CN213195621U - Moulding-die cooling device is used in cutter production - Google Patents
Moulding-die cooling device is used in cutter production Download PDFInfo
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- CN213195621U CN213195621U CN202021920972.XU CN202021920972U CN213195621U CN 213195621 U CN213195621 U CN 213195621U CN 202021920972 U CN202021920972 U CN 202021920972U CN 213195621 U CN213195621 U CN 213195621U
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- heat dissipation
- heat
- die pressing
- die
- pressing base
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Abstract
The utility model discloses a moulding-die cooling device is used in cutter production, including the clamping mechanism, the pressure seat that are used for the cutter production, the pressure seat is located clamping mechanism top still includes cooling body, air supply fan and supporting seat, cooling body is including heat dissipation frame, heat conduction copper, semiconductor refrigeration piece, heating panel, two the heat conduction copper is located both sides about the clamping mechanism. The utility model discloses utilize heat dissipation frame and heat conduction copper to come to carry out quick cooling to die pressing mechanism to can improve the cooling efficiency of whole die pressing mechanism, utilize the semiconductor refrigeration piece to come to carry out quick cooling to the heat conduction copper, utilize the air supply fan to sweep the heat that can quick absorption semiconductor refrigeration piece produced to the heating panel simultaneously, thereby make whole heat radiation structure more simple swift.
Description
Technical Field
The utility model relates to a cutter production field especially relates to a moulding-die cooling device is used in cutter production.
Background
The powder pressing die is a main tool for powder pressing, has the problems of quality, cost, safety, productivity and the like of powder metallurgy product production, and has extremely important influence on powder metallurgy process and parts; need carry out the cooling that lasts to the press mold when the suppression, and traditional heat sink when cooling to the mould, often need some cooling medium to carry out iterative circulation to could cool down the mould, but this kind of heat sink structure is comparatively complicated, still need connect corresponding circulation pipeline simultaneously, consequently unusual trouble, the heat transfer efficiency of every kind of medium is also different simultaneously, therefore cooling efficiency is not very high yet.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a moulding-die cooling device is used in cutter production in order to solve above-mentioned problem.
The utility model discloses a following technical scheme realizes above-mentioned purpose:
a compression mold cooling device for cutter production comprises a compression mold mechanism and a compression seat, wherein the compression seat is used for cutter production, the compression seat is positioned above the compression mold mechanism, the compression mold cooling device further comprises a cooling mechanism, a blowing fan and a supporting seat, the cooling mechanism comprises a heat dissipation frame, a heat conduction copper plate, a semiconductor refrigeration sheet and a heat dissipation plate, the two heat conduction copper plates are positioned on the upper side and the lower side of the compression mold mechanism, the supporting seat is arranged on the inner side of the heat conduction copper plate, the heat dissipation frame is arranged on the outer side of the heat conduction copper plate, the semiconductor refrigeration sheet is arranged between the heat dissipation frame and the heat conduction copper plate, the type of the semiconductor refrigeration sheet is TEC1-12706, and the heat dissipation; the air supply fan is connected to two ends of the heat dissipation frame through bolts.
Preferably: the die pressing mechanism comprises a lower die pressing base, an upper die pressing base, a spring and a supporting rod, wherein the upper end of the supporting rod penetrates through the top of the upper die pressing base, the lower end of the supporting rod is connected with the top of the lower die pressing base through welding, the top of the lower die pressing base is close to the front side and the rear side, and the spring is arranged on the outer side of the supporting rod and located between the lower die pressing base and the upper die pressing base.
According to the arrangement, the press seat is pushed to move downwards by the corresponding pressure device, so that the upper press die holder is pressed with the lower press die holder downwards along the supporting rod, and meanwhile, the spring is used for pushing the upper press die holder to reset quickly.
