 12, the heat dissipation mechanism has a good heat dissipation effect and accelerates the molding of the diaphragm, the heat dissipation mechanism 6 comprises a semiconductor refrigeration sheet 61, a mounting frame 62, a heat pumping fan 63, a heat conduction fan 64 and a protective net 65, the mounting frame 62 is arranged on two sides of the semiconductor refrigeration sheet 61, the heat conduction performance of the semiconductor refrigeration sheet 61 is good, the heat pumping fan 63 and the heat conduction fan 64 are respectively arranged inside the mounting frames 62 on two sides, the heat pumping fan 63 is located inside the cavity 11, the heat conduction fan 64 is located outside the base 1, the heat conduction fan 64 and the heat extraction fan 63 can be protected, the heat dissipation frame 7 is arranged below the lower die 2 and made of aluminum, and the heat conduction fan and the heat extraction fan have good heat conductivity and heat dissipation performance.

Further, the inside of going up mould 3 is provided with the groove 31 of moulding plastics, and the bottom in the groove 31 of moulding plastics is provided with the hole 32 of moulding plastics for mould plastics, the both sides in the groove 31 of moulding plastics all are provided with first holding tank 33, second holding tank 34 and third holding tank 35, and the below of first holding tank 33 is provided with second holding tank 34, and the below of second holding tank 34 is provided with third holding tank 35, and the size of three holding tank is different, and the effect is also different.

Further, the internally mounted of first holding tank 33 has screw rod 8, screw rod 8 passes through threaded connection with first holding tank 33, simple to operate, high durability and universality, can install and remove and can used repeatedly, first reset spring 9 is installed to the below of screw rod 8, a position for adjusting thimble 10, and recover, the internally mounted of second holding tank 34 and third holding tank 35 has thimble 10, thimble 10 includes limiting plate 101 and thimble main part 102, and limiting plate 101 is located the top of thimble main part 102, limiting plate 101 is located the inside of second holding tank 34, thimble main part 102 is located the inside of third holding tank 35.

Further, two second return springs 91 are installed below the limiting plate 101, and the two second return springs 91 are installed, the two second return springs 91 are respectively located at two sides of the thimble main body 102, and the second return springs 91 have good elasticity, which can help the thimble 10 to return to the original position.

Further, a compression block 4 is installed above the injection groove 31, and the lower end of the compression block 4 extends to the inside of the injection groove 31, and the compression block 4 moves to the inside of the injection groove 31, and the pressure difference of the injection groove 31 can be changed, so that the injection solution inside the injection groove 31 flows into the molding cavity 5 through the injection hole 32.

Furthermore, the limiting plate 101 and the thimble main body 102 are of an integrated structure, so that the integrity is good, the joint is seamless, and the sealing performance is good.

The working principle is as follows: when the injection molding device is used, the upper mold 3 is arranged above the lower mold 2, a proper amount of injection molding solution is added into the injection molding groove 31, the cylinder extends to drive the molding block 4 to move downwards and gradually enter the injection molding groove 31, the pressure difference in the injection molding groove 31 is changed along with the entering of the molding block 4, and the solution flows into the molding cavity 5 through the injection molding hole 32 under the action of pressure. The solution heat is great, transmit to in heat dissipation frame 7 and the cavity 11 through bed die 2, meanwhile, for 6 circular telegrams of heat dissipation mechanism, heat in the heat extraction fan 63 extraction cavity 11 passes to the cold junction of semiconductor refrigeration piece 61, when the electric current passes through, will produce the heat transfer between the both ends of semiconductor refrigeration piece 61, the heat will be followed one end and shifted to the other end, thereby produce the difference in temperature and form cold and hot end, can dispel the heat for the hot junction through heat conduction fan 64, can increase the difference in temperature of cold junction and hot junction, thereby make the temperature of cold junction lower, from this can accelerate the inside thermal giveaway of shaping chamber 5, accelerate the shaping of vibrations diaphragm. When the diaphragm adheres to the upper die 3, the two screw rods 8 can rotate clockwise simultaneously, the screw rods 8 move downwards to extrude the first return spring 9, the first return spring 9 is extruded to generate a reaction force, so that the ejector pin 10 is pushed to move downwards to eject the diaphragm from the upper die 3, the screw rods 8 rotate anticlockwise to recover to the original position, the first return spring 9 and the second return spring 91 are extruded to be removed, the first return spring 9 and the second return spring 91 perform recovery deformation work, and the ejector pin 10 is driven to recover to the original position.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The utility model provides a vibrations plastic mould for diaphragm, includes base (1), its characterized in that: the heat dissipation device is characterized in that a lower die (2) is arranged inside the base (1), an upper die (3) is arranged above the lower die (2), a forming cavity (5) is formed between the lower die (2) and the upper die (3), a cavity (11) is arranged inside the base (1), mounting grooves (12) are formed in two sides of the cavity (11), a heat dissipation mechanism (6) is arranged inside the mounting grooves (12), the heat dissipation mechanism (6) comprises semiconductor refrigeration sheets (61), a mounting frame (62), heat extraction fans (63), heat conduction fans (64) and a protective net (65), the mounting frame (62) is arranged on two sides of each semiconductor refrigeration sheet (61), the heat extraction fans (63) and the heat conduction fans (64) are respectively arranged inside the mounting frame (62), and the heat extraction fans (63) are located inside the cavity (11), the heat conduction fan (64) is located the outside of base (1), protection network (65) are installed to the inside one side of mounting bracket (62), heat dissipation frame (7) are installed to the below of bed die (2).

2. The plastic mold for vibration diaphragm of claim 1, wherein: the inside of going up mould (3) is provided with groove (31) of moulding plastics, the bottom of groove (31) of moulding plastics is provided with injection molding hole (32), the both sides of groove (31) of moulding plastics all are provided with first holding tank (33), second holding tank (34) and third holding tank (35), the below of first holding tank (33) is provided with second holding tank (34), the below of second holding tank (34) is provided with third holding tank (35).

3. The plastic mold for vibration diaphragm of claim 2, wherein: the internally mounted of first holding tank (33) has screw rod (8), screw rod (8) pass through threaded connection with first holding tank (33), first reset spring (9) are installed to the below of screw rod (8), the internally mounted of second holding tank (34) and third holding tank (35) has thimble (10), thimble (10) include limiting plate (101) and thimble main part (102), and limiting plate (101) are located the top of thimble main part (102), limiting plate (101) are located the inside of second holding tank (34), thimble main part (102) are located the inside of third holding tank (35).

4. The plastic mold for vibration diaphragm of claim 3, wherein: second reset springs (91) are installed below the limiting plate (101), two second reset springs (91) are installed, and the two second reset springs (91) are located on two sides of the ejector pin main body (102) respectively.

5. The plastic mold for vibration diaphragm of claim 2, wherein: and a compression molding block (4) is arranged above the injection molding groove (31), and the lower end of the compression molding block (4) extends into the injection molding groove (31).

6. The plastic mold for vibration diaphragm of claim 3, wherein: the limiting plate (101) and the thimble main body (102) are of an integrated structure.