Preferably: the die pressing mechanism comprises a lower die pressing base, an upper die pressing base and a hydraulic telescopic rod, the telescopic part of the hydraulic telescopic rod is connected to the bottom of the upper die pressing base through threads, and the fixed part of the hydraulic telescopic rod is connected to the positions, close to the front side and the rear side, of the top of the lower die pressing base through bolts.
According to the arrangement, the corresponding pressure device is used for pushing the press base to move downwards, so that the upper press base is pressed downwards with the lower press base, and meanwhile, the hydraulic telescopic rod is used for pushing the upper press base to rapidly reset.
Preferably: the upper end of the supporting seat is connected with the pressing seat through a screw, and the lower end of the supporting seat is connected with the top of the upper pressing seat through a screw.
According to the arrangement, the upper die holder and the lower die holder are supported by the supporting seat, so that the heat-conducting copper plate is prevented from deforming in the pressing process of the cutter.
Preferably: three groups of air inlet round holes are formed in the end faces of two sides of the heat dissipation frame, and air outlet round holes are formed in the end faces of the front side and the rear side of the heat dissipation frame.
According to the arrangement, the heat dissipation frame is utilized to enable flowing air sent by the air supply fan to be blown to each heat dissipation plate, so that the heat absorption and heat dissipation efficiency of the semiconductor refrigeration sheet can be improved.
Preferably: and heat dissipation silicone grease is coated between the heat conduction copper plate and the semiconductor refrigeration sheet, and meanwhile, heat dissipation silicone grease is also coated between the semiconductor refrigeration sheet and the heat dissipation frame.
So set up, utilize the heat dissipation silicone grease of scribbling on semiconductor refrigeration piece both sides to improve thermal transmission efficiency.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the heat dissipation frame and the heat conduction copper plate are used for rapidly cooling the die pressing mechanism, so that the cooling efficiency of the whole die pressing mechanism can be improved;
2. utilize the semiconductor refrigeration piece to carry out quick cooling to the heat conduction copper, utilize the air supply fan to sweep the heat that absorption semiconductor refrigeration piece that can be quick produced of heating panel simultaneously to make whole heat radiation structure more simple swift.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
FIG. 1 is a schematic structural view of an embodiment 1 of a die cooling device for producing a cutting tool according to the present invention;
FIG. 2 is a schematic structural view of an embodiment 2 of a die cooling device for producing a cutting tool according to the present invention;
FIG. 3 is a partial part view of the embodiment 1 of the die pressing mechanism of the die pressing cooling device for producing the cutting tool according to the present invention;
FIG. 4 is a partial part view of the embodiment 2 of the die pressing mechanism of the die cooling device for producing the cutting tool according to the present invention;
FIG. 5 is a partial sectional view of a cooling mechanism of a die cooling device for tool production according to the present invention;
FIG. 6 is a partial view of a support seat of a cooling device for a pressing mold for producing a cutting tool according to the present invention;
fig. 7 is a partial part diagram of a heat-conducting copper plate of a pressing die cooling device for cutter production.
The reference numerals are explained below:
1. a cooling mechanism; 2. a die pressing mechanism; 3. an air supply fan; 4. a supporting seat; 5. pressing a base; 11. a heat dissipation frame; 12. a heat-conducting copper plate; 13. a semiconductor refrigeration sheet; 14. a heat dissipation plate; 21. pressing a die holder; 22. an upper die holder; 23. a spring; 24. a support bar; 213. a hydraulic telescopic rod.
Detailed Description
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
The present invention will be further explained with reference to the accompanying drawings:
a compression mold cooling device for cutter production comprises a compression mold mechanism 2 used for cutter production, a compression seat 5, a cooling mechanism 1, an air supply fan 3 and a supporting seat 4, wherein the compression seat 5 is positioned above the compression mold mechanism 2, the cooling mechanism 1 comprises a heat dissipation frame 11, a heat conduction copper plate 12, a semiconductor refrigeration sheet 13 and a heat dissipation plate 14, the two heat conduction copper plates 12 are positioned at the upper side and the lower side of the compression mold mechanism 2, the supporting seat 4 is arranged at the inner side of the heat conduction copper plate 12, the heat dissipation frame 11 is arranged at the outer side of the heat conduction copper plate 12, the semiconductor refrigeration sheet 13 is arranged between the heat dissipation frame 11 and the heat conduction copper plate 12, and the heat dissipation plate 14; the blowing fan 3 is connected to both ends of the heat dissipation frame 11 by bolts.
Example 1
As shown in fig. 1, 3, 5, 6, and 7, the die pressing mechanism 2 includes a lower die holder 21, an upper die holder 22, a spring 23, and a support rod 24, wherein an upper end of the support rod 24 passes through a top of the upper die holder 22, a lower end of the support rod 24 is connected to a top of the lower die holder 21 near front and rear sides by welding, the spring 23 is disposed outside the support rod 24 and between the lower die holder 21 and the upper die holder 22, the press holder 5 is pushed by a corresponding pressure device to move downward, so that the upper die holder 22 is pressed against the lower die holder 21 along the support rod 24, and the spring 23 is used to push the upper die holder 22 to quickly return; the upper end of the supporting seat 4 is connected to the press seat 5 through a screw, the lower end of the supporting seat 4 is connected to the top of the upper press seat 22 through a screw, and the supporting seat 4 is used for supporting the upper press seat 22 and the lower press seat 21, so that the heat-conducting copper plate 12 is prevented from deforming in the cutter pressing process; three groups of air inlet round holes are formed in the end faces of the two sides of the heat dissipation frame 11, air outlet round holes are formed in the end faces of the front side and the rear side of the heat dissipation frame 11, and flowing air fed by the air supply fan 3 can be blown to each heat dissipation plate 14 by using the heat dissipation frame 11, so that the heat absorption and heat dissipation efficiency of the semiconductor refrigeration sheets 13 can be improved; heat dissipation silicone grease is coated between the heat conduction copper plate 12 and the semiconductor refrigeration piece 13, and heat dissipation silicone grease is also coated between the semiconductor refrigeration piece 13 and the heat dissipation frame 11, so that the heat transfer efficiency is improved by using the heat dissipation silicone grease coated on the two sides of the semiconductor refrigeration piece 13.
The working principle is as follows: when in use, the device is arranged at a corresponding position, the pressing raw material is placed between the lower die holder 21 and the upper die holder 22, the corresponding pressure device is used for pressing the press base 5, and therefore the top of the lower die holder 21 is matched with the lower end of the upper die holder 22 to press and form the tool raw material; in this process, utilize two heat conduction copper 12 to come to absorb the heat that lower die holder 21 and upper die holder 22 produced, heat conduction copper 12 transmits the heat to its side position through the heat transfer, semiconductor refrigeration piece 13 is seted up and is cooled down the refrigeration to heat conduction copper 12 side simultaneously, thereby utilize cold and hot neutralization to reduce the temperature of heat conduction copper 12, and the heat that semiconductor refrigeration piece 13 produced is transmitted on heat dissipation frame 11, 3 starts to sweep heat dissipation frame 11 inboardly of air supply fan simultaneously, come to carry out rapid cooling to heat dissipation plate 14 of heat dissipation frame 11 inboard through the air that flows at a high speed, the air after the cooling blows out through the side trompil department of heat dissipation frame 11 front and back both sides, thereby reach quick radiating effect.
Example 2
As shown in fig. 2 and 4, the difference between the embodiment 2 and the embodiment 1 is that the die pressing mechanism 2 includes a lower die holder 21, an upper die holder 22, and a hydraulic telescopic rod 213, wherein a telescopic portion of the hydraulic telescopic rod 213 is connected to a bottom of the upper die holder 22 through a screw, a fixing portion of the hydraulic telescopic rod 213 is connected to a top portion of the lower die holder 21 near front and rear sides through a bolt, and the corresponding pressing device is used to push the die holder 5 to move downward, so that the upper die holder 22 is pressed downward with the lower die holder 21, and the hydraulic telescopic rod 213 is used to push the upper die holder 22 to perform quick reset.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention.
Claims (6)
1. A moulding-die cooling device for cutter production, includes the moulding-die mechanism (2), the pressure seat (5) that are used for cutter production, press seat (5) to be located the moulding-die mechanism (2) top, its characterized in that: the cooling device is characterized by further comprising a cooling mechanism (1), an air supply fan (3) and a supporting seat (4), wherein the cooling mechanism (1) comprises a heat dissipation frame (11), heat-conducting copper plates (12), semiconductor refrigeration sheets (13) and heat dissipation plates (14), the two heat-conducting copper plates (12) are located on the upper side and the lower side of the compression molding mechanism (2), the supporting seat (4) is arranged on the inner side of each heat-conducting copper plate (12), the heat dissipation frame (11) is arranged on the outer side of each heat-conducting copper plate (12), the semiconductor refrigeration sheets (13) are arranged between the heat dissipation frame (11) and the heat-conducting copper plates (12), and the heat dissipation plates (14) are installed on the inner side of the heat; the air supply fan (3) is connected to the two ends of the heat dissipation frame (11) through bolts.
2. The cooling device for the die for producing the cutting tool according to claim 1, wherein: the die pressing mechanism (2) comprises a lower die pressing base (21), an upper die pressing base (22), a spring (23) and a supporting rod (24), the upper end of the supporting rod (24) penetrates through the top of the upper die pressing base (22), the lower end of the supporting rod (24) is connected with the top of the lower die pressing base (21) through welding, the positions of the front side and the rear side of the top of the lower die pressing base are close to each other, and the spring (23) is arranged on the outer side of the supporting rod (24) and located between the lower die pressing base (21) and the upper die pressing base (22.
3. The cooling device for the die for producing the cutting tool according to claim 1, wherein: the die pressing mechanism (2) comprises a lower die pressing base (21), an upper die pressing base (22) and a hydraulic telescopic rod (213), wherein the telescopic part of the hydraulic telescopic rod (213) is connected to the bottom of the upper die pressing base (22) through threads, and the fixed part of the hydraulic telescopic rod (213) is connected to the front side and the rear side of the top of the lower die pressing base (21) through bolts.
4. A cooling apparatus for a stamper for the production of cutting tools according to claim 2 or 3, wherein: the upper end of the supporting seat (4) is connected with the pressing seat (5) through a screw, and the lower end of the supporting seat (4) is connected with the top of the upper pressing seat (22) through a screw.
5. The cooling device for the die for producing the cutting tool according to claim 1, wherein: three groups of air inlet round holes are formed in the end faces of two sides of the heat dissipation frame (11), and air outlet round holes are formed in the end faces of the front side and the rear side of the heat dissipation frame (11).
6. The cooling device for the die for producing the cutting tool according to claim 1, wherein: and heat dissipation silicone grease is coated between the heat conduction copper plate (12) and the semiconductor refrigeration sheet (13), and meanwhile, heat dissipation silicone grease is also coated between the semiconductor refrigeration sheet (13) and the heat dissipation frame (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021920972.XU CN213195621U (en) | 2020-09-07 | 2020-09-07 | Moulding-die cooling device is used in cutter production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021920972.XU CN213195621U (en) | 2020-09-07 | 2020-09-07 | Moulding-die cooling device is used in cutter production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213195621U true CN213195621U (en) | 2021-05-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021920972.XU Active CN213195621U (en) | 2020-09-07 | 2020-09-07 | Moulding-die cooling device is used in cutter production |
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| Country | Link |
|---|---|
| CN (1) | CN213195621U (en) |
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2020
- 2020-09-07 CN CN202021920972.XU patent/CN213195621U/en active Active
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